TWI669777B - Adsorption device, vacuum processing device - Google Patents

Abstract

Provided is an adsorption device in which the adsorption force does not become weak.

The power receiving terminal (24) of the adsorption device (19a) is disposed in the power receiving side recess (23), and is configured to be covered by the lid portion (25a). When the substrate (5 ₁ to 5 ₃ ) is adsorbed, the adsorption device (19a) is placed on the power supply station (18a), and the power supply terminal (64) is brought into contact with the power receiving terminal (24), and for the substrate (5) The equivalent capacitance between ₁ ~ 5 ₃ ) and the adsorption electrode (22) is charged. When the adsorption device (19a) is moved, the substrate (5 ₁ to 5 ₃ ) is adsorbed by the residual charge of the equivalent capacitance, and the power receiving side concave portion (23) is covered by the lid portion (25a). The residual gas in the vacuum chamber is not brought into contact with the power receiving terminal (24). In the case where the power receiving terminal (24) is not corroded or a film is formed, the residual charge of the equivalent capacitor is not released.

Description

Adsorption device, vacuum processing device

The present invention relates to an adsorption device and a vacuum processing device, and more particularly to an adsorption device including a vacuum storage device capable of moving in a state in which a substrate is adsorbed in a vacuum atmosphere, and a vacuum supply device on which the adsorption device is placed. Processing device.

When the substrate is processed in a vacuum atmosphere, the substrate is placed on the adsorption device and adsorbed to the adsorption device, and indirectly controlled by the temperature of the adsorption device. A method of controlling the temperature of a substrate.

In recent years, there has been an adsorption device in which a battery is mounted and the substrate can be moved while being adsorbed by the operation of the battery. However, this is expensive and has a large volume.

Further, it is known that the following general adsorption device ‧ ‧ is a battery-free type, and is connected to a power receiving terminal connected to an adsorption electrode of the adsorption device and connected to a power source The power supply terminals of the power supply device are in contact with each other in a stationary state, and the adsorption electrode and the substrate are The equivalent capacitance is charged, and the power receiving terminal and the power supply terminal can be separated from each other and moved. The adsorption device can be adsorbed even when moving, by the residual charge accumulated in the equivalent capacitor. Substrate.

However, in such an adsorption device, there is a case where the adsorption force in the vacuum treatment or the adsorption force during the movement is lowered, and countermeasures are required.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-53348

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-99674

[Patent Document 3] WO2006-123680

The present invention has been made in order to solve the problems of the prior art described above, and an object thereof is to provide a technique capable of adsorbing a substrate without lowering the adsorption force during vacuum processing or during movement.

The inventors of the present invention found that the power receiving terminal of the adsorption device is in contact with the conductive gas atmosphere in the vacuum chamber in a state where a high voltage is applied by residual charge remaining in the equivalent capacitor. Therefore, during the movement, the residual charge is released, and the adsorption force is lowered during the movement. Therefore, if it is to prevent the power receiving terminal from being conductive gas When the body is exposed, the decrease in the adsorption force does not occur.

The invention of the present invention is based on the above-mentioned knowledge, and is an adsorption device comprising: a device body; and a power receiving side recess portion provided at the device body; and at least the power receiving side recess portion a part of the exposed power receiving terminal; and an adsorption electrode disposed at the apparatus body and electrically connected to the power receiving terminal, if the gas-conducting substance having electrical conductivity is placed on the apparatus body The substrate on the surface is in contact, and when a voltage is applied to the adsorption electrode, the substrate is adsorbed to the adsorption electrode. The adsorption device is characterized in that the adsorption electrode is to be disposed in the adsorption device. The power supply terminal placed at the power supply station and connected to the power supply device is inserted into the power receiving side recess, and the power supply terminal is brought into contact with the exposed portion of the power receiving terminal, and the power supply device is applied. The output adsorption voltage is such that the aforementioned power receiving end is applied after the adsorption voltage is applied to the adsorption electrode When the power supply terminal is separated from the power supply terminal, the residual charge remains in the adsorption electrode, and when the power receiving terminal is separated from the power supply terminal and the adsorption device is moved, the residual charge of the adsorption electrode is caused by The substrate is adsorbed to the adsorption electrode, and the power receiving side concave portion is closed by a lid portion provided at the apparatus body.

The present invention is an adsorption device, wherein the adsorption device is configured such that when the device body is in a horizontal posture, the cover portion is opened and contact between the power receiving terminal and the power supply terminal is Possibly, if the power supply terminal is pulled out from the power receiving side recess When the adsorption device is in a vertical posture from the horizontal posture, the power receiving side concave portion is closed by the lid portion.

The invention is an adsorption device in which a telescopic member is provided at the cover portion, and when the power supply terminal is inserted into the power receiving side recess, the cover portion is pressed by the power supply terminal. At least a part of the cover portion moves while the telescopic member is deformed, and the power receiving side recessed portion is opened. The power receiving terminal is in contact with the power feeding terminal, and the power feeding terminal is pulled out from the power receiving side recessed portion. Then, the deformation of the telescopic member is restored to the original state, and the power receiving side concave portion is covered by the cover portion.

The invention of the present invention is an adsorption device, wherein the cover portion is formed by deforming if pressed, and returning to the original shape if the pressing is released, when the power supply terminal is inserted into In the power receiving-side recessed portion, the cover portion is pressed by the power supply terminal, the cover portion is deformed, and the power receiving-side recessed portion is opened, and the power receiving terminal is in contact with the power supply terminal. When the power supply terminal is removed from the power receiving side recessed portion, the deformation of the cover portion is restored to the original shape, and the power receiving side concave portion is covered by the cover portion.

Further, the invention of the present invention is an adsorption device comprising: a device body; and a power receiving terminal provided at the device body; and a rectifying circuit provided at the device body; and being disposed at the device body And the adsorption electrode connected to the power receiving terminal via the rectifying circuit contacts the substrate placed on the surface of the apparatus body with a gas-like substance having electrical conductivity, and the adsorption When the electrode applies an adsorption voltage, the substrate is adsorbed to the adsorption electrode. The adsorption device is characterized in that the power receiving terminal is separated from the atmosphere outside the device body, and if the adsorption device is placed on the adsorption device In the radio station, the power supply terminal provided at the power supply station is in contact with the power receiving terminal in a non-contact state, and the power receiving terminal receives an AC voltage applied to the power supply terminal, and the adsorption is performed via the rectifier circuit. a voltage system is applied to the adsorption electrode, and when the adsorption device is separated from the power supply station and moved, the substrate is adsorbed to the adsorption electrode by residual charges of the adsorption electrode. The power receiving side grounding terminal capable of making contact with the power supply side ground terminal provided at the power supply station, and the conduction and blocking between the adsorption electrode and the power receiving side ground terminal, and the adsorption electrode Switching device for conducting or blocking between the power receiving terminal and the foregoing switching device a control device for switching, wherein a control signal for controlling conduction and blocking of the switching device is superimposed on an AC voltage applied to the power supply terminal, and the voltage received from the power receiving terminal is extracted The control signal is input to the aforementioned control device.

The present invention is an adsorption device, wherein the power receiving terminal and the power supply terminal are each formed by a plate electrode, and if the adsorption device is placed on the power supply station, the power receiving terminal and the aforementioned power receiving terminal The power supply terminal forms a capacitor.

The invention of the present invention is an adsorption device, wherein the power receiving terminal and the power supply terminal are respectively formed by a coil, and the foregoing adsorption When the device is placed on the power supply station, a transformer that magnetically couples the power receiving terminal and the power supply terminal is formed.

The invention of the present invention is an adsorption device in which a plurality of the substrates are placed on the adsorption electrode.

The invention of the present invention is an adsorption device in which the gas-like substance having electrical conductivity is a plasma.

Moreover, the present invention provides a vacuum processing apparatus comprising: a vacuum chamber in which a gas-conducting substance having electrical conductivity is formed; and a power supply station disposed inside the vacuum chamber; and a power supply terminal provided at the power supply station, wherein the power supply station is configured to be detachably arranged, and when the adsorption device is disposed at the power supply station, the adsorption device is provided The power receiving terminal is in contact with the power supply terminal, and the adsorption voltage outputted by the power supply device connected to the power supply terminal is applied to the adsorption device via the power supply terminal and the power receiving terminal. In the adsorption electrode, the substrate disposed at the adsorption device is electrostatically adsorbed, and the adsorption device includes: a device body; and a power receiving side recess provided at the device body, and the power receiving terminal; Attached to the power receiving side recess to expose at least a portion, and the adsorption electrode is disposed at the apparatus body and is The power receiving terminal is electrically connected to each other, and is configured such that a gas-like substance having electrical conductivity is brought into contact with a substrate placed on a surface of the apparatus body, and the adsorption voltage is applied to the adsorption electrode, and the substrate is And being adsorbed to the adsorption electrode, and inserting the power supply terminal into the recess of the power receiving side, and When the power supply terminal is in contact with the exposed portion of the power receiving terminal, the adsorption voltage output from the power supply device is applied to the adsorption electrode via the power receiving terminal, and after the adsorption voltage is applied to the adsorption electrode, When the power receiving terminal is separated from the power supply terminal, residual charge remains in the adsorption electrode, and when the power receiving terminal is separated from the power supply terminal and the adsorption device is moved, the adsorption electrode is The substrate is adsorbed to the adsorption electrode by the residual charge, and the power receiving side concave portion is closed by a lid portion provided at the apparatus body.

The invention of the present invention is a vacuum processing apparatus, wherein the adsorption device is configured such that when the device body is in a horizontal posture, the cover portion is opened and the contact between the power receiving terminal and the power supply terminal is When the power supply terminal is removed from the power receiving side recessed portion and the suction device is in a vertical posture from the horizontal posture, the power receiving side recessed portion is closed by the cover portion.

According to the invention, a vacuum processing apparatus is provided, wherein the cover portion is provided with a telescopic member, and when the power supply terminal is inserted into the power receiving side recess, the cover portion is pressed by the power supply terminal When the telescopic member is deformed, at least a part of the cover portion moves to be in a state in which the power receiving side recessed portion is opened, and the power receiving terminal is in contact with the power feeding terminal, and the power feeding terminal is recessed from the power receiving side. When the outer casing is removed, the deformation of the elastic member is restored to the original state, and the power receiving side concave portion is covered by the cover portion.

The invention of the present invention is a vacuum processing apparatus, wherein the cover is The portion is formed by deforming the material if it is pressed, and returning to the original shape if the pressing is released. When the power supply terminal is inserted into the power receiving side recess, the cover portion is When the power supply terminal is pressed, the cover portion is deformed and the power receiving side recessed portion is opened, and the power receiving terminal is in contact with the power feeding terminal, and when the power feeding terminal is removed from the power receiving side recessed portion, The deformation of the cover portion is restored to the original shape, and the power receiving side concave portion is covered by the cover portion.

The invention of the present invention is a vacuum processing apparatus comprising: a vacuum chamber in which a gas-like substance having electrical conductivity is formed; and a power supply station disposed inside the vacuum chamber; and is provided The power supply terminal at the power supply station is configured such that the adsorption device is detachably disposed, and when the adsorption device is disposed at the power supply station, is disposed at the adsorption device The power receiving terminal is in contact with the power supply terminal without contact, and an AC voltage output from a power supply device connected to the power supply terminal is applied to the power receiving terminal via the power supply terminal, and is received by the power receiving terminal. The rectified voltage obtained by rectifying the rectifier circuit connected to the terminal is applied to the adsorption electrode provided at the adsorption device, and the substrate disposed at the adsorption device is electrostatically adsorbed. The device includes a device body, and the rectifier circuit, the power receiving terminal, and the adsorption electrode are provided in the device The main body is configured such that when a gas-like substance having electrical conductivity is brought into contact with a substrate placed on a surface of the apparatus main body, and the rectifying voltage is applied to the adsorption electrode, the substrate is adsorbed to the foregoing At the adsorption electrode, the aforementioned power receiving terminal, After being separated from the atmosphere outside the apparatus body, after the rectifying voltage is applied to the adsorption electrode, residual charge remains in the adsorption electrode, and when the adsorption device is separated from the power supply station and moved, The substrate is adsorbed to the adsorption electrode by the residual charge of the adsorption electrode, and a power supply side ground terminal is provided at the power supply station, and the device body is provided with the foregoing a power receiving side grounding terminal for contacting the power supply side ground terminal, and a switching device for conducting or blocking between the adsorption electrode and the power receiving side ground terminal, and conducting or blocking between the adsorption electrode and the power receiving terminal, And a control device for controlling the conduction and the blocking of the switching device, wherein an AC signal applied to the power supply terminal is superimposed with a control signal for controlling conduction and blocking of the switching device, The control signal is extracted by the voltage received by the power receiving terminal, and is input to the control Set in.

By preventing deterioration of the power receiving terminal, corrosion, and formation of a thin film, the adsorption force is not lowered, and the life of the adsorption device is long.

5, 5 ₁ ~ 5 ₃ ‧ ‧ substrate

15 ₁ , 15 ₂ ‧‧‧ Vacuum processing unit

16‧‧‧vacuum tank

18, 18a~18e‧‧‧Power supply station

19, 19a~19e‧‧‧ adsorption device

21‧‧‧ device body

24, 31, 41‧‧‧Receiving terminals

32, 42‧‧‧Power-side control terminals

34‧‧‧Rectifier circuit

35‧‧‧Power receiving side control device

61‧‧‧

64, 65, 75‧‧‧ power supply terminals

66‧‧‧Power supply unit

67, 77‧‧‧Power supply side control terminals

Fig. 1 (a) to (c) are views for explaining a vacuum processing apparatus of the present invention.

Fig. 2 (a) and (b) are views for explaining an adsorption device according to a first example of the present invention.

Fig. 3 is a view for explaining an adsorption device of a first example in a vertical posture.

Fig. 4 (a) and (b) are views for explaining an adsorption device according to a second example of the present invention.

Fig. 5 (a) and (b) are views for explaining an adsorption device according to a third example of the present invention.

Fig. 6 (a) and (b) are views for explaining an adsorption device of a fourth example of the present invention.

Fig. 7 (a) and (b) are views for explaining an adsorption device according to a fifth example of the present invention.

<Embodiment>

The component symbol 2 of Figs. 1(a) to (c) is a vacuum apparatus of the present invention.

Referring to Fig. 1(a), the vacuum apparatus 2 has one or more vacuum processing units 15 ₁ and 15 ₂ .

The vacuum processing apparatuses 15 ₁ and 15 ₂ are provided with a vacuum chamber 16 in which a power supply table 18 and a processing unit 17 are disposed.

First, as shown in Fig. 1(b), the adsorption device 19 on which the plurality of substrates 5 are placed is carried into the interior of the first vacuum processing device 15 ₁ from the processing device 14 _{1 of the} preceding stage, and placed thereon. Above the power supply station 18.

At the power supply station 18, a power supply device 60 is provided, and at the adsorption device 19, a power receiving device 20 is provided. The power supply device 60 is connected to the power supply device 66, and the power receiving device 20 is connected to one of the adsorption electrodes 22 provided at the adsorption device 19. If the power supply device 66 operates and applies a voltage to the power supply device 60, A voltage is supplied to the power receiving device 20 from the power supply device 60. The voltage applied to the power receiving device 20 is supplied with an adsorption voltage from the power receiving device 20 to the adsorption electrode 22. The vacuum chamber 16 is connected to the ground potential. The potential of the adsorption electrode 22 can be adsorbed regardless of whether it is a positive potential or a negative potential.

At a position immediately below the plurality of substrates 5 placed at the adsorption device 19, the adsorption electrode 22 is disposed, and the adsorption electrode 22 is formed as a conductive plate or film. The substrate 5 is placed on the outer side of the outer periphery of the adsorption electrode 22 at a position further inside. Here, although one adsorption electrode 22 is used, the adsorption electrode may be configured by a plurality of small-diameter electrodes, and the adsorption voltage of the same size may be supplied to each small-diameter electrode.

Vacuum evacuation means 68 are connected to the vacuum chambers 16 of the vacuum processing units 15 ₁ and 15 ₂ , respectively, and vacuum is formed by operating the vacuum exhaust unit 68 and vacuuming the inside of the vacuum chamber 16. After the atmosphere, a plasma is formed inside the vacuum chamber 16, and the plasma is a gas-charged substance having conductivity, and is in contact with the wall surface of the substrate 5 and the vacuum chamber 16 placed on the adsorption device 19. The substrate 5 is electrically connected to the vacuum chamber 16 .

Each of the vacuum chambers 16 is connected to a ground potential, and the substrate 5 is connected to a ground potential.

An equivalent capacitance is formed between the substrate 5 and the adsorption electrode 22, and in a state where the substrate 5 is connected to the ground potential via plasma, if an adsorption voltage is supplied to the adsorption electrode 22, the equivalent capacitance is obtained. The substrate 5 and the adsorption electrode 22 are charged with a reverse polarity voltage, and an electrostatic force is generated therebetween, and the substrate 5 is electrostatically adsorbed to the adsorption electrode 22.

In this state, when the processing unit 17 is operated, the substrate 5 is vacuum-treated.

Here, the processing unit 17 is a shower plate, and an etching gas is introduced from the processing unit 17, and a plasma gas is formed inside the vacuum chamber 16 to be adsorbed to the substrate 5 at the adsorption device 19. The film formed on the surface of the substrate 5 is etched.

At the time of this vacuum processing, the substrate 5 and the adsorption device 19 are adhered to each other by adsorption, and the thermal conductivity is high. Therefore, the substrate 5 can be heated or cooled by providing a heating device or a cooling device at the power supply station 18 and heating or cooling the adsorption device 19 by the heating device or the cooling device.

During the vacuum processing, an adsorption voltage is supplied to the adsorption electrode 22, and when the vacuum treatment is completed, the voltage supply system from the power supply device 60 to the power receiving device 20 ends, and the adsorption electrode is applied. The voltage supply system of 22 ends.

In this state, the adsorption device 19 in the first vacuum processing device 15 ₁ is separated from the power supply table 18 by the transfer device or the like, and is moved to the vacuum chamber 16 of the next vacuum processing device 15 ₂ . Internally, as shown in Fig. 1(c), a new adsorption device 19 is placed at the power supply station 18 of the original vacuum processing unit 15 ₁ . In the figure, the reference numeral 11 is a vacuum valve that connects between the vacuum processing devices 15 ₁ and 15 ₂ and the processing devices 14 ₁ and 14 ₂ and passes the adsorption device 19 when it is in an open state.

At the power receiving device 20 of the moving adsorption device 19, no voltage is supplied from the power supply device 60, but even if the voltage supply to the adsorption electrode 22 is completed, the adsorption electrode 22 and the substrate 5 remain. There is a residual charge of opposite polarity, and the substrate 5 is maintained in a state of being adsorbed to the adsorption device 19 by the adsorption force of the residual charge.

An example of the specificity of the adsorption device 19 and the power supply station 18 will be described.

The component symbols 19a to 19e in FIGS. 2 and 4 to 7 represent the adsorption devices of the first to fifth examples, and the component symbols 18a to 18e represent the adsorption devices of the first to fifth examples. 19a~19e correspond to the specificity of the first to fifth power supply stations.

In the adsorption devices 19a to 19e of the first to fifth examples, the adsorption electrode 22 is disposed inside the device body 21 in which the insulator is formed into a plate shape, and the surface of the adsorption electrode 22 is configured as It is not exposed to the outside of the apparatus body 21.

On the surface of the apparatus body 21, a plurality of substrates 5 ₁ to 5 ₃ are placed. The adsorption electrode 22 is disposed at a position directly below each of the substrates 5 ₁ to 5 ₃ .

<1st case to 3rd case>

The power receiving devices 20a to 20c of the adsorption devices 19a to 19c of the first to third embodiments are provided with the power receiving side recess 23 provided on the back side of the device body 21 and the inside of the power receiving side recess 23, respectively. The power receiving terminal 24 at the bottom surface and the lid portions 25a, 25b, 25c, and 25d covering the power receiving side recess portion 23 are provided. At least a part of the power receiving terminal 24 is exposed in the power receiving side recess 23, and the power receiving terminal 24 is formed of a member having electrical conductivity such as metal, and the film surface is exposed to the power receiving side recess 23 .

The power supply stations 18a to 18c of the first to third examples are provided with the main body 61 in which the insulator is formed in a table shape, and the power supply devices 60a to 60c of the power supply stations 18a to 18c of the first to third examples. The power supply terminal 64 is provided.

Here, the power supply devices 60a to 60c of the first to third examples include the power supply side recessed portion 63 formed on the surface of the stage body 61, and the power supply terminal 64 is provided on the bottom surface of the power supply side recessed portion 63 via The power supply side telescopic member 62 such as a spring is attached.

The upper ends of the power supply terminals 64 of the power supply stations 18a to 18c of the first to third examples are located higher than the surface of the stage body 61, and the upper end of the power supply terminal 64 is raised from the surface of the stage body 61. Department It is set to be longer than the distance between the lower end of the power receiving terminal 24 and the bottom surface of the apparatus body 21. Here, the power receiving terminal 24 is a film, and the film surface is a lower end.

In the adsorption devices 19a and 19b of the first and second examples, the lid portions 25a and 25b are provided at the rotation device 27 rotatably attached to the bottom surface of the device body 21.

The lid portions 25a and 25b are such that the edges of the lid portions 25a and 25b are attached to the rotating device 27, and the lid portions 25a and 25b are configured to rotate together with the rotating device 27.

In the adsorption device 19a of the first example, when the apparatus body 21 is in the horizontal posture, the lid portion 25a is a portion of the lid portion 25a that is attached to the rotating device 27 at an upper position and on the opposite side by its own weight. Since the position of the lid portion 25a is such that the opening of the power receiving side recessed portion 23 is not closed, when the apparatus body 21 is in the horizontal posture, the lid portion 25a is in a vertical posture, and the lid of the power receiving side recessed portion 23 is opened.

On the other hand, as shown in FIG. 3, the suction device 19a of the first example is formed such that the side of the power receiving-side recess 23 on which the rotating device 27 is provided is upward and the opposite side is downward. In the case of the vertical arrangement, the lid portion 25a is vertical, and the opening of the power receiving-side recess portion 23 is also vertical. Therefore, the power receiving-side recess portion 23 is covered by the lid portion 25a.

In the adsorption device 19b of the second example, the lid portion 25b is attached to the apparatus main body 21 by the power receiving-side elastic member 28, and the second example is adsorbed in a state where the lid portion 25b is not pressed. Device 19b The electric side recessed portion 23 is covered by the lid portion 25b.

In the adsorption device 19c of the third example, the two cover portions 25c and 25d having flexibility are provided so that the side surfaces are in contact with each other and cover the power receiving side concave portion 23, and the two cover portions 25c and 25d are provided. The contact portion is configured to be positioned near the center of the power receiving side recess portion 23.

In the adsorption devices 19b and 19c of the second and third examples, the power receiving-side recesses 23 are covered by the lid portions 25b, 25c, and 25d, and the adsorption devices 19b and 19c of the second and third examples are When the inside of the vacuum chamber 16 moves, the residual gas inside the vacuum chamber 16 does not enter the inside of the power receiving side recess 23 of the adsorption devices 19b and 19c of the second and third examples. In the adsorption device 19a of the first embodiment, when the power receiving side concave portion 23 is covered, the suction device 19a of the first example can be moved without moving in the vertical posture. The residual gas in the vacuum chamber 16 enters the inside of the power receiving side recess portion 23.

The adsorption devices 19a to 19c of the first to third examples are placed in the first to third examples from the state in which they are disposed above the power supply stages 18a to 18c of the first to third examples. The engineering on the power supply stations 18a to 18c will be described.

The adsorption devices 19a to 19c of the first to third examples are placed in a horizontal posture, and are placed above the power supply stations 18a to 18c of the first to third examples by a moving device (not shown).

By moving the apparatus, the adsorption apparatuses 19a to 19c of the first to third examples are lowered while maintaining the horizontal posture.

By the lowering, in the adsorption device 19a of the first example, the lid portion 25a in the vertical posture is inserted into the power supply side concave portion 63.

The depth of the power supply side recess 63 is set to be longer than the height from the lower end of the lid portion 25a in the vertical posture to the bottom surface of the apparatus body 21. Therefore, the lower end of the cover portion 25a does not correspond to the power supply side. The bottom surface of the recess 63 is in contact, and the lower end of the power receiving terminal 24 and the upper end of the power supply terminal 64 are in contact with each other.

In the adsorption device 19b of the second example, the upper end of the power supply terminal 64 is in contact with the bottom surface of the lid portion 25b, and if the adsorption device 19b of the second example is further lowered, the power supply terminal 64 pushes the lid portion from below. 25b, the power receiving side telescopic element 28 is compressed and deformed, and the lid portion 25b is pushed upward, and the power supply terminal 64 is moved from the position immediately below the power receiving terminal 24, and is positioned inside the power receiving side recessed portion 23. The power receiving terminal 24 is exposed to the outside atmosphere of the power receiving side recess 23 .

On the other hand, in the adsorption device 19c of the third example, the power supply terminal 64 is disposed in the upper end of the power supply terminal 64 and the two cover portions 25c and 25d when the adsorption device 19c of the third example is lowered. The part that made the contact is at the location where it is abutted.

The two cover portions 25c and 25d are formed of a material that is deformed by being pressed, and the upper end of the power supply terminal 64 and the two contact portions 25c and 25d are in contact with each other. Then, when the adsorption device 19c of the third example is lowered, the contact portions of the two cover portions 25c and 25d are pushed downward from the lower side and pushed upward, and the shapes of the cover portions 25c and 25d are Bending deformation, position at the power receiving terminal 24 The portions of the lid portions 25c and 25d at the position immediately below are moved, and the power receiving terminal 24 positioned inside the power receiving side recess portion 23 is exposed to the outside atmosphere of the power receiving side recess portion 23.

When the adsorption devices 19b and 19c of the second and third examples are further lowered from this state, the upper end of the power supply terminal 64 moves in the power receiving-side recess 23 and approaches the power receiving terminal 24, and the upper end of the power supply terminal 64 is connected. The lower end of the power receiving terminal 24 makes a contact.

When the lower end of the power receiving terminal 24 of the adsorption devices 19a to 19c of the first to third examples is in contact with the upper end of the power supply terminal 64 of the power supply stages 18a to 18c of the first to third examples, the bottom surface of the apparatus body 21 When the suction devices 19a to 19c of the first to third examples are lowered, the power supply side expansion and contraction members 62 are compressed, and the power supply side expansion and contraction members 62 are shortened. At the same time, the adsorption devices 19a to 19c of the first to third examples are close to the power supply stages 18a to 18c of the first to third examples, and if the bottom surface of the apparatus body 21 is in contact with the surface of the stage body 61, the first The adsorption devices 19a to 19c of the third to third examples are placed on the power supply stages 18a to 18c of the first to third examples.

The power receiving terminal 24 is electrically connected to the adsorption electrode 22, and the power supply terminal 64 is electrically connected to the power supply device 66 disposed outside the vacuum chamber 16.

In the power supply stations 18a to 18c of the first to third examples, a variable DC voltage source is used at the power supply unit 66. If the power supply unit 66 starts and outputs a DC adsorption voltage, the power supply terminal 64 is used. An adsorption voltage is applied to the adsorption electrode 22 by the power receiving terminal 24.

Then, as described above, in the vacuum chamber 16 in which the power supply stages 18a to 18c of the first to third examples are disposed, the etching gas is introduced from the processing unit 17, and plasma of the etching gas is generated. Then, the plasma is made of a gas-conducting substance having electrical conductivity, and is in contact with the substrates 5 ₁ to 5 ₃ of the adsorption devices 19 a to 19 c of the first to third examples and the wall surface of the vacuum chamber 16 . _{The 1} to 5 ₃ series are connected to the ground potential, the equivalent capacitance is charged, and the substrates 5 ₁ to 5 ₃ are adsorbed to the adsorption electrodes 22 of the adsorption devices 19a to 19c of the first to third examples.

When the film on the surface of each of the substrates 5 ₁ to 5 ₃ is etched, the introduction of the etching gas is stopped, and the plasma is extinguished.

When the operation of the power supply device 66 is stopped, the adsorption electrode 22 is connected to the same ground potential as the vacuum chamber 16, and the electric charge accumulated in the equivalent capacitance is discharged, and then the first device is moved by the mobile device. The adsorption devices 19a to 19c of the third to third examples are separated from the power supply stages 18a to 18c of the first to third examples, and the power receiving terminal 24 is separated from the power supply terminal 64.

In the suction device 19a of the first example, after the power supply terminal 64 is removed from the power receiving side recessed portion 23, the power receiving side recessed portion 23 is covered by the lid portion 25a, and the vertical position is brought into a vertical posture.

In the adsorption device 19b of the second example, when the power supply terminal 64 is removed from the power receiving side recessed portion 23, the compressed power receiving side telescopic element 28 returns to its original shape, and the second embodiment of the adsorption device 19b receives power. The undercut portion 23 is covered by the lid portion 25b.

Further, in the adsorption device 19b of the third example, if the power is supplied When the terminal 64 is removed from the power receiving-side recessed portion 23, the two deformed cover portions 25c and 25d are restored to the original shape, and the power receiving-side recessed portion 23 of the adsorption device 19c of the third example is composed of two The cover portions 25c, 25d are covered.

In the adsorption electrodes 22 of the adsorption devices 19a to 19c of the first to third examples, a ground potential is connected, and after being separated from the power supply terminal 64, electric charges remain, and the potential of the adsorption electrode 22 is maintained. The voltage difference from the ground potential is in a large state.

In this state, if the power receiving terminal 24 is brought into contact with the reactive gas, the power receiving terminal 24 is deteriorated or corroded or a film is formed.

In the adsorption devices 19a to 19c of the first to third examples, since the power receiving-side recesses 23 are covered by the lid portions 25a to 25d, they are from the first to the third examples. When the power supply stages 18a to 18c are separated and are carried into the other vacuum chambers 16 while being covered, the residual gas inside the vacuum chambers 16 that are carried in cannot enter the power receiving side recesses 23 Internally, there is a problem that deterioration, corrosion, formation of a thin film, and the like are hard to occur at the power receiving terminal 24.

In the power supply stations 18a to 18c of the first to third examples, since the output voltage of the power supply device 66 is set to the ground potential, the power supply terminal 64 is connected to the ground potential, and therefore, even if it is in contact with the residual gas. It is also difficult to cause problems such as deterioration, corrosion, and film formation.

<4th and 5th cases>

Next, the adsorption devices 19d and 19e of the fourth and fifth examples will be described with reference to Figs. 6(a) and 6(b) and Figs. 7(a) and 7(b).

First, the configuration of the common configuration of the adsorption devices 19d and 19e of the fourth and fifth examples and the configuration of the power supply stations 18d and 18e of the fourth and fifth examples will be described.

In addition to the adsorption electrode 22, the power receiving devices 20d and 20e of the adsorption devices 19d and 19e of the fourth and fifth examples include the switching device 36, the rectifier circuit 34, the power receiving-side control device 35, and the power receiving side ground. The terminal 33, the power receiving side control terminals 32 and 42, and the power receiving terminals 31 and 41.

The power receiving terminals 31, 41 and the power receiving side control terminals 32, 42 are disposed near the bottom surface of the inside of the apparatus body 21, and are configured not to come into contact with the atmosphere outside the apparatus body 21.

The power receiving-side grounding terminal 33 is provided on the bottom surface of the apparatus main body 21, and is disposed inside the grounding recessed portion 38 having a depth equal to or greater than the thickness of the power receiving-side grounding terminal 33.

The power receiving terminals 31 and 41 are connected to the rectifier circuit 34, and the rectifier circuit 34 and the power receiving side ground terminal 33 are connected to the adsorption electrode 22 via the switching device 36.

Alternatively, the power receiving terminals 31 and 41 may be connected to the rectifier circuit 34 via the switching device 36, and the rectifier circuit 34 may be connected to the adsorption electrode 22.

The switching device 36 is controlled by the power receiving-side control device 35, and is input to the switching device 36 by the power receiving-side control device 35. The signal is generated by connecting the adsorption electrode 22 to one of the power receiving side ground terminal 33 and the power receiving terminal 31 or by blocking the adsorption electrode 22 from both the power receiving side ground terminal 33 and the rectifier circuit 34. Come to action. The adsorption electrode 22 is connected to the power receiving terminal 31 via the rectifier circuit 34.

During the transfer, the adsorption electrode 22 is blocked from both sides and placed at a floating potential.

The power feeding devices 60d and 60e of the power supply stations 18d and 18e of the fourth and fifth examples are provided with power supply terminals 65 and 75, power supply side control terminals 67 and 77, and power supply side ground terminal 84, respectively.

The power supply terminals 65, 75 are connected to the power supply device 66, which is an AC voltage source, and the power supply side control terminals 67, 77 are connected to the power supply side control device 69, and the power supply side ground terminal 84 is grounded. The potential is connected.

In the case of the difference between the adsorption device 19d of the fourth example, the power supply table 18d, the adsorption device 19e of the fifth example, and the power supply station 18e, the power receiving terminal 31 and the power receiving side of the adsorption device 19d of the fourth example will be described. The control terminal 32 and the power supply terminal 65 of the power supply station 18d of the fourth example and the power supply side control terminal 67 are each formed of a flat electrode, whereas the power receiving terminal 41 and the power receiving side of the fifth example adsorption device 19e are provided. The control terminal 42 and the power supply terminal 75 of the power supply station 18e of the fifth example and the power supply side control terminal 77 are each constituted by a coil.

When the adsorption devices 19d and 19e of the fourth and fifth examples are respectively carried on the power supply stages 18d and 18e of the fourth and fifth examples, The power receiving terminal 31 of the adsorption device 19d of the fourth example and the power supply terminal 65 of the power supply station 18d of the fourth example are arranged in close proximity to each other, and a power side capacitor having the power receiving terminal 31 and the power supply terminal 65 as electrodes is formed. The power receiving terminal 41 of the suction device 19e of the fifth example and the power supply terminal 75 of the power supply table 18e of the fifth example are arranged in close proximity to each other, and a transformer for magnetically coupling the power receiving terminal 41 and the power supply terminal 75 is formed.

When the adsorption devices 19d and 19e of the fourth and fifth examples are respectively carried on the power supply tables 18d and 18e of the fourth and fifth examples, the power supply side control terminals 67 and 77 and the power receiving side control terminal 32 are respectively carried. 42 is in close proximity to each other. In the power supply station 18d and the adsorption device 19d of the fourth example, the control capacitor is formed by the power supply side control terminal 67 and the power receiving side control terminal 32, and in the fifth example, the power supply station 18e and the adsorption At the device 19e, a transformer that magnetically couples the power supply side control terminal 77 and the power receiving side control terminal 42 is formed.

The power supply side control terminals 67, 77 are connected to the power supply side control device 69, and the voltage including the control signal is applied to the power supply side control terminals 67, 77 from the power supply side control device 69, and by the voltage When the current flowing through the power supply side control terminals 67, 77 is changed, the voltage including the control signal is energized at the power receiving side control terminals 32, 42 and the control signal is input to the power receiving side control device 35.

The power receiving-side control device 35 switches the connection of the switching device 36 in response to the content of the input control signal. Here, one of the two switches 37a and 37b is turned on, and the other one is turned on. The party is interrupted.

When the adsorption devices 19d and 19e on which the substrates 5 ₁ to 5 ₃ are placed are carried on the power supply tables 18d and 18e, the power supply-side control device 69 signals the content of the adsorption electrode 22 and the rectifier circuit 34. When the power supply side control terminals 67 and 77 and the power receiving side control terminals 32 and 42 are conducted to the power receiving-side control device 35, the power receiving-side control device 35 connects the adsorption electrode 22 to the rectifier circuit 34. In this state, the adsorption electrode 22 is cut away from the power receiving side ground terminal 33.

If the plasma is generated inside the vacuum chamber 16, and the substrate 5 ₁ to 5 ₃ is connected to the ground potential by the plasma, the power supply device 66 operates and outputs an AC voltage, and the fourth example is supplied. At the radio station 18d and the adsorption device 19d, the equivalent capacitance between the substrates 5 ₁ to 5 ₃ and the adsorption electrode 22 and the power side capacitance are connected in series with respect to the power supply device 66, and if the power supply device 66 outputs an AC voltage. Then, the voltage rectified by the rectifier circuit 34 is applied to the adsorption electrode 22, and the equivalent capacitance is charged to a voltage of one of a positive voltage or a negative voltage.

On the other hand, in the power supply station 18e and the adsorption device 19e of the fifth example, if the power supply unit 66 outputs an alternating current voltage and an alternating current flows through the power supply terminal 75, it is excited at the power receiving terminal 41 by magnetic coupling. There is an alternating voltage which is applied to the rectifier circuit 34.

The power supply side ground terminal 84 is connected to the ground potential, and the adsorption devices 19d and 19e of the fourth and fifth examples are respectively carried by In the state of the power supply tables 18d and 18e of the fourth and fifth examples, the power receiving side ground terminal 33 and the power supply side ground terminal 84 are in contact with each other, and the power receiving side ground terminal 33 is connected to the ground potential, and the fifth example is One end of the coil as the power receiving terminal 41 is connected to the power receiving side ground terminal 33, and is connected to the ground potential via the power supply side ground terminal 84, and the other end is connected to the rectifier circuit 34. The AC voltage excited by the power receiving terminal 41 is applied to the rectifying circuit 34. Thus, the current rectified by the rectifying circuit 34 flows to the equivalent capacitor, and the equivalent capacitor is charged. A voltage that is the polarity of one of a positive voltage or a negative voltage. The midpoint of the coil can also be connected to the power receiving side ground terminal 33.

Therefore, in the adsorption devices 19d and 19e of the fourth and fifth examples, the substrates 5 ₁ to 5 ₃ are adsorbed to the adsorption electrode 22 .

When the substrates 5 ₁ to 5 ₃ are vacuum-treated by the plasma formed inside the vacuum chamber 16, the vacuum processing is completed.

When the plasma is destroyed and the output of the power supply device 66 and the power supply-side control device 69 is stopped, the adsorption electrode 22 is a floating potential and remains in the equivalent capacitance. The state in which the substrates 5 ₁ to 5 ₃ are adsorbed to the adsorption electrode 22 is maintained.

When there is no next processing and the adsorption of the substrates 5 ₁ to 5 ₃ can be stopped from the adsorption electrode 22, the output from the power supply side control device 69 includes the adsorption electrode 22 and the power receiving side ground terminal 33. The voltage of the control signal to be connected is transmitted to the power receiving-side control device 35 via the power supply side control terminals 67, 77 and the power receiving side control terminals 32, 42 which switch the adsorption electrode 22 from the rectifier circuit 34. And being disconnected and connected to the power receiving side ground terminal 33, and discharging the equivalent capacitor between the ground potential and the ground potential via the plasma, the adsorption can be stopped, the plasma is extinguished, and the power supply device is also The output of the power supply-side control device 69 is stopped, and the adsorption devices 19d and 19e of the fourth and fifth examples are separated and moved from the power supply stations 18d and 18e of the fourth and fifth examples by the moving device.

In other words, in the conveyance, the adsorption devices 19d and 19e are entirely transported in a state where the adsorption state is maintained toward the next process, and the two switches 37a and 37b are blocked.

In the case of being carried out to the atmosphere, the switch 37a on the ground side is turned on, and the switch 37b on the power receiving side is blocked, and the adsorption electrode 22 is exposed to the plasma while being connected to the ground potential. Then move out to the atmosphere.

Even if the adsorption electrodes 22 of the adsorption devices 19d and 19e of the fourth and fifth examples are connected to the ground potential, and are separated from the power supply stages 18d and 18e of the fourth and fifth examples, the equivalent capacitance is obtained. The charge remains in the middle, and the state in which the substrates 5 ₁ to 5 ₃ are adsorbed to the adsorption electrode 22 is maintained.

The surfaces of the power receiving terminals 31 and 41 are covered with an insulating material, and at least the insulating layer covering the surfaces of the power receiving terminals 31 and 41 is disposed between the power receiving terminals 31 and 41 and the power feeding terminals 65 and 75. Material. Here, the insulation of the surface of the power receiving terminals 31, 41 is covered. The material of the nature is the material constituting the apparatus body 21.

The power receiving terminals 31 and 41 are high voltages due to residual charges. However, since the power receiving terminals 31 and 41 are not in contact with the external atmosphere of the apparatus body 21, the power receiving terminals 31 and 41 are not It will deteriorate, corrode, and there will be no film formation.

The power receiving terminals 31, 41 and the power receiving side control terminals 32, 42 and the power supply terminals 65, 75 and the power supply side control terminals 67, 77 are not disposed in the vacuum because they are disposed in the apparatus body 21 or in the stage body 61. In the internal atmosphere of the groove 16, there is no problem of deterioration, corrosion, formation of a film or the like. The surfaces of the terminals 31, 32, 41, 42, 65, 67, 75, and 77 may be covered by a film so as not to be exposed to the internal atmosphere of the vacuum chamber 16.

Since the power supply side ground terminal 84 is connected to the ground potential, and the power receiving side ground terminal 33 is placed at the ground potential or the floating potential, the power supply side ground terminal 84 and the power receiving side ground terminal 33 are also less likely to be deteriorated, corroded, and thinned. Forming issues such as.

(other examples)

Further, in each of the above examples, an example in which a plasma having an etching gas is used is used. However, even if the processing unit 17 is a sputtering target, the inside of the vacuum chamber 16 is used. The sputtering device is introduced into the sputtering gas introduction device, and a film forming device is formed in which the plasma of the sputtering gas is formed inside the vacuum chamber 16, and the substrate 5 ₁ is caused by the plasma of the sputtering gas. The 5 ₃ is connected to the ground potential and adsorbed to the adsorption electrode 22 of the adsorption devices 19a to 19c of the first to third examples, and is therefore included in the vacuum processing apparatus of the present invention.

In this case, if the sputtering target is sputtered by the formed sputtering gas, the substrates 5 ₁ to be adsorbed to the adsorption devices 19a to 19c of the first to third examples. On the surface of 5 ₃ , a film is formed.

Further, a plasma CVD apparatus which introduces a raw material gas of CVD from the processing unit 17 to form a plasma of a material gas and forms a thin film on the surfaces of the substrates 5 ₁ to 5 ₃ is also included in the vacuum processing apparatus of the present invention. .

Further, it is not limited to the plasma, and the substrate 5 ₁ to 5 ₃ placed on the adsorption devices 19a to 19e and the wall surface of the vacuum chamber 16 can be placed as long as it is electrically conductive. The electrical connection can be used to charge an equivalent capacitor, and thus can be used in the present invention.

The gas which is a gas-conducting substance having electrical conductivity can be introduced from a device other than the processing unit 17.

The adsorption electrode 22 is disposed inside the apparatus body 21, but may be disposed on the surface of the apparatus body 21, and the adsorption electrode 22 is covered with a protective film, and the adsorption electrode 22 is disposed at Similarly to the inside of the apparatus body 21, it is configured not to be in contact with the substrates 5 ₁ to 5 ₃ and to be separated from the atmosphere of the vacuum chamber 16 .

In the above example, the control signals output from the power supply side control terminals 67, 77 are received by the power receiving side control terminals 32, 42. However, the control signal can also be superimposed on the voltage outputted by the power supply terminals 64, 65, 75, and the control signal can be extracted from the voltage supplied to the power receiving terminals 24, 31, 41 by the extraction circuit. It is input to the power receiving side control device 35 again.

Claims (16)

An adsorption device comprising: a device body; and a power receiving side recess provided at the device body; and a power receiving terminal at the power receiving side recess to expose at least a portion; and being disposed at the device body Further, when the adsorption electrode electrically connected to the power receiving terminal is brought into contact with a substrate placed on the surface of the apparatus body by a gas-like substance having electrical conductivity, and a voltage is applied to the adsorption electrode, The substrate is adsorbed to the adsorption electrode, and the adsorption device is characterized in that the adsorption electrode is disposed at a power supply station on which the adsorption device is placed and connected to the power supply device. When the power supply terminal is inserted into the power receiving side recess and the power supply terminal is in contact with the exposed portion of the power receiving terminal, the adsorption voltage output from the power supply device is applied, and the adsorption voltage is applied to the adsorption electrode. Thereafter, if the power receiving terminal is separated from the power supply terminal, the residual charge remains. At the adsorption electrode, when the power receiving terminal is separated from the power supply terminal and the adsorption device is moved, the substrate is adsorbed to the adsorption electrode by the residual charge of the adsorption electrode, and The cover portion provided at the apparatus body is closed, and the power receiving side concave portion is closed. The adsorption device according to claim 1, wherein the adsorption device is configured such that when the device body is in a horizontal posture, the cover portion is opened and the power receiving terminal and the power supply terminal are In the case where the power supply terminal is pulled out from the power receiving side recessed portion and the suction device is in a vertical posture from the horizontal posture, the power receiving side concave portion is closed by the cover portion. The adsorption device according to the first aspect of the invention, wherein the cover portion is provided with a telescopic member, and when the power supply terminal is inserted into the power receiving side concave portion, the cover portion is connected to the power supply terminal When the telescopic member is deformed, at least a part of the cover portion moves and the power receiving side recessed portion is opened, and the power receiving terminal is in contact with the power feeding terminal, and the power feeding terminal is received from the power receiving terminal. When the undercut portion is removed, the deformation of the telescopic member is restored to the original shape, and the power receiving side concave portion is covered by the cover portion. The adsorption device according to claim 1, wherein the cover portion is formed by being deformed if pressed, and returning to an original shape if the pressing is released. When the terminal is inserted into the power receiving side recessed portion, the cover portion is pressed by the power supply terminal, the cover portion is deformed, and the power receiving side recessed portion is opened, and the power receiving terminal is connected to the power supply terminal. contact, When the power supply terminal is removed from the power receiving side recessed portion, the deformation of the cover portion is restored to the original shape, and the power receiving side concave portion is covered by the cover portion. An adsorption device comprising: a device body; and a power receiving terminal disposed at the device body; and a rectifying circuit disposed at the device body; and disposed at the device body and via the rectifying circuit The adsorption electrode connected to the power receiving terminal contacts the substrate placed on the surface of the apparatus body with a gas-like substance having electrical conductivity, and applies an adsorption voltage to the adsorption electrode. The adsorption device is characterized in that the power receiving terminal is separated from the atmosphere outside the device body, and if the adsorption device is placed on the power supply station, it is disposed in the foregoing The power supply terminal of the power supply station is close to the power receiving terminal in a non-contact state, and the power receiving terminal receives an AC voltage applied to the power supply terminal, and the adsorption voltage is applied to the adsorption electrode via the rectifier circuit. Where the adsorption device is separated from the power supply station and moved The adsorption of the residual charge the electrodes of the substrate is adsorbed to the adsorbing electrode, the adsorbing means comprising lines are: capable of being disposed in the power station of the power supply ground terminal for contact a power receiving side grounding terminal; and a switching device for conducting or blocking between the adsorption electrode and the power receiving side grounding terminal and conducting or blocking between the adsorption electrode and the power receiving terminal; and the switching device The control device for switching the connection, the control signal for controlling the conduction and the blocking of the switching device is superimposed on the AC voltage applied to the power supply terminal, and is extracted from the voltage received by the power receiving terminal. The aforementioned control signal is input to the aforementioned control device. The adsorption device according to claim 5, wherein the power receiving terminal and the power supply terminal are each formed by a plate electrode, and if the adsorption device is placed on the power supply station, A capacitor is formed by the power receiving terminal and the power supply terminal. The adsorption device according to claim 5, wherein the power receiving terminal and the power supply terminal are each formed by a coil, and when the adsorption device is placed on the power supply station, the power receiving terminal is formed. A transformer magnetically coupled to the aforementioned power supply terminal. The adsorption device according to claim 1, wherein the plurality of substrates are placed on the adsorption electrode. The adsorption device according to claim 5, wherein the plurality of substrates are placed on the adsorption electrode. An adsorption device as recited in claim 1, wherein Among them, the gas-like substance having electrical conductivity is a plasma. The adsorption device according to claim 5, wherein the gas-conducting substance having electrical conductivity is a plasma. A vacuum processing apparatus comprising: a vacuum chamber formed with a gas-conducting substance having electrical conductivity; and a power supply station disposed inside the vacuum chamber; and being disposed at the power supply station The power supply terminal is configured such that the adsorption device is detachably arranged, and when the adsorption device is disposed at the power supply station, the power receiving terminal provided at the adsorption device is connected to The power supply terminal is in contact with the adsorption voltage output from the power supply device connected to the power supply terminal, and is applied to the adsorption electrode provided at the adsorption device via the power supply terminal and the power receiving terminal. The substrate disposed at the adsorption device is electrostatically adsorbed, and the adsorption device includes: a device body; and a power receiving side recess provided in the device body, wherein the power receiving terminal is located at the power receiving side recess And at least a part of the exposed electrode is disposed at the apparatus body and is connected to the power receiving terminal Connection, if configured as a gas having a shape electrically conductive material of the substrate for contacting with the upper surface of the main body of the apparatus is placed, and for withdrawing the When the electrode is applied with the adsorption voltage, the substrate is adsorbed to the adsorption electrode, and when the power supply terminal is inserted into the power receiving side recess and the power supply terminal is in contact with the exposed portion of the power receiving terminal, the power source is The adsorption voltage outputted by the device is applied to the adsorption electrode via the power receiving terminal, and after the adsorption voltage is applied to the adsorption electrode, if the power receiving terminal is separated from the power supply terminal, the residual charge remains. In the adsorption electrode, when the power receiving terminal is separated from the power supply terminal and the adsorption device is moved, the substrate is adsorbed to the adsorption electrode by the residual charge of the adsorption electrode, and The power receiving side recessed portion is closed by a cover portion provided at the apparatus body. The vacuum processing apparatus according to claim 12, wherein the adsorption device is configured such that when the device body is in a horizontal posture, the cover portion is opened and the power receiving terminal and the power supply terminal are The contact between the power supply terminals is removed from the power receiving side recessed portion and the suction device is in a vertical posture from the horizontal posture, and the power receiving side concave portion is closed by the cover portion. The vacuum processing apparatus according to claim 12, wherein the cover portion is provided with a telescopic member, When the power supply terminal is inserted into the power receiving side recessed portion, the cover portion is pressed by the power supply terminal, and at least a part of the cover portion moves while the telescopic member is deformed, and the power receiving side recessed portion is opened. In the state in which the power receiving terminal is in contact with the power feeding terminal, when the power feeding terminal is removed from the power receiving side recess, the deformation of the telescopic member is restored, and the power receiving side recess is closed by the cover portion. cover. The vacuum processing apparatus according to claim 12, wherein the lid portion is formed by deforming the sheet portion if it is pressed, and returning to the original shape if the pressing is released. When the power supply terminal is inserted into the power receiving side recessed portion, the cover portion is pressed by the power supply terminal, the cover portion is deformed, and the power receiving side recessed portion is opened, and the power receiving terminal and the power supply terminal are When the power supply terminal is removed from the power receiving side recessed portion, the deformation of the cover portion is restored to the original state, and the power receiving side concave portion is covered by the cover portion. A vacuum processing apparatus comprising: a vacuum chamber formed with a gas-conducting substance having electrical conductivity; and a power supply station disposed inside the vacuum chamber; and being disposed at the power supply station The power supply terminal, the power supply station is configured to detachably arrange the adsorption device, When the adsorption device is disposed at the power supply station, the power receiving terminal provided at the adsorption device is an AC voltage outputted by the power supply device connected to the power supply terminal without being in contact with the power supply terminal. Is applied to the power receiving terminal via the power supply terminal, and is rectified by a rectifying circuit connected to the power receiving terminal, and is applied to the adsorption device provided at the adsorption device. The electrode disposed at the adsorption device is electrostatically adsorbed, and the adsorption device includes a device body, and the rectifier circuit, the power receiving terminal, and the adsorption electrode are disposed on the device body. When the gas-like substance having electrical conductivity is brought into contact with the substrate placed on the surface of the apparatus body, and the rectifying voltage is applied to the adsorption electrode, the substrate is adsorbed to the adsorption electrode. The power receiving terminal is separated from the atmosphere outside the device body, and is in the opposite After the rectifying voltage is applied to the adsorption electrode, residual charge remains in the adsorption electrode, and when the adsorption device is separated from the power supply station and moved, the substrate is caused by the residual charge of the adsorption electrode. Being adsorbed to the adsorption electrode, the power supply station is provided with a power supply side ground terminal, and the device body is provided with a power supply side connection a power receiving side grounding terminal for contacting the ground terminal, and a switching device for conducting or blocking between the adsorption electrode and the power receiving side ground terminal, and conducting or blocking between the adsorption electrode and the power receiving terminal, and The control device for controlling the conduction and the blocking control of the switching device superimposes a control signal for controlling the conduction and the blocking of the switching device in the AC voltage applied to the power supply terminal, and receives the control signal from the power receiving terminal. The control signal is extracted by the voltage received by the terminal and input to the control device.