JP2016177784A - Data management apparatus and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a data management apparatus and method for managing work data for use in SMT (Surface Mounting Technology) equipped therein in the data management apparatus and method.SOLUTION: The data management apparatus according to the present embodiment of the present invention includes: an installation point data read unit that reads installation point data of at least one component included in a reference board and a first array board that include same components installed at corresponding positions respectively; an offset calculation unit that calculates an offset of the first array board with respect to the reference board according to components by referring to the read installation point data; and an array data generation unit that generates array data composed of the calculated offset.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a data management apparatus and method, and more particularly, to a data management apparatus and method for managing work data used in SMT (Surface Mounting Technology) equipment.

  Surface mounting technology (SMT) is a general term for technologies for attaching components that can be directly mounted on the surface of a printed circuit board (PCB) to an electronic circuit.

  Specifically, in the SMT process, solder paste is printed on a printed circuit board (PCB), and various surface mounting components (Surface Mounting Device, SMD) are mounted on the printed circuit board using a mounter. , Refers to a technique of passing between a PCB and a lead of a surface mounting component by passing through a reflow oven.

  Such an SMT line can be said to be a technique for producing a PCB that is completed by an organic combination of a plurality of equipments, but can include at least one SMT line including a plurality of equipments according to the working environment.

  Generally, on the SMT line, a user generates work data by an offline program OLP (Off-Line Program). OLP, an operational solution program, is CAD-based integrated programming software for the operation of the applicant's SMT line.

  FIG. 1 is a flowchart of CAD data generation for generating conventional work data.

  Referring to FIG. 1, a CAD program is executed to correct CAD data to generate work data (S10), a data file is opened to generate a CAD file (S20), and desired data (for example, the angle of a part) After adding / modifying values (S30), the data is stored (S40).

  Thus, the correction of the data included in the work data can be corrected by an offline program, and can also be performed by a program included in the SMT equipment for mounting the surface mount component.

  On the other hand, when trying to correct a plurality of data included in work data, a lot of time is required.

  Therefore, there is a need for an invention that can make uniform corrections not only on one piece of data included in work data, but on all or part of the data.

Korean Published Patent No. 10-2012-0051309

  The problem to be solved by the present invention is to be able to perform uniform correction not only on one piece of data included in work data but also on all or part of the data.

  The problem of the present invention is not limited to the problems mentioned above, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

  In order to achieve the above object, a data management apparatus according to an embodiment of the present invention provides mounting point data for at least one component included in a reference board and a first array board each mounting the same component at a corresponding position. A mounting point data reading unit for reading, an offset calculation unit for calculating an offset of the first array board with respect to the reference board for each part with reference to the read mounting point data, and the calculated offset An array data generation unit for generating array data.

  According to an embodiment of the present invention, there is provided a data management method for reading mounting point data for at least one component included in a reference board and an array board, each of which has the same component mounted at a corresponding position, The method includes calculating an offset of the array board with respect to the reference board for each part with reference to mounting point data, and generating array data composed of the calculated offset.

  Specific contents of other embodiments are included in the detailed description and drawings.

  According to the data management apparatus and method of the present invention, by enabling uniform correction to not only one data included in work data but also all or a part of the data, the user can Work data can be updated more easily.

It is a flowchart of CAD data generation for generating the conventional work data. 1 is a diagram illustrating a data management system according to an embodiment of the present invention. It is a figure which shows a printed circuit board. It is a figure which shows a printed circuit board. It is a block diagram which shows the data management apparatus by embodiment of this invention. It is a figure which shows the detailed structure of the data management part by embodiment of this invention. It is a conceptual diagram which shows the relationship between the mounting point data and array data by embodiment of this invention. FIG. 5 is a flowchart illustrating a data management process according to an embodiment of the present invention.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be realized in various forms different from each other. The present embodiments merely complete the disclosure of the present invention, and It is provided to fully inform those skilled in the art of the scope of the invention and is defined only by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

  Unless otherwise defined, all terms used herein (including technical and scientific terms) are used in a sense that is commonly understood by those of ordinary skill in the art to which this invention belongs. The Also, terms defined in commonly used dictionaries are not ideally or excessively interpreted unless specifically defined and clarified.

  FIG. 2 is a diagram illustrating a data management system according to an embodiment of the present invention. The data management system 200 includes a work file generation device 210, a management server 220, a work file distribution device 230, and SMT (Surface Mounting Technology) equipment (241, 242, 243, 244).

  The work file generation device 210 plays a role of generating a work file used in the SMT equipment (241, 242, 243, 244) of the SMT line.

  The SMT process includes mounting various surface mounting components (Surface Mounting Device, SMD) on a printed circuit board (PCB) using a mounter equipment. It can be understood that mounting sequence data such as CAD data or BOM (Bill Of Material) data necessary for mounting a component is included.

  For example, the work file includes a part reference, an X value, a Y value, a Z value, an R value, a part name, a feeder, a nozzle, a header number, skip information, and a priority level. Such work data may be included.

  An offline program (Off-Line Program, OLP) is used in the generation of the work file by the work file generation apparatus 210, but the present invention is not limited to this.

  The management server 220 plays a role of storing and distributing the work file generated by the work file generating apparatus 210.

  FIG. 2 shows one work file generation device 210 and one work file distribution device 230. The work files generated by a plurality of work file generation devices 210 are managed by the management server 220 and stored. Can be provided to multiple work file distribution devices.

  Alternatively, a work file can be managed by a plurality of management servers, and an appropriate work file can be supplied to the work file distribution device 230.

  The work file distribution device 230 plays a role of transmitting the work file provided from the management server 220 to each SMT equipment (241, 242, 243, 244).

  In distributing the work file, the work file distribution device 230 can distribute the same work file to all the SMT devices (241, 242, 243, 244), and can selectively distribute the work file. For example, the work file 1 (not shown) provided from the management server 220 is distributed to the SMT equipment 1 (241) and the SMT equipment 3 (243), and the work file 2 provided from the management server 220 (not shown). Can be distributed to SMT equipment 2 (242) and work files can not be distributed to SMT equipment 4 (244).

  The SMT equipment (241, 242, 243, 244) performs the SMT process work using the work file received from the work file distribution device 230. In the present invention, the SMT equipment (241, 242, 243, 244) can perform uniform SMT process work by receiving the same work file at the same time, and receive work files at different time points or different from each other. Thus, individual SMT process operations can also be performed.

  The working file can be modified by each device. For example, the user modifies the work file generated using the work file generation device 210, modifies the work file using the management server 220, or modifies the work file using the work file distribution device 230. Or the work file can be modified using the SMT equipment (241, 242, 243, 244).

  Each device (210, 220, 230, 241 to 244) may include one or more programs that can modify the work file. Each device or each program that modifies the following work file is referred to as a modification subject.

  Meanwhile, the printed circuit board may include only a pair of components provided in one product, and may include a plurality of pairs of components provided in a plurality of products. For example, the printed circuit board may include a plurality of detail printed circuit boards, and each detail printed circuit board may have the same component mounted at a corresponding position.

  However, when changing the position or orientation of the same specific component included in all the detailed printed circuit boards, the user must correct the operation data of the corresponding parts for all the detailed printed circuit boards.

  For this reason, the data management device 500 of the present invention, which will be described later, considers the positional relationship between the detailed printed circuit boards, and generates work data that enables the position or orientation of the same component included in each detailed printed circuit board to be changed. Can be generated.

  In the present invention, the data management device 500 may be configured to be included in one of the work file generation device 210, the management server 220, the work file distribution device 230, and the SMT equipment (241, 242, 243, 244). It can also be realized as a device.

  3 and 4 are views showing a printed circuit board, in which one printed circuit board (300, 400) includes a plurality of boards (310, 320, 410, 420), and each board (310, 320, 410). , 420) shows that the same components (a1, b1, c1, d1, a2, b2, c2, d2) are mounted.

  Referring to FIG. 3, the board 2 (320) has the same posture with respect to the board 1 (310) and has a parallel displacement. That is, on the printed circuit board 300, the board 2 (320) is located at a distance away from the board 1 (310) by a certain distance in the X direction without rotating.

  In such a case, the parts (a1, b1, c1, d1) included in the board 1 (310) and the parts (a2, b2, c2, d2) included in the board 2 are separated in the X direction. There is an offset that is the same distance.

  Therefore, if the distance between the board 1 (310) and the board 2 (320) is known in advance, the board 2 (only by changing the position or posture of the components included in the board 1 (310). 320), the position or orientation of the parts included in the component can be uniformly changed.

  Referring to FIG. 4, there is shown a case where the board 2 (420) has a parallel position displacement in a posture rotated with respect to the board 1 (410). That is, on the printed circuit board 400, the board 2 (420) is positioned at a distance away from the board 1 (410) by a certain distance in the X direction while being rotated 180 degrees with respect to the board 1 (410).

  In such a case, there are 180 between the components (a1, b1, c1, d1) included in the board 1 (410) and the components (a2, b2, c2, d2) included in the board 2 (420). There is an offset of a degree rotation and a distance apart in the X direction.

  Therefore, when the rotation angle and the distance between the board 1 (410) and the board 2 (420) are separated in advance, the position or posture of the parts included in the board 1 (410) is changed. Only the position or posture of the parts included in the board 2 (420) can be changed uniformly.

  As described above, when the positional relationship between the board 1 (310, 410) and the board 2 (320, 420) is known in advance, the board 2 can be simply modified by correcting the work data of the board 1 (310, 410). The work data of (320, 420) can be uniformly corrected.

  Hereinafter, data indicating the position and orientation of the data included in the work data is referred to as mounting point data, and data indicating the positional relationship between the boards is referred to as array data.

  That is, the mounting point data indicates the absolute coordinates and orientation of each component on the printed circuit board, and the array data indicates the relative coordinates and relative orientation of the specific board with respect to the reference board for each component.

  The aforementioned X value, Y value, Z value, and R value can be included in the attachment point data. Here, the X value, the Y value, and the Z value indicate coordinate values in the XYZ space, and the R value indicates the rotation posture of each component with respect to the printed circuit board.

  Similar to the mounting point data, the array data is assigned to each part, and the array data can include an offset X value, an offset Y value, an offset Z value, and an offset R value. Here, the offset X value indicates the displacement value in the X-axis direction with respect to the corresponding part of the reference board, the offset Y value indicates the displacement value in the Y-axis direction with respect to the corresponding part of the reference board, and the offset Z value. Indicates the displacement value of the reference board in the Z-axis direction with respect to the corresponding part, and the offset R value indicates the rotational displacement of the reference board with respect to the corresponding part.

  For convenience of explanation, the case where the mounting point data includes an X value, a Y value, and an R value and the array data includes an offset X value, an offset Y value, and an offset R value will be mainly described.

  FIG. 5 is a block diagram showing a data management apparatus according to an embodiment of the present invention. The data management apparatus 500 includes an input unit 510, a storage unit 520, a control unit 530, a data management unit 540, an interface generation unit 550, and a communication unit 560.

  The input unit 510 plays a role of receiving mounting point data input to a plurality of boards constituting the printed circuit board. The input unit 510 is realized in the form of a button, a wheel, a jog shuttle, etc., and can receive input of attachment point data, and can also receive attachment point data by a wired or wireless communication method. The attachment point data can be input via the input unit 510 in the form of the work file described above.

  The input unit 510 may receive an array data generation command and other user commands.

  The storage unit 520 serves to store the mounting point data temporarily or permanently. The storage unit 520 stores the array data of each board. The storage unit 520 can store mounting point data or array data in the form of a work file.

  In storing the array data, the storage unit 520 can store the array data in an aligned manner according to a preset order. For example, the array data can be arranged according to the order of the parts included in the board, or the array data can be arranged according to the order of the mounting point data and stored in the form of a work file.

  The data management unit 540 plays a role of generating array data using the mounting point data. The data management unit 540 can generate array data using the mounting point data input by the input unit 510 or the mounting point data stored in the storage unit 520.

  FIG. 6 is a diagram illustrating a detailed configuration of the data management unit according to the embodiment of the present invention. The data management unit 540 includes a mounting point data interpretation unit 541, an offset calculation unit 542, an array data generation unit 543, and a mounting point data generation unit 544.

  The mounting point data reading unit 541 plays a role of reading mounting point data for at least one component included in the reference board and the array board in which the same components are mounted at corresponding positions. The mounting point data exists in the form of a work file for each printed circuit board or board. The mounting point data for each board is extracted from the work file and the value is read.

  Here, the reference board refers to a board that serves as a reference for generating array data, and the array board refers to a board to which array data is assigned based on mounting point data of the reference board.

  As described above, one printed circuit board includes a plurality of boards, and the same components are mounted on each board. Here, one of the plurality of boards may serve as a reference board, and the remaining boards may be array boards.

  Referring to FIGS. 3 and 4, one of the board 1 (310, 410) and the board 2 (320, 420) is a reference board, and the other is an array board.

  One printed circuit board has one reference board, but there can be a plurality of array boards, and array data can be assigned to each part of each array board.

  Referring back to FIG. 6, the offset calculation unit 542 plays a role of calculating the offset of the array board with respect to the reference board for each component with reference to the mounting point data read by the mounting point data reading unit 541.

  For example, when there is a displacement of 5.0 in the X-axis direction between the coordinates of a specific part included in the reference board and the coordinates of the corresponding part included in the array board, “only 5.0 in the X-axis direction” “Displacement” corresponds to the offset of the corresponding part.

  For example, the offset calculation unit 542 calculates the offset of each component by the following formula, but the offset calculation method by the offset calculation unit 542 is not limited to this.

Offset X = X2-X1cos (R2-R1) + Y1sin (R2-R1)
Offset Y = Y2-X1sin (R2-R1) -Y1cos (R2-R1)
Offset R = R2-R1
... Formula 1

  Here, X1 indicates mounting point data on the X axis of the reference board, X2 indicates mounting point data on the X axis of the array board, Y1 indicates mounting point data on the Y axis of the reference board, and Y2 indicates The mounting point data on the Y axis of the array board is indicated, R1 indicates mounting point data which is the rotation angle of the reference board with respect to the printed circuit board, and R2 indicates the mounting point data of the rotation angle of the array board with respect to the printed circuit board.

  On the other hand, part or all of the displacement between the components included in the reference board and the components included in the array board may be different.

  For example, the array board is separated from the reference board in the X-axis direction, and the offsets for the three parts are “4.9”, “5.0”, and “5.0”.

  In addition, the offset calculation unit 542 according to the embodiment of the present invention can calculate the offset of the array board with respect to the reference board in consideration of the similarity relationship between the plurality of calculated offsets.

  For example, in the above case, since the frequency of occurrence of the offset of “5.0” is high, the offset calculation unit 542 sets the final offset of the corresponding component whose offset is calculated as “4.9” to “5. 0 "can be determined.

  Alternatively, the offset calculation unit 542 can determine the final offset of each component by reflecting the calculated average offset of all components.

  Further, the offset calculation unit 542 can also calculate the offset of a component included in each array board by referring to the offset between the array boards. Assume that the printed circuit board includes a reference board, a first array board, and a second array board, and an offset of the first array board with respect to the reference board is calculated. An offset of the array board with respect to the reference board is referred to as a reference offset, and an offset between array boards is referred to as an inter-board offset.

  In such a case, the offset calculation unit 542 refers to the offset between the second array board and the board of the first array board and the reference offset of the first array board with respect to the reference board, and the second array board relative to the reference board. A reference offset can be calculated. That is, the offset calculation unit 542 does not compare the mounting point data of the reference board and the mounting point data of the second array board, and uses the offset between the first array board and the second array board to use the second array board. Can be calculated.

  When a plurality of boards included in the printed circuit board are regularly arranged, the offset between the boards in the corresponding printed circuit board may be constant, but the offset calculation unit 542 sets the reference offset of the specific array board between the boards. By applying the offset, the reference offset of the adjacent array board can be calculated.

  The array data generation unit 543 plays a role of generating array data composed of the offset (reference offset) calculated by the offset calculation unit 542. In the present invention, the reference offset means a displacement with respect to the mounting point data of each component included in the reference board. That is, a reference offset is given to each part included in the array board.

  The array data generation unit 543 can generate array data for the corresponding array board by combining the entire reference offset.

  FIG. 7 shows a process of generating array data using the attachment point data.

  Referring to FIG. 7, the reference offset 730 of the first array board is calculated using the mounting point data 710 of the reference board and the mounting point data 720 of the first array board.

  Also, the array data 740 of the first array board configured with the calculated reference offset 730 of the first array board can be generated.

  On the other hand, if there is an inter-board offset between the first array board and the second array board, the reference offset 731 of the second array board is calculated by applying the inter-board offset, and the second offset is calculated based on this. Array board array data 741 may be generated.

  Although not shown in FIG. 7, the reference offset (not shown) of the second array board is calculated using the mounting point data 710 of the reference board and the mounting point data (not shown) of the second array board. The array data (not shown) of the second array board configured with the calculated reference offset of the second array board may be generated.

  Referring to FIG. 5 again, the data management unit 540 may include a mounting point data generation unit 544 that generates the mounting point data of the array board by applying the array data of the array board to the mounting point data of the reference board.

  The mounting point data generation unit 544 can generate the mounting point data of the corresponding array board by applying the array data given to each array board to the mounting point data of the reference board.

  For example, the mounting point data of the reference board for a specific part is X = 5.0, Y = 4.0, R = 0, the array data of the corresponding array board is X = 10.0, Y = −2.0, When R = 0, the mounting point data of the corresponding array board is X = 15.0, Y = 2.0, and Y = 0.

  As described above, the storage unit 520 can store the array data in alignment according to the order of the mounting point data of the reference board. In addition, the mounting point data generation unit 544 can sequentially extract the array data arranged to generate the mounting point data of the array board. Thereby, synchronization between the mounting point data of the reference board and the mounting point data of the array board can be performed.

  The mounting point data generated by the mounting point data generation unit 544 can be corrected by the user. That is, the user can arbitrarily correct the mounting point data of the array board as well as the reference board.

  In the present invention, the work file is configured to include both mounting point data and array data. However, when the mounting point data is corrected, the corrected mounting point data and array data can be included in the work file.

  That is, the array data can be included in the work file while maintaining the state generated by the array data generation unit 543, and the attachment point data is included in the work file in the state of the attachment point data corrected by the user.

  Alternatively, the mounting point data before correction, the mounting point data after correction, and the array data can all be included in the work file.

  Referring to FIG. 5 again, the interface generation unit 550 serves to generate an interface including mounting point data or array data.

  The generated interface can be transmitted by another device via the communication unit 560, or can be displayed via a separate display means (not shown) provided.

  The control unit 530 performs general control on the input unit 510, the storage unit 520, the data management unit 540, the interface generation unit 550, and the communication unit 560.

  FIG. 8 is a flowchart illustrating a data management process according to an embodiment of the present invention.

  The mounting point data interpretation unit 541 extracts the mounting point data of the reference board and the array board from the work file (S810), and interprets the extracted mounting point data (S820).

  The read mounting point data is transmitted to the offset calculation unit 542, and the offset calculation unit 542 refers to the transmitted mounting point data to calculate an offset for each part of the array board (S830).

  Further, the array data generation unit 543 generates array data by combining the calculated offsets (S840).

  By simply correcting the mounting point data of the specific component included in the reference board later, the mounting point data of the corresponding component included in the entire array board can be corrected uniformly.

  As described above, the embodiments of the present invention have been described with reference to the accompanying drawings. However, those who have ordinary knowledge in the technical field to which the present invention belongs do not change the technical idea or essential features of the present invention. It will be understood that the present invention can be implemented in other specific forms. Therefore, it should be understood that the above embodiment is illustrative in all aspects and not restrictive.

510 Input unit 520 Storage unit 530 Control unit 540 Data management unit 550 Interface generation unit 560 Communication unit

Claims (4)

A mounting point data reading unit for reading mounting point data for at least one component included in the reference board and the first array board, each mounting the same component at a corresponding position;
An offset calculation unit that calculates an offset of the first array board with respect to the reference board by component with reference to the read mounting point data;
An array data generation unit configured to generate array data composed of the calculated offset.   2. The data management apparatus according to claim 1, wherein the offset calculation unit calculates an offset of the first array board with respect to the reference board for each component in consideration of the similarity relationship between the plurality of calculated offsets.   The data management apparatus according to claim 1, further comprising a storage unit that stores the array data generated for at least one component included in the first array board in an order that is set in advance. Reading mounting point data for at least one component included in a reference board and an array board each mounting the same component at a corresponding position;
Calculating an offset of the array board with respect to the reference board by component with reference to the read mounting point data;
Generating array data composed of the calculated offsets.

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