KR101960693B1 - 부품 탑재 방법 및 부품 실장 장치 - Google Patents

부품 탑재 방법 및 부품 실장 장치 Download PDF

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KR101960693B1
KR101960693B1 KR1020160130682A KR20160130682A KR101960693B1 KR 101960693 B1 KR101960693 B1 KR 101960693B1 KR 1020160130682 A KR1020160130682 A KR 1020160130682A KR 20160130682 A KR20160130682 A KR 20160130682A KR 101960693 B1 KR101960693 B1 KR 101960693B1
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Korean (ko)
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KR20170107879A (ko
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야스히로 스즈키
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야마하하쓰도키 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H01L21/681—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
KR1020160130682A 2016-03-16 2016-10-10 부품 탑재 방법 및 부품 실장 장치 Active KR101960693B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-052282 2016-03-16
JP2016052282A JP6585529B2 (ja) 2016-03-16 2016-03-16 部品搭載方法および部品実装装置

Publications (2)

Publication Number Publication Date
KR20170107879A KR20170107879A (ko) 2017-09-26
KR101960693B1 true KR101960693B1 (ko) 2019-03-21

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KR1020160130682A Active KR101960693B1 (ko) 2016-03-16 2016-10-10 부품 탑재 방법 및 부품 실장 장치

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JP (1) JP6585529B2 (https=)
KR (1) KR101960693B1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11410866B2 (en) * 2017-08-28 2022-08-09 Shinkawa Ltd. Apparatus and method for linearly moving movable body relative to object
JP7280741B2 (ja) * 2019-04-11 2023-05-24 ヤマハ発動機株式会社 基板作業装置
JP7346358B2 (ja) * 2020-06-08 2023-09-19 ヤマハ発動機株式会社 部品実装方法及び部品実装装置
CN112346266B (zh) * 2020-10-27 2023-01-10 合肥欣奕华智能机器股份有限公司 一种进行器件绑定的方法和装置及设备
DE102022105746A1 (de) * 2022-03-11 2023-09-14 ASMPT GmbH & Co. KG Räumlich verteilte Temperaturmessung entlang einer Komponente eines Positioniersystems für einen Bestückkopf eines Bestückautomaten
CN118313344B (zh) * 2024-06-12 2024-08-06 东莞市通科电子有限公司 一种三极管及其封装方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008004657A (ja) * 2006-06-21 2008-01-10 Juki Corp 表面実装装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3253218B2 (ja) * 1994-06-28 2002-02-04 ヤマハ発動機株式会社 実装機の位置補正装置
JP4648964B2 (ja) * 2008-06-04 2011-03-09 ヤマハ発動機株式会社 マーク認識システム、マーク認識方法および表面実装機
JP6055301B2 (ja) * 2012-12-19 2016-12-27 ヤマハ発動機株式会社 表面実装機

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008004657A (ja) * 2006-06-21 2008-01-10 Juki Corp 表面実装装置

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Publication number Publication date
JP6585529B2 (ja) 2019-10-02
KR20170107879A (ko) 2017-09-26
JP2017168619A (ja) 2017-09-21

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