KR102095826B1 - 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체 - Google Patents
절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체 Download PDFInfo
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- KR102095826B1 KR102095826B1 KR1020147029846A KR20147029846A KR102095826B1 KR 102095826 B1 KR102095826 B1 KR 102095826B1 KR 1020147029846 A KR1020147029846 A KR 1020147029846A KR 20147029846 A KR20147029846 A KR 20147029846A KR 102095826 B1 KR102095826 B1 KR 102095826B1
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- particles
- insulating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Powder Metallurgy (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012149213 | 2012-07-03 | ||
JPJP-P-2012-149213 | 2012-07-03 | ||
JPJP-P-2012-149212 | 2012-07-03 | ||
JP2012149212 | 2012-07-03 | ||
PCT/JP2013/068116 WO2014007238A1 (ja) | 2012-07-03 | 2013-07-02 | 絶縁性粒子付き導電性粒子、導電材料及び接続構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20150028764A KR20150028764A (ko) | 2015-03-16 |
KR102095826B1 true KR102095826B1 (ko) | 2020-04-01 |
Family
ID=49881993
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020147029845A KR102076066B1 (ko) | 2012-07-03 | 2013-07-02 | 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체 |
KR1020147029846A KR102095826B1 (ko) | 2012-07-03 | 2013-07-02 | 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020147029845A KR102076066B1 (ko) | 2012-07-03 | 2013-07-02 | 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체 |
Country Status (5)
Country | Link |
---|---|
JP (4) | JP6480660B2 (ja) |
KR (2) | KR102076066B1 (ja) |
CN (2) | CN104395967B (ja) |
TW (2) | TWI635517B (ja) |
WO (2) | WO2014007237A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201533960A (zh) * | 2014-02-21 | 2015-09-01 | Long Time Tech Co Ltd | 碳矽複合電極材料及其製備方法 |
JP6577723B2 (ja) * | 2014-03-10 | 2019-09-18 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、導電材料及び接続構造体 |
JP6431411B2 (ja) * | 2014-03-10 | 2018-11-28 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、導電材料及び接続構造体 |
CN105900180B (zh) * | 2014-06-05 | 2018-07-06 | 积水化学工业株式会社 | 导电糊剂、连接结构体及连接结构体的制造方法 |
JP6592235B2 (ja) * | 2014-10-02 | 2019-10-16 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体 |
EP3047973A3 (en) * | 2015-01-23 | 2016-09-07 | Konica Minolta, Inc. | Inkjet head, method of producing inkjet head, and inkjet recording device |
JP2016135563A (ja) * | 2015-01-23 | 2016-07-28 | コニカミノルタ株式会社 | インクジェットヘッド及びインクジェット記録装置 |
JP6610117B2 (ja) * | 2015-09-18 | 2019-11-27 | コニカミノルタ株式会社 | 接続構造体、インクジェットヘッド、インクジェットヘッドの製造方法及びインクジェット記録装置 |
JP6798509B2 (ja) * | 2016-02-10 | 2020-12-09 | 昭和電工マテリアルズ株式会社 | 絶縁被覆導電粒子、異方導電性接着剤、及び接続構造体 |
WO2018139552A1 (ja) * | 2017-01-27 | 2018-08-02 | 日立化成株式会社 | 絶縁被覆導電粒子、異方導電フィルム、異方導電フィルムの製造方法、接続構造体及び接続構造体の製造方法 |
CN110546222A (zh) * | 2017-04-28 | 2019-12-06 | 日立化成株式会社 | 粘接剂组合物及连接体的制造方法 |
JP7312109B2 (ja) * | 2018-04-04 | 2023-07-20 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体 |
KR20200140809A (ko) * | 2018-04-04 | 2020-12-16 | 세키스이가가쿠 고교가부시키가이샤 | 절연성 입자를 갖는 도전성 입자, 도전 재료 및 접속 구조체 |
KR20200140807A (ko) * | 2018-04-04 | 2020-12-16 | 세키스이가가쿠 고교가부시키가이샤 | 절연성 입자를 갖는 도전성 입자, 절연성 입자를 갖는 도전성 입자의 제조 방법, 도전 재료 및 접속 구조체 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004146261A (ja) * | 2002-10-25 | 2004-05-20 | Sekisui Chem Co Ltd | 絶縁被覆導電性微粒子及び導電接続構造体 |
JP2005044773A (ja) | 2003-07-07 | 2005-02-17 | Sekisui Chem Co Ltd | 被覆導電性粒子、異方性導電材料及び導電接続構造体 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2748705B2 (ja) * | 1991-02-14 | 1998-05-13 | 日立化成工業株式会社 | 回路の接続部材 |
CN100437838C (zh) * | 2003-07-07 | 2008-11-26 | 积水化学工业株式会社 | 包覆导电性粒子、各向异性导电材料以及导电连接结构体 |
JP4313664B2 (ja) * | 2003-12-11 | 2009-08-12 | 積水化学工業株式会社 | 突起導電性粒子、被覆導電性粒子及び異方性導電材料 |
JP2005187637A (ja) * | 2003-12-25 | 2005-07-14 | Sekisui Chem Co Ltd | 異方導電性接着剤、液晶表示素子用上下導通材料及び液晶表示素子 |
JP2006269296A (ja) * | 2005-03-24 | 2006-10-05 | Sekisui Chem Co Ltd | 突起粒子の製造方法、突起粒子、導電性突起粒子及び異方性導電材料 |
KR100819524B1 (ko) * | 2007-01-25 | 2008-04-07 | 제일모직주식회사 | 절연 전도성 미립자 및 이를 이용한 이방 전도성 필름 |
JP4862921B2 (ja) * | 2008-07-01 | 2012-01-25 | 日立化成工業株式会社 | 回路接続材料、回路接続構造体及びその製造方法 |
JP5368760B2 (ja) * | 2008-09-29 | 2013-12-18 | 積水化学工業株式会社 | 絶縁被覆導電性粒子、異方性導電材料及び接続構造体 |
JP5548053B2 (ja) * | 2010-07-02 | 2014-07-16 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体 |
JP5060655B2 (ja) * | 2010-07-02 | 2012-10-31 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体 |
JP5703149B2 (ja) * | 2011-07-06 | 2015-04-15 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体 |
JP5667555B2 (ja) * | 2011-12-12 | 2015-02-12 | 株式会社日本触媒 | 導電性微粒子及びそれを含む異方性導電材料 |
JP5667557B2 (ja) * | 2011-12-14 | 2015-02-12 | 株式会社日本触媒 | 導電性微粒子および異方性導電材料 |
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2013
- 2013-07-02 KR KR1020147029845A patent/KR102076066B1/ko active IP Right Grant
- 2013-07-02 KR KR1020147029846A patent/KR102095826B1/ko active IP Right Grant
- 2013-07-02 WO PCT/JP2013/068115 patent/WO2014007237A1/ja active Application Filing
- 2013-07-02 CN CN201380032491.1A patent/CN104395967B/zh active Active
- 2013-07-02 JP JP2013535612A patent/JP6480660B2/ja active Active
- 2013-07-02 WO PCT/JP2013/068116 patent/WO2014007238A1/ja active Application Filing
- 2013-07-02 JP JP2013535614A patent/JP6480661B2/ja active Active
- 2013-07-02 CN CN201380032489.4A patent/CN104380392B/zh active Active
- 2013-07-03 TW TW102123867A patent/TWI635517B/zh active
- 2013-07-03 TW TW102123868A patent/TWI607458B/zh active
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2017
- 2017-10-03 JP JP2017193264A patent/JP6475805B2/ja active Active
- 2017-10-03 JP JP2017193562A patent/JP6470810B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004146261A (ja) * | 2002-10-25 | 2004-05-20 | Sekisui Chem Co Ltd | 絶縁被覆導電性微粒子及び導電接続構造体 |
JP2005044773A (ja) | 2003-07-07 | 2005-02-17 | Sekisui Chem Co Ltd | 被覆導電性粒子、異方性導電材料及び導電接続構造体 |
Also Published As
Publication number | Publication date |
---|---|
KR20150028224A (ko) | 2015-03-13 |
CN104380392A (zh) | 2015-02-25 |
JP6480661B2 (ja) | 2019-03-13 |
KR102076066B1 (ko) | 2020-02-11 |
JP6475805B2 (ja) | 2019-02-27 |
JP2018029072A (ja) | 2018-02-22 |
KR20150028764A (ko) | 2015-03-16 |
CN104395967B (zh) | 2017-05-31 |
CN104395967A (zh) | 2015-03-04 |
TWI607458B (zh) | 2017-12-01 |
JP6480660B2 (ja) | 2019-03-13 |
TWI635517B (zh) | 2018-09-11 |
JP6470810B2 (ja) | 2019-02-13 |
JPWO2014007238A1 (ja) | 2016-06-02 |
JP2018029071A (ja) | 2018-02-22 |
JPWO2014007237A1 (ja) | 2016-06-02 |
TW201403628A (zh) | 2014-01-16 |
WO2014007237A1 (ja) | 2014-01-09 |
TW201405589A (zh) | 2014-02-01 |
CN104380392B (zh) | 2016-11-23 |
WO2014007238A1 (ja) | 2014-01-09 |
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