KR101958573B1 - 다층 캐리어 포일 - Google Patents

다층 캐리어 포일 Download PDF

Info

Publication number
KR101958573B1
KR101958573B1 KR1020170155109A KR20170155109A KR101958573B1 KR 101958573 B1 KR101958573 B1 KR 101958573B1 KR 1020170155109 A KR1020170155109 A KR 1020170155109A KR 20170155109 A KR20170155109 A KR 20170155109A KR 101958573 B1 KR101958573 B1 KR 101958573B1
Authority
KR
South Korea
Prior art keywords
layer
copper
ultra
carrier
thin copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020170155109A
Other languages
English (en)
Korean (ko)
Other versions
KR20180060998A (ko
Inventor
야오-셍 라이
쿠에이-센 쳉
주이-창 초우
Original Assignee
장 춘 페트로케미컬 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 장 춘 페트로케미컬 컴퍼니 리미티드 filed Critical 장 춘 페트로케미컬 컴퍼니 리미티드
Publication of KR20180060998A publication Critical patent/KR20180060998A/ko
Application granted granted Critical
Publication of KR101958573B1 publication Critical patent/KR101958573B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/22—Nickel or cobalt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020170155109A 2016-11-28 2017-11-20 다층 캐리어 포일 Active KR101958573B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/361,983 US9955588B1 (en) 2016-11-28 2016-11-28 Multilayer carrier foil
US15/361,983 2016-11-28

Publications (2)

Publication Number Publication Date
KR20180060998A KR20180060998A (ko) 2018-06-07
KR101958573B1 true KR101958573B1 (ko) 2019-03-14

Family

ID=61951829

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170155109A Active KR101958573B1 (ko) 2016-11-28 2017-11-20 다층 캐리어 포일

Country Status (5)

Country Link
US (1) US9955588B1 (https=)
JP (1) JP6546252B2 (https=)
KR (1) KR101958573B1 (https=)
CN (1) CN108124392B (https=)
TW (1) TWI655083B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
US10888002B2 (en) * 2019-03-28 2021-01-05 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with embedded tracks protruding up to different heights
CN118057914A (zh) * 2022-11-18 2024-05-21 鹏鼎控股(深圳)股份有限公司 具有极细线路的电路板及其制造方法
CN119947005A (zh) * 2023-10-26 2025-05-06 鹏鼎控股(深圳)股份有限公司 多层电路板及其制造方法
WO2025094611A1 (ja) * 2023-11-01 2025-05-08 三井金属鉱業株式会社 プリント配線板の製造方法
WO2025094612A1 (ja) * 2023-11-01 2025-05-08 三井金属鉱業株式会社 プリント配線板の製造方法
CN120888920B (zh) * 2025-07-31 2026-03-10 广东嘉元科技股份有限公司 一种ic封装用铜箔的生产方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013204065A (ja) 2012-03-27 2013-10-07 Jx Nippon Mining & Metals Corp キャリア付銅箔
JP2014193606A (ja) 2013-03-01 2014-10-09 Jx Nippon Mining & Metals Corp キャリア付銅箔、それを用いた銅張積層板、プリント配線板、それを用いた電子機器及びプリント配線板の製造方法
WO2016093109A1 (ja) 2014-12-08 2016-06-16 三井金属鉱業株式会社 プリント配線板の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5720347A (en) * 1980-07-14 1982-02-02 Nippon Denkai Kk Synthetic foil for printed wiring and its manufacture
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP2005260058A (ja) * 2004-03-12 2005-09-22 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、キャリア付き極薄銅箔の製造方法および配線板
JP4927503B2 (ja) * 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP2007214427A (ja) * 2006-02-10 2007-08-23 Shinko Electric Ind Co Ltd 配線基板の製造方法
EP2336395A1 (en) * 2008-09-05 2011-06-22 Furukawa Electric Co., Ltd. Ultrathin copper foil with carrier, and copper laminated board or printed wiring board
JP4824828B1 (ja) * 2010-11-04 2011-11-30 福田金属箔粉工業株式会社 複合金属箔及びその製造方法並びにプリント配線板
TWI569705B (zh) * 2011-03-30 2017-02-01 三井金屬礦業股份有限公司 多層印刷配線板的製造方法及以該製造方法所得之多層印刷配線板
JP5922227B2 (ja) * 2012-04-24 2016-05-24 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法及びプリント配線板の製造方法
CN104120471B (zh) * 2013-04-26 2018-06-08 Jx日矿日石金属株式会社 高频电路用铜箔、覆铜板、印刷配线板、带载体的铜箔、电子设备及印刷配线板的制造方法
JP6310191B2 (ja) * 2013-07-02 2018-04-11 Ｊｘ金属株式会社 キャリア付銅箔及びその製造方法、銅張積層板の製造方法及びプリント配線板の製造方法
US9210816B1 (en) 2013-12-18 2015-12-08 Stats Chippac Ltd. Method of manufacture of support system with fine pitch
WO2015122258A1 (ja) 2014-02-14 2015-08-20 古河電気工業株式会社 キャリア付き極薄銅箔、並びにこれを用いて作製された銅張積層板、プリント配線基板及びコアレス基板
TWI621381B (zh) * 2014-04-02 2018-04-11 Jx Nippon Mining & Metals Corp Laminated body with metal foil with carrier
KR101852671B1 (ko) * 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013204065A (ja) 2012-03-27 2013-10-07 Jx Nippon Mining & Metals Corp キャリア付銅箔
JP2014193606A (ja) 2013-03-01 2014-10-09 Jx Nippon Mining & Metals Corp キャリア付銅箔、それを用いた銅張積層板、プリント配線板、それを用いた電子機器及びプリント配線板の製造方法
WO2016093109A1 (ja) 2014-12-08 2016-06-16 三井金属鉱業株式会社 プリント配線板の製造方法

Also Published As

Publication number Publication date
JP6546252B2 (ja) 2019-07-17
CN108124392A (zh) 2018-06-05
US9955588B1 (en) 2018-04-24
JP2018088525A (ja) 2018-06-07
CN108124392B (zh) 2020-03-27
TW201832922A (zh) 2018-09-16
KR20180060998A (ko) 2018-06-07
TWI655083B (zh) 2019-04-01

Similar Documents

Publication Publication Date Title
KR101958573B1 (ko) 다층 캐리어 포일
TWI589201B (zh) Manufacturing method of a printed circuit board having a buried circuit and a printed circuit board obtained by the manufacturing method
KR101762049B1 (ko) 캐리어 부착 구리박, 구리 피복 적층판, 프린트 배선판, 전자 기기, 및, 프린트 배선판의 제조 방법
KR101852671B1 (ko) 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
KR101925673B1 (ko) 캐리어가 부착된 동박, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
KR101752528B1 (ko) 표면 처리 동박 및 그것을 사용한 적층판, 동판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법
KR101057878B1 (ko) 프린트 배선 기판 및 그 제조 방법
US20160183380A1 (en) Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US20160212836A1 (en) Surface-Treated Metal Material, Metal Foil With Carrier, Connector, Terminal, Laminate, Shielding Tape, Shielding Material, Printed Wiring Board, Processed Metal Member, Electronic Device, And Method For Manufacturing Printed Wiring Board
KR101761163B1 (ko) 보호층 구비 동장 적층판 및 다층 프린트 배선판
KR20160108328A (ko) 표면 처리 동박, 캐리어가 부착된 동박, 프린트 배선판, 구리 피복 적층판, 적층체 및 프린트 배선판의 제조 방법
KR101660663B1 (ko) 표면 처리 동박 및 그것을 사용한 적층판, 구리 피복 적층판, 프린트 배선판 그리고 전자 기기
US10201092B2 (en) Carrier-attached copper foil, laminate, printed-wiring board and method for manufacturing the printed wiring board
TWI532592B (zh) Surface treatment of copper foil and the use of its laminated board
TWI489014B (zh) Surface treatment of copper foil and the use of its laminated board, copper laminated board, printed wiring board, and electronic equipment
KR20180037343A (ko) 낮은 치수변화율을 갖는 연성동박적층필름 및 그 제조방법
TWI650240B (zh) 印刷電路板之製造方法
KR20170028047A (ko) 연성동박적층필름, 그 제조방법, 및 그것을 이용한 연성인쇄회로기판의 제조방법
JP6522974B2 (ja) キャリア付銅箔、積層体、積層体の製造方法、及び、プリント配線板の製造方法
KR100665367B1 (ko) 박막 커패시터 내장된 인쇄회로기판 및 그 제조방법
WO2019124307A1 (ja) プリント配線板の製造方法及び積層体

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20171120

PG1501 Laying open of application
A201 Request for examination
A302 Request for accelerated examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20180622

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20171120

Comment text: Patent Application

PA0302 Request for accelerated examination

Patent event date: 20180622

Patent event code: PA03022R01D

Comment text: Request for Accelerated Examination

Patent event date: 20171120

Patent event code: PA03021R01I

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20181022

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20190227

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20190308

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20190308

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20210910

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20210910

Start annual number: 4

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20240219

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20240826

Start annual number: 7

End annual number: 8