KR101954920B1 - 유기발광소자 패널 제조를 위한 기판이동 장치 및 방법 - Google Patents

유기발광소자 패널 제조를 위한 기판이동 장치 및 방법 Download PDF

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Publication number
KR101954920B1
KR101954920B1 KR1020180139415A KR20180139415A KR101954920B1 KR 101954920 B1 KR101954920 B1 KR 101954920B1 KR 1020180139415 A KR1020180139415 A KR 1020180139415A KR 20180139415 A KR20180139415 A KR 20180139415A KR 101954920 B1 KR101954920 B1 KR 101954920B1
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KR
South Korea
Prior art keywords
substrate
robot hand
adsorption unit
vacuum adsorption
vacuum
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KR1020180139415A
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English (en)
Korean (ko)
Inventor
이상식
오준호
고석준
김동우
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케이맥(주)
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Priority to KR1020180139415A priority Critical patent/KR101954920B1/ko
Application granted granted Critical
Publication of KR101954920B1 publication Critical patent/KR101954920B1/ko
Priority to CN201911009633.8A priority patent/CN111180373B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67793—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020180139415A 2018-11-13 2018-11-13 유기발광소자 패널 제조를 위한 기판이동 장치 및 방법 KR101954920B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020180139415A KR101954920B1 (ko) 2018-11-13 2018-11-13 유기발광소자 패널 제조를 위한 기판이동 장치 및 방법
CN201911009633.8A CN111180373B (zh) 2018-11-13 2019-10-23 用于制造有机发光元件面板的基板移动装置及方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180139415A KR101954920B1 (ko) 2018-11-13 2018-11-13 유기발광소자 패널 제조를 위한 기판이동 장치 및 방법

Publications (1)

Publication Number Publication Date
KR101954920B1 true KR101954920B1 (ko) 2019-03-08

Family

ID=65801487

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180139415A KR101954920B1 (ko) 2018-11-13 2018-11-13 유기발광소자 패널 제조를 위한 기판이동 장치 및 방법

Country Status (2)

Country Link
KR (1) KR101954920B1 (zh)
CN (1) CN111180373B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210108200A (ko) * 2020-02-25 2021-09-02 (주)메가센 원장 패널 흡착 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003292152A (ja) * 2002-03-29 2003-10-15 Hitachi Kiden Kogyo Ltd 枚葉基板の収納方法及び収納装置
KR20160024684A (ko) * 2014-08-26 2016-03-07 주식회사 테라세미콘 기판 이송 로봇
KR101833482B1 (ko) * 2016-09-08 2018-03-05 에스엔유 프리시젼 주식회사 기판 척킹 장치 및 이를 이용한 기판 척킹 방법
KR101847978B1 (ko) 2011-06-10 2018-04-12 엘지디스플레이 주식회사 유기발광소자 제조장비

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999039999A1 (fr) * 1998-02-09 1999-08-12 Nikon Corporation Appareil de support d'une plaque de base, appareil et procede de transport de cette plaque, appareil de remplacement de cette plaque et appareil d'exposition et procede de fabrication dudit appareil
KR20090070521A (ko) * 2007-12-27 2009-07-01 오에프티 주식회사 스피너 시스템의 트랜스퍼 로봇, 그 이송 핸드 및 그 진공인가 장치
JP5386238B2 (ja) * 2009-06-04 2014-01-15 株式会社日立ハイテクノロジーズ パネル基板搬送装置および表示パネルモジュール組立装置
US9033645B2 (en) * 2012-07-31 2015-05-19 Shenzhen China Star Optoelectronics Technology Co., Ltd. Liquid crystal panel transportation device and support arm structure with rotatable ancillary arm sections
KR20180002348A (ko) * 2016-06-29 2018-01-08 주식회사 선익시스템 기판 처짐 방지 장치를 갖는 증착 장비
KR20180036421A (ko) * 2016-09-30 2018-04-09 주식회사 선익시스템 기판 처리장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003292152A (ja) * 2002-03-29 2003-10-15 Hitachi Kiden Kogyo Ltd 枚葉基板の収納方法及び収納装置
KR101847978B1 (ko) 2011-06-10 2018-04-12 엘지디스플레이 주식회사 유기발광소자 제조장비
KR20160024684A (ko) * 2014-08-26 2016-03-07 주식회사 테라세미콘 기판 이송 로봇
KR101833482B1 (ko) * 2016-09-08 2018-03-05 에스엔유 프리시젼 주식회사 기판 척킹 장치 및 이를 이용한 기판 척킹 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210108200A (ko) * 2020-02-25 2021-09-02 (주)메가센 원장 패널 흡착 장치
KR102430727B1 (ko) 2020-02-25 2022-08-10 (주)메가센 원장 패널 흡착 장치

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Publication number Publication date
CN111180373B (zh) 2023-10-03
CN111180373A (zh) 2020-05-19

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