KR101953433B1 - 세라믹 기판 휨 발생용 도구 세트 및 이를 이용한 세라믹 기판의 휨 발생 방법 - Google Patents

세라믹 기판 휨 발생용 도구 세트 및 이를 이용한 세라믹 기판의 휨 발생 방법 Download PDF

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Publication number
KR101953433B1
KR101953433B1 KR1020160027260A KR20160027260A KR101953433B1 KR 101953433 B1 KR101953433 B1 KR 101953433B1 KR 1020160027260 A KR1020160027260 A KR 1020160027260A KR 20160027260 A KR20160027260 A KR 20160027260A KR 101953433 B1 KR101953433 B1 KR 101953433B1
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KR
South Korea
Prior art keywords
tool material
ceramic substrate
convex portion
concave portion
unit
Prior art date
Application number
KR1020160027260A
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English (en)
Korean (ko)
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KR20170104327A (ko
Inventor
홍주섭
소장미
장원철
Original Assignee
주식회사 케이씨씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=58722426&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR101953433(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 주식회사 케이씨씨 filed Critical 주식회사 케이씨씨
Priority to KR1020160027260A priority Critical patent/KR101953433B1/ko
Priority to DE202017101226.3U priority patent/DE202017101226U1/de
Priority to CN201720214964.5U priority patent/CN206672901U/zh
Publication of KR20170104327A publication Critical patent/KR20170104327A/ko
Application granted granted Critical
Publication of KR101953433B1 publication Critical patent/KR101953433B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Ceramic Products (AREA)
KR1020160027260A 2016-03-07 2016-03-07 세라믹 기판 휨 발생용 도구 세트 및 이를 이용한 세라믹 기판의 휨 발생 방법 KR101953433B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020160027260A KR101953433B1 (ko) 2016-03-07 2016-03-07 세라믹 기판 휨 발생용 도구 세트 및 이를 이용한 세라믹 기판의 휨 발생 방법
DE202017101226.3U DE202017101226U1 (de) 2016-03-07 2017-03-03 Vorrichtung zur Erzeugung von Wölbung eines Keramiksubstrats
CN201720214964.5U CN206672901U (zh) 2016-03-07 2017-03-07 用于产生陶瓷基板的翘曲的装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160027260A KR101953433B1 (ko) 2016-03-07 2016-03-07 세라믹 기판 휨 발생용 도구 세트 및 이를 이용한 세라믹 기판의 휨 발생 방법

Publications (2)

Publication Number Publication Date
KR20170104327A KR20170104327A (ko) 2017-09-15
KR101953433B1 true KR101953433B1 (ko) 2019-02-28

Family

ID=58722426

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160027260A KR101953433B1 (ko) 2016-03-07 2016-03-07 세라믹 기판 휨 발생용 도구 세트 및 이를 이용한 세라믹 기판의 휨 발생 방법

Country Status (3)

Country Link
KR (1) KR101953433B1 (zh)
CN (1) CN206672901U (zh)
DE (1) DE202017101226U1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044630A (ja) * 1999-07-29 2001-02-16 Nec Corp 多層プリント配線板の製造方法と積層装置
JP2003273289A (ja) * 2002-03-15 2003-09-26 Dowa Mining Co Ltd セラミックス回路基板およびパワーモジュール
JP2007129039A (ja) * 2005-11-02 2007-05-24 Nippon Pillar Packing Co Ltd フッ素樹脂プリント基板及びその製造方法
JP4581575B2 (ja) * 2004-09-09 2010-11-17 株式会社村田製作所 板状セラミック体の製造方法及びセラミック焼成用荷重付加部材
JP2015076551A (ja) * 2013-10-10 2015-04-20 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19715540C2 (de) * 1997-04-15 2002-02-07 Curamik Electronics Gmbh Verfahren zum Herstellen eines gewölbten Metall-Keramik-Substrates
JP5637719B2 (ja) 2010-03-31 2014-12-10 Ｄｏｗａメタルテック株式会社 金属セラミックス接合回路基板の製造方法
KR101280250B1 (ko) 2010-09-30 2013-07-05 주식회사 케이씨씨 금속접합 세라믹기판
KR101639728B1 (ko) 2014-08-25 2016-07-14 한국남동발전 주식회사 저회를 이용한 경량골재 제조시스템

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044630A (ja) * 1999-07-29 2001-02-16 Nec Corp 多層プリント配線板の製造方法と積層装置
JP2003273289A (ja) * 2002-03-15 2003-09-26 Dowa Mining Co Ltd セラミックス回路基板およびパワーモジュール
JP4581575B2 (ja) * 2004-09-09 2010-11-17 株式会社村田製作所 板状セラミック体の製造方法及びセラミック焼成用荷重付加部材
JP2007129039A (ja) * 2005-11-02 2007-05-24 Nippon Pillar Packing Co Ltd フッ素樹脂プリント基板及びその製造方法
JP2015076551A (ja) * 2013-10-10 2015-04-20 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板及びその製造方法

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Publication number Publication date
KR20170104327A (ko) 2017-09-15
CN206672901U (zh) 2017-11-24
DE202017101226U1 (de) 2017-05-02

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