KR101994954B1 - 와이어 본드 비아들을 지니는 마이크로전자 패키지, 및 마이크로전자 패키지용 층을 제조 및 보강하는 방법 - Google Patents

와이어 본드 비아들을 지니는 마이크로전자 패키지, 및 마이크로전자 패키지용 층을 제조 및 보강하는 방법 Download PDF

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KR101994954B1
KR101994954B1 KR1020157023814A KR20157023814A KR101994954B1 KR 101994954 B1 KR101994954 B1 KR 101994954B1 KR 1020157023814 A KR1020157023814 A KR 1020157023814A KR 20157023814 A KR20157023814 A KR 20157023814A KR 101994954 B1 KR101994954 B1 KR 101994954B1
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wire
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wire bonds
microelectronic
bond
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KR20150113179A (ko
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필립 댐베르그
지준 자오
엘리스 차우
로젠 알라토레
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인벤사스 코포레이션
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Priority claimed from US13/757,673 external-priority patent/US8940630B2/en
Priority claimed from US13/757,677 external-priority patent/US9136254B2/en
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    • H01L2225/06558—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking the devices having passive surfaces facing each other, i.e. in a back-to-back arrangement
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    • H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
    • H—ELECTRICITY
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    • H01L2225/06565—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking the devices having the same size and there being no auxiliary carrier between the devices
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    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
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    • H01L2225/06568—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking the devices decreasing in size, e.g. pyramidical stack
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    • H01L2225/1005—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
    • H01L2225/1011—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1023—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
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    • H01L2225/1005—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
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    • H01L2225/1005—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
KR1020157023814A 2013-02-01 2014-01-31 와이어 본드 비아들을 지니는 마이크로전자 패키지, 및 마이크로전자 패키지용 층을 제조 및 보강하는 방법 Active KR101994954B1 (ko)

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US13/757,673 US8940630B2 (en) 2013-02-01 2013-02-01 Method of making wire bond vias and microelectronic package having wire bond vias
US13/757,673 2013-02-01
US13/757,677 US9136254B2 (en) 2013-02-01 2013-02-01 Microelectronic package having wire bond vias and stiffening layer
US13/757,677 2013-02-01
PCT/US2014/014181 WO2014121090A1 (en) 2013-02-01 2014-01-31 Microelectronic package having wire bond vias, method of making and stiffening layer for same

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JP7693393B2 (ja) 2021-05-24 2025-06-17 キオクシア株式会社 半導体装置の製造方法
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CN116031216A (zh) * 2023-01-30 2023-04-28 甬矽电子(宁波)股份有限公司 扇入型封装结构及其制备方法

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