KR101923532B1 - Camera Module - Google Patents

Abstract

A camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; A housing unit disposed on the first printed circuit board; A holder module disposed at a distance from the bottom surface of the housing unit, the holder module including a first coil wound around an outer circumferential surface thereof and including at least one lens therein; A plate member coupled to a bottom surface of the holder module; A second printed circuit board mounted on the holder module; A plurality of wire springs having one end connected to the plate member and the other end connected to the second printed circuit board; And a buffer provided at a connection portion between the wire spring and the plate member.

Description

Camera module {Camera Module}

The present invention relates to a camera module.

In the case of a camera module mounted on a small electronic product, the camera module may be frequently hit during use, and the camera module may be shaken finely due to hand shake or the like during shooting. Taking these points into consideration, a camera module having an anti-shake device has recently been disclosed. For example, Korean Patent Registration No. 10-0741823 (registered Jul. 14, 2007) discloses a gyro sensor IC or an angular velocity sensor installed inside a device in which a camera module such as a mobile phone is mounted for correction of a hand- Is introduced.

However, when a separate angular velocity detection sensor is provided as described above, a separate detection sensor must be provided in order to realize the anti-shake function, thereby increasing the manufacturing cost. In addition, in order to construct and install the anti- There is a hassle to provide space.

Korean Patent No. 10-0741823 (July 16, 2007)

An object of the present invention is to provide a camera module having an OIS (Optical Image Stabilizer) function.

It is another object of the present invention to provide a camera module in which the buffer structure of the wire and the soldering portion is improved so that the impact resistance can be improved.

A camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; A housing unit disposed on the first printed circuit board; A holder module disposed at a distance from the bottom surface of the housing unit, the holder module including a first coil wound around an outer circumferential surface thereof and including at least one lens therein; A plate member coupled to a bottom surface of the holder module; A second printed circuit board mounted on the holder module; A plurality of wire springs having one end connected to the plate member and the other end connected to the second printed circuit board; And a buffer provided at a connection portion between the wire spring and the plate member.

The buffering portion may be formed to be capable of reciprocating about the connection portion.

The buffer part may be formed by a slit formed through the plate member and passing through a spring hole around which the wire spring is connected to the plate member by a connection material, And may be configured to penetrate the portion excluding the buffer portion in an arc shape.

It is also possible to further include a buffer hole formed through the space between the spring through hole and the buffer part.

In addition, the connection material may be formed of a conductive material such as lead.

The housing unit may include: a first housing disposed on the first printed circuit board; A second housing disposed above the first housing and having the second printed circuit board mounted on an upper side thereof; First and second permanent magnets interposed between the first and second housings; And a yoke disposed between the first and second permanent magnets or positioned on the inner side surfaces of the first and second housings to transmit magnetic force into the holder module.

The yoke may protrude from a center portion of the yoke toward the holder module.

The second housing and the second printed circuit board may be fixed with a double-sided tape.

And a shield can having a through hole at a position corresponding to the connection portion of the second printed circuit board and the wire spring and the lens module, and to surround the housing unit.

The holder module includes: an outer blade having a first coil wound on an outer circumferential surface thereof; A bobbin which is supported by an elastic member on an upper side of the outer blade and is arranged to be movable up and down inside the outer blade, a second coil is wound on an outer circumference of the outer blade, and at least one lens is installed therein; And upper and lower elastic members disposed on the upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade, wherein a center of the first coil is configured such that a magnetic force can be applied to the second coil A space portion can be formed.

The wire spring may be made of a metal material and may be connected to the plate member and the second printed circuit board so as to be conductive.

At least six wire springs are provided to supply two polarities for autofocusing control and four polarity power sources for OIS driving to the holder module through connection with the plate member and the second printed circuit board desirable.

The wire springs may have the same length, and two wire springs may be arranged at the corner portions of the holder module, and a total of eight wire springs may be provided.

According to the camera module of the present invention, since the buffer member is provided on the plate member provided under the outer blade, even if repetitive load is generated, breakage of the wire soldering connection portion due to impact of the camera module can be minimized.

Further, even if soldering is performed above the reference value by mistake of the operator during the assembling process, excess solder is impregnated into the buffer hole formed at a position near the soldering portion of the wire, thereby preventing the camera module from being defective.

1 is a schematic plan view of a camera module according to an embodiment of the present invention,
FIG. 2 is a cross-sectional view taken along line AA of FIG. 1,
3 and 4 are side views of a camera module according to an embodiment of the present invention,
5 and 6 are a plan view showing a pattern of a cushioning portion of a plate member according to the first embodiment of the present invention,
7 and 8 are plan views showing a pattern of a cushion portion of a plate member according to a second embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the line AA in FIG. 1, FIGS. 3 and 4 are side views of a camera module according to an embodiment of the present invention, 6 is a plan view showing a pattern of the cushioning portion of the plate member according to the first embodiment of the present invention and Figs. 7 and 8 are plan views showing the pattern of the cushioning portion of the plate member according to the second embodiment of the present invention .

2, a camera module according to the present invention includes a first printed circuit board 10, a housing unit 20, a first printed circuit board 10, A buffer module 100 provided on the holder module 30, the plate member 40, the second printed circuit board 50, the wire spring 60, and the plate member 40.

The first printed circuit board 10 is mounted on the image sensor 11 in the vicinity of the center thereof and is preferably provided as a PCB substrate. The first printed circuit board 10 may be provided with a plurality of terminal portions for arranging components for operating the image sensor 11 or for supplying power and outputting information of the image sensor 11 .

The housing unit 20 is disposed on the first printed circuit board 10 to form a skeleton of the camera module. According to a preferred embodiment of the present invention, the housing unit 20 includes a first housing 21, a second housing 22, first and second permanent magnets 23 and 24, and a yoke 25, .

The first housing 21 is disposed on an upper surface of the first printed circuit board 10 as a base and spaced apart from the image sensor 11 by a predetermined distance. The first housing 21 may further include a filter member for filtering an image incident on the image sensor 11 if necessary.

The second housing 22 is disposed on the upper side of the first housing 21 to cover the first housing 21. An opening is formed in the vicinity of the center of the second housing 22 at a position corresponding to the image sensor 11. The second printed circuit board 50 to be described later is adhered and fixed to the upper surface of the second housing 22 by a fixing member such as a double-sided tape or an adhesive. However, the second printed circuit board 50 is not limited thereto, It is also possible to provide the second printed circuit board 50 with a separate third housing such as a case or shield can and fix the second printed circuit board 50 on the inner side with the fixing member. If the third housing is provided, the second printed circuit board 50 may be pressed and supported by the third housing without a separate fixing member.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 so that a magnetic force is applied to the holder module 30. The first and second permanent magnets 23 and 24 may have the same size. Also, the first and second permanent magnets 23 and 24 and the yoke 25 may be disposed on the inner side surfaces of the first and second housings, if possible, within the design tolerance range.

On the other hand, if the size of the first and second permanent magnets 23 and 24 increases, the OIS drive becomes large even if the current is small. If the first and second permanent magnets 23 and 24 are constant in size , The OIS drive becomes larger as the currents flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 are increased. As a result, the larger the size of the first and second permanent magnets 23 and 24, the better the OIS drive, but it is desirable to design the optimal size within other design tolerances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24. The yoke 25 is provided in a shape protruding near the center so that the magnetic force of the first and second permanent magnets 23 and 24 can be invested into the inner space of the holder module 30. Preferably, the width is provided in the same manner as the first and second permanent magnets 23 and 24, and the center is protruded by a predetermined size so that the permanent magnet and the yoke are formed to have a substantially "T" desirable.

The holder module 30 is spaced apart from the inner bottom surface of the housing unit 20 by a predetermined distance. The holder module 30 includes an outer blade 31 and a bobbin 32. The holder module 30 can perform pendulum movement in the forward / backward / left / right and diagonal directions while being suspended from the wire spring 60.

Spring members 35 and 36 are provided on the upper and lower sides of the outer blade 31 so as to be elastically supported by the spring member 35 so that the bobbin 32 can move upward and downward.

As shown in FIG. 1, the outer blade 31 has a total of four first coils 31a to 31d wound on the outer circumferential surface of four sides, and the four side central portions around which the coils 31a to 31d are wound There is no coil. The yoke 25 may be disposed at a position corresponding to the opened space and the yoke 25 may be partially inserted into the space.

The plate member 40 may be fixed to the bottom surface of the outer blade 31 with a fixing member 33 such as double-sided tape or adhesive. The outer blade 31 is rotated in the front, rear, left, and right directions as shown by arrows in FIG. 2 in accordance with the interaction between the magnetic forces of the first and second permanent magnets 22 and 23 and the first coils 31a to 31d. And is spaced apart from the bottom surface of the first housing 21 by a predetermined distance.

A plurality of spring through holes 37 may be formed in the outer blade 31 so that the wire spring 60 penetrates the outer blade 31 and is connected to the plate member 40.

The bobbin (32) is arranged such that the outer blade (31) is vertically movable inside and at least one lens (34) is installed therein. A second coil 32a is wound on the outer circumferential surface of the bobbin 32. The second coil 32a is connected to the first coils 31a to 31d of the outer blade 31 through the yoke 25, And moves up and down the bobbin 32 by interaction with the magnetic force that is invested through the open space. The larger the size of the yoke 25, the better the AF drive, but this also depends on the optimum design value. The focus of the image transmitted to the image sensor 11 can be automatically adjusted by the bobbin 32 moving up and down.

The plate member 40 is preferably made of a metal material that can be energized and is disposed on the bottom surface of the outer blade 31 as described above so as to supply power to the first and second coils 31a and 32a The wire spring 60 is connected. The connection can be done in any way as long as it can be connected by soldering or other conductive material. That is, the connection portion w 'of the plate member 40 is connected to the first and second coils 31a and 32a, respectively, as shown in FIG. 2, And transmits the supplied power to the first and second coils 31a and 32a so as to form an electromagnetic force.

In this case, the second coil 32a may be directly connected to the plate member 40. As shown in FIG. 2, after the lower spring 36 is connected to the lower spring 36, It is also possible to connect with the plate member 40.

The second printed circuit board 50 is fixed to the upper side of the second housing 22 by a fixing member such as a double-sided tape or an adhesive member as described above. The power transmitted through the terminal portion 52 of the printed circuit board 50 is transmitted to the plate member 40 through the wire spring 60. [ The connection can be done in any way as long as it can be connected by soldering or other conductive material.

As shown in FIGS. 3 and 4, the second printed circuit board 50 is provided to cover one side wall of the first and second housings 21 and 22, A window 55 may be formed on the surface facing the second permanent magnets 23 and 24 and the yoke 25 so that interference with them can be avoided.

This is because the first and second permanent magnets 23 and 24 and the yoke 25 are directly attached to the shield can 70 to be described later by fixing means such as epoxy.

The second printed circuit board 50 may be a flexible printed circuit board (FPCB), a printed circuit board (PCB), or an R-FPCB (rigid FPCB integrated type), but is not limited thereto and may be electrically connected Any substrate can be used. In the case of the present invention, the plate member 40 may be formed of a thin metal plate for the formation of the shock absorbing portion 100 for shock absorption at the connection portion w 'where the wire spring 60 is soldered against an external impact .

Both ends of the wire spring 60 are connected to the plate member 40 and the second printed circuit board 50. At this time, one end of the wire spring 60 is connected to the second printed circuit board 50 as shown in FIG. 2, and the wire spring 60 connected to the second printed circuit board 50 The first and second coils 31a and 32a are connected to the first and second permanent magnets 23 and 24 and the second and third coils 31a and 32b, .

2, the other end of the wire spring 60 passes through a spring through hole 37 formed in the outer blade 31, and is inserted into a plate member (not shown) provided on the bottom surface of the outer blade 31, (40). At this time, the other end of the wire spring 60 is connected to a pad (not shown) formed on the plate member 40 like the second printed circuit board 50 (not shown) A spring through hole 41 through which the wire spring 60 passes is formed. The connection can be done in any way as long as it can be connected by soldering or other conductive material. According to this configuration, the outer blade 31 may be suspended from the wire spring 60, and may be spaced apart from the bottom surface of the first housing 21 by a certain distance. The outer blade 31 performs the pendulum motion according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24 so that the outer blade 31 can be corrected by the interaction of the first coil 31a and the first and second permanent magnets 23, 24. For this purpose, it is preferable that the wire spring 60 is made of a metal material which is elastic and able to withstand an impact, and is made conductive.

On the other hand, the thinner the thickness of the wire spring 60, the better the mobility for correcting the shaking motion even with a small current, which may vary depending on the optimum design value. Preferably, the thickness of the wire spring 60 is several 탆 to several hundred 탆, preferably 1 to 100 탆.

At least six wire windings 60 are preferably provided. Four polarity power sources for at least two polarities for autofocusing control and correction for camera shake correction movement are provided on the second printed circuit board 50 And the plate member 40 to the holder module 30 through the connection between the plate member 40 and the plate member 40.

According to a preferred embodiment of the present invention, as shown in FIG. 1 and FIG. 2, it is preferable that a total of 8 pieces are provided at the corner portions of the holder module 30 with the same length, .

2, the second printed circuit board 50 may include a third housing such as the shield can 70, as described above, The magnets 23 and 24 and the yoke 25 are fixedly coupled to the shield can 70 by epoxy or the like so that a window 55 is formed in order to avoid this coupling portion, (21) (22).

If the shield can 70 is removed, the second printed circuit board 50 is formed of PCB or the like, and the first and second permanent magnets 23 and 24 and the yoke The second printed circuit board 50 may be formed of a PCB and the window 55 may be provided as described above so that the window 55 may be provided with the second printed circuit board 50, 1 and the second permanent magnets 23 and 24 and the yoke 25 may be inserted into the yoke 25 and the yoke 25 may be further reinforced by a shielding tape or the like.

The buffer part 100 is formed on the connection part w 'where the wire spring 60 and the plate member 40 are electrically connected to each other by soldering or Ag bond so that the impact applied to the wire spring 60 and the repeated load So that it can be absorbed.

5, the buffer part 100 includes a slit 42 formed in the vicinity of the edge of the plate member 40 and formed around the spring through hole 41 through which the wire spring 60 penetrates, May be configured to be connected to the plate member 40 so that the periphery of the spring through hole 41 can reciprocate in a direction parallel to the acceleration direction about the buffer part 100. [

According to the first preferred embodiment of the present invention, the shape of the slit 42 may be such that a portion except for the buffer portion 100 has a circular ring shape as shown in FIG. 5 . At this time, as shown in FIG. 6, the buffer hole 200 may be further formed at a position close to the spring through-hole 41. When the wire spring 60 penetrating the spring through hole 41 is electrically connected to the buffer hole 200 by soldering or the like, the buffer hole 200 is filled with the solder, (Not shown). That is, if the operator accidentally injects too much lead, the lead may flow toward the cushioning part 100. At this time, if the cushioning hole 200 formed through the path is provided, And flows into the hole 200, so that it does not flow to the buffer part 100 side any more. Therefore, even if an impact is generated in the wire spring 60, the shock absorbing member 100 can maintain the flexibility of the plate member 40, It can be absorbed through morphological transformation.

According to a second preferred embodiment of the present invention, as shown in FIG. 7, the shape of the buffer part 100 may be configured to be symmetrical with respect to the spring through-hole 41. Also in this case, as shown in FIG. 8, a buffer hole 200 may be formed around the spring through-hole 41. The function of the buffer hole 200 is the same.

The shape of the buffer hole 200 may be an arc shape as shown in FIG. 6, or may be circular as shown in FIG. 8, but it is not limited thereto, Or any other shape in which a conductive connecting member such as a wire can flow.

However, the buffer hole 200 needs to be formed between the buffer part 100 and the spring through hole 41. If the buffer hole 200 is too large, the strength around the buffer part 100 is lowered. Therefore, Is preferably smaller than the area of the spring through hole (41). According to this configuration, it is possible to prevent the connection portion w 'of the plate member 40 from being damaged by an external impact.

A typical assembly procedure is to combine the bobbin 32 and the outer blade 31 and then fix the second housing 22, the plate member 40 and the second printed circuit board 50 and the wire spring And the first housing 21 is connected to the first printed circuit board 10 after the bobbin 32 having the lens barrel is coupled. Before connecting the first housing 21, the permanent magnet and yoke coupling may be performed first. This assembly sequence may be changed as needed. That is, it may be possible directly from the equipment without a jig. In this process, even if the force for inserting and connecting the bobbin 32 with the lens barrel is excessively large, the buffer part 100 can absorb such an excessive force even if the coupling part w 'is damaged. That is, when the load is applied to the wire spring 60 in the vicinity of the connection portion w 'between the wire spring 60 and the plate member 40, the buffer portion 100 is pulled in the gravity direction or shaken from side to side And absorbs the generated load as strain energy due to the reciprocating movement of the connection portion (w ') around the buffer portion (100).

Therefore, it is possible to perform the connection operation again due to the breakage of the connection portion (w ') during the assembling process, to prevent the inconvenience that the parts can not be used, and to manufacture the camera module with higher reliability.

According to a preferred embodiment of the present invention, a through hole is provided at a position corresponding to the holder module 30 around the connection portion w of the second printed circuit board 50 and the wire spring 60, And a shield can 70 installed to enclose the units 21 and 22. In this case, as described above, the second printed circuit board 50 may be fixedly attached to the inner circumferential surface of the shield can 70. Meanwhile, the shield can 70 is not necessarily required, and may be omitted depending on the configuration of the housing units 21 and 22.

2, the hook unit 80 may be provided on four sides or at least one side of the shield can 70 in order to fix the shield can 70 to the first housing 21. As shown in FIG. The position may be within a range allowed by the center or edge design, and the number may be one or more.

The hook unit 80 may include a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81 , And may be configured as the opposite if necessary.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

10; A first printed circuit board 20; The housing unit
21; A first housing 22; The second housing
23; A first permanent magnet 24; The second permanent magnet
25; Yoke 30; Holder module
31; An outer blade 31a; The first coil
32; Bobbin 32a; The second coil
40; Plate member 50; The second printed circuit board
52; Terminal 60; Wire spring
70; Shield can 80; Hook unit
100; Buffer part 200; Buffer hole

Claims (16)

A first printed circuit board on which an image sensor is mounted;
A housing unit disposed on the first printed circuit board;
A holder module disposed at a distance from the bottom surface of the housing unit, the holder module including a first coil wound around an outer circumferential surface thereof and including at least one lens therein;
A plate member coupled to a bottom surface of the holder module;
A second printed circuit board mounted on the holder module;
A plurality of wire springs having one end connected to the plate member and the other end connected to the second printed circuit board; And
And a cushioning portion provided at a connection portion between the wire spring and the plate member,
Wherein the buffer part is formed by a slit formed through the plate member and formed around the spring through hole in which the wire spring is connected to the plate member by a connecting material,
Wherein the slit penetrates a portion of the plate member excluding the buffer portion in an arc shape.
The apparatus according to claim 1,
The camera module being capable of reciprocating about the connection portion.
delete delete delete delete The connector according to claim 1, wherein the housing unit comprises:
A first housing disposed above the first printed circuit board;
A second housing disposed above the first housing and having the second printed circuit board mounted on an upper side thereof;
First and second permanent magnets interposed between the first and second housings;
And a yoke disposed between the first and second permanent magnets or positioned on a side surface of the first and second housings to transmit magnetic force into the holder module.
8. The motor according to claim 7,
And a central portion facing the holder module is protruded.
8. The method of claim 7,
Wherein the second housing and the second printed circuit board are fixed to each other with a double-sided tape.
8. The method of claim 7,
And a shield can having a through hole at a position corresponding to a connection portion of the second printed circuit board and the wire spring and the lens module, and to surround the housing unit.
The optical module according to claim 1,
An outer blade having an outer circumferential surface on which the first coil is wound;
A bobbin which is supported by an elastic member on an upper side of the outer blade and is arranged to be movable up and down inside the outer blade, a second coil is wound on an outer circumference of the outer blade, and at least one lens is installed therein; And
And upper and lower elastic members disposed on upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade,
Wherein a center portion of the first coil is formed with a space portion so that a magnetic force can be invested in the second coil.
The wire springs according to claim 1,
Wherein the plate member and the second printed circuit board are electrically connected to each other by a metal material.
The wire springs according to claim 1,
Wherein at least six polarities for autofocusing control and four polarity powers for OIS driving are supplied to the holder module through connection with the plate member and the second printed circuit board.
The wire springs according to claim 12,
Two camera module modules are provided in the corner module of the holder module with the same length. A first printed circuit board on which an image sensor is mounted;
A housing unit disposed on the first printed circuit board;
A holder module disposed at a distance from the bottom surface of the housing unit, the holder module including a first coil wound around an outer circumferential surface thereof and including at least one lens therein;
A plate member coupled to a bottom surface of the holder module;
A second printed circuit board mounted on the holder module;
A plurality of wire springs having one end connected to the plate member and the other end connected to the second printed circuit board;
A cushioning portion formed at a connection portion between the wire spring and the plate member, the cushion portion being formed through a slit formed through the plate member and penetrating around a spring hole communicating the wire spring with the plate member; And
And a cushion hole formed through the space between the spring through hole and the buffer part.
A first printed circuit board on which an image sensor is mounted;
A housing unit disposed on the first printed circuit board;
A holder module disposed at a distance from the bottom surface of the housing unit, the holder module including a first coil wound around an outer circumferential surface thereof and including at least one lens therein;
A plate member coupled to a bottom surface of the holder module;
A second printed circuit board mounted on the holder module;
A plurality of wire springs having one end connected to the plate member and the other end connected to the second printed circuit board; And
And a cushioning portion provided at a connection portion between the wire spring and the plate member,
Wherein the buffer part is formed by a slit formed through the plate member and formed around the spring through hole in which the wire spring is connected to the plate member by a connecting material,
Wherein the connecting material is a conductive material such as lead.

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