KR101954920B1 - 유기발광소자 패널 제조를 위한 기판이동 장치 및 방법 - Google Patents

유기발광소자 패널 제조를 위한 기판이동 장치 및 방법 Download PDF

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Publication number
KR101954920B1
KR101954920B1 KR1020180139415A KR20180139415A KR101954920B1 KR 101954920 B1 KR101954920 B1 KR 101954920B1 KR 1020180139415 A KR1020180139415 A KR 1020180139415A KR 20180139415 A KR20180139415 A KR 20180139415A KR 101954920 B1 KR101954920 B1 KR 101954920B1
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South Korea
Prior art keywords
substrate
robot hand
adsorption unit
vacuum adsorption
vacuum
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KR1020180139415A
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English (en)
Korean (ko)
Inventor
이상식
오준호
고석준
김동우
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케이맥(주)
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Priority to KR1020180139415A priority Critical patent/KR101954920B1/ko
Application granted granted Critical
Publication of KR101954920B1 publication Critical patent/KR101954920B1/ko
Priority to CN201911009633.8A priority patent/CN111180373B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67793—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020180139415A 2018-11-13 2018-11-13 유기발광소자 패널 제조를 위한 기판이동 장치 및 방법 KR101954920B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020180139415A KR101954920B1 (ko) 2018-11-13 2018-11-13 유기발광소자 패널 제조를 위한 기판이동 장치 및 방법
CN201911009633.8A CN111180373B (zh) 2018-11-13 2019-10-23 用于制造有机发光元件面板的基板移动装置及方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180139415A KR101954920B1 (ko) 2018-11-13 2018-11-13 유기발광소자 패널 제조를 위한 기판이동 장치 및 방법

Publications (1)

Publication Number Publication Date
KR101954920B1 true KR101954920B1 (ko) 2019-03-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180139415A KR101954920B1 (ko) 2018-11-13 2018-11-13 유기발광소자 패널 제조를 위한 기판이동 장치 및 방법

Country Status (2)

Country Link
KR (1) KR101954920B1 (zh)
CN (1) CN111180373B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210108200A (ko) * 2020-02-25 2021-09-02 (주)메가센 원장 패널 흡착 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003292152A (ja) * 2002-03-29 2003-10-15 Hitachi Kiden Kogyo Ltd 枚葉基板の収納方法及び収納装置
KR20160024684A (ko) * 2014-08-26 2016-03-07 주식회사 테라세미콘 기판 이송 로봇
KR101833482B1 (ko) * 2016-09-08 2018-03-05 에스엔유 프리시젼 주식회사 기판 척킹 장치 및 이를 이용한 기판 척킹 방법
KR101847978B1 (ko) 2011-06-10 2018-04-12 엘지디스플레이 주식회사 유기발광소자 제조장비

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4296587B2 (ja) * 1998-02-09 2009-07-15 株式会社ニコン 基板支持装置、基板搬送装置及びその方法、基板保持方法、並びに露光装置及びその製造方法
KR20090070521A (ko) * 2007-12-27 2009-07-01 오에프티 주식회사 스피너 시스템의 트랜스퍼 로봇, 그 이송 핸드 및 그 진공인가 장치
JP5386238B2 (ja) * 2009-06-04 2014-01-15 株式会社日立ハイテクノロジーズ パネル基板搬送装置および表示パネルモジュール組立装置
US9033645B2 (en) * 2012-07-31 2015-05-19 Shenzhen China Star Optoelectronics Technology Co., Ltd. Liquid crystal panel transportation device and support arm structure with rotatable ancillary arm sections
KR20180002348A (ko) * 2016-06-29 2018-01-08 주식회사 선익시스템 기판 처짐 방지 장치를 갖는 증착 장비
KR20180036421A (ko) * 2016-09-30 2018-04-09 주식회사 선익시스템 기판 처리장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003292152A (ja) * 2002-03-29 2003-10-15 Hitachi Kiden Kogyo Ltd 枚葉基板の収納方法及び収納装置
KR101847978B1 (ko) 2011-06-10 2018-04-12 엘지디스플레이 주식회사 유기발광소자 제조장비
KR20160024684A (ko) * 2014-08-26 2016-03-07 주식회사 테라세미콘 기판 이송 로봇
KR101833482B1 (ko) * 2016-09-08 2018-03-05 에스엔유 프리시젼 주식회사 기판 척킹 장치 및 이를 이용한 기판 척킹 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210108200A (ko) * 2020-02-25 2021-09-02 (주)메가센 원장 패널 흡착 장치
KR102430727B1 (ko) 2020-02-25 2022-08-10 (주)메가센 원장 패널 흡착 장치

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Publication number Publication date
CN111180373B (zh) 2023-10-03
CN111180373A (zh) 2020-05-19

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