KR102006059B1 - 스핀 코팅 프로세스에서 결함 제어를 위한 덮개 플레이트 - Google Patents

스핀 코팅 프로세스에서 결함 제어를 위한 덮개 플레이트 Download PDF

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Publication number
KR102006059B1
KR102006059B1 KR1020167025698A KR20167025698A KR102006059B1 KR 102006059 B1 KR102006059 B1 KR 102006059B1 KR 1020167025698 A KR1020167025698 A KR 1020167025698A KR 20167025698 A KR20167025698 A KR 20167025698A KR 102006059 B1 KR102006059 B1 KR 102006059B1
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KR
South Korea
Prior art keywords
substrate
fluid flow
flow member
ring
shaped section
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KR1020167025698A
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English (en)
Korean (ko)
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KR20160125429A (ko
Inventor
데렉 더블유. 바셋
월리스 피. 프린츠
조슈아 에스. 후게
가츠노리 이치노
유이치 데라시타
고우스케 요시하라
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20160125429A publication Critical patent/KR20160125429A/ko
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Publication of KR102006059B1 publication Critical patent/KR102006059B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/002Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005Spin coating
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/162Coating on a rotating support, e.g. using a whirler or a spinner

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020167025698A 2014-02-24 2014-02-24 스핀 코팅 프로세스에서 결함 제어를 위한 덮개 플레이트 KR102006059B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/018054 WO2015126425A1 (en) 2014-02-24 2014-02-24 Cover plate for defect control in spin coating

Publications (2)

Publication Number Publication Date
KR20160125429A KR20160125429A (ko) 2016-10-31
KR102006059B1 true KR102006059B1 (ko) 2019-07-31

Family

ID=53878750

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167025698A KR102006059B1 (ko) 2014-02-24 2014-02-24 스핀 코팅 프로세스에서 결함 제어를 위한 덮개 플레이트

Country Status (4)

Country Link
JP (1) JP6448064B2 (zh)
KR (1) KR102006059B1 (zh)
CN (1) CN106132564B (zh)
WO (1) WO2015126425A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107159522B (zh) * 2017-05-24 2023-04-07 吉林大学 一种在叶轮表面均匀涂覆聚氨酯减阻材料的装置
CN108031612A (zh) * 2017-11-28 2018-05-15 宁波美固力磁电有限公司 一种点胶机
CN108816672B (zh) * 2018-06-19 2020-06-26 吉林大学 一种在旋转涂覆叶轮过程中节约材料的方法
JP6606239B1 (ja) * 2018-08-22 2019-11-13 株式会社オリジン 塗布物質塗布済対象物の製造方法
JP7402655B2 (ja) * 2019-10-17 2023-12-21 東京エレクトロン株式会社 基板処理装置
CN111687017A (zh) * 2020-04-24 2020-09-22 河北叁迪光学科技有限公司 一种用于手表的3d曲面屏及其喷涂工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6013316A (en) 1998-02-07 2000-01-11 Odme Disc master drying cover assembly
US6261635B1 (en) 1999-08-27 2001-07-17 Micron Technology, Inc. Method for controlling air over a spinning microelectronic substrate
US8387635B2 (en) 2006-07-07 2013-03-05 Tel Fsi, Inc. Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2359276C3 (de) * 1973-11-28 1979-11-08 Bayer Ag, 5090 Leverkusen Vorrichtung zum quantitativen Aufbringen einer gegebenenfalls verschäumten Flüssigkeit auf eine Fadenschar
JPS6376431A (ja) * 1986-09-19 1988-04-06 Hitachi Ltd スピン塗布装置
JPH0248066A (ja) * 1988-08-10 1990-02-16 Fuji Photo Film Co Ltd スピン塗布装置
US5395649A (en) * 1992-02-04 1995-03-07 Sony Corporation Spin coating apparatus for film formation over substrate
JP3248232B2 (ja) * 1992-02-04 2002-01-21 ソニー株式会社 レジスト塗布装置及びレジストの回転塗布方法
US5211753A (en) * 1992-06-15 1993-05-18 Swain Danny C Spin coating apparatus with an independently spinning enclosure
TW268905B (zh) * 1993-05-20 1996-01-21 Tokyo Electron Co Ltd
JP3605852B2 (ja) * 1994-05-18 2004-12-22 ソニー株式会社 基板の回転塗布装置
JPH0871484A (ja) * 1994-08-31 1996-03-19 Mitsubishi Chem Corp スピンコーター
JPH0910658A (ja) * 1995-06-27 1997-01-14 Hitachi Ltd 塗布方法および塗布装置
JPH11345763A (ja) * 1998-06-02 1999-12-14 Nippon Foundry Inc 半導体基板の処理装置
JP4043163B2 (ja) * 1999-12-24 2008-02-06 エム・セテック株式会社 薬液塗布方法とその装置
US6866431B2 (en) * 2002-02-19 2005-03-15 Canon Kabushiki Kaisha Light amount adjustment apparatus, manufacturing method, and photographing apparatus
TWI265550B (en) * 2002-05-14 2006-11-01 Toshiba Corp Fabrication method, manufacturing method for semiconductor device, and fabrication device
US7323124B2 (en) * 2002-08-14 2008-01-29 Fujifilm Corporation Optical disc cover layer formation method and optical disc cover layer formation device
US6716285B1 (en) * 2002-10-23 2004-04-06 The United States Of America As Represented By The Secretary Of The Air Force Spin coating of substrate with chemical
TWI229367B (en) * 2002-12-26 2005-03-11 Canon Kk Chemical treatment apparatus and chemical treatment method
JP3890026B2 (ja) * 2003-03-10 2007-03-07 東京エレクトロン株式会社 液処理装置および液処理方法
JP4730306B2 (ja) * 2004-06-25 2011-07-20 東レ株式会社 繊維束の製造方法
KR101690047B1 (ko) * 2008-05-09 2016-12-27 티이엘 에프에스아이, 인코포레이티드 개방 동작 모드와 폐쇄 동작 모드사이를 용이하게 변경하는 처리실 설계를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는 장치 및 방법
JP2010137153A (ja) * 2008-12-10 2010-06-24 Tdk Corp スピンコート装置、スピンコート方法及び情報記録媒体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6013316A (en) 1998-02-07 2000-01-11 Odme Disc master drying cover assembly
US6261635B1 (en) 1999-08-27 2001-07-17 Micron Technology, Inc. Method for controlling air over a spinning microelectronic substrate
US8387635B2 (en) 2006-07-07 2013-03-05 Tel Fsi, Inc. Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids

Also Published As

Publication number Publication date
WO2015126425A1 (en) 2015-08-27
JP6448064B2 (ja) 2019-01-09
CN106132564B (zh) 2019-12-20
KR20160125429A (ko) 2016-10-31
JP2017508616A (ja) 2017-03-30
CN106132564A (zh) 2016-11-16

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