KR101928358B1 - Light emitting device package - Google Patents

Light emitting device package Download PDF

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Publication number
KR101928358B1
KR101928358B1 KR1020120047919A KR20120047919A KR101928358B1 KR 101928358 B1 KR101928358 B1 KR 101928358B1 KR 1020120047919 A KR1020120047919 A KR 1020120047919A KR 20120047919 A KR20120047919 A KR 20120047919A KR 101928358 B1 KR101928358 B1 KR 101928358B1
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KR
South Korea
Prior art keywords
light emitting
light
emitting device
electrode
lens
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KR1020120047919A
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Korean (ko)
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KR20130124652A (en
Inventor
송윤수
문연태
도형석
김낙훈
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020120047919A priority Critical patent/KR101928358B1/en
Publication of KR20130124652A publication Critical patent/KR20130124652A/en
Application granted granted Critical
Publication of KR101928358B1 publication Critical patent/KR101928358B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

A light emitting device package according to an embodiment includes a body; A first electrode and a second electrode disposed on the body; A light emitting element disposed in the body and electrically connected to the first electrode and the second electrode; A molding part covering the light emitting element; And a lens positioned on the molding part, wherein the lens includes a light dispersing part for dispersing light generated from the light emitting element and a supporting part protruding from a lower periphery of the light dispersing part, Is thinner than the thickness in the boundary region with the light dispersing portion.

Description

[0001] LIGHT EMITTING DEVICE PACKAGE [0002]

An embodiment relates to a light emitting device package.

BACKGROUND ART Light emitting devices such as a light emitting diode (LD) or a laser diode using semiconductor materials of Group 3-5 or 2-6 group semiconductors are widely used for various colors such as red, green, blue, and ultraviolet And it is possible to realize white light rays with high efficiency by using fluorescent materials or colors, and it is possible to realize low energy consumption, semi-permanent life time, quick response speed, safety and environment friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps .

Therefore, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting element capable of replacing a fluorescent lamp or an incandescent lamp Diode lighting, automotive headlights, and traffic lights.

1 is a side sectional view of a conventional light emitting device package.

The conventional light emitting device package may include a body 10, first and second electrodes 21 and 22, a light emitting element 30, a molding part 40, and a lens 50.

The light emitting device 30 is electrically connected to the first and second electrodes 21 and 22 to receive a current required to drive the light emitting device 30 and is surrounded by the molding part 40.

The lens 50 is disposed on the upper part of the molding part 40 and the lens 50 can disperse the light generated from the light emitting device 30 in various directions to increase the directivity angle.

The lens 50 is attached to the body 10 and the molding part 40 by an adhesive 60.

1 (A), the thickness of the portion of the lens 50 which is in contact with the body 10 is large, and in particular, the thickness of the edge region of the lens 50 is thick, The adhesion of the lens 50 frequently occurred in the edge region of the lens 50 due to the stress between the lens 50 and the lens 50.

This poor adhesion of the lens 50 lowers the reliability of the light emitting device package and causes a decrease in the light distribution characteristic of the lens 50 that disperses the light emitted from the light emitting element 30. [

The embodiment intends to improve the reliability of the light emitting device package.

A light emitting device package according to an embodiment includes a body; A first electrode and a second electrode disposed on the body; A light emitting element disposed in the body and electrically connected to the first electrode and the second electrode; A molding part covering the light emitting element; And a lens positioned on the molding part, wherein the lens includes a light dispersing part for dispersing light generated from the light emitting element and a supporting part protruding from a lower periphery of the light dispersing part, Is thinner than the thickness in the boundary region with the light dispersing portion.

The thickness of the support portion may gradually become thinner toward the edge region in the boundary region with the light dispersing unit.

The support may have a roughness on one side of the edge region.

The lens may include a phosphor.

The support portion may have a sloped side surface of the edge region.

The upper surface of the edge region may be an inclined surface.

The molding unit may include a phosphor.

The body includes a cavity having a side surface and a bottom surface, and the light emitting element may be positioned on a bottom surface of the cavity.

The side surface of the cavity may be inclined.

An adhesive may be positioned between the lens and the molding part.

A reflective layer may be formed on at least a part of the first electrode and the second electrode.

According to the embodiment, the stress with the body at the edge region of the lens is reduced, so that the adhesion failure of the lens is reduced, and the reliability of the light emitting device package can be improved.

1 is a side sectional view of a conventional light emitting device package.
2 is a side sectional view of a light emitting device package according to the first embodiment;
3 is a side sectional view of the light emitting device package according to the second embodiment.
4 is a side sectional view of a light emitting device package according to a third embodiment;
5 is a side sectional view of a light emitting device package according to a fourth embodiment;
6 is a side sectional view of a light emitting device package according to a fifth embodiment;
7 illustrates one embodiment of a process for attaching a lens to an array of light emitting device packages.
8 is a view illustrating an embodiment of a headlamp in which a light emitting device package according to an embodiment is disposed.
FIG. 9 is a diagram illustrating a display device in which a light emitting device package according to an embodiment is disposed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

In the description of the embodiment according to the present invention, in the case of being described as being formed "on or under" of each element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

2 is a side sectional view of the light emitting device package according to the first embodiment.

The light emitting device package 100A according to the first embodiment includes a body 110, a first electrode 121 and a second electrode 122 disposed on the body 110, a second electrode 122 disposed on the body 110, A light emitting device 130 electrically connected to the first electrode 121 and the second electrode 122, a molding part 140 covering the light emitting device 130, and a lens 130 positioned on the molding part 140. [ (150).

The body 110 may be formed of a silicon material, an epoxy molding compound (EMC), a synthetic resin material, or a metal material. If the body 110 is made of a conductive material such as a metal material, an insulating layer may be coated on the surface of the body 110 to reduce an electrical short between the first electrode 121 and the second electrode 122 .

A light emitting device 130 is disposed on the body 110.

The body 110 may include a cavity 112 having a side 112a and a bottom 112b wherein the light emitting device 130 may be located on the bottom surface 112b of the cavity 112 .

The side surface 112a of the cavity 112 may be an inclined surface so that the light can be propagated to the open region of the cavity 112 by reflecting the light generated from the light emitting device 130. [

The light emitting device 130 includes an LED (Light Emitting Diode) using a semiconductor layer of a plurality of compound semiconductor layers, for example, a group III-V element, and the LED may include a coloring material emitting light such as blue, green, LED or UV LED. The emitted light of the LED may be implemented using various semiconductors, but is not limited thereto.

The first electrode 121 and the second electrode 122 are electrically isolated from each other and supply a current to the light emitting device 130. The first electrode 121 and the second electrode 122 may reflect light generated from the light emitting device 130 to increase the light efficiency and may discharge the heat emitted from the light emitting device 130 to the outside It is possible.

The light emitting device 140 may be disposed on the body 110 or on the electrode 121 or the second electrode 122. The first electrode 121 and the light emitting element 130 are directly energized and the second electrode 122 and the light emitting element 130 are connected through a wire. The light emitting device 130 may be connected to the first and second electrodes 121 and 122 by a flip chip method or a die bonding method in addition to the wire bonding method.

A reflective layer (not shown) for reflecting the light generated from the light emitting device 130 to the outside of the light emitting device package 100A is formed on the first and second electrodes 121 and 122 exposed on the bottom surface 112b of the cavity 112 .

The light generated from the light emitting device 130 may proceed to the lower portion of the light emitting device 130 or may be reflected by the side surface 112a of the cavity 112 of the body 110 and proceed to the lower portion of the light emitting device 130, The reflective layer is provided to reflect light, thereby improving light extraction efficiency of the light emitting device package 100A.

The reflective layer is made of a material having a high reflectivity, and silver (Ag) may be coated on the first and second electrodes 121 and 122 as an example. The reflective layer may be made of aluminum (Al) in addition to silver (Ag), an alloy containing silver, or an alloy containing aluminum, but is not limited thereto.

The body 110 may have a molding part 140 surrounding the light emitting device 130. When the cavity 112 is formed in the body 110, the molding part 140 may be formed so as to fill the cavity 112.

The molding part 140 protects the light emitting element 130 and can prevent the light emitting element 130 from being separated or separated. The molding part 140 may be formed of a transparent silicone resin or an epoxy molding compound (EMC).

The molding unit 140 may include a phosphor to change the wavelength of light generated in the light emitting device 130.

The phosphor may include a garnet-based phosphor, a silicate-based phosphor, a nitride-based phosphor, or an oxynitride-based phosphor.

For example, the garnet-base phosphor is YAG (Y 3 Al 5 O 12 : Ce 3 +) or TAG: may be a (Tb 3 Al 5 O 12 Ce 3 +), wherein the silicate-based phosphor is (Sr, Ba, Mg, Ca) 2 SiO 4 : Eu 2 + , and the nitride phosphor may be CaAlSiN 3 : Eu 2 + containing SiN, and the oxynitride phosphor may be Si 6 - x Al x O x N 8 -x: Eu may be a 2 + (0 <x <6 ), but not always limited thereto.

The light of the first wavelength range generated by the light emitting device 130 excites the phosphor and is converted into the light of the second wavelength range and the light of the second wavelength range passes through the lens 150, have.

The lens 150 is disposed on the molding part 140 and may be disposed in contact with the molding part 140 and the body 110.

The lens 150 may include a convex shape to disperse light generated from the light emitting device 130 at various angles.

The lens 150 may be formed of the same material as the molding part 140 or a different material.

The lens 150 may include a transparent silicone resin, and may include a phosphor according to an embodiment.

When the lens 150 includes a phosphor, the phosphor may be uniformly dispersed throughout the lens 150, or the phosphor may be thinly coated on one side of the inside or outside of the lens 150.

The lens 150 is attached to the body 110 and the molding part 140 through an adhesive 160. The adhesive 160 may be an adhesive resin but is not limited thereto.

The lens 150 includes a light dispersion unit 152 for dispersing the light generated from the light emitting device 130 and a support unit 154 protruding from the lower periphery of the light dispersion unit 152.

The light dispersing portion 152 includes a convex shape, and at least a part of the region may include a concave shape, but is not limited thereto.

The light is uniformly dispersed at various angles by the light dispersing unit 152 of the lens 150 and the orientation angle of the light emitting device package 100A can be adjusted by adjusting the shape of the light dispersing unit 152. [

The width of the lower surface of the light dispersing portion 152 may correspond to the width of the upper surface of the molding portion 140, but is not limited thereto.

The support portion 154 of the lens 150 may protrude around the lower portion of the light dispersing portion 152 and may have a constant width around the light dispersing portion 152.

The width of the light dispersing portion 152 may correspond to the width of the body 110 in contact with the light dispersing portion 152, but is not limited thereto.

The supporting portion 154 is formed such that the thickness d 2 of the edge region 154b is smaller than the thickness d 1 in the boundary region 154a with the light dispersing portion 152.

Conventionally, the thickness of the support portion of the lens is relatively thick and uniform, and adhesion failure between the lens and the body frequently occurs particularly in the edge region.

The thickness d 2 of the edge region 154b of the support portion 154 is formed to be thinner than the thickness d 1 of the boundary region 154a with respect to the light dispersion portion 152, And the body 110, thereby improving the phenomenon that the lens 150 is peeled from the body 110.

3 is a side sectional view of the light emitting device package according to the second embodiment.

The contents overlapping with the above embodiments will not be described again, and the differences will be mainly described below.

The light emitting device package 100A according to the second embodiment includes a body 110, a first electrode 121 and a second electrode 122 disposed on the body 110, a second electrode 122 disposed on the body 110, A light emitting device 130 electrically connected to the first electrode 121 and the second electrode 122, a molding part 140 covering the light emitting device 130, and a lens 130 positioned on the molding part 140. [ (150).

The lens 150 includes a light dispersion unit 152 for dispersing the light generated from the light emitting device 130 and a support unit 154 protruding from the lower periphery of the light dispersion unit 152.

The thickness of the edge region 154b of the support portion 154 is formed to be thinner than the thickness of the boundary region 154a with respect to the light dispersion portion 152 and the boundary region 154a between the light dispersion portion 152 and the edge region 154b ), The thickness may gradually become thinner.

3, the thickness of the supporting portion 154 is linearly reduced from the boundary region 154a to the edge region 154b with respect to the light dispersing portion 152. However, according to the embodiment, , For example, in the form of a step or curve, but not limited thereto.

4 is a side sectional view of the light emitting device package according to the third embodiment.

The contents overlapping with the above embodiments will not be described again, and the differences will be mainly described below.

The light emitting device package 100A according to the third embodiment includes a body 110, a first electrode 121 and a second electrode 122 disposed on the body 110, a second electrode 122 disposed on the body 110, A light emitting device 130 electrically connected to the first electrode 121 and the second electrode 122, a molding part 140 covering the light emitting device 130, and a lens 130 positioned on the molding part 140. [ (150).

The lens 150 includes a light dispersion unit 152 for dispersing the light generated from the light emitting device 130 and a support unit 154 protruding from the lower periphery of the light dispersion unit 152.

The support portion 154 is formed such that the thickness of the edge region 154b is smaller than the thickness of the boundary region 154a with respect to the light dispersion portion 152 and the roughness 156 is formed on one side of the edge region 154b .

The edge area 154b of the support part 154 is thin when the lens 150 is manufactured so that the edge area 154b is cut by the breaking process without cutting using a separate blade, . &Lt; / RTI &gt;

The breaking process refers to a process in which a blade is not used, and both sides of the cut portion are gripped and pressure is applied to break the cut portion.

When the lens is separated into individual lenses 150 by the braking process, the cut surface of the edge region 154b is not smooth, and the roughness 156 can be formed as shown in Fig.

According to the embodiment, since the separate lens 150 can be easily separated by the braking process without using a separate blade, the manufacturing process of the lens 150 can be simplified.

5 is a side sectional view of the light emitting device package according to the fourth embodiment.

The contents overlapping with the above embodiments will not be described again, and the differences will be mainly described below.

The light emitting device package 100A according to the fourth embodiment includes a body 110, a first electrode 121 and a second electrode 122 disposed on the body 110, a second electrode 122 disposed on the body 110, A light emitting device 130 electrically connected to the first electrode 121 and the second electrode 122, a molding part 140 covering the light emitting device 130, and a lens 130 positioned on the molding part 140. [ (150).

The lens 150 includes a light dispersion unit 152 for dispersing the light generated from the light emitting device 130 and a support unit 154 protruding from the lower periphery of the light dispersion unit 152.

The thickness of the edge region 154b of the support portion 154 is formed to be thinner than the thickness of the boundary region 154a with respect to the light dispersion portion 152 and the side surface of the edge region 154b may be inclined.

The thickness of the edge region 154b is equal to a predetermined distance from the boundary region 154a with respect to the light dispersion portion 152 and the thickness of the edge region 154b does not become thinner over the entire region of the support portion 154, The thickness can be gradually reduced.

That is, since the adhesion of the lens 150 due to the stress is most frequently generated in the edge region 154b, the side surface of the edge region 154b is formed as an inclined surface to reduce the thickness, thereby preventing adhesion failure due to stress .

6 is a side sectional view of the light emitting device package according to the fifth embodiment.

The contents overlapping with the above embodiments will not be described again, and the differences will be mainly described below.

The light emitting device package 100A according to the fifth embodiment includes a body 110, a first electrode 121 and a second electrode 122 disposed on the body 110, a second electrode 122 disposed on the body 110, A light emitting device 130 electrically connected to the first electrode 121 and the second electrode 122, a molding part 140 covering the light emitting device 130, and a lens 130 positioned on the molding part 140. [ (150).

The lens 150 includes a light dispersion unit 152 for dispersing the light generated from the light emitting device 130 and a support unit 154 protruding from the lower periphery of the light dispersion unit 152.

The thickness of the edge region 154b of the support portion 154 is formed to be thinner than the thickness of the boundary region 154a with respect to the light dispersion portion 152 and the upper surface of the edge region 154b may be an inclined surface.

6 shows a continuous slope from the boundary region 154a to the upper surface of the edge region 154b as an example. However, according to the embodiment, the boundary with the light dispersing unit 152 The thickness of the region 154a may be equal to a certain distance, and the thickness of the edge region 154b may be gradually decreased as the upper surface of the edge region 154b is formed of an inclined surface.

7 is a view showing an embodiment of a process of attaching a lens to an array of light emitting device packages.

Referring to FIG. 7, a lens 150 is attached to an array 210 of light emitting device packages including the molding part 140. The lens 150 is attached while being arranged so that its bottom surface faces the molding part 140.

The lens 150 can be manufactured by applying a silicone resin to a mold 220 having a frame of a shape of a lens 150 on one side, curing it, and then cutting it.

The mold 220 is woven so that the edge portion of the lens 150 is thin as shown in FIG. 7B. According to the manufacturing process, the individual lens 150 is formed by a breaking process without using a separate blade, Can be used separately.

Hereinafter, a head lamp and a backlight unit will be described as an embodiment of an illumination system in which the above-described light emitting device package is disposed.

8 is a view showing an embodiment of a headlamp in which a light emitting device package according to an embodiment is disposed.

8, light emitted from the light emitting module 710 in which the light emitting device package according to the embodiment is disposed is reflected by the reflector 720 and the shade 730, and then transmitted through the lens 740 and directed toward the front of the vehicle body .

FIG. 9 is a diagram illustrating a display device in which a light emitting device package according to an embodiment is disposed.

9, the display device 800 according to the embodiment includes a light emitting module 830 and 835, a reflection plate 820 on the bottom cover 810, and a reflection plate 820 disposed in front of the reflection plate 820, A first prism sheet 850 and a second prism sheet 860 disposed in front of the light guide plate 840 and a second prism sheet 860 disposed between the first prism sheet 850 and the second prism sheet 860. The light guiding plate 840 guides light emitted from the light- A panel 870 disposed in front of the panel 870 and a color filter 880 disposed in the front of the panel 870.

The light emitting module includes the above-described light emitting device package 835 on the circuit board 830. Here, a PCB or the like may be used for the circuit board 830, and the light emitting device package 835 is as described with reference to FIG.

The bottom cover 810 may house the components in the display device 800. The reflection plate 820 may be formed as a separate component as shown in the drawing, or may be formed to be coated on the rear surface of the light guide plate 840 or on the front surface of the bottom cover 810 with a highly reflective material Do.

Here, the reflection plate 820 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and polyethylene terephthalate (PET) can be used.

The light guide plate 840 scatters light emitted from the light emitting device package module so that the light is uniformly distributed over the entire screen area of the LCD. Accordingly, the light guide plate 830 is made of a material having a good refractive index and transmittance. The light guide plate 830 may be formed of polymethyl methacrylate (PMMA), polycarbonate (PC), or polyethylene (PE). An air guide system is also available in which the light guide plate is omitted and light is transmitted in a space above the reflective sheet 820.

The first prism sheet 850 is formed on one side of the support film with a transparent and elastic polymeric material, and the polymer may have a prism layer in which a plurality of steric structures are repeatedly formed. As shown in the drawings, the plurality of patterns may be repeatedly provided with a stripe pattern.

In the second prism sheet 860, the edges and the valleys on one surface of the support film may be perpendicular to the edges and the valleys on one surface of the support film in the first prism sheet 850. This is to uniformly distribute the light transmitted from the light emitting module and the reflective sheet in all directions of the panel 870.

In the present embodiment, the first prism sheet 850 and the second prism sheet 860 form an optical sheet, which may be formed of other combinations, for example, a microlens array or a diffusion sheet and a microlens array Or a combination of one prism sheet and a microlens array, or the like.

A liquid crystal display (LCD) panel may be disposed on the panel 870. In addition to the liquid crystal display panel 860, other types of display devices requiring a light source may be provided.

In the panel 870, the liquid crystal is positioned between the glass bodies, and the polarizing plate is placed on both glass bodies to utilize the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

A liquid crystal display panel used in a display device is an active matrix type, and a transistor is used as a switch for controlling a voltage supplied to each pixel.

A color filter 880 is provided on the front surface of the panel 870 so that light projected from the panel 870 transmits only red, green, and blue light for each pixel.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, This is possible.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the equivalents of the claims, as well as the claims.

100A to 100E: Light emitting device package 110: Body
121: first electrode 122: second electrode
130: light emitting element 140: molding part
150: lens 152:
154: support part 160: adhesive
210: light emitting device package array 220: mold
710: Light emitting module 720: Reflector
800: Display device 810: Bottom cover
820: reflector 840: light guide plate
850: first prism sheet 860: second prism sheet
870: Panel 880: Color filter

Claims (11)

Body;
A first electrode and a second electrode disposed on the body;
A light emitting element disposed in the body and electrically connected to the first electrode and the second electrode;
A molding part covering the light emitting element; And
And a lens positioned on the molding part,
Wherein the lens includes a light dispersing unit for dispersing light generated from the light emitting device and a support protruding from a lower periphery of the light dispersing unit,
Wherein the support portion includes a first region adjacent to the light scattering portion and a second region in an edge direction, the first region having a constant first thickness, the second region having a constant second thickness, Wherein the first thickness is greater than the second thickness. delete The method according to claim 1,
Wherein the support portion has a roughness at the side of the edge region. The method according to claim 1,
Wherein the lens comprises a phosphor. The method according to claim 1,
And the width of the light dispersing portion corresponds to the width of the upper surface of the molding portion. The method according to claim 1,
Wherein a width of the support portion corresponds to a width of an upper surface of the body. The method according to claim 1,
Wherein the molding part comprises a phosphor. The method according to claim 1,
Wherein the body includes a cavity having a side surface and a bottom surface, and the light emitting element is located on a bottom surface of the cavity. 9. The method of claim 8,
And a side surface of the cavity is an inclined surface. The method according to claim 1,
And an adhesive is disposed between the lens and the molding part. The method according to claim 1,
And a reflective layer formed on at least a part of the first electrode and the second electrode.
KR1020120047919A 2012-05-07 2012-05-07 Light emitting device package KR101928358B1 (en)

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Application Number Priority Date Filing Date Title
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KR20130124652A KR20130124652A (en) 2013-11-15
KR101928358B1 true KR101928358B1 (en) 2018-12-12

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