KR101988923B1 - 배선 기판 제조 방법, 배선 기판 제조용 지지체 및 배선 기판용 구조체 - Google Patents

배선 기판 제조 방법, 배선 기판 제조용 지지체 및 배선 기판용 구조체 Download PDF

Info

Publication number
KR101988923B1
KR101988923B1 KR1020120140519A KR20120140519A KR101988923B1 KR 101988923 B1 KR101988923 B1 KR 101988923B1 KR 1020120140519 A KR1020120140519 A KR 1020120140519A KR 20120140519 A KR20120140519 A KR 20120140519A KR 101988923 B1 KR101988923 B1 KR 101988923B1
Authority
KR
South Korea
Prior art keywords
metal layer
layer
substrate
metal foil
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020120140519A
Other languages
English (en)
Korean (ko)
Other versions
KR20130063475A (ko
Inventor
겐타로 가네코
가즈히로 고바야시
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20130063475A publication Critical patent/KR20130063475A/ko
Application granted granted Critical
Publication of KR101988923B1 publication Critical patent/KR101988923B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B32B2260/023—Two or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020120140519A 2011-12-06 2012-12-05 배선 기판 제조 방법, 배선 기판 제조용 지지체 및 배선 기판용 구조체 Active KR101988923B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-266721 2011-12-06
JP2011266721A JP5902931B2 (ja) 2011-12-06 2011-12-06 配線基板の製造方法、及び、配線基板製造用の支持体

Publications (2)

Publication Number Publication Date
KR20130063475A KR20130063475A (ko) 2013-06-14
KR101988923B1 true KR101988923B1 (ko) 2019-06-13

Family

ID=48524232

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120140519A Active KR101988923B1 (ko) 2011-12-06 2012-12-05 배선 기판 제조 방법, 배선 기판 제조용 지지체 및 배선 기판용 구조체

Country Status (4)

Country Link
US (1) US20130143062A1 (https=)
JP (1) JP5902931B2 (https=)
KR (1) KR101988923B1 (https=)
TW (1) TWI598221B (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6063183B2 (ja) * 2012-08-31 2017-01-18 パナソニックＩｐマネジメント株式会社 剥離可能銅箔付き基板及び回路基板の製造方法
KR101448529B1 (ko) * 2013-06-17 2014-10-08 주식회사 심텍 프라이머층을 이용하는 세미어디티브법을 적용하는 인쇄회로기판의 제조 방법
TWI555166B (zh) * 2013-06-18 2016-10-21 矽品精密工業股份有限公司 層疊式封裝件及其製法
JP6266965B2 (ja) * 2013-12-04 2018-01-24 Ｊｘ金属株式会社 多層プリント配線基板の製造方法及びベース基材
US9522514B2 (en) 2013-12-19 2016-12-20 Intel Corporation Substrate or panel with releasable core
US9554472B2 (en) * 2013-12-19 2017-01-24 Intel Corporation Panel with releasable core
US9434135B2 (en) 2013-12-19 2016-09-06 Intel Corporation Panel with releasable core
US9554468B2 (en) * 2013-12-19 2017-01-24 Intel Corporation Panel with releasable core
JP2015144150A (ja) * 2014-01-31 2015-08-06 京セラサーキットソリューションズ株式会社 配線基板の製造方法
CN105931997B (zh) * 2015-02-27 2019-02-05 胡迪群 暂时性复合式载板
WO2016143117A1 (ja) * 2015-03-12 2016-09-15 三井金属鉱業株式会社 キャリア付き金属箔及び配線基板の製造方法
TWI571994B (zh) * 2015-06-30 2017-02-21 旭德科技股份有限公司 封裝基板及其製作方法
CN106550542B (zh) * 2015-09-17 2021-10-26 奥特斯(中国)有限公司 插入保护结构并且靠近保护结构具有纯介质层的部件载体
US9899239B2 (en) 2015-11-06 2018-02-20 Apple Inc. Carrier ultra thin substrate
KR101932326B1 (ko) * 2016-12-20 2018-12-24 주식회사 두산 인쇄회로기판 및 이의 제조방법
KR102179165B1 (ko) * 2017-11-28 2020-11-16 삼성전자주식회사 캐리어 기판 및 상기 캐리어 기판을 이용한 반도체 패키지의 제조방법
WO2020121652A1 (ja) * 2018-12-14 2020-06-18 三菱瓦斯化学株式会社 半導体素子搭載用パッケージ基板の製造方法
CN113710470A (zh) * 2019-04-16 2021-11-26 日本制铁株式会社 金属-纤维增强树脂复合体
JP7528578B2 (ja) * 2020-07-09 2024-08-06 Ｔｏｐｐａｎホールディングス株式会社 支持体付き基板ユニット、基板ユニット、半導体装置、および、支持体付き基板ユニットの製造方法
CN113066767B (zh) * 2021-03-05 2022-01-25 南通越亚半导体有限公司 临时承载板及其制作方法和封装基板的制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049660A (ja) * 2004-08-06 2006-02-16 Cmk Corp プリント配線板の製造方法
JP2010130003A (ja) * 2008-11-26 2010-06-10 Samsung Electro-Mechanics Co Ltd 多層印刷回路基板及びその製造方法
JP2010251690A (ja) * 2009-04-14 2010-11-04 Samsung Electro-Mechanics Co Ltd 基板製造用キャリア部材及びこれを用いた基板製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517507B2 (https=) * 1972-06-29 1980-05-12
US6270889B1 (en) * 1998-01-19 2001-08-07 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6355360B1 (en) * 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
US6565954B2 (en) * 1998-05-14 2003-05-20 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
US6379487B1 (en) * 2000-05-05 2002-04-30 Ga-Tek Inc. Component of printed circuit board
US6459046B1 (en) * 2000-08-28 2002-10-01 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method for producing the same
US6955740B2 (en) * 2002-01-10 2005-10-18 Polyclad Laminates, Inc. Production of laminates for printed wiring boards using protective carrier
EP1357773A3 (en) * 2002-04-25 2005-11-30 Matsushita Electric Industrial Co., Ltd. Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
TW200420208A (en) * 2002-10-31 2004-10-01 Furukawa Circuit Foil Ultra-thin copper foil with carrier, method of production of the same, and printed circuit board using ultra-thin copper foil with carrier
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
JP4334005B2 (ja) * 2005-12-07 2009-09-16 新光電気工業株式会社 配線基板の製造方法及び電子部品実装構造体の製造方法
JP5092662B2 (ja) * 2007-10-03 2012-12-05 凸版印刷株式会社 印刷配線板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049660A (ja) * 2004-08-06 2006-02-16 Cmk Corp プリント配線板の製造方法
JP2010130003A (ja) * 2008-11-26 2010-06-10 Samsung Electro-Mechanics Co Ltd 多層印刷回路基板及びその製造方法
JP2010251690A (ja) * 2009-04-14 2010-11-04 Samsung Electro-Mechanics Co Ltd 基板製造用キャリア部材及びこれを用いた基板製造方法

Also Published As

Publication number Publication date
JP5902931B2 (ja) 2016-04-13
JP2013120771A (ja) 2013-06-17
US20130143062A1 (en) 2013-06-06
TW201334956A (zh) 2013-09-01
TWI598221B (zh) 2017-09-11
KR20130063475A (ko) 2013-06-14

Similar Documents

Publication Publication Date Title
KR101988923B1 (ko) 배선 기판 제조 방법, 배선 기판 제조용 지지체 및 배선 기판용 구조체
US10398038B2 (en) Printed wiring board and method for manufacturing printed wiring board
JP5306634B2 (ja) 配線基板及び半導体装置及び配線基板の製造方法
KR102032171B1 (ko) 전자 부품 내장 기판 및 그 제조 방법
US9997441B2 (en) Support member, wiring substrate, method for manufacturing wiring substrate, and method for manufacturing semiconductor package
US20110296681A1 (en) Printed wiring board and method for manufacturing same
KR101937717B1 (ko) 지지체, 지지체 제조 방법, 배선 기판 제조 방법, 전자 부품 제조 방법, 및 배선 구조체
US8945329B2 (en) Printed wiring board and method for manufacturing printed wiring board
CN103681559B (zh) 芯片封装基板和结构及其制作方法
JP2011199077A (ja) 多層配線基板の製造方法
US20150319848A1 (en) Printed wiring board, semiconductor package and method for manufacturing printed wiring board
CN106550554B (zh) 用于制造部件载体的上面具有伪芯和不同材料的两个片的保护结构
JP2014110390A (ja) 配線基板の製造方法
US10219369B2 (en) Circuit board
KR101205464B1 (ko) 인쇄회로기판 제조방법
JP2010251690A (ja) 基板製造用キャリア部材及びこれを用いた基板製造方法
JP5302920B2 (ja) 多層配線基板の製造方法
JP5302927B2 (ja) 多層配線基板の製造方法
JP5432354B2 (ja) 配線基板製造用の仮基板及びその製造方法
JP6682963B2 (ja) 多層配線基板の製造方法及び剥離用積層基板
CN106550542B (zh) 插入保护结构并且靠近保护结构具有纯介质层的部件载体
JP5340622B2 (ja) 多層配線基板
JP2019121766A (ja) プリント配線板およびその製造方法
KR101167422B1 (ko) 캐리어 부재 및 이를 이용한 인쇄회로기판의 제조방법
JP4461801B2 (ja) 半導体装置およびその製造方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20220517

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000