KR102053593B1 - 리프트핀유닛의 이동방법 및 기판처리장치 - Google Patents

리프트핀유닛의 이동방법 및 기판처리장치 Download PDF

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Publication number
KR102053593B1
KR102053593B1 KR1020170162250A KR20170162250A KR102053593B1 KR 102053593 B1 KR102053593 B1 KR 102053593B1 KR 1020170162250 A KR1020170162250 A KR 1020170162250A KR 20170162250 A KR20170162250 A KR 20170162250A KR 102053593 B1 KR102053593 B1 KR 102053593B1
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KR
South Korea
Prior art keywords
substrate
lift pin
unit
pin unit
supply
Prior art date
Application number
KR1020170162250A
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English (en)
Korean (ko)
Other versions
KR20190063286A (ko
Inventor
손홍준
Original Assignee
주식회사 테스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 테스 filed Critical 주식회사 테스
Priority to KR1020170162250A priority Critical patent/KR102053593B1/ko
Priority to TW107141127A priority patent/TWI712103B/zh
Priority to CN201811432476.7A priority patent/CN109841544B/zh
Publication of KR20190063286A publication Critical patent/KR20190063286A/ko
Application granted granted Critical
Publication of KR102053593B1 publication Critical patent/KR102053593B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
KR1020170162250A 2017-11-29 2017-11-29 리프트핀유닛의 이동방법 및 기판처리장치 KR102053593B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020170162250A KR102053593B1 (ko) 2017-11-29 2017-11-29 리프트핀유닛의 이동방법 및 기판처리장치
TW107141127A TWI712103B (zh) 2017-11-29 2018-11-20 頂銷單元的移動方法以及基板處理裝置
CN201811432476.7A CN109841544B (zh) 2017-11-29 2018-11-28 顶销单元的移动方法及基板处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170162250A KR102053593B1 (ko) 2017-11-29 2017-11-29 리프트핀유닛의 이동방법 및 기판처리장치

Publications (2)

Publication Number Publication Date
KR20190063286A KR20190063286A (ko) 2019-06-07
KR102053593B1 true KR102053593B1 (ko) 2019-12-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170162250A KR102053593B1 (ko) 2017-11-29 2017-11-29 리프트핀유닛의 이동방법 및 기판처리장치

Country Status (3)

Country Link
KR (1) KR102053593B1 (zh)
CN (1) CN109841544B (zh)
TW (1) TWI712103B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102288733B1 (ko) * 2019-09-25 2021-08-11 (주)에스티아이 기판처리장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150359A (ja) * 1998-11-18 2000-05-30 Tokyo Electron Ltd 基板熱処理装置及び基板熱処理方法

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JP3214505B2 (ja) * 1991-09-13 2001-10-02 株式会社デンソー 半導体装置の製造方法
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
US6821912B2 (en) * 2000-07-27 2004-11-23 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6767176B2 (en) * 2001-06-29 2004-07-27 Applied Materials, Inc. Lift pin actuating mechanism for semiconductor processing chamber
JP4111703B2 (ja) * 2001-10-19 2008-07-02 アプライド マテリアルズ インコーポレイテッド ウエハリフト機構
TWI271813B (en) * 2002-05-08 2007-01-21 Jusung Eng Co Ltd Apparatus for manufacturing a semiconductor device
JP3929879B2 (ja) * 2002-11-21 2007-06-13 京セラ株式会社 ウェハ支持部材
CN100499059C (zh) * 2006-08-22 2009-06-10 资腾科技股份有限公司 水平手动式晶舟转换器防护装置
KR20080058568A (ko) * 2006-12-22 2008-06-26 세메스 주식회사 리프트 핀 및 이를 갖는 기판 처리 장치
TWM343237U (en) * 2007-02-01 2008-10-21 Applied Materials Inc Mask etch plasma reactor with cathode lift pin assembly
KR101362814B1 (ko) * 2007-04-13 2014-02-21 참엔지니어링(주) 플라즈마 처리 방법
JP2010238716A (ja) * 2009-03-30 2010-10-21 Mitsubishi Electric Corp 基板加熱処理方法、該基板加熱処理方法を用いた表示装置の製造方法、及び基板加熱処理装置
CN101964321B (zh) * 2009-07-22 2012-09-05 北京北方微电子基地设备工艺研究中心有限责任公司 一种基片处理设备及其顶针升降装置
KR100965143B1 (ko) * 2009-10-27 2010-06-25 (주)앤피에스 서셉터 유닛 및 이를 구비하는 기판 처리 장치
JP5551420B2 (ja) * 2009-12-04 2014-07-16 東京エレクトロン株式会社 基板処理装置及びその電極間距離の測定方法並びにプログラムを記憶する記憶媒体
JP2012087336A (ja) * 2010-10-18 2012-05-10 Seiko Epson Corp 基板処理装置、基板処理室のクリーニング方法、および電気光学装置の製造方法
CN102064126B (zh) * 2010-11-04 2013-04-17 友达光电股份有限公司 基板运输处理方法
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CN103668101B (zh) * 2012-09-21 2015-12-16 无锡华润华晶微电子有限公司 沉积成膜装置中所使用的晶圆固定装置
CN104269369A (zh) * 2014-08-29 2015-01-07 沈阳拓荆科技有限公司 一种通过真空装载腔为晶圆预热的装置及方法
CN105779960B (zh) * 2014-12-19 2018-09-18 北京北方华创微电子装备有限公司 沉积组件及半导体加工设备
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CN106486411B (zh) * 2015-09-01 2019-06-11 东京毅力科创株式会社 基板处理装置、升降销的位置检测、调节和异常检测方法
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150359A (ja) * 1998-11-18 2000-05-30 Tokyo Electron Ltd 基板熱処理装置及び基板熱処理方法

Also Published As

Publication number Publication date
KR20190063286A (ko) 2019-06-07
TW201933531A (zh) 2019-08-16
CN109841544A (zh) 2019-06-04
TWI712103B (zh) 2020-12-01
CN109841544B (zh) 2023-05-09

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