CN105992512A - Data management apparatus and method - Google Patents
Data management apparatus and method Download PDFInfo
- Publication number
- CN105992512A CN105992512A CN201510944270.2A CN201510944270A CN105992512A CN 105992512 A CN105992512 A CN 105992512A CN 201510944270 A CN201510944270 A CN 201510944270A CN 105992512 A CN105992512 A CN 105992512A
- Authority
- CN
- China
- Prior art keywords
- data
- substrate
- mount point
- array
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000013523 data management Methods 0.000 title abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 106
- 238000003860 storage Methods 0.000 claims description 14
- 230000000875 corresponding effect Effects 0.000 claims description 8
- 230000002596 correlated effect Effects 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 description 7
- 238000007726 management method Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 241001269238 Data Species 0.000 description 2
- 102100037060 Forkhead box protein D3 Human genes 0.000 description 2
- 101001029308 Homo sapiens Forkhead box protein D3 Proteins 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 238000011112 process operation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Operations Research (AREA)
- Geometry (AREA)
- Evolutionary Computation (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Software Systems (AREA)
- Data Mining & Analysis (AREA)
- Databases & Information Systems (AREA)
- Mathematical Physics (AREA)
- Architecture (AREA)
Abstract
The present invention relates to a data management apparatus and method, and particularly relates to a data management apparatus and method for managing work data used in SMT (Surface Mounting Technology) equipment. A data management apparatus according to an embodiment of the present invention comprises: a mounting point data reading unit for reading mounting point data related to at least one part included in a reference substrate and an array substrate for mounting the same parts to corresponding positions; an offset calculating unit for calculating an offset of the array substrate relative to the reference substrate for each part according to the read mounting point data; and an array data generating unit for generating array data composed of the calculated offset.
Description
Technical field
The present invention relates to a kind of data administrator and method, be used for managing SMT in particular to one
The data administrator of the work data used in equipment and method.
Background technology
Surface mounting technology (Surface Mounting Technology；SMT) it is that handle can be directly against being loaded on
Printed circuit board (PCB) (Printed Circuit Board；The parts on surface PCB) are attached at the technology of circuit
General name.
Specifically, SMT technique is a kind of at the upper Printing Paste of printed circuit board (PCB) (PCB), and utilizes
Placement equipment equipment comes various surface mounting devices (Surface Mounting Device；SMD) it is installed to
On printed circuit board (PCB), then make its through reflow soldering so that the lead-in wire of PCB and surface mounting devices
Between engage technology.
This SMT processing line can be described as being to be completed by the organically combination of multiple equipment for production
The technology of PCB, it can be equipped with at least one SMT including multiple equipment according to working environment
Processing line.
Generally, in SMT processing line, user of service can be by the OLP as off-line procedure
(Off-Line Program) generates work data.As the OLP of operating scheme program be a kind of for
Run the integration programming software based on CAD of the SMT processing line of applicant.
Fig. 1 is the cad data genesis sequence figure for generating work data of the prior art.
With reference to Fig. 1, generate work data to revise cad data, run CAD program (S10),
And open data file and generate cad file (S20), then add/revise required data (such as,
The angle value etc. of parts) (S30), then store data (S40).
So, the amendment operation of the data that work data includes can be performed by off-line procedure, also
Can be performed by the program of the SMT equipment for installing surface mounting devices.
It addition, when multiple data that amendment is contained in work data, it may be necessary to when consuming more
Between.
It is, therefore, desirable to provide a kind of invention, its data being possible not only to include work data are entered
Row amendment, but also the data of all or part can be performed unified amendment.
[prior art literature]
[patent documentation]
Korean Patent Laid the 10-2012-0051309th (2012.05.22)
Summary of the invention
The technical problem to be solved is to provide a kind of and can not only include work data
One data are modified but also the number that can modify the data of all or part uniformly
According to managing device and method.
The technical problem of the present invention is not limited to technical problem mentioned above, those skilled in the art
Other purposes NM can be clearly understood that according to content set forth below.
In order to solve technical problem as above, data management according to an embodiment of the invention fills
Put and include: mount point digital independent portion, be used for reading mount point data, these mount point data and at least one
Individual parts are correlated with, and these at least one parts are contained in and identical parts are installed on each corresponding position
Reference substrate and array base palte；Side-play amount calculating part, with reference to the described mount point data read by portion
Part calculates the side-play amount of the described array base palte relative to described reference substrate；Array data generating unit,
The array data being made up of the described side-play amount calculated for generation.
Data managing method according to another embodiment of the present invention comprises the steps: that reading installation counts
According to, these mount point data are relevant at least one parts, and these at least one parts are contained in identical portion
Part is installed on reference substrate and the array base palte of each position of correspondence；With reference to the described mount point read
Data and calculate the side-play amount of the described array base palte relative to described reference substrate by parts；Generate by
The array data that the described side-play amount calculated is constituted.
The details of other embodiments are contained in detailed description and accompanying drawing.
Data administrator according to the present invention as above and method, user of service is possible not only to work
The data that industry data include are modified, but also can hold the data of all or part
The amendment that row is unified, therefore user of service can update work data the most easily.
Accompanying drawing explanation
Fig. 1 is the cad data genesis sequence figure for generating work data of the prior art.
Fig. 2 is the figure representing data management system according to an embodiment of the invention.
Fig. 3 and Fig. 4 is the figure representing printed circuit board (PCB).
Fig. 5 is the module map representing data administrator according to an embodiment of the invention.
Fig. 6 is the figure representing the detail structure of Data Management Department according to an embodiment of the invention.
Fig. 7 is the figure representing the relation of mount point data and array data according to an embodiment of the invention.
Fig. 8 is the flow chart of data management processes according to an embodiment of the invention.
Symbol description
510: input unit 520: storage part
530: control portion 540: Data Management Department
550: interface generating unit 560: communication unit
Detailed description of the invention
Hereinafter, referring to the drawings a preferred embodiment of the present invention is described in detail.With reference to basis
Accompanying drawing and the embodiment that describes in detail, advantages of the present invention and feature are also used for these sides achieved the goal
Method can become definitely.But the invention is not limited in embodiments disclosed below, and can be embodied as
Mutually different variform, only in order to intactly disclose the present invention the scope of the present invention is complete
Inform the technical field belonging to the present invention has the technical staff of basic knowledge and the present embodiment is provided,
The present invention is only defined in the category of claims.Run through entire disclosure, identical reference notation
Number refer to identical element.
Without other definition, then all terms used in this specification (include technology and
Term in terms of science) can be used as in the technical field belonging to the present invention having basic knowledge
The implication that personnel can jointly understand.It addition, the term obtaining definition in general dictionary is not having
In the case of the clearest and the most definite definition, will not be explained singularly or exceedingly.
Fig. 2 is the figure representing data management system according to an embodiment of the invention, this data management system
200 are configured to include: job file generating means 210, management server 220, job file distribution dress
Put 230 and SMT (surface mounting technologies；Surface Mounting Technology) device 241,
242、243、244。
Job file generating means 210 act as generate for SMT processing line SMT equipment 241,
242, the job file of 243,244.
SMT technique includes utilizing placement equipment and at printed circuit board (PCB) (Printed Circuit Board；PCB)
The various surface mounting devices of upper installation (Surface Mounting Device；SMD) operation, the present invention
Middle job file can be understood as including: installs the CAD (area of computer aided required for surface mounting devices
Design) data or BOM (Bill Of Material；BOM) the installation sequence data such as data.
Such as, job file may include that parts index, X value, Y value, Z value, R value, parts
Name, feeding machine (feeder), spray/suction nozzle (nozzle), head numbering, omit (skip) information and excellent
The work datas such as first order (level).
Generate in operation at the job file by means of job file generating means 210, it is possible to use off-line
Program (Off-Line Program:OLP), but the invention is not limited in this.
Manage acting as storage and distributing the work generated by job file generating means 210 of server 220
Industry file.
Fig. 2 represents a job file generating means 210 and a job file distributor 230,
But management server 220 can be utilized to manage the operation generated by multiple job file generating means 210
File, it is possible to the job file of storage is provided in multiple job file distributor 230.
Or, can be by multiple management server admin job files, it is possible to applicable job file
It is supplied in job file distributor 230.
The effect of job file distributor 230 is to each SMT equipment 241,242,243,244
The job file provided by management server 220 is provided.
When distributing job file, job file distributor 230 both can be to all of SMT equipment
241, the job file that 242,243,244 distribution are identical, it is also possible to optionally distribute job file.
Such as, management server 220 job file 1 (not shown) provided can distribute to SMT equipment
1 (in Fig. 1 241) and SMT equipment 3 (in Fig. 1 243), carried by management server 220
The job file 2 (not shown) of confession can be supplied to SMT equipment 2 (in Fig. 1 242), and permissible
Distribute job file to SMT equipment 4 (in Fig. 1 244).
SMT equipment 241,242,243,244 utilization receives from job file distributor 230
Job file performs SMT process operation.SMT equipment 241,242,243,244 in the present invention
Both can receive identical job file at identical time point and perform the most identical SMT technique and make
Industry, it is also possible to because time point is different or receives job file is different and perform mutual district
Other SMT process operation.
Job file can be revised by each device.Such as, user can utilize job file to generate dress
Put 210 to revise the job file of generation, or management server 220 can be utilized to revise operation literary composition
Part, or job file distributor 230 can be utilized to revise job file, or SMT can be utilized
Equipment 241,242,243,244 revises job file.
It addition, each device 210,220,230,241～244 can include revising the one of job file
Individual above program, revises each device of job file by being used for below or each program is referred to as amendment
Main body.
It addition, printed circuit board (PCB) can only include a set of parts being provided to a product, it is also possible to include
It is provided to many sets parts of multiple product.Such as, printed circuit board (PCB) can include multiple thin portions printed circuit
Plate, parts identical in each thin portion printed circuit board (PCB) can be mounted on corresponding position respectively.
But, to the position of identical particular elements or the appearance being contained in all thin portions printed circuit board (PCB)
When gesture changes, user needs the operation number of the associated components corresponding to all thin portions printed circuit board (PCB)
According to modifying.
To this end, the following data administrator 500 according to the present invention can generate following work data:
Make in view of the position relationship of thin portion printed circuit board (PCB) that each thin portion printed circuit board (PCB) includes is identical
Position or posture corresponding to parts change.
In the present invention, data administrator 500 may be embodied in job file generating means 210, pipe
Reason server 220, job file distributor 230 and SMT equipment 241,242,243,244
In any one and constitute, it is also possible to be embodied as single device.
Fig. 3 and Fig. 4 is the figure representing printed circuit board (PCB), and it represents a printed circuit board (PCB) 300,400
Including multiple substrates 310,320,410,420, and on each substrate 310,320,410,420
Mount identical parts a1, b1, c1, d1, a2, b2, c2, d2.
With reference to Fig. 3, it represents that substrate 2 (320) has identical posture relative to substrate 1 (310)
Situation with parallel displacement.That is, on printed circuit board (PCB) 300, substrate 2 (320) is relative to base
Plate 1 (310) and be positioned at the position of predetermined distance along the X direction under the state that do not rotates.
In the case, parts a1, b1, c1, d1 that substrate 1 (310) includes and substrate 2 wrap
Side-play amount big as the most separated by a distance is there is between parts a2, b2, c2, d2 of including
(offset)。
Therefore, know in advance substrate 1 (310) and substrate 2 (320) separated by a distance in the case of,
Only by changing position or the posture of the parts that substrate 1 (310) includes, it is possible to change uniformly
The position of the parts that substrate 2 (320) includes or posture.
With reference to Fig. 4, it represents that substrate 2 (420) has the posture of rotation relative to substrate 1 (410)
Situation with parallel displacement.That is, on printed circuit board (PCB) 400, substrate 2 (420) is relative to base
Plate 1 (410) and revolve turnback state under be positioned at and be separated by with substrate 1 (410) along the X direction
The position of preset distance.
In the case, substrate 1 (410) includes parts a1, b1, c1, d1 and substrate 2 (420)
Following side-play amount is there is: the rotation of 180 degree between parts a2, b2, c2, d2 of including；With edge
X-direction equal translation separated by a distance.
Therefore, the anglec of rotation between the substrate 1 (410) of parts and substrate 2 (420) is pressed in understanding in advance
In the case of spending and being separated by a distance, can be only by changing the position of the parts that substrate 1 (410) include
Put or posture and change position or the posture of the parts that substrate 2 (420) includes uniformly.
As it has been described above, knowing in advance between substrate 1 (310,410) and substrate 2 (320,420)
In the case of position relationship, only by the work data of substrate 1 (310,410) is modified, just
The work data of substrate 2 (320,420) can be revised uniformly.
Hereinafter, it is included in the data of work data the data for representing position and posture and is referred to as peace
Mounting point data, and represent that the data of the position relationship between substrate are referred to as array (array) data by being used for.
That is, mount point data represent the absolute coordinate of all parts on printed circuit board (PCB) and absolute posture,
Array data represent the relative coordinate by the particular substrate relative to the substrate as benchmark of all parts with
And relative pose.
Mount point data can include above-mentioned X value, Y value, Z value, R value.Here, X value, Y
Value, Z value represent X-Y-Z coordinate figure spatially；R value represents each portion relative to printed circuit board (PCB)
The rotation gesture of part.
Identical with mount point data, give array data by all parts, array data may include that
Offset X value, side-play amount Y value, side-play amount Z value, side-play amount R value.Here, offset X value
Represent the shift value along X-direction of the associated components relative to the substrate as benchmark；Side-play amount Y value
Represent the shift value along Y direction of the associated components relative to the substrate as benchmark；Side-play amount Z value
Represent the shift value along Z-direction of the associated components relative to the substrate as benchmark；Side-play amount R value
Represent the swing offset of the associated components relative to the substrate as benchmark.
For convenience of description, X value, Y value, R value and array data bag are included with mount point data below
Include offset X value, side-play amount Y value, the situation of side-play amount R value are main illustrating.
Fig. 5 is the module map representing data administrator according to an embodiment of the invention, and data management fills
Put 500 to include: input unit 510, storage part 520, control portion 530, Data Management Department 540, interface
Generating unit 550 and communication unit 560.
The effect of input unit 510 is to receive the mount point data about the multiple substrates constituting printed circuit board (PCB).
Input unit 510 both can be realized by forms such as button, wheel, shuttle knobs (jog shuttle) and receive
Mount point data, it is also possible to receive mount point data by wired or communication.Mount point
Data can be received with above-mentioned job file form by input unit 510.
It addition, input unit 510 can be with the generation order of receiving array data and other user commands.
The effect of storage part 520 is temporarily or permanently to store mount point data.It addition, storage part
520 array datas that can store each substrate.Storage part 520 can be mount point data or array
Data are stored as the form of job file.
When storage array data, storage part 520 can sort according to the order being previously set and store
Array data.For example, it is possible to the order of the parts included according to substrate carrys out arrayed data sequence, it is possible to
Carry out arrayed data sequence with the order according to mount point data, and store with the form of job file.
The effect of Data Management Department 540 is to utilize mount point data to generate array data.Data Management Department
540 can be utilized the mount point data inputted by input unit 510 or be stored in storage part 520
Mount point data generate array data.
Fig. 6 is the figure representing the detail structure of Data Management Department according to an embodiment of the invention, data pipe
Reason portion 540 is configured to include: mount point digital independent portion 541, side-play amount calculating part 542, array data
Generating unit 543 and mount point data generating section 544.
Mount point digital independent portion 541 performs following function: reading mount point data, this installation is counted
According to relevant at least one parts, these at least one parts are contained in and identical parts are installed on correspondence
The reference substrate of each position and array base palte.Mount point data can be with by printed circuit board (PCB) or press
The form of the job file of substrate exists, for extracting the mount point data of each substrate from job file
And read the value of these data.
Here, reference substrate refers to the substrate on the basis of becoming when generating array data, array base palte refers to
Mount point data based on reference substrate and be endowed the substrate of array data.
As it has been described above, a printed circuit board (PCB) can include multiple substrate, it is possible to paste by each substrate
Pretend with parts.Here, an effect that can perform reference substrate in multiple substrates, and other
Substrate can be array base palte.
Illustrate referring to Fig. 3 and Fig. 4.Substrate 1 (310,410) and substrate 2 (320,
420) one in can become reference substrate, and remaining one can become array base palte.
In a printed circuit board (PCB), reference substrate is one, but array base palte can exist multiple,
And array data can be given by the parts of each array base palte.
Explanatory diagram 6 again, side-play amount calculating part 542 performs to act on as follows: with reference to by mount point data
Mount point data that reading part 541 reads and calculate the array base palte relative to reference substrate by parts
Side-play amount.
Such as, the corresponding component that the coordinate of the particular elements included when reference substrate and array base palte include
When there is the displacement equal to 5.0 along X-direction between coordinate, " the position equal to 5.0 along X-direction
Move " it is equivalent to the side-play amount of these parts.
Such as, side-play amount calculating part 542 can utilize following mathematical expression to calculate the inclined of all parts
Shifting amount, but the side-play amount calculation by means of side-play amount calculating part 542 is not limited thereto.
[mathematical expression]
Offset X=X2-X1cos (R2-R1)+Y1sin (R2-R1)
Side-play amount Y=Y2-X1sin (R2-R1)-Y1cos (R2-R1)
Side-play amount R=R2-R1
Wherein, X1 represents the mount point data in the X-axis of reference substrate；X2 represents the X of array base palte
Mount point data on axle；Y1 represents the mount point data in the Y-axis of reference substrate；Y2 represents array
Mount point data in the Y-axis of substrate；R1 represents the anglec of rotation of the reference substrate relative to printed circuit board (PCB)
The mount point data of degree；R2 represents the mount point of the anglec of rotation of the array base palte relative to printed circuit board (PCB)
Data.
It addition, in displacement between the parts that include of the parts that include of reference substrate and array base palte, one
Point or all can be different.
Such as, array base palte can be separated by along X-direction with reference substrate, and with three parts
Corresponding side-play amount can be " 4.9 ", " 5.0 ", " 5.0 ".
To this, according to an embodiment of the invention side-play amount calculating part 542 can consider to calculate multiple
Similarity relation between side-play amount and calculate the side-play amount of the array base palte relative to reference substrate.
Such as, in the case of as above, the occurrence frequency of " 5.0 " this side-play amount is higher, therefore side-play amount
Calculating part 542 can be defined as the final side-play amount of the associated components that side-play amount is " 4.9 " calculated
“5.0”。
Or, side-play amount calculating part 542 can reflect the meansigma methods of the side-play amount of all parts calculated
And determine the final side-play amount of all parts.
It addition, side-play amount calculating part 542 can also calculate with reference to the side-play amount between array base palte respectively
The side-play amount of the parts that individual array base palte includes.Assume printed circuit board (PCB) include reference substrate, first gust
Row substrate and the second array base palte, and calculated the inclined of the first array base palte relative to reference substrate
Shifting amount.Further, the side-play amount of the array base palte relative to reference substrate is called datum offset amount, and handle
Side-play amount between array base palte is referred to as side-play amount between substrate.
In the case, side-play amount calculating part 542 is referred to the second array base palte and the first array base palte
Between substrate between side-play amount and relative to reference substrate the first array base palte datum offset amount and based on
Calculate the datum offset amount of the second array base palte relative to reference substrate.That is, side-play amount calculating part 542
The mount point data of reference substrate and the mount point data of the second array base palte can not be compared, but permissible
Side-play amount between the substrate between the first array base palte and the second array base palte is utilized to calculate the second array base
The side-play amount of plate.
In the case of the multiple substrates included in the printed circuit boards regularly arrange, this printed circuit board (PCB)
Substrate between side-play amount be probably constant, side-play amount calculating part 542 can be to the base of specific array substrate
Side-play amount between quasi-side-play amount application substrate, thus calculate the datum offset amount of adjacent array base palte.
The effect of array data generating unit 543 is to generate to be calculated by by means of side-play amount calculating part 542
The array data that constitutes of side-play amount (datum offset amount).In the present invention, datum offset amount refers to
The displacement of the mount point data of all parts included relative to reference substrate.That is, by array base palte
Including all parts and give datum offset amount.
Here, array data generating unit 543 can be combined all datum offset amounts and generate relatively
Array data in associated array substrate.
Fig. 7 represents and utilizes mount point data to generate the process of array data.
With reference to Fig. 7, utilize mount point data 710 and the mount point of the first array base palte of reference substrate
Data 720 and calculate the datum offset amount (730) of the first array base palte.
It is then possible to generate first be made up of the datum offset amount 730 of the first array base palte calculated
The array data (740) of array base palte.
It addition, when between the substrate existed between the first array base palte and the second array base palte during side-play amount, can
The datum offset amount (731) of the second array base palte is calculated with side-play amount between application substrate, and based on this
And generate the array data (741) of the second array base palte.
Although it addition, represent the most in the figure 7, but the mount point data 710 of reference substrate can be utilized
And second array base palte mount point data (not shown) and to calculate the benchmark of the second array base palte inclined
Shifting amount (not shown), and generate second gust be made up of the datum offset amount of the second array base palte calculated
The array data (not shown) of row substrate.
Again illustrating Fig. 5, Data Management Department 540 may include that mount point data generating section 544,
Array data to the mount point market demand array base palte of reference substrate, thus generate the peace of array base palte
Mounting point data.
Mount point data generating section 544 is given to each array base to the mount point market demand of reference substrate
The array data of plate, such that it is able to generate the mount point data of associated array substrate.
Such as, if corresponding to the mount point data of the reference substrate of particular elements be X=5.0, Y=4.0,
R=0, and the array data of associated array substrate is X=10.0, Y=-2.0, R=0, then associated array substrate
Mount point data can be X=15.0, Y=2.0, R=0.
As it has been described above, storage part 520 can sort also according to the order of the mount point data of reference substrate
Storage array data.To this, mount point data generating section 544 can extract the array data of sequence successively
And generate the mount point data of array base palte.Accordingly, mount point data and the battle array of reference substrate can be performed
Synchronization between the mount point data of row substrate.
The mount point data generated by means of mount point data generating section 544 can be revised by user.
That is, user is possible not only to revise reference substrate, but also the installation that can arbitrarily revise array base palte is counted
According to.
In the present invention, job file can include that mount point data and array data are constituted in the lump, in peace
In the case of mounting point data is revised, the mount point data of amendment and array data can be contained in operation
In file.
That is, array data maintains the state generated by array data generating unit 543 and is included in job file
In, the state of mount point data then mount point data to be revised by user is included in job file.
Or, the mount point data before amendment, amended mount point data and array data can
It is included in job file.
Referring again to Fig. 5, the effect of interface generating unit 550 is to generate to include mount point data or array
The interface of data.
The interface generated can be sent in other devices by communication unit 560, or can be by means of
The special display unit (not shown) that possessed and shown.
Control portion 530 is for generating input unit 510, storage part 520, Data Management Department 540, interface
Portion 550 and communication unit 560 perform comprehensively to control.
Fig. 8 is the flow chart of data management processes according to an embodiment of the invention.
Mount point digital independent portion 541 extracts reference substrate and the installation of array base palte from job file
Point data (S810), and read the mount point data (S820) extracted.
The mount point data read are transferred to side-play amount calculating part 542, and side-play amount calculating part 542 is joined
The side-play amount by parts (S830) of array base palte is calculated according to the mount point data of transmission.
Then, the side-play amount calculated is combined and generates array data by array data generating unit 543
(S840)。
Afterwards, the mount point data of only particular elements by including reference substrate are modified, just
The mount point data of the associated components that whole array base paltes includes can be revised uniformly.
Embodiments of the invention are illustrated with reference to above content and accompanying drawing, but belonging to the present invention
Technical field has the personnel of ABC be all appreciated that and can not change its technological thought or basic feature
And it is embodied as other concrete forms.It is understood, therefore, that the above embodiment recorded is in all respects and shows
Example rather than determinate.
Claims (4)
1. a data administrator, including:
Mount point digital independent portion, is used for reading mount point data, these mount point data and at least one portion
Part is correlated with, and these at least one parts are contained in the benchmark of each position that identical parts are installed on correspondence
Substrate and array base palte；
Side-play amount calculating part, is calculated relative to described by parts with reference to the described mount point data read
The side-play amount of the described array base palte of reference substrate；And
Array data generating unit, for generating the array data being made up of the described side-play amount calculated.
2. data administrator as claimed in claim 1, wherein,
Described side-play amount calculating part consider the similarity relation between the multiple side-play amounts calculated by parts and by
Described parts calculate the side-play amount of the described array base palte relative to described reference substrate.
3. data administrator as claimed in claim 1, wherein, also includes:
Storage part, sorts according to order set in advance and stores corresponding to being included in described array base palte
At least one parts and the described array data that generates.
4. a data managing method, comprises the steps:
Reading mount point data, these mount point data are relevant at least one parts, these at least one parts
It is contained in reference substrate and the array base palte of each position that identical parts are installed on correspondence；
Calculate relative to described in described reference substrate as parts with reference to the described mount point data read
The side-play amount of array base palte；And
Generate the array data being made up of the described side-play amount calculated.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150038966A KR102045328B1 (en) | 2015-03-20 | 2015-03-20 | Apparatus and method for managing data |
| KR10-2015-0038966 | 2015-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105992512A true CN105992512A (en) | 2016-10-05 |
| CN105992512B CN105992512B (en) | 2018-12-07 |
Family
ID=57039639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510944270.2A Active CN105992512B (en) | 2015-03-20 | 2015-12-16 | Data administrator and method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6239655B2 (en) |
| KR (1) | KR102045328B1 (en) |
| CN (1) | CN105992512B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101438397A (en) * | 2006-05-09 | 2009-05-20 | 东京毅力科创株式会社 | Imaging position correction method, imaging method, and substrate imaging apparatus |
| KR20140112003A (en) * | 2014-08-27 | 2014-09-22 | 박호열 | Method and device for production management of surface mounted tfchnology |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3281457B2 (en) * | 1993-08-04 | 2002-05-13 | 協立電機株式会社 | Board component mounting inspection method and inspection device |
| JPH1154993A (en) * | 1997-08-01 | 1999-02-26 | Yamagata Casio Co Ltd | Component mounting device |
| JP4270618B2 (en) | 1998-11-17 | 2009-06-03 | 山形カシオ株式会社 | Component mounting program creation device |
| JP2001036297A (en) * | 1999-07-23 | 2001-02-09 | Yamagata Casio Co Ltd | Component mounting apparatus |
| JP2004103918A (en) * | 2002-09-11 | 2004-04-02 | Matsushita Electric Ind Co Ltd | Method for preparing common mounting data, program for preparing the same, recording medium with the recorded program, device for preparing common mounting data, and board manufacturing system |
| KR101649855B1 (en) | 2010-11-12 | 2016-08-23 | 한화테크윈 주식회사 | Method for optimizing component mounting sequence with variable pitch head and component mounting device using the same |
| KR101404099B1 (en) * | 2012-09-10 | 2014-06-05 | (주)에스엠티코리아 | Parts mounting information verification apparatus and method |
| JP6075770B2 (en) * | 2013-04-08 | 2017-02-08 | 日置電機株式会社 | Data processing device |
-
2015
- 2015-03-20 KR KR1020150038966A patent/KR102045328B1/en active IP Right Grant
- 2015-12-16 CN CN201510944270.2A patent/CN105992512B/en active Active
-
2016
- 2016-02-02 JP JP2016017788A patent/JP6239655B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101438397A (en) * | 2006-05-09 | 2009-05-20 | 东京毅力科创株式会社 | Imaging position correction method, imaging method, and substrate imaging apparatus |
| KR20140112003A (en) * | 2014-08-27 | 2014-09-22 | 박호열 | Method and device for production management of surface mounted tfchnology |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102045328B1 (en) | 2019-11-15 |
| CN105992512B (en) | 2018-12-07 |
| JP2016177784A (en) | 2016-10-06 |
| KR20160112731A (en) | 2016-09-28 |
| JP6239655B2 (en) | 2017-11-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100581339C (en) | Production condition determining method, production condition determining apparatus, mounter and program | |
| JP6297591B2 (en) | Data update method for circuit board working system and circuit board working system | |
| US20150206086A1 (en) | Production line management method and production line management system | |
| KR20120012442A (en) | Management system of electronic components mounting line | |
| US7409667B1 (en) | Techniques for modeling a circuit board structure | |
| CN107079617B (en) | The control device of electronic part mounting and data input device to the control device input data | |
| JP6395708B2 (en) | Management method and management apparatus for electronic component mounting system having a plurality of production lines | |
| US20110022613A1 (en) | Method and System for Qualifying CAD Objects | |
| CN105992512A (en) | Data management apparatus and method | |
| US6510356B2 (en) | Method and apparatus for programming a paste dispensing machine | |
| CN105159560A (en) | Component alignment method and system in circuit design software | |
| JP6820897B2 (en) | How to prepare the setup kit for the installation machine | |
| JP2011199078A (en) | Management system in electronic component mounting line | |
| JP7050821B2 (en) | Correspondence generator | |
| JP6138195B2 (en) | Data management apparatus and method | |
| CN101770527A (en) | Method for modifying data of circuit components | |
| KR102119055B1 (en) | Method for operation of chip mounter | |
| KR102433792B1 (en) | Apparatus and method for producing mounting point data | |
| KR101217747B1 (en) | Apparatus and Method for Generating Bill of Material for Electronic Part Auto-Inserting System and CAD System | |
| KR102564238B1 (en) | The Apparatus For Updating Job Data | |
| KR102074978B1 (en) | Apparatus and method for providing arrangement pattern | |
| WO2022264256A1 (en) | Data capturing device | |
| CN112329375B (en) | Design method and device for mounting program ECN, electronic equipment and storage medium | |
| JP2014045085A (en) | Support apparatus, support method and program | |
| KR20170084602A (en) | Apparatus and method for managing data |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Gyeongnam Changwon City, South Korea Patentee after: HANWHA AEROSPACE Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Patentee before: HANWHA TECHWIN Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190415 Address after: Gyeongnam Changwon City, South Korea Patentee after: Hanwha Precision Machinery Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Patentee before: HANWHA AEROSPACE Co.,Ltd. |
|
| TR01 | Transfer of patent right |