TWI669777B - 吸附裝置、真空處理裝置 - Google Patents

吸附裝置、真空處理裝置 Download PDF

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Publication number
TWI669777B
TWI669777B TW105111663A TW105111663A TWI669777B TW I669777 B TWI669777 B TW I669777B TW 105111663 A TW105111663 A TW 105111663A TW 105111663 A TW105111663 A TW 105111663A TW I669777 B TWI669777 B TW I669777B
Authority
TW
Taiwan
Prior art keywords
power supply
power receiving
adsorption
terminal
power
Prior art date
Application number
TW105111663A
Other languages
English (en)
Chinese (zh)
Other versions
TW201703186A (zh
Inventor
川久保大輔
前平謙
不破耕
鈴木傑之
Original Assignee
日商愛發科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商愛發科股份有限公司 filed Critical 日商愛發科股份有限公司
Publication of TW201703186A publication Critical patent/TW201703186A/zh
Application granted granted Critical
Publication of TWI669777B publication Critical patent/TWI669777B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Separation Of Gases By Adsorption (AREA)
TW105111663A 2015-04-15 2016-04-14 吸附裝置、真空處理裝置 TWI669777B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-083775 2015-04-15
JP2015083775 2015-04-15

Publications (2)

Publication Number Publication Date
TW201703186A TW201703186A (zh) 2017-01-16
TWI669777B true TWI669777B (zh) 2019-08-21

Family

ID=57126024

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105111663A TWI669777B (zh) 2015-04-15 2016-04-14 吸附裝置、真空處理裝置

Country Status (5)

Country Link
JP (1) JP6400188B2 (fr)
KR (1) KR102002719B1 (fr)
CN (1) CN107431040B (fr)
TW (1) TWI669777B (fr)
WO (1) WO2016167224A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107431040B (zh) * 2015-04-15 2020-10-16 株式会社爱发科 吸附装置、真空处理装置
JP7190802B2 (ja) * 2017-02-16 2022-12-16 日本特殊陶業株式会社 静電チャックおよび基板保持方法
WO2019044290A1 (fr) * 2017-08-28 2019-03-07 株式会社クリエイティブテクノロジー Procédé de maintien de pièce a travailler électrostatique et appareil de maintien de pièce a travailler électrostatique
JP2019057538A (ja) * 2017-09-19 2019-04-11 株式会社アルバック 吸着装置、真空装置
JP7170449B2 (ja) * 2018-07-30 2022-11-14 東京エレクトロン株式会社 載置台機構、処理装置及び載置台機構の動作方法
CN112740367A (zh) * 2018-09-27 2021-04-30 东京毅力科创株式会社 基片处理装置和基片处理方法
JP7292913B2 (ja) * 2019-03-26 2023-06-19 株式会社アルバック 真空装置、運搬装置、アラインメント方法
JP7263082B2 (ja) * 2019-03-29 2023-04-24 株式会社アルバック 真空装置、運搬装置、アラインメント方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05315429A (ja) * 1992-05-07 1993-11-26 Hitachi Ltd 半導体製造装置の搬送装置
JPH0851137A (ja) * 1994-08-08 1996-02-20 Shinko Electric Co Ltd 半導体製造装置における搬送装置
JP2009004806A (ja) * 2003-07-08 2009-01-08 Future Vision:Kk 基板ステージ用静電チャック及びそれに用いる電極ならびにそれらを備えた処理システム
WO2010095540A1 (fr) * 2009-02-18 2010-08-26 株式会社アルバック Plateau de transport de plaquette et procédé de fixation de plaquette sur un plateau

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004313998A (ja) * 2003-04-18 2004-11-11 Ebara Corp ハロゲン化物の分解装置
CN100576486C (zh) 2005-05-20 2009-12-30 筑波精工株式会社 静电保持装置以及使用其的静电钳
DE202005011367U1 (de) 2005-07-18 2005-09-29 Retzlaff, Udo, Dr. Transfer-ESC auf Wafer-Basis
JP5112808B2 (ja) 2007-10-15 2013-01-09 筑波精工株式会社 静電型補強装置
JP6312451B2 (ja) * 2014-01-29 2018-04-18 東京エレクトロン株式会社 給電部カバー構造及び半導体製造装置
CN107431040B (zh) * 2015-04-15 2020-10-16 株式会社爱发科 吸附装置、真空处理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05315429A (ja) * 1992-05-07 1993-11-26 Hitachi Ltd 半導体製造装置の搬送装置
JPH0851137A (ja) * 1994-08-08 1996-02-20 Shinko Electric Co Ltd 半導体製造装置における搬送装置
JP2009004806A (ja) * 2003-07-08 2009-01-08 Future Vision:Kk 基板ステージ用静電チャック及びそれに用いる電極ならびにそれらを備えた処理システム
WO2010095540A1 (fr) * 2009-02-18 2010-08-26 株式会社アルバック Plateau de transport de plaquette et procédé de fixation de plaquette sur un plateau

Also Published As

Publication number Publication date
CN107431040B (zh) 2020-10-16
KR102002719B1 (ko) 2019-07-23
JPWO2016167224A1 (ja) 2018-01-18
TW201703186A (zh) 2017-01-16
KR20170129940A (ko) 2017-11-27
JP6400188B2 (ja) 2018-10-03
CN107431040A (zh) 2017-12-01
WO2016167224A1 (fr) 2016-10-20

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