KR102029522B1 - 마이크로센서 패키지 및 그와 관련된 조립 방법 - Google Patents

마이크로센서 패키지 및 그와 관련된 조립 방법 Download PDF

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KR102029522B1
KR102029522B1 KR1020147029413A KR20147029413A KR102029522B1 KR 102029522 B1 KR102029522 B1 KR 102029522B1 KR 1020147029413 A KR1020147029413 A KR 1020147029413A KR 20147029413 A KR20147029413 A KR 20147029413A KR 102029522 B1 KR102029522 B1 KR 102029522B1
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South Korea
Prior art keywords
substrate
microsensor
bonding
circuit board
printed circuit
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KR1020147029413A
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Korean (ko)
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KR20150031223A (ko
Inventor
제임스 알 언더브린크
마크 셰플라크
딜런 피. 알랙샌더
티파니 엔 레이건
제시카 씨. 멜로이
Original Assignee
더 보잉 컴파니
유니버시티 오브 플로리다 리서치 파운데이션, 아이엔씨.
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Publication of KR20150031223A publication Critical patent/KR20150031223A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/096—Feed-through, via through the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Measuring Fluid Pressure (AREA)
KR1020147029413A 2012-06-15 2013-03-18 마이크로센서 패키지 및 그와 관련된 조립 방법 Active KR102029522B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/524,141 US9278849B2 (en) 2012-06-15 2012-06-15 Micro-sensor package and associated method of assembling the same
US13/524,141 2012-06-15
PCT/US2013/032811 WO2013187987A1 (en) 2012-06-15 2013-03-18 Micro-sensor package and associated method of assembling the same

Publications (2)

Publication Number Publication Date
KR20150031223A KR20150031223A (ko) 2015-03-23
KR102029522B1 true KR102029522B1 (ko) 2019-10-07

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Application Number Title Priority Date Filing Date
KR1020147029413A Active KR102029522B1 (ko) 2012-06-15 2013-03-18 마이크로센서 패키지 및 그와 관련된 조립 방법

Country Status (7)

Country Link
US (1) US9278849B2 (https=)
EP (1) EP2861523B1 (https=)
JP (1) JP6177320B2 (https=)
KR (1) KR102029522B1 (https=)
CN (1) CN104334492B (https=)
CA (1) CA2870476C (https=)
WO (1) WO2013187987A1 (https=)

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US9146164B2 (en) * 2013-03-07 2015-09-29 Sensata Technologies, Inc. Pressure transducer substrate with self alignment feature
WO2016130766A1 (en) * 2015-02-12 2016-08-18 University Of Florida Research Foundation, Inc. Mems capacitive shear sensor system having an interface circuit
JP6344266B2 (ja) * 2015-03-03 2018-06-20 株式会社デンソー 半導体装置およびその製造方法
KR101966491B1 (ko) 2016-03-16 2019-04-05 현대자동차주식회사 전해질 고갈을 방지할 수 있는 리튬 공기 전지
US10737933B2 (en) * 2016-04-05 2020-08-11 University Of Florida Research Foundation, Incorporated Flush-mount micromachined transducers
CN107290099B (zh) 2016-04-11 2021-06-08 森萨塔科技公司 压力传感器、用于压力传感器的插塞件和制造插塞件的方法
EP3236226B1 (en) 2016-04-20 2019-07-24 Sensata Technologies, Inc. Method of manufacturing a pressure sensor
US10545064B2 (en) 2017-05-04 2020-01-28 Sensata Technologies, Inc. Integrated pressure and temperature sensor
US10323998B2 (en) 2017-06-30 2019-06-18 Sensata Technologies, Inc. Fluid pressure sensor
US10724907B2 (en) 2017-07-12 2020-07-28 Sensata Technologies, Inc. Pressure sensor element with glass barrier material configured for increased capacitive response
US10557770B2 (en) 2017-09-14 2020-02-11 Sensata Technologies, Inc. Pressure sensor with improved strain gauge
CN111133768A (zh) * 2017-09-21 2020-05-08 美商楼氏电子有限公司 具有进入保护的麦克风中的提升mems器件
CN108190828B (zh) * 2018-02-07 2024-08-13 北京先通康桥医药科技有限公司 Mems传感器线阵、触诊探头及其制造方法
EP3680211B1 (en) * 2019-01-10 2024-03-06 TE Connectivity Solutions GmbH Sensor unit and method of interconnecting a substrate and a carrier
CN110610953B (zh) * 2019-09-30 2020-06-02 大连环宇安迪科技有限公司 一种相机感测组件及其制造方法
US20240375795A1 (en) * 2023-04-25 2024-11-14 Rohit Gadagkar Electromagnetic propulsion device for generating unidirectional force and method thereof

Citations (3)

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KR100705007B1 (ko) 2005-11-30 2007-04-09 매그나칩 반도체 유한회사 마이크로 센서 및 그 제조방법
JP2009004507A (ja) * 2007-06-20 2009-01-08 Shinko Electric Ind Co Ltd 電子部品用パッケージ及びその製造方法と電子部品装置
US20100084722A1 (en) 2008-09-22 2010-04-08 Torsten Kramer Method for manufacturing a micromechanical chip and a component having a chip of this type

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AU2002333693A1 (en) * 2001-08-24 2003-04-01 Schott Glas Method for producing micro-electromechanical components
US7534722B2 (en) * 2005-06-14 2009-05-19 John Trezza Back-to-front via process
CN101346815B (zh) * 2005-12-26 2012-03-28 京瓷株式会社 微小电子机械装置及其制造方法
JP5011820B2 (ja) * 2006-05-24 2012-08-29 オムロン株式会社 積層デバイス、およびその製造方法
JP2008085508A (ja) * 2006-09-26 2008-04-10 Matsushita Electric Works Ltd 音響センサの製造方法
DE102008025599B4 (de) 2007-05-14 2013-02-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gehäuste aktive Mikrostrukturen mit Direktkontaktierung zu einem Substrat
JP4481323B2 (ja) * 2007-07-20 2010-06-16 日立オートモティブシステムズ株式会社 物理量センサ及びその製造方法
TWI464835B (zh) * 2008-04-04 2014-12-11 藤倉股份有限公司 半導體封裝體及其製造方法
US7929376B2 (en) 2008-04-25 2011-04-19 The Boeing Company Method and apparatus for identifying noise sources
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JP5325630B2 (ja) * 2009-03-27 2013-10-23 株式会社東芝 マイクロホン装置並びにその調整装置及び調整方法
JP5018852B2 (ja) * 2009-09-29 2012-09-05 セイコーエプソン株式会社 圧電デバイスの製造方法
US8580594B2 (en) * 2011-08-09 2013-11-12 Taiwan Semiconductor Manufacturing Company, Ltd. Method of fabricating a semiconductor device having recessed bonding site

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
KR100705007B1 (ko) 2005-11-30 2007-04-09 매그나칩 반도체 유한회사 마이크로 센서 및 그 제조방법
JP2009004507A (ja) * 2007-06-20 2009-01-08 Shinko Electric Ind Co Ltd 電子部品用パッケージ及びその製造方法と電子部品装置
US20100084722A1 (en) 2008-09-22 2010-04-08 Torsten Kramer Method for manufacturing a micromechanical chip and a component having a chip of this type

Also Published As

Publication number Publication date
EP2861523B1 (en) 2016-08-24
JP2015527568A (ja) 2015-09-17
KR20150031223A (ko) 2015-03-23
CN104334492A (zh) 2015-02-04
JP6177320B2 (ja) 2017-08-09
EP2861523A1 (en) 2015-04-22
WO2013187987A1 (en) 2013-12-19
US20130336511A1 (en) 2013-12-19
CA2870476C (en) 2016-11-29
US9278849B2 (en) 2016-03-08
CN104334492B (zh) 2016-08-24
CA2870476A1 (en) 2013-12-19

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