JP6585529B2 - 部品搭載方法および部品実装装置 - Google Patents

部品搭載方法および部品実装装置 Download PDF

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Publication number
JP6585529B2
JP6585529B2 JP2016052282A JP2016052282A JP6585529B2 JP 6585529 B2 JP6585529 B2 JP 6585529B2 JP 2016052282 A JP2016052282 A JP 2016052282A JP 2016052282 A JP2016052282 A JP 2016052282A JP 6585529 B2 JP6585529 B2 JP 6585529B2
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Japan
Prior art keywords
mark
data acquisition
coordinate system
component mounting
parameter
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JP2016052282A
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English (en)
Japanese (ja)
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JP2017168619A5 (https=
JP2017168619A (ja
Inventor
鈴木　康弘
康弘 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
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Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP2016052282A priority Critical patent/JP6585529B2/ja
Priority to KR1020160130682A priority patent/KR101960693B1/ko
Publication of JP2017168619A publication Critical patent/JP2017168619A/ja
Publication of JP2017168619A5 publication Critical patent/JP2017168619A5/ja
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Publication of JP6585529B2 publication Critical patent/JP6585529B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
JP2016052282A 2016-03-16 2016-03-16 部品搭載方法および部品実装装置 Active JP6585529B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016052282A JP6585529B2 (ja) 2016-03-16 2016-03-16 部品搭載方法および部品実装装置
KR1020160130682A KR101960693B1 (ko) 2016-03-16 2016-10-10 부품 탑재 방법 및 부품 실장 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016052282A JP6585529B2 (ja) 2016-03-16 2016-03-16 部品搭載方法および部品実装装置

Publications (3)

Publication Number Publication Date
JP2017168619A JP2017168619A (ja) 2017-09-21
JP2017168619A5 JP2017168619A5 (https=) 2018-11-08
JP6585529B2 true JP6585529B2 (ja) 2019-10-02

Family

ID=59913610

Family Applications (1)

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JP2016052282A Active JP6585529B2 (ja) 2016-03-16 2016-03-16 部品搭載方法および部品実装装置

Country Status (2)

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JP (1) JP6585529B2 (https=)
KR (1) KR101960693B1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11410866B2 (en) * 2017-08-28 2022-08-09 Shinkawa Ltd. Apparatus and method for linearly moving movable body relative to object
JP7280741B2 (ja) * 2019-04-11 2023-05-24 ヤマハ発動機株式会社 基板作業装置
JP7346358B2 (ja) * 2020-06-08 2023-09-19 ヤマハ発動機株式会社 部品実装方法及び部品実装装置
CN112346266B (zh) * 2020-10-27 2023-01-10 合肥欣奕华智能机器股份有限公司 一种进行器件绑定的方法和装置及设备
DE102022105746A1 (de) * 2022-03-11 2023-09-14 ASMPT GmbH & Co. KG Räumlich verteilte Temperaturmessung entlang einer Komponente eines Positioniersystems für einen Bestückkopf eines Bestückautomaten
CN118313344B (zh) * 2024-06-12 2024-08-06 东莞市通科电子有限公司 一种三极管及其封装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3253218B2 (ja) * 1994-06-28 2002-02-04 ヤマハ発動機株式会社 実装機の位置補正装置
JP4860366B2 (ja) * 2006-06-21 2012-01-25 Ｊｕｋｉ株式会社 表面実装装置
JP4648964B2 (ja) * 2008-06-04 2011-03-09 ヤマハ発動機株式会社 マーク認識システム、マーク認識方法および表面実装機
JP6055301B2 (ja) * 2012-12-19 2016-12-27 ヤマハ発動機株式会社 表面実装機

Also Published As

Publication number Publication date
KR20170107879A (ko) 2017-09-26
KR101960693B1 (ko) 2019-03-21
JP2017168619A (ja) 2017-09-21

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