CN105992512B - Data administrator and method - Google Patents
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- CN105992512B CN105992512B CN201510944270.2A CN201510944270A CN105992512B CN 105992512 B CN105992512 B CN 105992512B CN 201510944270 A CN201510944270 A CN 201510944270A CN 105992512 B CN105992512 B CN 105992512B
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 159
- 238000009434 installation Methods 0.000 claims abstract description 80
- 238000004364 calculation method Methods 0.000 claims abstract description 18
- 238000003860 storage Methods 0.000 claims description 15
- 238000013523 data management Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 238000007726 management method Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000011112 process operation Methods 0.000 description 3
- 102100037060 Forkhead box protein D3 Human genes 0.000 description 2
- 101001029308 Homo sapiens Forkhead box protein D3 Proteins 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 241001269238 Data Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
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- 230000001419 dependent effect Effects 0.000 description 1
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- 239000011159 matrix material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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Abstract
The present invention relates to a kind of data administrator and methods more particularly to a kind of for managing the data administrator and method of work data used in SMT equipment.The data administrator of embodiment according to the present invention includes: installation point reading data portion, point data is installed for reading, the installation point data is related at least one component, which is contained in the reference substrate and array substrate that identical component is installed on to corresponding each position；Offset calculation part is calculated the offset of the array substrate relative to the reference substrate referring to the installation point data read by component；Array data generating unit, the array data constituted for generating the offset calculated.
Description
Technical field
The present invention relates to a kind of data administrator and methods, make in particular to one kind for managing in SMT equipment
The data administrator and method of work data.
Background technique
Surface mounting technology (Surface Mounting Technology；It SMT is) that handle can directly be mounted on printed circuit
Plate (Printed Circuit Board；The component on surface PCB) is attached at the general name of the technology of circuit.
Specifically, SMT technique be one kind on printed circuit board (PCB) Printing Paste, and using mount machine equipment come
Various surface mounting devices (Surface Mounting Device；SMD it) is installed on printed circuit board, then makes its warp
Reflow soldering is crossed, to make the technology engaged between PCB and the lead of surface mounting devices.
This SMT processing line can be described as being the skill for producing the PCB of the organic combination completion by multiple equipment
Art can be equipped at least one SMT processing line including multiple equipment according to operating environment.
In general, user of service can pass through the OLP (Off-Line as off-line procedure in SMT processing line
Program) work data is generated.OLP as operating scheme program is a kind of for running the SMT processing line of applicant
Integration programming software based on CAD.
Fig. 1 is in the prior art for generating the CAD data genesis sequence figure of work data.
Referring to Fig.1, work data is generated in order to modify CAD data, run CAD program (S10), and open data file
And cad file (S20) is generated, then add/modify required data (for example, angle value etc. of component) (S30), then store
Data (S40).
In this way, the modification operation for the data for including in work data can be executed by off-line procedure, can also pass through
The program of SMT equipment for mounting surface mounted member executes.
In addition, when multiple data that modification is contained in work data, it may be necessary to consume the more time.
It is, therefore, desirable to provide a kind of invention, can not only modify to a data for including in work data, and
And can also the data of all or part be executed with unified modification.
[existing technical literature]
[patent document]
Korean Patent Laid the 10-2012-0051309th (2012.05.22)
Summary of the invention
It can not only be to a number for including in work data technical problem to be solved by the present invention lies in one kind is provided
According to modifying but also can be to the data administrator and method that the data of all or part are uniformly modified.
Technical problem of the invention is not limited to technical problem as mentioned above, and those skilled in the art can basis
The content recorded below and be clearly understood that unmentioned other purposes.
In order to solve technical problem as described above, data administrator according to an embodiment of the invention includes:
Installation point reading data portion, for reading installation point data, the installation point data is related at least one component, this at least one
Component is contained in the reference substrate and array substrate that identical component is installed on to corresponding each position；Offset calculates
Portion is calculated the inclined of the array substrate relative to the reference substrate referring to the installation point data read by component
Shifting amount；Array data generating unit, the array data constituted for generating the offset calculated.
Data managing method according to another embodiment of the present invention includes the following steps: to read installation point data, the peace
Mounting point data is related at least one component, which, which is contained in, is installed on corresponding each position for identical component
The reference substrate and array substrate set；It is calculated by component relative to the benchmark referring to the installation point data read
The offset of the array substrate of substrate；Generate the array data that the offset calculated is constituted.
Specifics of other embodiments are contained in detailed description and attached drawing.
According to data administrator and method present invention as described above, user of service not only can be in work data
Including a data modify, but also the data of all or part can be executed with unified modification, therefore make
Work data more can be easily updated with personnel.
Detailed description of the invention
Fig. 1 is in the prior art for generating the CAD data genesis sequence figure of work data.
Fig. 2 is the figure for indicating the data management system of embodiment according to the present invention.
Fig. 3 and Fig. 4 is the figure for indicating printed circuit board.
Fig. 5 is the module map for indicating the data administrator of embodiment according to the present invention.
Fig. 6 is the figure for indicating the detail structure of Data Management Department of embodiment according to the present invention.
Fig. 7 is the figure of the installation point data for indicating embodiment according to the present invention and the relationship of array data.
Fig. 8 is the flow chart of the data management processes of embodiment according to the present invention.
Symbol description
510: input unit 520: storage unit
530: control unit 540: Data Management Department
550: interface generating unit 560: communication unit
Specific embodiment
Hereinafter, a preferred embodiment of the present invention is described in detail referring to attached drawing.Referring to reference to the accompanying drawings and detailed
Describe bright embodiment in detail, these methods that advantages of the present invention and feature are also used to achieve the goal can become more clear.So
And the invention is not limited to embodiments disclosed below, and mutually different variform can be embodied as, only in order to complete
Site preparation, which discloses the present invention and completely informs the scope of the present invention, has basic knowledge in technical field belonging to the present invention
Technical staff and the present embodiment is provided, the present invention only defined in the scope of claims.Through the whole instruction,
Identical reference marks refers to identical constituent element.
If defined without others, in this specification using all terms (including technology and it is scientific for the use of
Term) personnel that can be used as in technical field belonging to the present invention with basic knowledge can jointly understand
Meaning.In addition, the term defined in general dictionary is in the case where especially specific definition, it will not be by exception
Ground is exceedingly explained.
Fig. 2 is the figure for indicating the data management system of embodiment according to the present invention, which is configured to
It include: job file generating means 210, management server 220, job file distributor 230 and SMT (surface mount skill
Art；Surface Mounting Technology) device 241,242,243,244.
The effect of job file generating means 210 is to generate the SMT equipment 241,242,243,244 for being used for SMT processing line
Job file.
SMT technique is including the use of placement equipment and in printed circuit board (Printed Circuit Board；PCB it is installed on)
Various surface mounting devices (Surface Mounting Device；SMD process), the present invention in job file be understood that
To include: (CAD) data of CAD required for mounting surface mounted member or BOM (Bill Of
Material；Bill of materials) the installation sequences data such as data.
For example, job file may include: component index, X value, Y value, Z value, R value, name of parts, feeding machine (feeder),
Spray/suction nozzle (nozzle), omits the work datas such as (skip) information and priority (level) at head number.
It is generated in operation by means of the job file of job file generating means 210, can use off-line procedure (Off-
Line Program:OLP), however the present invention is not limited thereto.
The effect of management server 220 is to store and distribute the job file generated by job file generating means 210.
Fig. 2 indicates a job file generating means 210 and a job file distributor 230, however can benefit
The job file generated by multiple job file generating means 210 is managed with management server 220, and can be the operation of storage
File is provided into multiple job file distributors 230.
Alternatively, job file can be managed by multiple management servers, and suitable job file can be supplied to work
In industry file distribution means 230.
The effect of job file distributor 230 is to send to each SMT equipment 241,242,243,244 by management service
The job file that device 220 provides.
When distributing job file, job file distributor 230 both can to all SMT equipment 241,242,243,
The identical job file of 244 distribution, also distributes job file to the property of can choose.For example, the work provided by management server 220
Industry file 1 (not shown) can distribute to SMT equipment 1 (241 in Fig. 1) and SMT equipment 3 (243 in Fig. 1), by managing
The job file 2 (not shown) that server 220 provides can be supplied to SMT equipment 2 (242 in Fig. 1), and can not give SMT
Equipment 4 (244 in Fig. 1) distributes job file.
SMT equipment 241,242,243,244 is executed using the job file received from job file distributor 230
SMT process operation.SMT equipment 241,242,243,244 can both be put at the same time in the present invention receives identical operation
File and execute same identical SMT process operation, can also job file different because of time point or receiving it is mutual
It is not identical and execute the SMT process operation that is mutually distinguishable.
Job file can be modified by each device.For example, user can use job file generating means 210 to repair
Change the job file of generation, can use management server 220 perhaps to modify job file or can use job file
Distributor 230 modifies job file, or can use SMT equipment 241,242,243,244 to modify job file.
In addition, each device 210,220,230,241~244 may include the more than one journey that can modify job file
Sequence is known as each device for being used to modify job file or each program to modify main body below.
In addition, printed circuit board can only include being provided to a set of component an of product, also may include be provided to it is more
More set components of a product.For example, printed circuit board may include multiple thin portion printed circuit boards, each thin portion printed circuit board
In identical component can be mounted on corresponding position respectively.
However, to the identical particular elements for being contained in all thin portion printed circuit boards position or posture become
When more, user needs the work data the associated components for corresponding to all thin portion printed circuit boards to modify.
For this purpose, following work data can be generated in following data administrators according to the present invention 500: in view of thin
The positional relationship of portion's printed circuit board and make position corresponding to the identical component for including in each thin portion printed circuit board or
Person's posture changes.
In the present invention, data administrator 500 may be embodied in job file generating means 210, management server
220, any one in job file distributor 230 and SMT equipment 241,242,243,244 and constitute, can also be real
It is now individual device.
Fig. 3 and Fig. 4 is the figure for indicating printed circuit board, indicates that a printed circuit board 300,400 includes multiple bases
Plate 310,320,410,420, and mounted on each substrate 310,320,410,420 identical component a1, b1, c1, d1, a2,
b2、c2、d2。
Referring to Fig. 3, substrate 2 (320) posture having the same and parallel displacement relative to substrate 1 (310) is indicated
Situation.That is, substrate 2 (320) relative to substrate 1 (310) in the state of not rotating on printed circuit board 300
Positioned at the position of predetermined distance along the X direction.
Component a2, b2 for including in component a1, b1, c1, the d1 and substrate 2 in the case, including in substrate 1 (310),
Exist and equally big offset (offset) separated by a distance along the X direction between c2, d2.
Therefore, in the case where knowing substrate 1 (310) and substrate 2 (320) separated by a distance in advance, only by changing base
The position for the component for including in plate 1 (310) or posture, so that it may uniformly change the position for the component for including in substrate 2 (320)
It sets or posture.
Referring to Fig. 4, indicate that substrate 2 (420) have the posture of rotation and parallel displacement relative to substrate 1 (410)
Situation.That is, on printed circuit board 400, substrate 2 (420) position in the state of rotating 180 degree relative to substrate 1 (410)
In the position along the X direction and with substrate 1 (410) predetermined distance.
In the case, the component for including in component a1, b1, c1, the d1 and substrate 2 (420) for including in substrate 1 (410)
There are following offsets between a2, b2, c2, d2: the rotation of 180 degree；With equal translation separated by a distance along the X direction.
Therefore, rotation angle between the prior substrate 1 (410) and substrate 2 (420) understood by component and it is separated by
In the case where distance, substrate uniformly only can be changed by the position or posture that change the component that substrate 1 (410) include
The position for the component that 2 (420) include or posture.
As described above, the case where knowing the positional relationship between substrate 1 (310,410) and substrate 2 (320,420) in advance
Under, it is only modified by the work data to substrate 1 (310,410), it will be able to uniformly modify substrate 2 (320,420)
Work data.
Hereinafter, being included in the data of work data for indicating that the data of position and posture are known as installing points
According to, and the data for being used to indicate positional relationship between substrate are known as array (array) data.
That is, absolute coordinate and the absolute posture of all parts on installation point data expression printed circuit board, number of arrays
According to the relative coordinate and relative pose for indicating the particular substrate relative to the substrate as benchmark by all parts.
Installing point data may include above-mentioned X value, Y value, Z value, R value.Here, X value, Y value, Z value indicate the space X-Y-Z
On coordinate value；R value indicates the rotation gesture of all parts relative to printed circuit board.
It is identical as installation point data, assign array data by all parts, array data may include: offset X value,
Offset Y value, offset Z value, offset R value.Here, offset X value indicates the dependent part relative to the substrate as benchmark
The shift value along the x axis of part；Offset Y value indicates the associated components relative to the substrate as benchmark along the y axis
Shift value；Offset Z value indicates the shift value along Z-direction of the associated components relative to the substrate as benchmark；Offset
Measure the swing offset for the associated components that R value is indicated relative to the substrate as benchmark.
For ease of description, below with installation point data include X value, Y value, R value and array data include offset X value,
It is illustrated based on offset Y value, the situation of offset R value.
Fig. 5 is the module map for indicating the data administrator of embodiment according to the present invention, and data administrator 500 wraps
It includes: input unit 510, storage unit 520, control unit 530, Data Management Department 540, interface generating unit 550 and communication unit 560.
The effect of input unit 510 is the installation point data received about the multiple substrates for constituting printed circuit board.Input unit
510 can both be realized by forms such as button, wheel, shuttle knobs (jog shuttle) and receive installation point data, can also be led to
Wired or communication is crossed to receive installation point data.Installing point data can be by input unit 510 with above-mentioned
Job file form receives.
In addition, input unit 510 can receive the generation order and other users order of array data.
The effect of storage unit 520 is that temporarily or permanently point data is installed in storage.In addition, storage unit 520 can be deposited
Store up the array data of each substrate.Storage unit 520 can be stored as installation point data or array data the shape of job file
State.
In storage array data, storage unit 520 can sort according to the sequence being previously set and storage array data.
For example, can be according to the sequence for the component that substrate includes come arrayed data sequence, it can also be according to the sequence of installation point data
Carry out arrayed data sequence, and is stored in the form of job file.
The effect of Data Management Department 540 is to generate array data using installation point data.Data Management Department 540 can benefit
Number of arrays is generated with the installation point data inputted by input unit 510 or the installation point data for being stored in storage unit 520
According to.
Fig. 6 is the figure for indicating the detail structure of Data Management Department of embodiment according to the present invention, 540 structure of Data Management Department
As include: installation point reading data portion 541, offset calculation part 542, array data generating unit 543 and installation point data
Generating unit 544.
Installation point reading data portion 541 executes following function: reading installation point data, the installation point data and at least one
A component is related, at least one component be contained in by identical component be installed on corresponding each position reference substrate and
Array substrate.Installing point data can exist in the form of by printed circuit board or by the job file of substrate, be used for from work
The installation point data of each substrate is extracted in industry file and reads the value of the data.
Here, reference substrate refers to the substrate when generating array data as benchmark, array substrate refers to based on benchmark
The installation point data of substrate and the substrate for being endowed array data.
As described above, a printed circuit board may include multiple substrates, and can be mounted by each substrate identical
Component.Here, one in multiple substrates can execute the effect of reference substrate, and other substrates can be array substrate.
It is illustrated referring to Fig. 3 and Fig. 4.One in substrate 1 (310,410) and substrate 2 (320,420)
Reference substrate can be become, and remaining one can become array substrate.
In a printed circuit board, reference substrate is one, however array substrate is there may be multiple, and can be by each
The component of a array substrate assigns array data.
Explanatory diagram 6 again, offset calculation part 542 execute following effect: reading referring to by installation point reading data portion 541
The installation point data got and the offset that the array substrate relative to reference substrate is calculated by component.
For example, between the coordinate for the corresponding component that the coordinate and array substrate of the particular elements for including when reference substrate include
In the presence of when being equal to 5.0 displacement, " displacement for being equal to 5.0 along the x axis " is equivalent to the offset of the component along the x axis
Amount.
For example, offset calculation part 542 can use following mathematical expression and calculate the offset of all parts, however
It is not limited thereto by means of the offset calculation of offset calculation part 542.
[mathematical expression]
Offset X=X2-X1cos (R2-R1)+Y1sin (R2-R1)
Offset Y=Y2-X1sin (R2-R1)-Y1cos (R2-R1)
Offset R=R2-R1
Wherein, X1 indicates the installation point data in the X-axis of reference substrate；X2 indicates the installation point in the X-axis of array substrate
Data；Y1 indicates the installation point data in the Y-axis of reference substrate；Y2 indicates the installation point data in the Y-axis of array substrate；R1 table
Show the installation point data of the rotation angle of the reference substrate relative to printed circuit board；R2 indicates the battle array relative to printed circuit board
The installation point data of the rotation angle of column substrate.
In addition, in displacement between the component that component and array substrate that reference substrate includes include, a part or complete
It portion can be different.
For example, array substrate can be separated by along X-direction and with reference substrate, and offset corresponding with three components
Amount can be " 4.9 ", " 5.0 ", " 5.0 ".
In this regard, the offset calculation part 542 of embodiment according to the present invention it is contemplated that calculated multiple offsets it
Between similarity relation and calculate the offset of the array substrate relative to reference substrate.
For example, the occurrence frequency of " 5.0 " this offset is higher, therefore offset calculation part 542 in the case where as above
The final offset for the associated components that calculated offset is " 4.9 " can be determined as " 5.0 ".
Alternatively, offset calculation part 542 can reflect the average value of the offset of calculated all components and determine each
The final offset of a component.
In addition, offset calculation part 542 can also calculate each array base referring to the offset between array substrate
The offset for the component for including in plate.Assuming that printed circuit board includes reference substrate, the first array substrate and second array base
Plate, and calculated the offset of the first array substrate relative to reference substrate.Also, the array relative to reference substrate
The offset of substrate is known as datum offset amount, and the offset between array substrate is called offset between substrate.
In the case, offset calculation part 542 is referred to the base between second array substrate and the first array substrate
Between plate offset and relative to the first array substrate of reference substrate datum offset amount and calculate relative to reference substrate
Second array substrate datum offset amount.That is, offset calculation part 542 can not compare the installation point data of reference substrate with
The installation point data of second array substrate, and between the substrate being available between the first array substrate and second array substrate partially
Shifting amount and the offset for calculating second array substrate.
In the case that the multiple substrates for including in the printed circuit boards regularly arrange, between the substrate of the printed circuit board
Offset may be it is constant, offset calculation part 542 can be the datum offset amount application substrate between specific array substrate partially
Shifting amount, to calculate the datum offset amount of adjacent array substrate.
The effect of array data generating unit 543 is generated by the calculated offset by means of offset calculation part 542
The array data that (datum offset amount) is constituted.In the present invention, datum offset amount refer to include relative in reference substrate
The displacement of the installation point data of all parts.That is, assigning datum offset amount by all parts for including in array substrate.
Here, array data generating unit 543 can be combined all datum offset amounts and generate relative to Correlation Matrix
The array data of column substrate.
Fig. 7 indicates the process for using installation point data and generating array data.
Referring to Fig. 7, using the installation point data 710 of reference substrate and the installation point data 720 of the first array substrate
Calculate the datum offset amount (730) of the first array substrate.
It is then possible to the first array substrate that the datum offset amount 730 for generating the first array substrate calculated is constituted
Array data (740).
In addition, base can be applied when there are offset between the substrate between the first array substrate and second array substrate
Offset between plate and the datum offset amount (731) for calculating second array substrate, and second array substrate is generated based on this
Array data (741).
In addition, although not indicated in Fig. 7, can use reference substrate installation point data 710 and second gust
The installation point data (not shown) of column substrate and the datum offset amount (not shown) for calculating second array substrate, and generate by counting
The array data (not shown) for the second array substrate that the datum offset amount of the second array substrate of calculating is constituted.
Fig. 5 is illustrated again, Data Management Department 540 may include: installation point data generating section 544, to benchmark base
The array data of the installation point data application array substrate of plate, to generate the installation point data of array substrate.
Installation point data generating section 544 is given to the array of each array substrate to the installation point data application of reference substrate
Data, so as to generate the installation point data of associated array substrate.
For example, if correspond to particular elements reference substrate installation point data be X=5.0, Y=4.0, R=0, and
The array data of associated array substrate is X=10.0, Y=-2.0, R=0, then the installation point data of associated array substrate can be
X=15.0, Y=2.0, R=0.
As described above, storage unit 520 can be sorted according to the sequence of the installation point data of reference substrate and storage array
Data.In this regard, installation point data generating section 544 can successively extract the array data of sequence and generate the installation point of array substrate
Data.Accordingly, it can execute synchronous between the installation point data of reference substrate and the installation point data of array substrate.
The installation point data generated by means of installation point data generating section 544 can be modified by user.That is, user is not
Reference substrate can be only modified, but also can arbitrarily modify the installation point data of array substrate.
In the present invention, job file can include installation point data and array data together and constitute, in installation point data
In the case where obtaining modification, the installation point data and array data of modification be may include in job file.
That is, array data maintains the state generated by array data generating unit 543 and is included in job file, and install
Point data is then included in job file with the state for the installation point data modified by user.
Alternatively, installation point data, modified installation point data and the array data before modification can be included in and make
In industry file.
Referring again to Fig. 5, the effect of interface generating unit 550 is that generate include to install connecing for point data or array data
Mouthful.
The interface of generation can be sent in other devices by communication unit 560, or can be by means of having
Special display unit (not shown) and shown.
Control unit 530 is used for input unit 510, storage unit 520, Data Management Department 540, interface generating unit 550 and leads to
Letter portion 560 executes comprehensive control.
Fig. 8 is the flow chart of the data management processes of embodiment according to the present invention.
The installation point data of reference substrate and array substrate is extracted from job file in installation point reading data portion 541
(S810), and the installation point data (S820) extracted is read.
The installation point data read is transferred to offset calculation part 542, peace of the offset calculation part 542 referring to transmission
Mounting point data and the offset (S830) by component for calculating array substrate.
Then, array data generating unit 543 is combined calculated offset and generates array data (S840).
Later, it is only modified by the installation point data to the particular elements for including in reference substrate, it will be able to unified
The installation point data for the associated components for including in the whole array substrate of ground modification.
The embodiment of the present invention is illustrated referring to above content and attached drawing, however the technical field belonging to the present invention
In the personnel with basic knowledge be all appreciated that and can not change its technical idea or essential characteristic and be embodied as other specific shapes
State.It is understood, therefore, that the embodiment recorded above is illustratively, without being restrictive in all respects.
Claims (4)
1. a kind of data administrator, characterized by comprising:
Installation point reading data portion, for reading installation point data, the installation point data is related at least one component, this is at least
One component is contained in the reference substrate and array substrate that identical component is installed on to corresponding each position；
Offset calculation part is calculated the institute relative to the reference substrate by component referring to the installation point data read
State the offset of array substrate；And
Array data generating unit, the array data constituted for generating the offset calculated.
2. data administrator as described in claim 1, wherein
The offset calculation part consider the similarity relation between the calculated multiple offsets of component and based on the component
Calculate the offset of the array substrate relative to the reference substrate.
3. data administrator as described in claim 1, wherein further include:
Storage unit, sorting according to preset sequence and storing to correspond to is included at least one of array substrate portion
Part and the array data generated.
4. a kind of data managing method, it is characterised in that include the following steps:
Installation point data is read, the installation point data is related at least one component, which is contained in will be identical
Component be installed on the reference substrate and array substrate of corresponding each position；
The array substrate relative to the reference substrate is calculated by component referring to the installation point data read
Offset；And
Generate the array data that the offset calculated is constituted.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150038966A KR102045328B1 (en) | 2015-03-20 | 2015-03-20 | Apparatus and method for managing data |
| KR10-2015-0038966 | 2015-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
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| CN101438397A (en) * | 2006-05-09 | 2009-05-20 | 东京毅力科创株式会社 | Imaging position correction method, imaging method, and substrate imaging apparatus |
| KR20140112003A (en) * | 2014-08-27 | 2014-09-22 | 박호열 | Method and device for production management of surface mounted tfchnology |
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| JP3281457B2 (en) * | 1993-08-04 | 2002-05-13 | 協立電機株式会社 | Board component mounting inspection method and inspection device |
| JPH1154993A (en) * | 1997-08-01 | 1999-02-26 | Yamagata Casio Co Ltd | Component mounting device |
| JP4270618B2 (en) | 1998-11-17 | 2009-06-03 | 山形カシオ株式会社 | Component mounting program creation device |
| JP2001036297A (en) * | 1999-07-23 | 2001-02-09 | Yamagata Casio Co Ltd | Component mounting apparatus |
| JP2004103918A (en) * | 2002-09-11 | 2004-04-02 | Matsushita Electric Ind Co Ltd | Method for preparing common mounting data, program for preparing the same, recording medium with the recorded program, device for preparing common mounting data, and board manufacturing system |
| KR101649855B1 (en) | 2010-11-12 | 2016-08-23 | 한화테크윈 주식회사 | Method for optimizing component mounting sequence with variable pitch head and component mounting device using the same |
| KR101404099B1 (en) * | 2012-09-10 | 2014-06-05 | (주)에스엠티코리아 | Parts mounting information verification apparatus and method |
| JP6075770B2 (en) * | 2013-04-08 | 2017-02-08 | 日置電機株式会社 | Data processing device |
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| CN101438397A (en) * | 2006-05-09 | 2009-05-20 | 东京毅力科创株式会社 | Imaging position correction method, imaging method, and substrate imaging apparatus |
| KR20140112003A (en) * | 2014-08-27 | 2014-09-22 | 박호열 | Method and device for production management of surface mounted tfchnology |
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| JP6239655B2 (en) | 2017-11-29 |
| CN105992512A (en) | 2016-10-05 |
| KR20160112731A (en) | 2016-09-28 |
| JP2016177784A (en) | 2016-10-06 |
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