KR102045328B1 - Apparatus and method for managing data - Google Patents

Abstract

The present invention relates to a data management apparatus and method, and more particularly, to a data management apparatus and method for managing work data used in Surface Mounting Technology (SMT) equipment.
According to an embodiment of the present invention, a data management apparatus includes: a mounting point data reading unit configured to read mounting point data for at least one component included in a reference board and a first array board mounting the same component at corresponding positions; An offset calculator configured to calculate an offset of the first array board with respect to the reference board for each component with reference to the read mounting point data, and an array data generator configured to generate array data including the calculated offset.

Description

Apparatus and method for managing data}

The present invention relates to a data management apparatus and method, and more particularly, to a data management apparatus and method for managing job data used in Surface Mounting Technology (SMT) equipment.

Surface Mounting Technology (SMT) refers to a technology for attaching a component that can be directly mounted on a surface of a printed circuit board (PCB) to an electronic circuit.

Specifically, in the SMT process, solder paste is printed on a printed circuit board (PCB), various surface mounting devices (SMDs) are mounted on the printed circuit board using a mounter, and then passed through a reflow oven. It refers to the technology of joining PCBs and leads of surface mount components.

Such an SMT line may be referred to as a technology for producing a PCB completed by an organic combination of a plurality of devices, and may include at least one SMT line including a plurality of devices according to a working environment.

In general, in the SMT line, the user generates work data through an offline program OLP. OLP, an operational solutions program, is CAD-based integrated programming software for Applicants' SMT line operations.

1 is a flowchart of CAD data generation for generating conventional job data.

Referring to Figure 1, in order to modify the CAD data to generate the working data, run the CAD program (S10), open the data file to generate the CAD file (S20), the desired data (for example the angle value of the part And the like) (S30), and then store the data (S40).

As such, the data included in the work data may be modified through an offline program, and may also be performed through a program of an SMT device for mounting a surface mount component.

On the other hand, if you want to modify a plurality of data included in the work data may take a lot of time.

Accordingly, there is a need for the emergence of the invention that enables uniform modifications to all or part of data as well as one data contained in the work data.

Korean Unexamined Patent Publication No. 10-2012-0051309 (2012.05.22)

The problem to be solved by the present invention is to be able to perform a uniform modification to all or part of the data as well as one data contained in the working data.

The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the data management apparatus according to the embodiment of the present invention reads the mounting point data for at least one component included in the reference board and the first array board mounting the same component at corresponding respective positions. An array data configured to generate an array data including a mounting point data reading unit, an offset calculator configured to calculate an offset of the first array board with respect to the reference board for each component by reference to the read mounting point data, and the calculated offset It includes a generation unit.

According to an embodiment of the present invention, a data management method includes reading mounting point data of at least one component included in a reference board and an array board mounting the same component at corresponding respective positions, and reading the mounting point data. Computing the offset of the array board with respect to the reference board for each component with reference to, and generating the array data consisting of the calculated offset.

Specific details of other embodiments are included in the detailed description and the drawings.

According to the data management apparatus and method of the present invention as described above, the user can update the work data more easily by allowing a uniform modification to all or part of data as well as one data included in the work data. Will be.

1 is a flowchart of CAD data generation for generating conventional job data.
2 is a diagram illustrating a data management system according to an exemplary embodiment of the present invention.
3 and 4 illustrate a printed circuit board.
5 is a block diagram illustrating a data management apparatus according to an exemplary embodiment of the present invention.
6 is a diagram illustrating a detailed configuration of a data management unit according to an embodiment of the present invention.
7 is a conceptual diagram illustrating a relationship between mounting point data and array data according to an exemplary embodiment of the present invention.
8 is a flowchart illustrating a data management process according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms. The embodiments of the present invention make the posting of the present invention complete and the general knowledge in the technical field to which the present invention belongs. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

2 is a diagram illustrating a data management system according to an exemplary embodiment of the present invention, in which the data management system 200 includes a job file generation device 210, a management server 220, a job file distribution device 230, and an SMT (Surface). Mounting Technology) equipment (241, 242, 243, 244).

The work file generating device 210 serves to generate a work file used by the SMT devices 241, 242, 243, and 244 of the SMT line.

The SMT process includes mounting various Surface Mounting Devices (SMDs) on a printed circuit board (PCB) using a mounter. In the present invention, a work file is required for mounting the surface mount components. It can be understood that mounting sequence data such as CAD data or Bill Of Material (BOM) data is included.

For example, a work file might include a part reference, X value, Y value, Z value, R value, part name, feeder, nozzle, header number, skip information, and level. The same job data may be included.

An off-line program (OLP) may be used in generating a work file by the work file generating device 210, but the present invention is not limited thereto.

The management server 220 stores and distributes the work file generated by the work file generating device 210.

2 illustrates one work file generating device 210 and one work file distribution device 230, the work files generated by the plurality of work file generating devices 210 are managed by the management server 220. Managed and stored work files can be provided to a plurality of work file distribution devices.

Alternatively, a work file may be managed by a plurality of management servers, and an appropriate work file may be supplied to the work file distribution device 230.

The job file distribution device 230 transmits a job file provided from the management server 220 to each SMT device 241, 242, 243, and 244.

In distributing the work file, the work file distribution device 230 may distribute the same work file to all the SMT devices 241, 242, 243, and 244, and may selectively distribute the work file. For example, work file 1 (not shown) provided from management server 220 is distributed to SMT device 1 241 and SMT device 3 243, and work file 2 (not shown) provided from management server 220. May be distributed to the SMT device 2 242, and the work file may not be distributed to the SMT device 4 244.

The SMT equipment 241, 242, 243, and 244 performs an SMT process operation using the work file received from the work file distribution device 230. In the present invention, the SMT equipment 241, 242, 243, and 244 may perform a uniform SMT process operation by receiving the same work file at the same time point, and may receive each other at different time points or as different work files are received. Individual SMT process tasks may also be performed.

The job file can be modified by each device. For example, a user may modify a job file generated using the job file generating device 210, modify a job file using the management server 220, or use the job file distribution device 230. Or modify the work file using the SMT equipment 241, 242, 243, 244.

In addition, each device (210, 220, 230, 241 ~ 244) may include one or more programs that can modify the work file, hereinafter, each device or each program for modifying the work file is called a modification agent.

On the other hand, the printed circuit board may include only one set of parts provided in one product, it may include a plurality of parts provided in a plurality of products. For example, a plurality of detailed printed circuit boards may be included in the printed circuit board, and the same components may be mounted in corresponding positions in each detailed printed circuit board.

However, if the user wants to change the position or posture of the same specific part included in all the detailed printed circuit boards, the user must modify the work data of the corresponding parts for all the detailed printed circuit boards.

To this end, the data management apparatus 500 of the present invention, which will be described later, may generate job data to change the position or attitude of the same components included in each detailed printed circuit board in consideration of the positional relationship between the detailed printed circuit boards. have.

In the present invention, the data management device 500 is included in one of the job file generating device 210, the management server 220, the job file distribution device 230 and the SMT equipment 241, 242, 243, 244 to be configured It may be implemented as a separate device.

3 and 4 illustrate a printed circuit board, in which one printed circuit board 300, 400 includes a plurality of boards 310, 320, 410, 420, and each board 310, 320, 410, 420. Is a diagram showing that the same components a1, b1, c1, d1, a2, b2, c2, d2 are mounted.

Referring to FIG. 3, the board 2 320 has the same posture with respect to the board 1 310 and has parallel positional displacements. That is, on the printed circuit board 300, the board 2 320 is positioned at a distance apart from the board 1 310 by a predetermined distance in the X direction.

In this case, an offset by a distance spaced in the X direction exists between the parts a1, b1, c1, and d1 included in the board 1 310 and the parts a2, b2, c2, and d2 included in the board 2. do.

Therefore, when the distance between the board 1 310 and the board 2 320 is known in advance, the parts included in the board 2 320 may be changed only by changing the position or attitude of the parts included in the board 1 310. The position or posture can also be changed uniformly.

Referring to FIG. 4, the board 2 420 has a parallel positional displacement in a rotational position with respect to the board 1 410. That is, on the printed circuit board 400, the board 2 420 is positioned at a distance apart from the board 1 410 by a predetermined distance in the X direction while being rotated 180 degrees with respect to the board 1 410.

In this case, the parts a1, b1, c1, and d1 included in the board 1 410 and the parts a2, b2, c2 and d2 included in the board 2 420 are rotated 180 degrees and spaced apart in the X direction. There will be an offset by the distance.

Therefore, when the rotation angle and the distance between the board 1 410 and the board 2 420 for each component are known in advance, the board 2 420 may be changed by simply changing the position or attitude of the components included in the board 1 410. The position or posture of the parts included in the) can also be changed uniformly.

As such, when the positional relationship between the boards 1 (310, 410) and the boards 2 (320, 420) is known in advance, the board 2 (320, 420) of the boards 2 (320, 420) can be modified by simply modifying the data. Work data can be modified uniformly.

Hereinafter, data indicating the position and attitude among the data included in the work data is called mounting point data, and data indicating the positional relationship between boards is called array data.

That is, the mounting point data represents the absolute coordinates and the absolute posture of each component on the printed circuit board, and the array data represents the relative coordinates and the relative posture of a specific board with respect to the board which is a reference for each component.

The above-described X value, Y value, Z value, and R value may be included in the mounting point data. Here, the X value, the Y value, and the Z value represent coordinate values in the X-Y-Z space, and the R value represents a rotational attitude of each component with respect to the printed circuit board.

Similar to the mounting point data, array data is provided for each component, and the array data may include an offset X value, an offset Y value, an offset Z value, and an offset R value. Here, the offset X value represents a displacement value in the X axis direction with respect to the corresponding component of the board as a reference, and the offset Y value represents a displacement value in the Y axis direction with respect to the corresponding component of the reference board, and the offset Z The value represents the displacement value in the Z-axis direction of the corresponding component of the reference board, and the offset R value represents the rotational displacement of the corresponding component of the reference board.

For convenience of description, the mounting point data will include an X value, a Y value, and an R value, and the array data will be described with reference to an offset X value, an offset Y value, and an offset R value.

5 is a block diagram illustrating a data management apparatus according to an exemplary embodiment of the present invention. The data management apparatus 500 includes an input unit 510, a storage unit 520, a control unit 530, a data management unit 540, and an interface generation. The unit 550 and the communication unit 560 is included.

The input unit 510 serves to receive mounting point data for a plurality of boards constituting the printed circuit board. The input unit 510 may be implemented in the form of a button, a wheel, a jog shuttle, or the like to receive mounting point data, or may receive the mounting point data by wire or wireless communication. The mounting point data may be input through the input unit 510 in the form of the above-described work file.

In addition, the input unit 510 may receive a command for generating array data and other user commands.

The storage unit 520 stores the mounting point data temporarily or permanently. In addition, the storage unit 520 may store array data of each board. The storage unit 520 may store the mounting point data or the array data in the form of a work file.

The data manager 540 generates array data using mounting point data. The data manager 540 may generate array data using mounting point data input by the input unit 510 or mounting point data stored in the storage unit 520.

6 is a diagram illustrating a detailed configuration of a data management unit according to an exemplary embodiment of the present invention, wherein the data management unit 540 includes a mounting point data reading unit 541, an offset calculating unit 542, an array data generating unit 543, and a mounting point. And a data generator 544.

The mounting point data reading unit 541 reads mounting point data for at least one component included in the reference board and the array board mounting the same component at corresponding positions. The mounting point data may exist in the form of a printed circuit board or board-specific work file, which extracts the mounting point data of each board from the work file and reads the value.

Here, the reference board refers to a board which is a reference for generating array data, and the array board refers to a board to which array data is given based on mounting point data of the reference board.

As described above, one printed circuit board may include a plurality of boards, and the same component may be mounted for each board. Here, one of the plurality of boards may serve as a reference board, and the other board may be an array board.

Referring to FIGS. 3 and 4, one of the first boards 310 and 410 and the second boards 320 and 420 may be a reference board, and the other may be an array board.

In one printed circuit board, there is one reference board but a plurality of array boards may exist, and array data may be provided for each component of the array board.

Referring to FIG. 6 again, the offset calculator 542 calculates the offset of the array board with respect to the reference board for each component by referring to the mounting point data read by the mounting point data reader 541.

For example, if there is a displacement of 5.0 in the X-axis direction between the coordinates of a particular component included in the reference board and the corresponding component included in the array board, then "5.0 displacements in the X-axis direction" Corresponds to the offset.

For example, the offset calculator 542 may calculate the offset of each component by using the following equation, but the offset calculation method by the offset calculator 542 is not limited thereto.

[Equation]

Offset X = X2-X1cos (R2-R1) + Y1sin (R2-R1)

Offset Y = Y2-X1sin (R2-R1)-Y1cos (R2-R1)

Offset R = R2-R1

Here, X1 represents the X-axis mounting point data of the reference board, X2 represents the X-axis mounting point data of the array board, Y1 represents the Y-axis mounting point data of the reference board, Y2 represents the Y-axis mounting point data of the array board, R1 represents mounting point data, which is the rotation angle of the reference board with respect to the printed circuit board, and R2 represents mounting point data, which is the rotation angle of the array board with respect to the printed circuit board.

Meanwhile, some or all of the displacements between components included in the reference board and components included in the array board may be heterogeneous.

For example, the array board is spaced in the X-axis direction with respect to the reference board, and the offsets for the three components may be "4.9", "5.0", and "5.0".

Accordingly, the offset calculator 542 according to the embodiment of the present invention may calculate the offset of the array board with respect to the reference board in consideration of the similarity relationship between the calculated plurality of offsets.

For example, in the above case, since the frequency of occurrence of the offset of "5.0" is high, the offset calculator 542 may determine the final offset of the corresponding component calculated as having the offset of "4.9" as "5.0".

Alternatively, the offset calculator 542 may determine the final offset of each part by reflecting the average of the calculated offsets of all the parts.

In addition, the offset calculator 542 may calculate the offset of components included in each array board by referring to the offset between the array boards. It is assumed that a printed circuit board includes a reference board, a first array board, and a second array board, and an offset of the first array board with respect to the reference board is calculated. In addition, the offset of the array board with respect to the reference board is referred to as a reference offset, and the offset between array boards is referred to as an inter-board offset.

In this case, the offset calculator 542 calculates a reference offset of the second array board with respect to the reference board by referring to the inter-board offset of the second array board and the first array board and the reference offset of the first array board with respect to the reference board. can do. That is, the offset calculator 542 does not compare the mounting point data of the reference board and the mounting point data of the second array board, and uses the offset between boards of the first array board and the second array board to offset the second array board. It can be calculated.

When a plurality of boards included in the printed circuit board are regularly arranged, the board-to-board offset in the printed circuit board may be constant. The offset calculator 542 applies the board-to-board offset to the reference offset of the specific array board. Thus, the reference offset of the adjacent array boards can be calculated.

The array data generator 543 serves to generate array data composed of offsets (reference offsets) calculated by the offset calculator 542. In the present invention, the reference offset means a displacement with respect to the mounting point data of each component included in the reference board. That is, the reference offset is given to each component included in the array board.

Thus, the array data generator 543 may generate array data for the array board by combining the entire reference offsets.

A process of generating array data using mounting point data is illustrated in FIG. 7.

Referring to FIG. 7, the reference point offset 730 of the first array board is calculated using the mounting point data 710 of the reference board and the mounting point data 720 of the first array board.

The array data 740 of the first array board configured with the calculated reference offset 730 of the first array board may be generated.

On the other hand, if there is an inter-board offset between the first array board and the second array board, the inter-board offset is applied to calculate the reference offset 731 of the second array board, based on the array data of the second array board 741 may be generated.

In addition, although not shown in FIG. 7, the mounting point data 710 of the reference board and the mounting point data (not shown) of the second array board are used to calculate a reference offset (not shown) of the second array board. Array data (not shown) of the second array board configured as the reference offset of the second array board may be generated.

Referring again to FIG. 5, the data manager 540 may include a mounting point data generator 544 that generates mounting point data of the array board by applying array data of the array board to mounting point data of the reference board.

The mounting point data generator 544 may generate mounting point data of a corresponding array board by applying array data applied to each array board to mounting point data of a reference board.

For example, if the mounting point data for a reference board for a particular component is X = 5.0, Y = 4.0, R = 0, and the array data for that array board is X = 10.0, Y = -2.0, R = 0, The mounting point data of the array board can be X = 15.0, Y = 2.0, Y = 0.

The generated mounting point data may be modified by the user. That is, the user can arbitrarily modify the mounting point data of the array board as well as the reference board.

In the present invention, the work file may include both the mounting point data and the array data. When the mounting point data is modified, the modified mounting point data and the array data may be included in the working file.

That is, the array data is included in the work file while maintaining the state generated by the array data generating unit 543, and the mounting point data is included in the work file in the state of the mounting point data modified by the user.

Alternatively, the pre-modification mounting point data, the post-modification mounting point data and the array data may all be included in the working file.

Referring back to FIG. 5, the interface generator 550 generates an interface including mounting point data or array data.

The generated interface may be transmitted to another device through the communication unit 560 or may be displayed through a separate display means (not shown).

The controller 530 performs overall control of the input unit 510, the storage unit 520, the data manager 540, the interface generator 550, and the communication unit 560.

8 is a flowchart illustrating a data management process according to an embodiment of the present invention.

The mounting point data reading unit 541 extracts mounting point data of the reference board and the array board from the work file (S810), and reads the extracted mounting point data (S820).

The read mounting point data is transferred to the offset calculator 542, and the offset calculator 542 calculates an offset for each component of the array board with reference to the transferred mounting point data (S830).

The array data generation unit 543 generates array data by combining the calculated offsets (S840).

In the future, by simply modifying the mounting point data of a specific component included in the reference board, the mounting point data of the corresponding component included in the entire array board can be uniformly modified.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. You will understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

510: input unit 520: storage unit
530: control unit 540: data management unit
550: interface generation unit 560: communication unit

Claims (3)

A mounting point data reading unit for reading mounting point data for at least one component included in the reference board and the first array board mounting the same component at corresponding respective positions;
An offset calculator configured to calculate a component-specific offset of the first array board with respect to the reference board with reference to the read mounting point data; And
Including an array data generation unit for generating an array data configured by the calculated component-specific offset,
The offset calculation unit,
Calculating an offset of the first array board with respect to the reference board in consideration of the similarity between the calculated component-specific offsets,
And correct each of the component-specific offsets of the first array board to be equal to the offset of the first array board with respect to the reference board. delete Reading mounting point data for at least one component included in the reference board and the array board mounting the same component at corresponding respective locations;
Calculating a component-specific offset of the array board with respect to the reference board with reference to the read mounting point data; And
Generating array data including the calculated component-specific offsets,
Calculating the offset for each part of the array board,
Calculating an offset of the array board with respect to the reference board in consideration of the similarity between the calculated offsets for each component,
And offset each of the component-specific offsets of the array board to be equal to the offset of the array board relative to the reference board.

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