KR101932943B1 - 재료 증착 시스템 및 재료 증착 시스템에서 재료를 증착하기 위한 방법 - Google Patents
재료 증착 시스템 및 재료 증착 시스템에서 재료를 증착하기 위한 방법 Download PDFInfo
- Publication number
- KR101932943B1 KR101932943B1 KR1020177018668A KR20177018668A KR101932943B1 KR 101932943 B1 KR101932943 B1 KR 101932943B1 KR 1020177018668 A KR1020177018668 A KR 1020177018668A KR 20177018668 A KR20177018668 A KR 20177018668A KR 101932943 B1 KR101932943 B1 KR 101932943B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- vacuum
- deposition system
- vacuum chamber
- substrates
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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- H01L51/001—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2014/076747 WO2016087005A1 (en) | 2014-12-05 | 2014-12-05 | Material deposition system and method for depositing material in a material deposition system |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170092670A KR20170092670A (ko) | 2017-08-11 |
KR101932943B1 true KR101932943B1 (ko) | 2018-12-27 |
Family
ID=52130229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020177018668A KR101932943B1 (ko) | 2014-12-05 | 2014-12-05 | 재료 증착 시스템 및 재료 증착 시스템에서 재료를 증착하기 위한 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6550464B2 (ja) |
KR (1) | KR101932943B1 (ja) |
CN (1) | CN107002223B (ja) |
TW (1) | TWI619823B (ja) |
WO (1) | WO2016087005A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106637091B (zh) * | 2017-02-24 | 2019-08-30 | 旭科新能源股份有限公司 | 用于薄膜太阳能电池制造的高温蒸发炉 |
CN109699190B (zh) | 2017-08-24 | 2023-04-28 | 应用材料公司 | 在真空处理系统中非接触地传输装置及方法 |
CN111902563A (zh) * | 2018-03-28 | 2020-11-06 | 应用材料公司 | 真空处理设备以及用于处理基板的方法 |
CN111663104A (zh) * | 2020-06-24 | 2020-09-15 | 武汉华星光电半导体显示技术有限公司 | 蒸镀系统及蒸镀方法 |
WO2022107945A1 (ko) * | 2020-11-23 | 2022-05-27 | 엘지전자 주식회사 | 자가조립장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120064728A1 (en) * | 2010-09-15 | 2012-03-15 | Jeong-Ho Yi | Substrate depositing system and depositing method using the same |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8900366B2 (en) * | 2002-04-15 | 2014-12-02 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
JP4013859B2 (ja) * | 2003-07-17 | 2007-11-28 | 富士電機ホールディングス株式会社 | 有機薄膜の製造装置 |
JP4685404B2 (ja) * | 2003-10-15 | 2011-05-18 | 三星モバイルディスプレイ株式會社 | 有機電界発光素子の垂直蒸着方法,その装置,及び有機電界発光素子の垂直蒸着装置に使用される蒸着源 |
KR100635496B1 (ko) * | 2005-02-25 | 2006-10-17 | 삼성에스디아이 주식회사 | 격벽을 구비하는 측면 분사형 선형 증발원 및 그 증발원을구비하는 증착장치 |
KR100784953B1 (ko) * | 2006-05-23 | 2007-12-11 | 세메스 주식회사 | 다수의 도가니를 이용한 유기발광소자 박막 제작을 위한선형증발원 |
US20080131587A1 (en) * | 2006-11-30 | 2008-06-05 | Boroson Michael L | Depositing organic material onto an oled substrate |
US8119204B2 (en) * | 2007-04-27 | 2012-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Film formation method and method for manufacturing light-emitting device |
US20100159132A1 (en) * | 2008-12-18 | 2010-06-24 | Veeco Instruments, Inc. | Linear Deposition Source |
KR101097737B1 (ko) * | 2009-03-31 | 2011-12-22 | 에스엔유 프리시젼 주식회사 | 박막 증착 장치와 박막 증착 방법 및 박막 증착 시스템 |
US20110052795A1 (en) * | 2009-09-01 | 2011-03-03 | Samsung Mobile Display Co., Ltd. | Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same |
JP2014005478A (ja) * | 2010-10-08 | 2014-01-16 | Kaneka Corp | 蒸着装置 |
JP5911958B2 (ja) * | 2011-08-25 | 2016-04-27 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 長方形基板に層を堆積させるためのマスク構造体、装置および方法 |
JP2013163837A (ja) * | 2012-02-09 | 2013-08-22 | Canon Tokki Corp | 蒸着装置並びに蒸着装置を用いた成膜方法 |
EP3187618A1 (en) * | 2013-12-10 | 2017-07-05 | Applied Materials, Inc. | Evaporation source for organic material, deposition apparatus for depositing organic materials in a vacuum chamber having an evaporation source for organic material, and method for evaporating organic material |
-
2014
- 2014-12-05 KR KR1020177018668A patent/KR101932943B1/ko active IP Right Grant
- 2014-12-05 WO PCT/EP2014/076747 patent/WO2016087005A1/en active Application Filing
- 2014-12-05 JP JP2017530018A patent/JP6550464B2/ja active Active
- 2014-12-05 CN CN201480083861.9A patent/CN107002223B/zh active Active
-
2015
- 2015-12-01 TW TW104140033A patent/TWI619823B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120064728A1 (en) * | 2010-09-15 | 2012-03-15 | Jeong-Ho Yi | Substrate depositing system and depositing method using the same |
Also Published As
Publication number | Publication date |
---|---|
WO2016087005A1 (en) | 2016-06-09 |
TWI619823B (zh) | 2018-04-01 |
KR20170092670A (ko) | 2017-08-11 |
CN107002223A (zh) | 2017-08-01 |
JP6550464B2 (ja) | 2019-07-24 |
TW201631185A (zh) | 2016-09-01 |
CN107002223B (zh) | 2019-11-05 |
JP2017538039A (ja) | 2017-12-21 |
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