JP6590599B2 - 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法 - Google Patents

位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法 Download PDF

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Publication number
JP6590599B2
JP6590599B2 JP2015171202A JP2015171202A JP6590599B2 JP 6590599 B2 JP6590599 B2 JP 6590599B2 JP 2015171202 A JP2015171202 A JP 2015171202A JP 2015171202 A JP2015171202 A JP 2015171202A JP 6590599 B2 JP6590599 B2 JP 6590599B2
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substrate
light
mark
light source
determining
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JP2015171202A
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Japanese (ja)
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JP2016110066A5 (zh
JP2016110066A (ja
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剛一 田村
剛一 田村
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to US14/948,548 priority Critical patent/US9841299B2/en
Priority to TW104139186A priority patent/TWI620039B/zh
Priority to KR1020150167023A priority patent/KR101993950B1/ko
Priority to EP15196752.8A priority patent/EP3026491B1/en
Priority to CN201510846079.4A priority patent/CN105652611B/zh
Publication of JP2016110066A publication Critical patent/JP2016110066A/ja
Publication of JP2016110066A5 publication Critical patent/JP2016110066A5/ja
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Publication of JP6590599B2 publication Critical patent/JP6590599B2/ja
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2015171202A 2014-11-28 2015-08-31 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法 Active JP6590599B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US14/948,548 US9841299B2 (en) 2014-11-28 2015-11-23 Position determining device, position determining method, lithographic apparatus, and method for manufacturing object
TW104139186A TWI620039B (zh) 2014-11-28 2015-11-25 位置判斷裝置、位置判斷方法、微影設備及用於製造物件的方法
KR1020150167023A KR101993950B1 (ko) 2014-11-28 2015-11-27 위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법
EP15196752.8A EP3026491B1 (en) 2014-11-28 2015-11-27 Position determining device, position determining method, lithographic apparatus, and method for manufacturing object
CN201510846079.4A CN105652611B (zh) 2014-11-28 2015-11-27 位置确定装置和方法、平版印刷设备及物品制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014242526 2014-11-28
JP2014242526 2014-11-28

Publications (3)

Publication Number Publication Date
JP2016110066A JP2016110066A (ja) 2016-06-20
JP2016110066A5 JP2016110066A5 (zh) 2018-08-30
JP6590599B2 true JP6590599B2 (ja) 2019-10-16

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JP2015171202A Active JP6590599B2 (ja) 2014-11-28 2015-08-31 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法

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JP (1) JP6590599B2 (zh)
KR (1) KR101993950B1 (zh)
CN (1) CN105652611B (zh)
TW (1) TWI620039B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6896771B2 (ja) * 2016-06-13 2021-06-30 エーエスエムエル ネザーランズ ビー．ブイ． 基板上のターゲット構造の位置を決定するための方法及び装置、並びに、基板の位置を決定するための方法及び装置
JP6276449B1 (ja) * 2017-03-30 2018-02-07 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
JP6490771B1 (ja) * 2017-09-27 2019-03-27 株式会社アルバック 位置検出装置、位置検出方法、および、蒸着装置
CN109585351B (zh) * 2018-10-29 2021-06-22 苏州腾晖光伏技术有限公司 一种提高晶硅双面太阳电池的背铝栅线对准精度的方法
CN111355541A (zh) * 2020-04-02 2020-06-30 Oppo广东移动通信有限公司 网络设备、搜寻网络信号的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
TWI250556B (en) * 2001-07-20 2006-03-01 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
JPWO2006025386A1 (ja) * 2004-08-31 2008-05-08 株式会社ニコン 位置合わせ方法、処理システム、基板の投入再現性計測方法、位置計測方法、露光方法、基板処理装置、計測方法及び計測装置
US7626701B2 (en) * 2004-12-27 2009-12-01 Asml Netherlands B.V. Lithographic apparatus with multiple alignment arrangements and alignment measuring method
SG124407A1 (en) * 2005-02-03 2006-08-30 Asml Netherlands Bv Method of generating a photolithography patterningdevice, computer program, patterning device, meth od of determining the position of a target image on or proximate a substrate, measurement device, and lithographic apparatus
US7342642B2 (en) * 2005-06-20 2008-03-11 Asml Netherlands B.V. Pre-aligning a substrate in a lithographic apparatus, device manufacturing method, and device manufactured by the manufacturing method
DE102007042271B3 (de) * 2007-09-06 2009-02-05 Vistec Semiconductor Systems Gmbh Verfahren zur Bestimmung der Lage der Entlackungskante eines scheibenförmigen Objekts
JP5084558B2 (ja) * 2008-02-28 2012-11-28 キヤノン株式会社 表面形状計測装置、露光装置及びデバイス製造方法
JP5324231B2 (ja) * 2009-01-08 2013-10-23 日東電工株式会社 半導体ウエハのアライメント装置
CN102402127B (zh) * 2010-09-17 2014-01-22 上海微电子装备有限公司 一种硅片预对准装置及方法
JP5875335B2 (ja) * 2011-11-15 2016-03-02 キヤノン株式会社 位置検出装置および露光装置
TWI581055B (zh) * 2012-10-02 2017-05-01 聯華電子股份有限公司 形成光罩的方法

Also Published As

Publication number Publication date
KR101993950B1 (ko) 2019-06-27
TW201621481A (zh) 2016-06-16
TWI620039B (zh) 2018-04-01
JP2016110066A (ja) 2016-06-20
CN105652611A (zh) 2016-06-08
KR20160065019A (ko) 2016-06-08
CN105652611B (zh) 2018-05-08

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