KR102038106B1 - 절연층 제조방법 및 다층인쇄회로기판 제조방법 - Google Patents

절연층 제조방법 및 다층인쇄회로기판 제조방법 Download PDF

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Publication number
KR102038106B1
KR102038106B1 KR1020170136513A KR20170136513A KR102038106B1 KR 102038106 B1 KR102038106 B1 KR 102038106B1 KR 1020170136513 A KR1020170136513 A KR 1020170136513A KR 20170136513 A KR20170136513 A KR 20170136513A KR 102038106 B1 KR102038106 B1 KR 102038106B1
Authority
KR
South Korea
Prior art keywords
group
insulating layer
formula
resin layer
alkali
Prior art date
Application number
KR1020170136513A
Other languages
English (en)
Korean (ko)
Other versions
KR20180044816A (ko
Inventor
정우재
경유진
최병주
최보윤
이광주
정민수
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to JP2018559357A priority Critical patent/JP6732047B2/ja
Priority to TW106136345A priority patent/TWI672985B/zh
Priority to PCT/KR2017/011739 priority patent/WO2018080125A1/ko
Priority to CN201780031167.6A priority patent/CN109156084B/zh
Publication of KR20180044816A publication Critical patent/KR20180044816A/ko
Application granted granted Critical
Publication of KR102038106B1 publication Critical patent/KR102038106B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020170136513A 2016-10-24 2017-10-20 절연층 제조방법 및 다층인쇄회로기판 제조방법 KR102038106B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018559357A JP6732047B2 (ja) 2016-10-24 2017-10-23 絶縁層の製造方法および多層印刷回路基板の製造方法
TW106136345A TWI672985B (zh) 2016-10-24 2017-10-23 絕緣層和多層印刷電路板的製造方法
PCT/KR2017/011739 WO2018080125A1 (ko) 2016-10-24 2017-10-23 절연층 제조방법 및 다층인쇄회로기판 제조방법
CN201780031167.6A CN109156084B (zh) 2016-10-24 2017-10-23 用于制造绝缘层和多层印刷电路板的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160138673 2016-10-24
KR20160138673 2016-10-24

Publications (2)

Publication Number Publication Date
KR20180044816A KR20180044816A (ko) 2018-05-03
KR102038106B1 true KR102038106B1 (ko) 2019-10-29

Family

ID=62244703

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170136513A KR102038106B1 (ko) 2016-10-24 2017-10-20 절연층 제조방법 및 다층인쇄회로기판 제조방법

Country Status (4)

Country Link
JP (1) JP6732047B2 (zh)
KR (1) KR102038106B1 (zh)
CN (1) CN109156084B (zh)
TW (1) TWI672985B (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264370A (ja) * 2002-03-11 2003-09-19 Kyocera Chemical Corp 多層プリント配線板とその製造方法、およびそれに用いるプリント配線板用銅箔付き樹脂シート

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970018396A (ko) * 1995-09-11 1997-04-30 김광호 다층배선의 형성 방법
JP3147113B2 (ja) * 1999-03-29 2001-03-19 日本電気株式会社 マザーボードプリント配線板およびその製造方法
KR20140133892A (ko) * 2006-06-06 2014-11-20 히타치가세이가부시끼가이샤 산성 치환기와 불포화 말레이미드기를 갖는 경화제의 제조 방법 및 열경화성 수지 조성물, 프리프레그 및 적층판
KR101275474B1 (ko) * 2007-10-29 2013-06-14 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 포지티브형 감광성 수지 조성물, 패턴의 제조방법 및 전자부품
JP6388450B2 (ja) * 2013-08-13 2018-09-12 太陽インキ製造株式会社 アルカリ現像型光硬化性熱硬化性樹脂組成物およびそれを用いたプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264370A (ja) * 2002-03-11 2003-09-19 Kyocera Chemical Corp 多層プリント配線板とその製造方法、およびそれに用いるプリント配線板用銅箔付き樹脂シート

Also Published As

Publication number Publication date
JP6732047B2 (ja) 2020-07-29
TWI672985B (zh) 2019-09-21
JP2019516252A (ja) 2019-06-13
CN109156084B (zh) 2021-04-30
TW201831060A (zh) 2018-08-16
CN109156084A (zh) 2019-01-04
KR20180044816A (ko) 2018-05-03

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