CN107431040B - Adsorption device and vacuum processing device - Google Patents

Adsorption device and vacuum processing device Download PDF

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Publication number
CN107431040B
CN107431040B CN201680022120.9A CN201680022120A CN107431040B CN 107431040 B CN107431040 B CN 107431040B CN 201680022120 A CN201680022120 A CN 201680022120A CN 107431040 B CN107431040 B CN 107431040B
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terminal
power supply
power receiving
adsorption
power
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CN107431040A (en
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川久保大辅
前平谦
不破耕
铃木杰之
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Ulvac Inc
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Ulvac Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Separation Of Gases By Adsorption (AREA)

Abstract

To provide an adsorption device which does not weaken the adsorption force. The power receiving terminals 24 of the suction device 19a are disposed in the power receiving-side recess 23 and can be covered with the cover 25 a. On the counter substrate 51~53When suction is performed, the suction device 19a is placed on the power supply station 18a, and the power supply terminal 64 is brought into contact with the power receiving terminal 24 to be applied to the substrate 51~53And the equivalent capacitance with the adsorption electrode 22. When the adsorption device 19a is moved, the substrate 5 is adsorbed by the residual charge of the equivalent capacitance1~53While the lid portion 25a covers the power receiving-side concave portion 23, the residual gas in the vacuum chamber does not contact the power receiving terminals 24. The residual charge of the equivalent capacitance is not discharged without the corrosion of the power receiving terminal 24 or the formation of a thin film.

Description

Adsorption device and vacuum processing device
Technical Field
The present invention relates to an adsorption apparatus and a vacuum processing apparatus, and more particularly, to an adsorption apparatus that can move in a state of adsorbing a substrate in a vacuum environment, and a vacuum processing apparatus having a power supply stage on which the adsorption apparatus is mounted.
Background
When a substrate is processed in a vacuum environment, a method is performed in which the substrate is placed on an adsorption device and the adsorption device adsorbs the substrate, and the temperature of the substrate is indirectly controlled by controlling the temperature of the adsorption device.
In recent years, although there is an adsorption device that is equipped with a battery and can move in a state where a substrate is adsorbed by operation of the battery, the adsorption device is expensive and also large in volume.
Further, there is a suction apparatus which is free of a battery, and which is capable of moving by bringing a power receiving terminal connected to a suction electrode of the suction apparatus into contact with a power supply terminal of a power supply apparatus connected to a power supply in a stationary state to charge an equivalent capacitance between the suction electrode and a substrate and separating the power receiving terminal and the power supply terminal from each other.
However, in such a suction apparatus, there is a case where the suction force during the vacuum processing or the suction force during the movement is reduced, and a countermeasure is required.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2007-53348;
patent document 2: japanese patent laid-open publication No. 2009-99674;
patent document 3: WO2006-123680 publication.
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made to solve the above-described problems of the prior art, and an object of the present invention is to provide a technique capable of sucking a substrate without reducing the suction force during vacuum processing or during movement.
Means for solving the problems
The inventors of the present invention have found that: since the power receiving terminal of the adsorption device is in contact with the conductive gas atmosphere in the vacuum chamber in a state where a high voltage is applied due to the residual charge remaining in the equivalent capacitance, the residual charge is discharged during movement, and the adsorption force decreases during movement. Therefore, if the exposure of the power receiving terminal to the conductive gas is prevented, the decrease in the suction force is eliminated.
The present invention is based on the above findings, and provides an adsorption apparatus comprising: a device main body; a power receiving side recess provided in the device main body; a power receiving terminal at least a portion of which is exposed to the power receiving-side recess; and an adsorption electrode provided in the device main body, electrically connected to the power receiving terminal, the adsorption electrode being adsorbed by a gas-like substance having conductivity, the adsorption electrode being in contact with a substrate placed on a surface of the device main body, the adsorption electrode being configured to apply an adsorption voltage output from the power supply device to a power supply terminal provided in a power supply stand on which the adsorption device is placed and connected to a power supply device when the power supply terminal is inserted into the power receiving-side recess and the power supply terminal is in contact with an exposed portion of the power receiving terminal, the adsorption electrode remaining electric charges in the adsorption electrode when the power receiving terminal is separated from the power supply terminal after the adsorption voltage is applied to the adsorption electrode, and the adsorption electrode being configured to move the adsorption device while the power receiving terminal is separated from the power supply terminal, the substrate is attracted by the attraction electrode due to the residual charge of the attraction electrode, and the power receiving-side recess is closed by a lid provided to the device main body.
The invention relates to an adsorption device, which comprises the following components: the suction device is configured such that the cover is opened when the device body is in a horizontal posture to enable the power receiving terminals to be brought into contact with the power feeding terminals, and the power receiving-side concave portion is closed by the cover when the power feeding terminals are pulled out from the power receiving-side concave portion and the suction device is changed from the horizontal posture to a vertical posture.
The invention relates to an adsorption device, which comprises the following components: the cover portion is provided with an extensible member, and when the power supply terminal is inserted into the power receiving side recess portion, the cover portion is pressed by the power supply terminal, the extensible member is deformed, and at the same time, at least a part of the cover portion moves to a state where the power receiving side recess portion is opened, the power supply terminal comes into contact with the power receiving terminal, and when the power supply terminal is removed from the power receiving side recess portion, the extensible member is deformed to return to its original state, and the power receiving side recess portion is covered with the cover portion.
The invention relates to an adsorption device, which comprises the following components: the cover portion is formed of a material that deforms when pressed and returns to its original shape when the pressing is released, and when the power supply terminal is inserted into the power receiving-side recess portion, the cover portion is pressed by the power supply terminal, the cover portion deforms to become a state in which the power receiving-side recess portion is opened, the power supply terminal comes into contact with the power receiving terminal, and when the power supply terminal is removed from the power receiving-side recess portion, the deformation of the cover portion returns to its original shape, and the power receiving-side recess portion is covered with the cover portion.
The present invention is an adsorption apparatus comprising: a device main body; a power receiving terminal provided in the device main body; a rectifying circuit provided in the apparatus main body; and an adsorption electrode provided in the device main body, connected to the power receiving terminal via the rectifier circuit, and in contact with a substrate placed on a surface of the device main body, the substrate is attracted by the attraction electrode when an attraction voltage is applied to the attraction electrode, wherein the power receiving terminal is separated from an environment outside the apparatus main body, and when the adsorption apparatus is mounted on a power supply stand, a power supply terminal provided in the power supply station and the power receiving terminal are in proximity in a non-contact state, the power receiving terminal receives an alternating voltage applied to the power supply terminal, applies the chucking voltage to the chucking electrode via the rectifying circuit, when the adsorption device moves while being separated from the power supply stage, the substrate is adsorbed by the adsorption electrode due to residual charges of the adsorption electrode.
The invention relates to an adsorption device, which comprises the following components: comprising: a power receiving-side ground terminal contactable with a power supply-side ground terminal provided in the power supply station; a switching device for connecting or disconnecting the attraction electrode to or from the power receiving-side ground terminal and connecting or disconnecting the attraction electrode to or from the power receiving terminal; and a control device that switches connection of the switching device, superimposes a control signal that controls on/off of the switching device on an alternating-current voltage applied to the power supply terminal, extracts the control signal from a voltage received by the power receiving terminal, and inputs the control signal to the control device.
The invention relates to an adsorption device, which comprises the following components: is provided with: a power receiving-side ground terminal contactable with a power supply-side ground terminal provided in the power supply station; a switching device for connecting or disconnecting the attraction electrode to or from the power receiving-side ground terminal and connecting or disconnecting the attraction electrode to or from the power receiving terminal; a control device that switches connection of the switching device; and a power receiving side control terminal connected to the control device, and to which a control signal for controlling on/off of the switching device is input from a power supply side control terminal provided in the power supply station.
The invention relates to an adsorption device, which comprises the following components: the power receiving terminal and the power supply terminal are each constituted by a plate electrode, and when the adsorption device is placed on the power supply stage, a capacitor is formed by the power receiving terminal and the power supply terminal.
The invention relates to an adsorption device, which comprises the following components: the power supply side control terminal and the power reception side control terminal are respectively constituted by parallel flat plate type electrodes, and when the adsorption apparatus is placed on the power supply stage, a capacitor is formed by the power reception side control terminal and the power supply side control terminal, and the control signal output from the power supply side control terminal is transmitted to the power reception side control terminal.
The invention relates to an adsorption device, which comprises the following components: the power receiving terminal and the power supply terminal are each formed of a coil, and when the suction device is placed on the power supply table, a transformer is formed in which the power receiving terminal and the power supply terminal are magnetically coupled.
The invention relates to an adsorption device, which comprises the following components: the power supply side control terminal and the power reception side control terminal are each formed of a coil, and when the suction device is placed on the power supply stage, a transformer is formed in which the power reception side control terminal and the power supply side control terminal are magnetically coupled, and the control signal output from the power supply side control terminal is transmitted to the power reception side control terminal.
The invention relates to an adsorption device, which comprises the following components: the plurality of substrates are placed on the adsorption electrode.
The invention relates to an adsorption device, which comprises the following components: the plurality of substrates are placed on the adsorption electrode.
The invention relates to an adsorption device, which comprises the following components: the gaseous substance having conductivity is plasma.
The invention relates to an adsorption device, which comprises the following components: the gaseous substance having conductivity is plasma.
Further, the present invention provides a vacuum processing apparatus comprising: a vacuum chamber for forming a gaseous substance having conductivity; a power supply station disposed inside the vacuum chamber; and a power supply terminal provided in the power supply station, wherein the power supply station is configured to detachably dispose an adsorption device, and when the adsorption device is disposed in the power supply station, a power receiving terminal provided in the adsorption device is brought into contact with the power supply terminal, and an adsorption voltage output from a power supply device connected to the power supply terminal is applied to an adsorption electrode provided in the adsorption device via the power supply terminal and the power receiving terminal, whereby a substrate disposed in the adsorption device is electrostatically adsorbed.
The invention of the present application is a vacuum processing apparatus having the adsorption apparatus, which is a vacuum processing apparatus as follows: the adsorption device is provided with: a device main body; and a power receiving-side recess portion provided in the device main body, the power receiving terminal being exposed at least partially in the power receiving-side recess portion, an adsorption electrode being provided in the device main body, the adsorption electrode being electrically connected to the power receiving terminal, a gaseous substance having conductivity being in contact with a substrate placed on a surface of the device main body, the substrate being adsorbed by the adsorption electrode when the adsorption voltage is applied to the adsorption electrode, the adsorption voltage output from the power supply device being applied to the adsorption electrode via the power receiving terminal when the power supply terminal is inserted into the power receiving-side recess portion and the power supply terminal is in contact with the exposed portion of the power receiving terminal, and the residual electric charges remaining in the adsorption electrode when the power receiving terminal is separated from the power supply terminal after the adsorption voltage is applied to the adsorption electrode and the adsorption device is moved while the power receiving terminal is separated from the power supply terminal, the substrate is attracted by the attraction electrode due to the residual charge of the attraction electrode, and the power receiving-side recess is closed by a lid provided to the device main body.
The present invention relates to a vacuum processing apparatus, which comprises: the suction device is configured such that the cover is opened when the device body is in a horizontal posture to enable the power receiving terminals to be brought into contact with the power feeding terminals, and the power receiving-side concave portion is closed by the cover when the power feeding terminals are pulled out from the power receiving-side concave portion and the suction device is changed from the horizontal posture to a vertical posture.
The present invention relates to a vacuum processing apparatus, which comprises: the cover portion is provided with an extensible member, and when the power supply terminal is inserted into the power receiving side recess portion, the cover portion is pressed by the power supply terminal, the extensible member is deformed, and at the same time, at least a part of the cover portion moves to a state where the power receiving side recess portion is opened, the power supply terminal comes into contact with the power receiving terminal, and when the power supply terminal is removed from the power receiving side recess portion, the extensible member is deformed to return to its original state, and the power receiving side recess portion is covered with the cover portion.
The present invention relates to a vacuum processing apparatus, which comprises: the cover portion is formed of a material that deforms when pressed and returns to its original shape when the pressing is released, and when the power supply terminal is inserted into the power receiving-side recess portion, the cover portion is pressed by the power supply terminal, the cover portion deforms to become a state in which the power receiving-side recess portion is opened, the power supply terminal comes into contact with the power receiving terminal, and when the power supply terminal is removed from the power receiving-side recess portion, the deformation of the cover portion returns to its original shape, and the power receiving-side recess portion is covered with the cover portion.
The present invention provides a vacuum processing apparatus, comprising: a vacuum chamber for forming a gaseous substance having conductivity; a power supply station disposed inside the vacuum chamber; and a power supply terminal provided in the power supply station, wherein the power supply station is configured to detachably dispose an adsorption device, and when the adsorption device is disposed in the power supply station, a power receiving terminal provided in the adsorption device is brought into proximity with the power supply terminal in a non-contact manner, an alternating-current voltage output from a power supply device connected to the power supply terminal is applied to the power receiving terminal via the power supply terminal, a rectified voltage rectified by a rectifier circuit connected to the power receiving terminal is applied to an adsorption electrode provided in the adsorption device, and a substrate disposed in the adsorption device is electrostatically adsorbed.
The invention of the present application is a vacuum processing apparatus having the adsorption apparatus, which is a vacuum processing apparatus as follows: the adsorption device is configured to: the apparatus includes an apparatus main body, the rectifier circuit, the power receiving terminal, and the adsorption electrode are provided in the apparatus main body, a gaseous substance having conductivity is in contact with a substrate placed on a surface of the apparatus main body, and the substrate is adsorbed by the adsorption electrode when the rectifier voltage is applied to the adsorption electrode, and the apparatus is configured such that: the power receiving terminal is separated from an environment outside the device main body, residual charges remain in the chucking electrode after the rectified voltage is applied to the chucking electrode, and the substrate is chucked by the chucking electrode due to the residual charges of the chucking electrode when the chucking electrode is separated from the power feeding stage and moved.
The present invention relates to a vacuum processing apparatus, which comprises: the power supply station is provided with a power supply side ground terminal, and the apparatus main body is provided with: a power receiving-side ground terminal contactable with the power supply-side ground terminal; a switching device for connecting or disconnecting the attraction electrode to or from the power receiving-side ground terminal and connecting or disconnecting the attraction electrode to or from the power receiving terminal; and a control device that controls the turning on and off of the switching device, superimposes a control signal that controls the turning on and off of the switching device on an alternating-current voltage applied to the power supply terminal, extracts the control signal from a voltage received by the power receiving terminal, and inputs the control signal to the control device.
The present invention relates to a vacuum processing apparatus, which comprises: the power supply station is provided with a power supply side ground terminal, and the apparatus main body is provided with: a power receiving-side ground terminal contactable with the power supply-side ground terminal; a switching device that conducts or cuts off between the attraction electrode and the power receiving-side ground terminal and between the attraction electrode and the power receiving terminal; a control device for controlling the on/off of the switching device; and a power receiving side control terminal connected to the control device and configured to input a control signal for controlling the on/off to the control device from a power supply side control terminal provided in the power supply station.
The present invention relates to a vacuum processing apparatus, which comprises: the power receiving terminal and the power supply terminal are each constituted by a plate electrode, and when the adsorption device is placed on the power supply stage, a capacitor is formed by the power receiving terminal and the power supply terminal.
The present invention relates to a vacuum processing apparatus, which comprises: the power supply side control terminal and the power reception side control terminal are respectively constituted by parallel flat plate type electrodes, and when the adsorption apparatus is placed on the power supply stage, a capacitor is formed by the power reception side control terminal and the power supply side control terminal, and the control signal output from the power supply side control terminal is transmitted to the power reception side control terminal.
The present invention relates to a vacuum processing apparatus, which comprises: the power receiving terminal and the power supply terminal are each formed of a coil, and when the suction device is placed on the power supply table, a transformer is formed in which the power receiving terminal and the power supply terminal are magnetically coupled.
The present invention relates to a vacuum processing apparatus, which comprises: the power supply side control terminal and the power reception side control terminal are each formed of a coil, and when the suction device is placed on the power supply stage, a transformer is formed in which the power reception side control terminal and the power supply side control terminal are magnetically coupled, and the control signal output from the power supply side control terminal is transmitted to the power reception side control terminal.
Effects of the invention
By preventing deterioration, corrosion, and film formation of the power receiving terminal, the decrease in the suction force is eliminated, and the life of the suction device is increased.
Drawings
FIGS. 1 (a) to (c) are views for explaining a vacuum processing apparatus according to the present invention.
Fig. 2 (a) and (b) are views for explaining an adsorption apparatus according to a first example of the present invention.
Fig. 3 is a diagram for explaining a first example of the suction apparatus in the vertical posture.
Fig. 4 (a) and (b) are views for explaining an adsorption apparatus according to a second example of the present invention.
Fig. 5 (a) and (b) are views for explaining an adsorption apparatus according to a third example of the present invention.
Fig. 6 (a) and (b) are views for explaining an adsorption apparatus according to a fourth example of the present invention.
Fig. 7 (a) and (b) are views for explaining an adsorption apparatus according to a fifth example of the present invention.
Detailed Description
< embodiment >
Reference numeral 2 in FIGS. 1 (a) to (c) is a vacuum apparatus of the present invention.
Referring to fig. 1 (a), the vacuum apparatus 2 has one or more vacuum processing apparatuses 151、152。
Vacuum pointGrooming device 151、152The vacuum vessel 16 is provided, and a power supply station 18 and a processing unit 17 are disposed inside the vacuum vessel 16.
First, as shown in fig. 1 (b), the processing device 14 at the slave stage1The adsorption device 19 on which the plurality of substrates 5 are placed is carried into the first vacuum processing apparatus 151And is placed on the power supply table 18.
The power feeding station 18 is provided with a power feeding device 60, and the suction device 19 is provided with a power receiving device 20. The power feeding device 60 is connected to the power feeding device 66, and the power receiving device 20 is connected to one of the attraction electrodes 22 provided in the attraction device 19, and when the power feeding device 66 is operated to apply a voltage to the power feeding device 60, the power feeding device 60 supplies the voltage to the power receiving device 20. The voltage supplied to the power receiving device 20 is used to supply a clamping voltage from the power receiving device 20 to the clamping electrode 22. The vacuum tank 16 is connected to a ground potential. The potential of the attraction electrode 22 can be attracted regardless of whether it is a positive potential or a negative potential.
The chucking electrode 22 is located right below the plurality of substrates 5 placed on the chucking device 19, the chucking electrode 22 is here a single conductive plate or film, and each substrate 5 is placed inside the outer periphery of the chucking electrode 22. Here, one chucking electrode 22 is used, but a plurality of small-diameter electrodes may be used to form a chucking electrode and a chucking voltage of the same magnitude may be supplied to each of the small-diameter electrodes.
The vacuum exhaust devices 68 are connected to the vacuum processing apparatus 15, respectively1、152The vacuum chamber 16 in (2) is operated by the vacuum evacuation device 68, and when plasma is formed in the vacuum chamber 16 after the vacuum chamber 16 is evacuated to form a vacuum atmosphere, the plasma is a gaseous charged substance having conductivity, and is in contact with the substrate 5 placed on the adsorption device 19 and the wall surface of the vacuum chamber 16, thereby electrically connecting the substrate 5 to the vacuum chamber 16.
Each vacuum chamber 16 is connected to a ground potential, and the substrate 5 is connected to the ground potential.
An equivalent capacitance is formed between the substrate 5 and the attraction electrode 22, and when an attraction voltage is supplied to the attraction electrode 22 in a state where the substrate 5 is connected to a ground potential by plasma, the equivalent capacitance is charged, the substrate 5 and the attraction electrode 22 are charged to voltages of opposite polarities to each other, an electrostatic force is generated therebetween, and the substrate 5 is electrostatically attracted by the attraction electrode 22.
In this state, when the processing unit 17 is operated, the substrate 5 is vacuum-processed.
Here, the processing unit 17 is a shower plate (shower plate), and an etching gas is introduced from the processing unit 17 to form an etching gas plasma inside the vacuum chamber 16, so that the thin film formed on the surface of the substrate 5 is etched with respect to the substrate 5 adsorbed by the adsorbing device 19.
During this vacuum treatment, the substrate 5 is closely attached to the suction device 19 by suction, and the thermal conductivity is increased. Therefore, the substrate 5 can be heated or cooled by providing a heating device or a cooling device on the power supply table 18 and heating or cooling the adsorption device 19 by those heating devices or cooling devices.
During the vacuum processing, the chucking voltage is supplied to the chucking electrode 22, and when the vacuum processing is completed, the voltage supply from the power feeding device 60 to the power receiving device 20 is completed, and the voltage supply to the chucking electrode 22 is completed.
In this state, the first vacuum processing apparatus 15 is transferred by a transfer apparatus or the like1The suction device 19 is separated from the power supply table 18 and moved to the next vacuum processing apparatus 152As shown in FIG. 1 (c), a new adsorption apparatus 19 is placed in the vacuum vessel 16 of the first vacuum processing apparatus 151The power supply station 18. In the figure, reference numeral 11 denotes a vacuum processing apparatus 151、152Interval or processing device 141、142And the like, and when the vacuum valve is in an open state, the suction device 19 is allowed to pass through the vacuum valve.
Although no voltage is supplied from the power feeding device 60 to the power receiving device 20 of the attraction device 19 that is moving, residual charges of opposite polarities remain on the attraction electrode 22 and the substrate 5 even when the voltage supply to the attraction electrode 22 is completed, and the substrate 5 is maintained in the attracted state by the attraction device 19 due to the attraction force of the residual charges.
Specific examples of the suction device 19 and the power supply table 18 will be described.
Reference numerals 19a to 19e in fig. 2 and 4 to 7 denote specific first to fifth example suction devices, and reference numerals 18a to 18e denote specific first to fifth example power feeding stations corresponding to the first to fifth example suction devices 19a to 19 e.
In the adsorption devices 19a to 19e of the first to fifth examples, the adsorption electrode 22 is disposed inside the device main body 21 formed by forming an insulator into a plate shape, and the surface of the adsorption electrode 22 is not exposed to the outside of the device main body 21.
A plurality of substrates 5 are mounted on the surface of the apparatus main body 211~53. Adsorption electrodes 22 are provided on the respective substrates 51~53In the position directly below.
< first to third examples >
The power receiving devices 20a to 20c of the adsorption devices 19a to 19c of the first to third examples respectively have: a power receiving-side recess 23 provided on the back surface side of the device main body 21, power receiving terminals 24 arranged inside the power receiving-side recess 23, that is, on the bottom surface thereof, and covers 25a, 25b, 25c, and 25d forming a cover of the power receiving-side recess 23. At least a part of the power receiving terminal 24 is exposed to the power receiving-side recess 23, and here, the power receiving terminal 24 is made of a member having electrical conductivity such as metal, and the film surface is exposed to the power receiving-side recess 23.
The power feeding tables 18a to 18c of the first to third examples have a table main body 61 formed by forming an insulating body into a table shape, and the power feeding devices 60a to 60c of the power feeding tables 18a to 18c of the first to third examples have power feeding terminals 64.
Here, the power feeding devices 60a to 60c of the first to third examples have a power feeding side concave portion 63 formed on the surface of the table main body 61, and a power feeding terminal 64 is attached to the bottom surface of the power feeding side concave portion 63 via a power feeding side extensible member 62 such as a spring.
The upper ends of the power supply terminals 64 of the power supply stations 18a to 18c of the first to third examples are located above the surface of the station main body 61, and the height of the upper ends of the power supply terminals 64 from the surface of the station main body 61 is longer than the distance between the lower ends of the power receiving terminals 24 and the bottom surface of the apparatus main body 21. Here, the power receiving terminal 24 is a film, and the film surface is the lower end.
In the suction devices 19a and 19b of the first and second examples, the lid portions 25a and 25b are provided on a rotating device 27 rotatably attached to the bottom surface of the device main body 21.
The lid portions 25a and 25b are attached to the rotating device 27 at the edges of the lid portions 25a and 25b, and the lid portions 25a and 25b rotate together with the rotating device 27.
In the suction device 19a of the first example, when the device main body 21 is in the horizontal posture, the lid portion 25a is positioned upward at the portion attached to the rotating device 27 and downward at the opposite side thereof due to its own weight, and therefore, the lid portion 25a does not close the opening of the power receiving-side concave portion 23, and when the device main body 21 is in the horizontal posture, the lid portion 25a is in the vertical posture and the lid of the power receiving-side concave portion 23 is opened.
On the other hand, in the case where the suction device 19a of the first example is vertically disposed such that the side of the power receiving-side concave portion 23 where the rotating device 27 is provided is located upward and the opposite side is located downward as shown in fig. 3, the lid portion 25a is vertical and the opening of the power receiving-side concave portion 23 is vertical, and therefore the power receiving-side concave portion 23 is covered with the lid portion 25 a.
In the suction device 19b of the second example, the lid portion 25b is attached to the device body 21 via the power receiving side expansion member 28, and the power receiving side concave portion 23 of the suction device 19b of the second example is covered with the lid portion 25b in a state where the lid portion 25b is not pressed.
In the suction device 19c of the third example, the two flexible lid portions 25c and 25d are provided so that the side surfaces thereof contact each other to cover the power receiving-side recess 23, and the contact portions of the two lid portions 25c and 25d are located near the center of the power receiving-side recess 23.
In the adsorption devices 19b and 19c of the second and third examples, the power receiving-side concave portion 23 is covered with the lid portions 25b, 25c, and 25d, and when the adsorption devices 19b and 19c of the second and third examples are moved inside the vacuum chamber 16, residual gas in the vacuum chamber 16 does not enter the power receiving-side concave portion 23 of the adsorption devices 19b and 19c of the second and third examples, whereas when the adsorption device 19a of the first example is in the vertical posture, the power receiving-side concave portion 23 is covered, and therefore, when the adsorption device 19a of the first example is moved in the vertical posture, residual gas in the moved vacuum chamber 16 does not enter the power receiving-side concave portion 23.
The following describes a process of placing the suction devices 19a to 19c of the first to third examples on the power feeding tables 18a to 18c of the first to third examples in a state where they are spaced apart from the upper sides of the power feeding tables 18a to 18c of the first to third examples.
The suction devices 19a to 19c of the first to third examples are set in a horizontal posture, and they are arranged above the power supply tables 18a to 18c of the first to third examples, respectively, by a moving device (not shown).
The first to third embodiments of the suction devices 19a to 19c are lowered by the moving device while they are in a horizontal posture.
Due to the lowering, in the suction device 19a of the first example, the lid portion 25a in the vertical posture is inserted into the power supply side concave portion 63.
Since the depth of the power supply-side concave portion 63 is longer than the height from the lower end of the lid portion 25a in the vertical posture to the bottom surface of the apparatus main body 21, the lower end of the lid portion 25a does not contact the bottom surface of the power supply-side concave portion 63, and the lower end of the power receiving terminal 24 contacts the upper end of the power supply terminal 64.
In the suction device 19b of the second example, the upper end of the power supply terminal 64 contacts the bottom surface of the lid portion 25b, and when the suction device 19b of the second example is further lowered, the power supply terminal 64 presses the lid portion 25b from below, the power receiving-side expansion member 28 is compressively deformed, the lid portion 25b is pushed upward, the power supply terminal 64 is moved from the position directly below the power receiving terminal 24, and the power receiving terminal 24 located inside the power receiving-side recess 23 is exposed to the external environment of the power receiving-side recess 23.
On the other hand, in the suction device 19c of the third example, the power supply terminal 64 is disposed at a position where the upper end of the power supply terminal 64 can come into contact with the portions of the two lid portions 25c and 25d when the suction device 19c of the third example is lowered.
When the two covers 25c and 25d are formed of a material that deforms when pressed, and when the suction device 19c of the third example is further lowered after the upper end of the power supply terminal 64 and the portions where the two covers 25c and 25d contact each other are brought into contact, the contact portions of the two covers 25c and 25d are pressed from below and pushed upward, the shapes of the covers 25c and 25d are bent and deformed, the portions of the covers 25c and 25d located directly below the power receiving terminals 24 are moved, and the power receiving terminals 24 located inside the power receiving-side recess 23 are exposed to the external environment of the power receiving-side recess 23.
When the suction devices 19b and 19c of the second and third examples are further lowered from this state, the upper end of the power supply terminal 64 moves in the power receiving-side concave portion 23 close to the power receiving terminal 24, and the upper end of the power supply terminal 64 comes into contact with the lower end of the power receiving terminal 24.
When the lower ends of the power receiving terminals 24 of the suction devices 19a to 19c of the first to third examples are brought into contact with the upper ends of the power supply terminals 64 of the power supply stages 18a to 18c of the first to third examples, the bottom surface of the device main body 21 is not brought into contact with the surface of the stage main body 61, and when the suction devices 19a to 19c of the first to third examples are further lowered, the power supply side extensible member 62 is compressed and the power supply side extensible member 62 is shortened, and at the same time, the suction devices 19a to 19c of the first to third examples are brought close to the power supply stages 18a to 18c of the first to third examples, and when the bottom surface of the device main body 21 is brought into contact with the surface of the stage main body 61, the suction devices 19a to 19c of the first to third examples are placed on the power supply stages 18a to 18c of the first to third examples.
The power receiving terminal 24 is electrically connected to the adsorption electrode 22, and the power supply terminal 64 is electrically connected to a power supply device 66 disposed outside the vacuum chamber 16.
In the power feeding stages 18a to 18c of the first to third examples, a variable dc voltage source is used for the power supply device 66, and when the power supply device 66 is activated and outputs a dc clamping voltage, the clamping voltage is applied to the clamping electrode 22 via the power feeding terminal 64 and the power receiving terminal 24.
Then, when the etching gas is introduced from the processing section 17 into the vacuum chamber 16 in which the power feeding stages 18a to 18c of the first to third examples are disposed to generate plasma of the etching gas as described above, the plasma is a gaseous substance having conductivity, and the substrate 5 on the adsorption devices 19a to 19c of the first to third examples is placed1~53The substrate 5 is in contact with the wall surface of the vacuum chamber 161~53Is connected to ground potential, the equivalent capacitor is charged, and the substrate 51~53Is adsorbed by the adsorption electrodes 22 of the adsorption devices 19a to 19c of the first to third examples.
When each substrate 51~53The introduction of the etching gas is stopped when the thin film on the surface of (1) is etched, and the plasma is extinguished.
After the operation of the power supply device 66 is stopped, the attraction electrode 22 is connected to the same ground potential as the vacuum tank 16, and the electric charges accumulated in the equivalent capacitance are discharged, the attraction devices 19a to 19c of the first to third examples are separated from the power feeding stages 18a to 18c of the first to third examples by the moving device, and the power receiving terminal 24 is separated from the power feeding terminal 64.
The suction device 19a of the first example is set to the vertical posture from the horizontal posture after the power feeding terminal 64 is removed from the power receiving-side concave portion 23 so that the power receiving-side concave portion 23 is covered with the lid portion 25 a.
In the suction device 19b of the second example, when the power feeding terminal 64 is pulled out from the power receiving-side concave portion 23, the compressed power receiving-side expansion member 28 returns to the original shape, and the power receiving-side concave portion 23 of the suction device 19b of the second example is covered with the lid portion 25 b.
In the suction device 19c of the third example, when the power feeding terminal 64 is pulled out from the power receiving-side concave portion 23, the deformed two lid portions 25c and 25d return to the original shapes, and the power receiving-side concave portion 23 of the suction device 19c of the third example is covered with the two lid portions 25c and 25 d.
The attraction electrodes 22 of the attraction devices 19a to 19c of the first to third examples are connected to the ground potential, and electric charges remain even after being separated from the power supply terminal 64, and the voltage as the difference between the potential of the attraction electrode 22 and the ground potential is in a large state.
In this state, when the power receiving terminal 24 is in contact with a reactive gas, deterioration or corrosion of the power receiving terminal 24 or formation of a thin film occurs.
In the adsorption devices 19a to 19c of the first to third examples, since the power receiving-side concave portion 23 is in a state of being covered with the cover portions 25a to 25d, when the vacuum vessel 16 is separated from the power feeding tables 18a to 18c of the first to third examples and is carried into another vacuum vessel 16 in a state of being covered with the cover, the residual gas in the carried-in vacuum vessel 16 cannot enter the inside of the power receiving-side concave portion 23, and therefore, problems such as deterioration, corrosion, and formation of a thin film are unlikely to occur in the power receiving terminal 24.
In the power feeding stages 18a to 18c of the first to third examples, since the output voltage of the power supply device 66 is set to the ground potential and the power feeding terminal 64 is connected to the ground potential, problems such as deterioration, corrosion, and film formation are less likely to occur even if the power feeding stage comes into contact with the residual gas.
< fourth and fifth examples >
Next, the adsorption apparatuses 19d and 19e of the fourth and fifth examples will be described with reference to fig. 6 (a) and (b) and fig. 7 (a) and (b).
First, a configuration common to the suction devices 19d and 19e of the fourth and fifth examples and a configuration common to the power feeding tables 18d and 18e of the fourth and fifth examples will be described.
The power receiving devices 20d and 20e of the suction devices 19d and 19e of the fourth and fifth examples include a switching device 36, a rectifier circuit 34, a power receiving-side control device 35, a power receiving-side ground terminal 33, power receiving- side control terminals 32 and 42, and power receiving terminals 31 and 41, in addition to the suction electrode 22.
The power receiving terminals 31 and 41 and the power receiving- side control terminals 32 and 42 are disposed near the bottom surface inside the device main body 21 and do not come into contact with the environment outside the device main body 21.
The power receiving-side ground terminal 33 is provided on the bottom surface of the apparatus main body 21, and is disposed so as to be exposed to the inside of the ground recess 38 having a depth equal to or greater than the thickness of the power receiving-side ground terminal 33.
The power receiving terminals 31 and 41 are connected to the rectifier circuit 34, and the rectifier circuit 34 and the power receiving side ground terminal 33 are connected to the adsorption electrode 22 via the switching device 36.
The power receiving terminals 31 and 41 may be connected to the rectifier circuit 34 via the switching device 36, and the rectifier circuit 34 may be connected to the adsorption electrode 22.
The switching device 36 is controlled by the power reception-side control device 35, and is operated by a signal output from the power reception-side control device 35 to the switching device 36 so as to connect the attraction electrode 22 to either one of the power reception-side ground terminal 33 and the power reception terminal 31 or to disconnect the attraction electrode 22 from both the power reception-side ground terminal 33 and the rectifier circuit 34. The adsorption electrode 22 is connected to the power receiving terminal 31 via a rectifier circuit 34.
During the conveyance, the attraction electrode 22 is cut off from both sides and set at a floating potential (floating potential).
The power feeding devices 60d, 60e of the power feeding stations 18d, 18e of the fourth and fifth embodiments have power feeding terminals 65, 75, power feeding side control terminals 67, 77, and power feeding side ground terminal 84, respectively.
The power supply terminals 65 and 75 are connected to a power supply device 66 as an ac voltage source, the power supply side control terminals 67 and 77 are connected to a power supply side control device 69, and the power supply side ground terminal 84 is connected to a ground potential.
To explain the different configurations of the suction device 19d and the power feeding stage 18d of the fourth example and the suction device 19e and the power feeding stage 18e of the fifth example, the power receiving terminal 31 and the power receiving-side control terminal 32 of the suction device 19d of the fourth example and the power feeding terminal 65 and the power feeding-side control terminal 67 of the power feeding stage 18d of the fourth example are each formed of a flat plate-like electrode, whereas the power receiving terminal 41 and the power receiving-side control terminal 42 of the suction device 19e of the fifth example and the power feeding terminal 75 and the power feeding-side control terminal 77 of the power feeding stage 18e of the fifth example are each formed of a coil.
When the suction devices 19d and 19e of the fourth and fifth examples are placed on the power feeding tables 18d and 18e of the fourth and fifth examples, respectively, the power receiving terminal 31 of the suction device 19d of the fourth example and the power feeding terminal 65 of the power feeding table 18d of the fourth example are disposed in parallel and in proximity to each other, and a power side capacitor having the power receiving terminal 31 and the power feeding terminal 65 as electrodes is formed, and the power receiving terminal 41 of the suction device 19e of the fifth example and the power feeding terminal 75 of the power feeding table 18e of the fifth example are disposed in proximity to each other, and a transformer in which the power receiving terminal 41 and the power feeding terminal 75 are magnetically coupled (magnetic coupling) is formed.
Further, when the attraction devices 19d, 19e of the fourth and fifth examples are placed on the power feeding stations 18d, 18e of the fourth and fifth examples, respectively, the power feeding- side control terminals 67, 77 are close to the power receiving- side control terminals 32, 42, and in the power feeding station 18d and the attraction device 19d of the fourth example, a control capacitor is formed by the power feeding-side control terminal 67 and the power receiving-side control terminal 32, and in the power feeding station 18e and the attraction device 19e of the fifth example, a transformer in which the power feeding-side control terminal 77 and the power receiving-side control terminal 42 are magnetically coupled is formed.
The power supply- side control terminals 67 and 77 are connected to the power supply-side control device 69, a voltage including a control signal is applied from the power supply-side control device 69 to the power supply- side control terminals 67 and 77, and when a current flowing through the power supply- side control terminals 67 and 77 changes due to the voltage, a voltage including a control signal is induced in the power reception- side control terminals 32 and 42, and the control signal is input to the power reception-side control device 35.
The power reception side control device 35 switches the connection of the switching device 36 according to the content of the input control signal. Here, one of the two switches 37a and 37b is turned on, and the other is turned off.
When the substrate 5 is placed thereon1~53When the suction devices 19d and 19e are placed on the power feeding tables 18d and 18e, the power feeding side control device 69 transmits a signal for connecting the suction electrode 22 to the rectifying circuit 34 to the power receiving side control device 35 via the power feeding side control terminals 67 and 77 and the power receiving side control terminals 32 and 42, and the power receiving side control device 35 connects the suction electrode 22 to the rectifying circuit 34. In this state, the attraction electrode 22 is disconnected from the power reception side ground terminal 33.
Plasma is generated in the vacuum chamber 16, and the substrate 5 is placed on the plasma1~53When the power supply device 66 is connected to the ground potential and outputs an ac voltage on the assumption that it is operated, the substrates 5 are placed on the power feeding stage 18d and the suction device 19d of the fourth example1~53The equivalent capacitance between the adsorption electrode 22 and the power-side capacitor are connected in series to the power supply device 66, and when the power supply device 66 outputs an ac voltage, a voltage rectified by the rectifier circuit 34 is applied to the adsorption electrode 22, and the equivalent capacitance is charged by a voltage of either positive or negative polarity.
On the other hand, in the power supply stand 18e and the suction device 19e of the fifth example, when the power supply device 66 outputs an ac voltage and an ac current flows through the power supply terminal 75, an ac voltage is induced in the power receiving terminal 41 due to magnetic coupling, and the ac voltage is applied to the rectifier circuit 34.
The power supply-side ground terminal 84 is connected to a ground potential, and in a state where the adsorption devices 19d, 19e of the fourth and fifth examples are placed on the power supply stations 18d, 18e of the fourth and fifth examples, respectively, the power reception-side ground terminal 33 is in contact with the power supply-side ground terminal 84, the power reception-side ground terminal 33 is connected to the ground potential, one end of the coil as the power reception terminal 41 of the fifth example is connected to the power reception-side ground terminal 33, is connected to the ground potential via the power supply-side ground terminal 84, and the other end is connected to the rectifier circuit 34, and when an ac voltage caused in the power reception terminal 41 is applied to the rectifier circuit 34, a current rectified by the rectifier circuit 34 flows to the equivalent capacitor, and the equivalent capacitor is charged with a voltage of either a positive or negative polarity. The midpoint of the coil may also be connected to the power-receiving-side ground terminal 33.
Therefore, in the suction devices 19d and 19e of the fourth and fifth examples, the substrates 5 are respectively disposed1~53Is adsorbed by the adsorption electrode 22.
When each substrate 5 is caused to generate plasma in the vacuum chamber 161~53When the vacuum treatment is performed, the vacuum treatment is completed.
When the plasma is extinguished and the outputs of the power supply 66 and the power supply side control unit 69 are also stopped in the case of conveyance before the next process, the attraction electrode 22 becomes a floating potential, and charges remain in the equivalent capacitance, thereby maintaining the substrate 51~53And is adsorbed by the adsorption electrode 22.
Stopping the substrate 5 from the adsorption electrode 22 without the next process1~53In the case of the attraction, a voltage including a control signal for connecting the attraction electrode 22 to the power receiving-side ground terminal 33 is output from the power supply-side control device 69, and passes through the power supply- side control terminals 67 and 77 and the power receiving- side control terminal 32,42 is transmitted to the power reception side controller 35, the switching device 36 disconnects the adsorption electrode 22 from the rectifier circuit 34 and connects it to the power reception side ground terminal 33, discharges the equivalent capacitance between the electrode and the ground potential through which the plasma has passed, stops adsorption, extinguishes the plasma, stops the outputs of the power supply device 66 and the power supply side controller 69, and moves the adsorption devices 19d and 19e of the fourth and fifth examples and the power supply stations 18d and 18e of the fourth and fifth examples by separating them by the moving device.
In short, during the conveyance, the suction devices 19d and 19e are conveyed while maintaining the suction state toward the next process, and therefore, the two switches 37a and 37b are turned off.
When the electrode is carried out into the atmosphere, the switch 37a on the ground side is turned on, the switch 37b on the power receiving side is turned off, and the electrode is exposed to plasma in a state where the adsorption electrode 22 is connected to the ground potential, and then carried out into the atmosphere.
Even if the attraction electrodes 22 of the attraction devices 19d and 19e of the fourth and fifth examples are connected to the ground potential and separated from the power feeding stages 18d and 18e of the fourth and fifth examples, electric charges remain in the equivalent capacitance, and the substrate 5 is maintained1~53And is adsorbed by the adsorption electrode 22.
The surfaces of the power receiving terminals 31 and 41 are covered with an insulating material, and at least the insulating material covering the surfaces of the power receiving terminals 31 and 41 is disposed between the power receiving terminals 31 and 41 and the power supply terminals 65 and 75. Here, the insulating material covering the surfaces of the power receiving terminals 31 and 41 is a material constituting the device main body 21.
Although the power receiving terminals 31 and 41 have a high voltage due to residual electric charges, the power receiving terminals 31 and 41 do not come into contact with the external environment of the apparatus main body 21, and therefore the power receiving terminals 31 and 41 do not deteriorate or corrode, and do not form a thin film.
The power receiving terminals 31 and 41, the power receiving- side control terminals 32 and 42, the power feeding terminals 65 and 75, and the power feeding- side control terminals 67 and 77 are disposed in the apparatus main body 21 or the stage main body 61, and are not exposed to the internal environment of the vacuum chamber 16, and therefore, problems such as deterioration, corrosion, and thin film formation do not occur. The surfaces of the terminals 31, 32, 41, 42, 65, 67, 75, and 77 may be covered with a film so as not to be exposed to the internal environment of the vacuum chamber 16.
Since the power-feeding-side ground terminal 84 is connected to the ground potential and the power-receiving-side ground terminal 33 is at the ground potential or the floating potential, the power-feeding-side ground terminal 84 and the power-receiving-side ground terminal 33 are less likely to suffer from problems such as deterioration, corrosion, and thin-film formation.
< other examples >
In the above examples, although the etching gas plasma was used, for example, in a film forming apparatus in which the processing unit 17 is a sputtering target and a sputtering gas is introduced from a sputtering gas introduction device into the vacuum chamber 16 to form a plasma of the sputtering gas in the vacuum chamber 16, the substrate 5 is caused to be sputtered by the plasma of the sputtering gas1~53The vacuum processing apparatus of the present invention is also included in the vacuum processing apparatus of the first to third embodiments because the vacuum processing apparatus is connected to the ground potential and is sucked by the suction electrodes 22 of the suction devices 19a to 19c of the first to third embodiments.
In this case, when sputtering targets are sputtered by the formed sputtering gas, the substrates 5 adsorbed by the adsorption devices 19a to 19c of the first to third examples are subjected to sputtering1~53A thin film is formed on the surface of (2).
Furthermore, a CVD source gas is introduced from the processing unit 17 to form a plasma of the source gas, and the plasma is formed on the substrate 51~53The plasma CVD apparatus for forming a thin film on a surface of the substrate according to the present invention is also included in the vacuum processing apparatus of the present invention.
Further, the substrate 5 placed on the adsorption devices 19a to 19e can be made to be a gaseous substance having conductivity without being limited to plasma1~53The present invention can be applied to the present invention because the equivalent capacitance can be charged by being electrically connected to the wall surface of the vacuum chamber 16.
A gas that is a gaseous substance having conductivity may be introduced from a device other than the processing unit 17.
The adsorption electrode 22 is disposed inside the apparatus main body 21, but is disposedCovering the adsorption electrode 22 with the protective film on the surface of the device main body 21 is not similar to the substrate 5 in the case where the adsorption electrode 22 is disposed inside the device main body 211~53The contact may be separated from the atmosphere in the vacuum chamber 16.
In the above example, the control signals output from the power supply side control terminals 67 and 77 are received by the power reception side control terminals 32 and 42, but the control signals may be superimposed on the voltages output from the power supply terminals 64, 65, and 75, extracted from the voltages supplied to the power reception terminals 24, 31, and 41 by an extraction circuit, and input to the power reception side control device 35.
Description of reference numerals
5、51~53… … base plate
151、152… … vacuum processing device
16 … … vacuum tank
18. 18 a-18 e … … power supply station
19. 19a to 19e … … adsorption device
21 … … device body
24. 31, 41 … … power receiving terminal
32. 42 … … power receiving side control terminal
34 … … rectifier circuit
35 … … power receiving side control device
61 … … table main body
64. 65, 75 … … power supply terminal
66 … … power supply device
67. 77 … … power supply side control terminal.

Claims (26)

1. An adsorption device having:
a device main body;
a power receiving side recess provided in the device main body;
a power receiving terminal at least a portion of which is exposed to the power receiving-side recess; and
an adsorption electrode provided in the device main body and electrically connected to the power receiving terminal,
a gaseous substance having conductivity is brought into contact with a substrate placed on the surface of the device main body, and when a voltage is applied to the adsorption electrode, the substrate is adsorbed by the adsorption electrode,
wherein,
the adsorption electrode is applied with adsorption voltage output by the power supply device when a power supply terminal connected with the power supply device is inserted into the power receiving side concave part and the power supply terminal is contacted with the exposed part of the power receiving terminal,
when the power receiving terminal is separated from the power supply terminal after the adsorption voltage is applied to the adsorption electrode, residual charges remain in the adsorption electrode,
when the suction device is moved while the power receiving terminal and the power supply terminal are separated from each other, the substrate is sucked by the suction electrode due to the residual electric charges of the suction electrode, and the power receiving-side recess is closed by a lid provided in the device main body.
2. The adsorption device of claim 1,
the suction device opens the cover when the device body is in a horizontal posture to enable the power receiving terminals to come into contact with the power supply terminals,
when the power supply terminal is pulled out from the power receiving-side concave portion and the suction device is changed from the horizontal posture to the vertical posture, the power receiving-side concave portion is closed by the lid portion.
3. The adsorption device of claim 1,
a telescopic member is arranged on the cover part,
when the power supply terminal is inserted into the power receiving-side concave portion, the lid portion is pressed by the power supply terminal, the extensible member is deformed, and at the same time, at least a part of the lid portion moves to a state where the power receiving-side concave portion is opened, and the power supply terminal comes into contact with the power receiving terminal,
when the power supply terminal is removed from the power receiving-side concave portion, the deformation of the extensible member is restored to the original state, and the power receiving-side concave portion is covered with the cover portion.
4. The adsorption device of claim 1,
the cover portion is formed of a material that deforms when pressed and returns to an original shape when the pressing is released,
when the power supply terminal is inserted into the power receiving-side concave portion, the lid portion is pressed by the power supply terminal, the lid portion deforms to become a state in which the power receiving-side concave portion is opened, and the power supply terminal comes into contact with the power receiving terminal,
when the power supply terminal is removed from the power receiving-side recess, the deformation of the lid returns to its original shape, and the power receiving-side recess is covered with the lid.
5. The adsorption apparatus according to claim 1, wherein a plurality of the substrates are placed on the adsorption electrode.
6. The adsorption apparatus according to claim 1, wherein the gaseous substance having conductivity is plasma.
7. An adsorption device having:
a device main body;
a power receiving terminal provided in the device main body;
a rectifying circuit provided in the apparatus main body; and
an adsorption electrode provided in the device main body and connected to the power receiving terminal via the rectifier circuit,
the power receiving terminal is separated from an environment outside the device body,
when the adsorption device is placed on a power supply stand, a power supply-side ground terminal provided in the power supply stand is brought into contact with a power reception-side ground terminal provided in the device main body to connect the power reception-side ground terminal to a ground potential, the power supply terminal provided in the power supply stand is brought into proximity to the power reception terminal in a non-contact state, the power reception terminal receives an alternating-current voltage applied to the power supply terminal, and the rectifier circuit rectifies the alternating-current voltage received by the power reception terminal and applies the rectified adsorption voltage to the adsorption electrode,
a gaseous substance having conductivity is brought into contact with a substrate placed on the surface of the apparatus main body and a vacuum tank connected to a ground potential to connect the substrate to the ground potential, and the substrate is adsorbed by the adsorption device,
when the adsorption device moves while being separated from the power supply stage, the substrate is adsorbed by the adsorption electrode due to residual charges of the adsorption electrode.
8. The adsorption apparatus according to claim 7, wherein a plurality of the substrates are placed on the adsorption electrode.
9. The adsorption apparatus according to claim 7, wherein the gaseous substance having conductivity is plasma.
10. The adsorption device of claim 7, wherein:
a switching device for connecting or disconnecting the attraction electrode to or from the power receiving-side ground terminal and connecting or disconnecting the attraction electrode to or from the power receiving terminal;
a control device that switches connection of the switching device; and
and a power receiving side control terminal connected to the control device, and to which a control signal for controlling on/off of the switching device is input from a power supply side control terminal provided in the power supply station.
11. The adsorption device of claim 7,
the power receiving terminal and the power supplying terminal are respectively constituted by plate electrodes,
when the adsorption device is placed on the power supply table, a capacitor is formed by the power receiving terminal and the power supply terminal.
12. The adsorption device of claim 10,
the power supply side control terminal and the power receiving side control terminal are respectively composed of parallel flat plate type electrodes,
a capacitor is formed by the power receiving side control terminal and the power supplying side control terminal when the adsorption device is mounted on the power supplying stage,
the control signal output from the power supply side control terminal is transmitted to the power reception side control terminal.
13. The adsorption device of claim 7,
the power receiving terminal and the power supply terminal are each constituted by a coil,
when the adsorption device is placed on the power supply table, a transformer is formed in which the power receiving terminal and the power supply terminal are magnetically coupled.
14. The adsorption device of claim 10,
the power supply side control terminal and the power receiving side control terminal are each constituted by a coil,
a transformer in which the power receiving side control terminal and the power supply side control terminal are magnetically coupled when the adsorption device is mounted on the power supply stage,
the control signal output from the power supply side control terminal is transmitted to the power reception side control terminal.
15. An adsorption device having:
a device main body;
a power receiving terminal provided in the device main body;
a rectifying circuit provided in the apparatus main body; and
an adsorption electrode provided in the device main body and connected to the power receiving terminal via the rectifier circuit,
wherein,
the power receiving terminal is separated from an environment outside the device body,
when the attraction means is mounted on a power supply stand, a power supply terminal provided in the power supply stand approaches the power receiving terminal in a non-contact state, the power receiving terminal receives an alternating-current voltage applied to the power supply terminal and applies an attraction voltage to the attraction electrode via the rectifying circuit,
a gaseous substance having conductivity is in contact with a substrate placed on the surface of the device main body, and when the adsorption voltage is applied to the adsorption electrode, the substrate is adsorbed by the adsorption electrode,
when the adsorption device is separated from the power supply stage and moves, the substrate is adsorbed by the adsorption electrode due to the residual charge of the adsorption electrode,
the adsorption device has:
a power receiving-side ground terminal contactable with a power supply-side ground terminal provided in the power supply station;
a switching device for connecting or disconnecting the attraction electrode to or from the power receiving-side ground terminal and connecting or disconnecting the attraction electrode to or from the power receiving terminal; and
a control device for switching the connection of the switching device,
control signals for controlling the switching device to be turned on and off are superimposed on the alternating-current voltage applied to the power supply terminal,
the control signal is extracted from the voltage received from the power receiving terminal and input into the control device.
16. A vacuum processing apparatus, comprising:
a vacuum chamber for forming a gaseous substance having conductivity;
a power supply station disposed inside the vacuum chamber; and
a power supply terminal provided to the power supply station,
the power supply station is configured to detachably dispose an adsorption device,
when the adsorption device is disposed on the power supply stage,
a power receiving terminal provided in the adsorption device is in contact with the power supply terminal, and an adsorption voltage output from a power supply device connected to the power supply terminal is applied to an adsorption electrode provided in the adsorption device via the power supply terminal and the power receiving terminal, whereby a substrate arranged in the adsorption device is electrostatically adsorbed,
the adsorption device is provided with:
a device main body; and
a power receiving side concave portion provided in the apparatus main body,
the power receiving terminal is exposed at least partially in the power receiving-side recess,
a suction electrode provided in the device main body and electrically connected to the power receiving terminal,
a gaseous substance having conductivity is in contact with a substrate placed on the surface of the device main body, and when the adsorption voltage is applied to the adsorption electrode, the substrate is adsorbed by the adsorption electrode,
applying a clamping voltage output by the power supply device to the clamping electrode via the power receiving terminal when the power supply terminal is inserted into the power receiving-side recess and the power supply terminal is in contact with the exposed portion of the power receiving terminal,
when the power receiving terminal is separated from the power supply terminal after the adsorption voltage is applied to the adsorption electrode, residual charges remain in the adsorption electrode,
when the suction device is moved while the power receiving terminal and the power supply terminal are separated from each other, the substrate is sucked by the suction electrode due to the residual electric charges of the suction electrode, and the power receiving-side recess is closed by a lid provided in the device main body.
17. The vacuum processing apparatus according to claim 16,
the suction device opens the cover when the device body is in a horizontal posture to enable the power receiving terminals to come into contact with the power supply terminals,
when the power supply terminal is pulled out from the power receiving-side concave portion and the suction device is changed from the horizontal posture to the vertical posture, the power receiving-side concave portion is closed by the lid portion.
18. The vacuum processing apparatus according to claim 16,
a telescopic member is arranged on the cover part,
when the power supply terminal is inserted into the power receiving-side concave portion, the lid portion is pressed by the power supply terminal, the extensible member is deformed, and at the same time, at least a part of the lid portion moves to a state where the power receiving-side concave portion is opened, and the power supply terminal comes into contact with the power receiving terminal,
when the power supply terminal is removed from the power receiving-side concave portion, the deformation of the extensible member is restored to the original state, and the power receiving-side concave portion is covered with the cover portion.
19. The vacuum processing apparatus according to claim 16,
the cover portion is formed of a material that deforms when pressed and returns to an original shape when the pressing is released,
when the power supply terminal is inserted into the power receiving-side concave portion, the lid portion is pressed by the power supply terminal, the lid portion deforms to become a state in which the power receiving-side concave portion is opened, and the power supply terminal comes into contact with the power receiving terminal,
when the power supply terminal is removed from the power receiving-side recess, the deformation of the lid returns to its original shape, and the power receiving-side recess is covered with the lid.
20. A vacuum processing apparatus, wherein,
comprising: a vacuum chamber for forming a gaseous substance having conductivity; a power supply station disposed inside the vacuum chamber;
a power supply terminal provided to the power supply station; and an adsorption device, wherein the adsorption device is arranged on the base,
the power supply station is configured to detachably dispose the adsorption device,
the adsorption device is provided with a device main body,
the device main body is provided with a rectifying circuit, a power receiving terminal, an adsorption electrode, a power receiving side grounding terminal capable of contacting with a power supply side grounding terminal provided on the power supply station,
when the adsorption device is disposed on the power feeding stage, the power receiving-side ground terminal is in contact with the power feeding-side ground terminal to connect the power receiving-side ground terminal to a ground potential, the power receiving terminal is in non-contact proximity with the power feeding terminal, an alternating-current voltage output from a power supply device connected to the power feeding terminal is applied to the power receiving terminal via the power feeding terminal, and a rectified voltage rectified by the rectifier circuit connected to the power receiving terminal is applied to the adsorption electrode,
a gaseous substance having conductivity is brought into contact with a substrate placed on the surface of the apparatus main body and the vacuum chamber connected to a ground potential to connect the substrate to the ground potential, and the substrate disposed in the adsorption device is electrostatically adsorbed,
when the adsorption device moves while being separated from the power supply stage, the substrate is adsorbed by the adsorption electrode due to residual charges of the adsorption electrode.
21. The vacuum processing apparatus of claim 20,
in the device main body, provided are:
a switching device that conducts or cuts off between the attraction electrode and the power receiving-side ground terminal and between the attraction electrode and the power receiving terminal;
a control device for controlling the on/off of the switching device; and
a power receiving side control terminal connected to the control device and inputting a control signal for controlling the on/off to the control device from a power supply side control terminal provided in the power supply station,
the power receiving terminal is separated from an environment outside the device main body.
22. The vacuum processing apparatus according to claim 21, wherein the vacuum processing apparatus is configured to:
the power receiving terminal and the power supplying terminal are respectively constituted by plate electrodes,
when the adsorption device is placed on the power supply table, a capacitor is formed by the power receiving terminal and the power supply terminal.
23. The vacuum processing apparatus of claim 22,
the power supply side control terminal and the power receiving side control terminal are respectively composed of parallel flat plate type electrodes,
a capacitor is formed by the power receiving side control terminal and the power supplying side control terminal when the adsorption device is mounted on the power supplying stage,
the control signal output from the power supply side control terminal is transmitted to the power reception side control terminal.
24. The vacuum processing apparatus according to claim 21,
the power receiving terminal and the power supply terminal are each constituted by a coil,
when the adsorption device is placed on the power supply table, a transformer is formed in which the power receiving terminal and the power supply terminal are magnetically coupled.
25. The vacuum processing apparatus of claim 24,
the power supply side control terminal and the power receiving side control terminal are each constituted by a coil,
a transformer in which the power receiving side control terminal and the power supply side control terminal are magnetically coupled when the adsorption device is mounted on the power supply stage,
the control signal output from the power supply side control terminal is transmitted to the power reception side control terminal.
26. A vacuum processing apparatus, comprising:
a vacuum chamber for forming a gaseous substance having conductivity;
a power supply station disposed inside the vacuum chamber; and
a power supply terminal provided to the power supply station,
the power supply station is configured to detachably dispose an adsorption device,
when the adsorption device is disposed on the power supply stage,
a power receiving terminal provided in the adsorption device and the power supply terminal are in non-contact proximity, an alternating current voltage output from a power supply device connected to the power supply terminal is applied to the power receiving terminal via the power supply terminal, a rectified voltage rectified by a rectifier circuit connected to the power receiving terminal is applied to an adsorption electrode provided in the adsorption device, and a substrate arranged in the adsorption device is electrostatically adsorbed,
the adsorption device is configured to:
is provided with a main body of the device,
the rectifying circuit, the power receiving terminal, and the adsorption electrode are provided in the device main body,
a gaseous substance having conductivity is in contact with a substrate placed on the surface of the device main body, and when the rectified voltage is applied to the adsorption electrode, the substrate is adsorbed by the adsorption electrode,
further, the structure is as follows:
the power receiving terminal is separated from an environment outside the device body,
residual charge remains in the chucking electrode after the rectified voltage is applied to the chucking electrode,
the substrate is attracted by the attraction electrode due to the residual electric charges of the attraction electrode when the attraction device moves while being separated from the power supply stage,
a power supply side ground terminal is provided on the power supply stand,
in the device main body, provided are:
a power receiving-side ground terminal contactable with the power supply-side ground terminal;
a switching device for connecting or disconnecting the attraction electrode to or from the power receiving-side ground terminal and connecting or disconnecting the attraction electrode to or from the power receiving terminal; and
a control device that controls the turning on and off of the switching device,
control signals for controlling the switching device to be turned on and off are superimposed on the alternating-current voltage applied to the power supply terminal,
the control signal is extracted from the voltage received from the power receiving terminal and input into the control device.
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