KR102002719B1 - 흡착 장치, 진공 처리 장치 - Google Patents

흡착 장치, 진공 처리 장치 Download PDF

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Publication number
KR102002719B1
KR102002719B1 KR1020177030748A KR20177030748A KR102002719B1 KR 102002719 B1 KR102002719 B1 KR 102002719B1 KR 1020177030748 A KR1020177030748 A KR 1020177030748A KR 20177030748 A KR20177030748 A KR 20177030748A KR 102002719 B1 KR102002719 B1 KR 102002719B1
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KR
South Korea
Prior art keywords
terminal
adsorption
power
electrode
receiving
Prior art date
Application number
KR1020177030748A
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English (en)
Korean (ko)
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KR20170129940A (ko
Inventor
다이스케 가와쿠보
겐 마에히라
고우 후와
다카유키 스즈키
Original Assignee
가부시키가이샤 알박
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Application filed by 가부시키가이샤 알박 filed Critical 가부시키가이샤 알박
Publication of KR20170129940A publication Critical patent/KR20170129940A/ko
Application granted granted Critical
Publication of KR102002719B1 publication Critical patent/KR102002719B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Separation Of Gases By Adsorption (AREA)
KR1020177030748A 2015-04-15 2016-04-11 흡착 장치, 진공 처리 장치 KR102002719B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2015-083775 2015-04-15
JP2015083775 2015-04-15
PCT/JP2016/061719 WO2016167224A1 (fr) 2015-04-15 2016-04-11 Dispositif d'aspiration par vide et dispositif de traitement sous vide

Publications (2)

Publication Number Publication Date
KR20170129940A KR20170129940A (ko) 2017-11-27
KR102002719B1 true KR102002719B1 (ko) 2019-07-23

Family

ID=57126024

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177030748A KR102002719B1 (ko) 2015-04-15 2016-04-11 흡착 장치, 진공 처리 장치

Country Status (5)

Country Link
JP (1) JP6400188B2 (fr)
KR (1) KR102002719B1 (fr)
CN (1) CN107431040B (fr)
TW (1) TWI669777B (fr)
WO (1) WO2016167224A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107431040B (zh) * 2015-04-15 2020-10-16 株式会社爱发科 吸附装置、真空处理装置
JP7190802B2 (ja) * 2017-02-16 2022-12-16 日本特殊陶業株式会社 静電チャックおよび基板保持方法
WO2019044290A1 (fr) * 2017-08-28 2019-03-07 株式会社クリエイティブテクノロジー Procédé de maintien de pièce a travailler électrostatique et appareil de maintien de pièce a travailler électrostatique
JP2019057538A (ja) * 2017-09-19 2019-04-11 株式会社アルバック 吸着装置、真空装置
JP7170449B2 (ja) * 2018-07-30 2022-11-14 東京エレクトロン株式会社 載置台機構、処理装置及び載置台機構の動作方法
CN112740367A (zh) * 2018-09-27 2021-04-30 东京毅力科创株式会社 基片处理装置和基片处理方法
JP7292913B2 (ja) * 2019-03-26 2023-06-19 株式会社アルバック 真空装置、運搬装置、アラインメント方法
JP7263082B2 (ja) * 2019-03-29 2023-04-24 株式会社アルバック 真空装置、運搬装置、アラインメント方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009004806A (ja) * 2003-07-08 2009-01-08 Future Vision:Kk 基板ステージ用静電チャック及びそれに用いる電極ならびにそれらを備えた処理システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05315429A (ja) * 1992-05-07 1993-11-26 Hitachi Ltd 半導体製造装置の搬送装置
JPH0851137A (ja) * 1994-08-08 1996-02-20 Shinko Electric Co Ltd 半導体製造装置における搬送装置
JP2004313998A (ja) * 2003-04-18 2004-11-11 Ebara Corp ハロゲン化物の分解装置
CN100576486C (zh) 2005-05-20 2009-12-30 筑波精工株式会社 静电保持装置以及使用其的静电钳
DE202005011367U1 (de) 2005-07-18 2005-09-29 Retzlaff, Udo, Dr. Transfer-ESC auf Wafer-Basis
JP5112808B2 (ja) 2007-10-15 2013-01-09 筑波精工株式会社 静電型補強装置
US8582274B2 (en) * 2009-02-18 2013-11-12 Ulvac, Inc. Tray for transporting wafers and method for fixing wafers onto the tray
JP6312451B2 (ja) * 2014-01-29 2018-04-18 東京エレクトロン株式会社 給電部カバー構造及び半導体製造装置
CN107431040B (zh) * 2015-04-15 2020-10-16 株式会社爱发科 吸附装置、真空处理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009004806A (ja) * 2003-07-08 2009-01-08 Future Vision:Kk 基板ステージ用静電チャック及びそれに用いる電極ならびにそれらを備えた処理システム

Also Published As

Publication number Publication date
CN107431040B (zh) 2020-10-16
JPWO2016167224A1 (ja) 2018-01-18
TW201703186A (zh) 2017-01-16
KR20170129940A (ko) 2017-11-27
TWI669777B (zh) 2019-08-21
JP6400188B2 (ja) 2018-10-03
CN107431040A (zh) 2017-12-01
WO2016167224A1 (fr) 2016-10-20

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