KR102067987B1 - 기판 절단 장치 - Google Patents

기판 절단 장치 Download PDF

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Publication number
KR102067987B1
KR102067987B1 KR1020170157312A KR20170157312A KR102067987B1 KR 102067987 B1 KR102067987 B1 KR 102067987B1 KR 1020170157312 A KR1020170157312 A KR 1020170157312A KR 20170157312 A KR20170157312 A KR 20170157312A KR 102067987 B1 KR102067987 B1 KR 102067987B1
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KR
South Korea
Prior art keywords
substrate
cutting
axis direction
plate
unit
Prior art date
Application number
KR1020170157312A
Other languages
English (en)
Korean (ko)
Other versions
KR20190059577A (ko
Inventor
정하진
박지웅
조진완
정재석
김동명
김범석
Original Assignee
주식회사 탑 엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 탑 엔지니어링 filed Critical 주식회사 탑 엔지니어링
Priority to KR1020170157312A priority Critical patent/KR102067987B1/ko
Priority to CN201811404723.2A priority patent/CN109824261B/zh
Publication of KR20190059577A publication Critical patent/KR20190059577A/ko
Application granted granted Critical
Publication of KR102067987B1 publication Critical patent/KR102067987B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
KR1020170157312A 2017-11-23 2017-11-23 기판 절단 장치 KR102067987B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020170157312A KR102067987B1 (ko) 2017-11-23 2017-11-23 기판 절단 장치
CN201811404723.2A CN109824261B (zh) 2017-11-23 2018-11-23 基板切割装置及基板切割方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170157312A KR102067987B1 (ko) 2017-11-23 2017-11-23 기판 절단 장치

Publications (2)

Publication Number Publication Date
KR20190059577A KR20190059577A (ko) 2019-05-31
KR102067987B1 true KR102067987B1 (ko) 2020-01-20

Family

ID=66657311

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170157312A KR102067987B1 (ko) 2017-11-23 2017-11-23 기판 절단 장치

Country Status (2)

Country Link
KR (1) KR102067987B1 (zh)
CN (1) CN109824261B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200144168A (ko) * 2019-06-17 2020-12-29 주식회사 탑 엔지니어링 기판 반송 헤드
KR102353208B1 (ko) * 2020-01-29 2022-01-24 주식회사 탑 엔지니어링 기판 절단 장치의 제어 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100748159B1 (ko) * 2001-01-17 2007-08-09 미쓰보시 다이야몬도 고교 가부시키가이샤 절단장치, 절단시스템 및 절단방법
KR100751575B1 (ko) * 2003-09-24 2007-08-22 미쓰보시 다이야몬도 고교 가부시키가이샤 기판 절단 시스템, 기판 제조장치 및 기판 절단방법
KR100753162B1 (ko) 2005-12-29 2007-08-30 주식회사 탑 엔지니어링 모터의 포지션 에러를 이용한 기판 위치 검출 방법 및 이를이용한 스크라이버
KR100824253B1 (ko) * 2006-07-18 2008-04-24 주식회사 에스에프에이 기판 절단시스템 및 그 방법
JP2008024574A (ja) * 2006-07-25 2008-02-07 Optrex Corp 基板の切断方法
TWI435850B (zh) * 2008-01-23 2014-05-01 Mitsuboshi Diamond Ind Co Ltd Scribing device and scribing method
KR101089172B1 (ko) * 2008-04-21 2011-12-02 주식회사 탑 엔지니어링 합착 기판의 단차 스크라이빙 방법 및 그 제어 시스템
TW201008887A (en) * 2008-06-25 2010-03-01 Mitsuboshi Diamond Ind Co Ltd Scribing apparatus
JP4996703B2 (ja) * 2010-02-09 2012-08-08 三星ダイヤモンド工業株式会社 基板分断装置
KR101236805B1 (ko) * 2011-11-16 2013-02-25 세메스 주식회사 기판 커팅 장치 및 기판 커팅 방법
KR102605917B1 (ko) * 2016-04-07 2023-11-27 주식회사 탑 엔지니어링 스크라이빙 장치

Also Published As

Publication number Publication date
CN109824261A (zh) 2019-05-31
KR20190059577A (ko) 2019-05-31
CN109824261B (zh) 2022-12-02

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E701 Decision to grant or registration of patent right
GRNT Written decision to grant