KR101993950B1 - 위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법 - Google Patents
위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법 Download PDFInfo
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- KR101993950B1 KR101993950B1 KR1020150167023A KR20150167023A KR101993950B1 KR 101993950 B1 KR101993950 B1 KR 101993950B1 KR 1020150167023 A KR1020150167023 A KR 1020150167023A KR 20150167023 A KR20150167023 A KR 20150167023A KR 101993950 B1 KR101993950 B1 KR 101993950B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- light
- mark
- light receiving
- unit
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2014-242526 | 2014-11-28 | ||
JP2014242526 | 2014-11-28 | ||
JP2015171202A JP6590599B2 (ja) | 2014-11-28 | 2015-08-31 | 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法 |
JPJP-P-2015-171202 | 2015-08-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160065019A KR20160065019A (ko) | 2016-06-08 |
KR101993950B1 true KR101993950B1 (ko) | 2019-06-27 |
Family
ID=56122139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150167023A KR101993950B1 (ko) | 2014-11-28 | 2015-11-27 | 위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6590599B2 (zh) |
KR (1) | KR101993950B1 (zh) |
CN (1) | CN105652611B (zh) |
TW (1) | TWI620039B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6896771B2 (ja) * | 2016-06-13 | 2021-06-30 | エーエスエムエル ネザーランズ ビー.ブイ. | 基板上のターゲット構造の位置を決定するための方法及び装置、並びに、基板の位置を決定するための方法及び装置 |
JP6276449B1 (ja) * | 2017-03-30 | 2018-02-07 | 株式会社荏原製作所 | 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体 |
JP6490771B1 (ja) * | 2017-09-27 | 2019-03-27 | 株式会社アルバック | 位置検出装置、位置検出方法、および、蒸着装置 |
CN109585351B (zh) * | 2018-10-29 | 2021-06-22 | 苏州腾晖光伏技术有限公司 | 一种提高晶硅双面太阳电池的背铝栅线对准精度的方法 |
CN111355541A (zh) * | 2020-04-02 | 2020-06-30 | Oppo广东移动通信有限公司 | 网络设备、搜寻网络信号的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080013089A1 (en) * | 2004-08-31 | 2008-01-17 | Nikon Corporation | Positioning method, processing system, measurement method of substrate loading repeatability, position measurement method, exposure method, substrate processing apparatus, measurement method, and measurement apparatus |
US20090130784A1 (en) * | 2007-09-06 | 2009-05-21 | Vistec Semiconductor Systems Gmbh | Method for determining the position of the edge bead removal line of a disk-like object |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5194743A (en) * | 1990-04-06 | 1993-03-16 | Nikon Corporation | Device for positioning circular semiconductor wafers |
TWI250556B (en) * | 2001-07-20 | 2006-03-01 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
US7626701B2 (en) * | 2004-12-27 | 2009-12-01 | Asml Netherlands B.V. | Lithographic apparatus with multiple alignment arrangements and alignment measuring method |
SG124407A1 (en) * | 2005-02-03 | 2006-08-30 | Asml Netherlands Bv | Method of generating a photolithography patterningdevice, computer program, patterning device, meth od of determining the position of a target image on or proximate a substrate, measurement device, and lithographic apparatus |
US7342642B2 (en) * | 2005-06-20 | 2008-03-11 | Asml Netherlands B.V. | Pre-aligning a substrate in a lithographic apparatus, device manufacturing method, and device manufactured by the manufacturing method |
JP5084558B2 (ja) * | 2008-02-28 | 2012-11-28 | キヤノン株式会社 | 表面形状計測装置、露光装置及びデバイス製造方法 |
JP5324231B2 (ja) * | 2009-01-08 | 2013-10-23 | 日東電工株式会社 | 半導体ウエハのアライメント装置 |
CN102402127B (zh) * | 2010-09-17 | 2014-01-22 | 上海微电子装备有限公司 | 一种硅片预对准装置及方法 |
JP5875335B2 (ja) * | 2011-11-15 | 2016-03-02 | キヤノン株式会社 | 位置検出装置および露光装置 |
TWI581055B (zh) * | 2012-10-02 | 2017-05-01 | 聯華電子股份有限公司 | 形成光罩的方法 |
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2015
- 2015-08-31 JP JP2015171202A patent/JP6590599B2/ja active Active
- 2015-11-25 TW TW104139186A patent/TWI620039B/zh active
- 2015-11-27 CN CN201510846079.4A patent/CN105652611B/zh active Active
- 2015-11-27 KR KR1020150167023A patent/KR101993950B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080013089A1 (en) * | 2004-08-31 | 2008-01-17 | Nikon Corporation | Positioning method, processing system, measurement method of substrate loading repeatability, position measurement method, exposure method, substrate processing apparatus, measurement method, and measurement apparatus |
US20090130784A1 (en) * | 2007-09-06 | 2009-05-21 | Vistec Semiconductor Systems Gmbh | Method for determining the position of the edge bead removal line of a disk-like object |
Also Published As
Publication number | Publication date |
---|---|
TW201621481A (zh) | 2016-06-16 |
JP6590599B2 (ja) | 2019-10-16 |
TWI620039B (zh) | 2018-04-01 |
JP2016110066A (ja) | 2016-06-20 |
CN105652611A (zh) | 2016-06-08 |
KR20160065019A (ko) | 2016-06-08 |
CN105652611B (zh) | 2018-05-08 |
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