KR102052561B1 - Camera Module - Google Patents

Abstract

The camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; A housing unit disposed above the first printed circuit board; A holder module disposed at a predetermined distance from an inner bottom surface of the housing unit, having a first coil wound around an outer circumferential surface thereof, and having at least one lens installed therein; A second printed circuit board coupled to the bottom surface of the holder module; A third printed circuit board installed above the holder module; A plurality of wire springs having one end connected to the second printed circuit board and the other end connected to the third printed circuit board; And a buffer unit provided at a connection portion of the wire spring and the third printed circuit board and surrounding the connection portion of the wire spring and the third printed circuit board.

Description

Camera Module

The present invention relates to a camera module.

In the case of a camera module mounted in a small electronic product, the camera module may be frequently shocked during use, and the camera module may be minutely shaken due to the shaking of the user during shooting. In view of such a point, the camera module which has the shake prevention means in recent years is disclosed.

For example, in Korean Patent Registration No. 10-0741823 (registered on July 16, 2007), a gyro sensor IC or an angular velocity sensor is installed inside a device in which a camera module such as a mobile phone is mounted to correct a hand shake phenomenon. How to do is introduced.

However, if a separate angular velocity detection sensor is provided in this way, a separate detection sensor must be provided to implement a hand shake prevention function, causing an increase in manufacturing cost, and for configuring and installing a hand shake prevention device separately from a camera module. There is a hassle to make room.

(Patent Document 1) KR10-0741823 B1

SUMMARY OF THE INVENTION An object of the present invention is to provide a camera module having an optical image stabilizer function.

The camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; A housing unit disposed above the first printed circuit board; A holder module disposed at a distance from an inner bottom surface of the housing unit, the first coil being wound around an outer circumferential surface, and including at least one lens therein; A second printed circuit board coupled to the bottom surface of the holder module; A third printed circuit board installed above the holder module; A plurality of wire springs having one end connected to the second printed circuit board and the other end connected to the third printed circuit board; And a buffer unit provided at a connection portion of the wire spring and the third printed circuit board and surrounding the connection portion of the wire spring and the third printed circuit board.

The buffer unit may include at least one injection hole formed through the third printed circuit board and penetrating around the through hole to which the wire spring is connected; And a second wire spring through hole formed in the housing unit so as to be coaxial with the through hole of the third printed circuit board and communicating with the injection hole through the upper opening.

In addition, the camera module according to an embodiment of the present invention, it is preferable to further include an adhesive material injected into the second wire spring through the injection hole.

In addition, the wire spring and the third printed circuit board is connected through the through hole, wherein the upper and lower surfaces of the third printed circuit board through the through hole are preferably connected with a connecting material, and the connecting material is conductive such as lead. It is preferably provided with a substance.

The buffer unit may further include a pair of injection holes formed through the third printed circuit board and penetrating to both sides of the first wire spring through hole to which the wire spring is soldered; A second wire spring through hole formed in the housing unit so as to be coaxial with the first wire spring through hole of the third printed circuit board and communicating with the injection hole through an upper opening; It is preferable to include.

In addition, the camera unit according to an embodiment of the present invention, the adhesive material is injected into the second wire spring through the injection hole; wherein the adhesive material is in the second wire spring through and the It is preferable to cover the entire connecting portion formed on the upper surface of the third printed circuit board. At this time, the adhesive material is preferably provided with epoxy.

The second wire spring through hole may include: an upper opening provided in a housing unit in a funnel shape of a light beam narrower; And a wire spring support hole provided coaxially with the through hole.

The diameter of the second wire spring through hole may be equal to or larger than the diameter of the through hole.

The housing unit may include a first housing disposed above the first printed circuit board; A second housing disposed above the first housing and having the third printed circuit board installed thereon; First and second permanent magnets interposed between the first and second housings; And a yoke disposed between the first and second permanent magnets or positioned on inner surfaces of the first and second housings to transfer a magnetic force into the holder module.

It is preferable that the yoke has a central portion protruding from the holder module.

Preferably, the second housing and the third printed circuit board are fixed with double-sided tape.

In addition, the camera module according to a preferred embodiment of the present invention, the shield can has a through hole in a position corresponding to the connecting portion of the third printed circuit board and the wire spring and the lens module, the shield can is installed to surround the housing unit; It is preferable to further include.

The holder module may include an outer blade having a first coil wound around an outer circumferential surface thereof; A bobbin elastically supported by an elastic member on the upper side of the outer blade, arranged to be movable up and down inside the outer blade, and having a second coil wound around its outer circumferential surface, and having at least one lens installed therein; And upper and lower elastic members disposed on the upper side and the lower side of the bobbin to elastically support the bobbin with respect to the outer blade, wherein the center of the first coil can be magnetically invested in the second coil side. The space portion can be formed so that.

The wire spring may be made of a metal material and may be electrically connected to the second and third printed circuit boards.

At least six wire springs are provided to supply two polarities for auto focusing control and four polarity powers for driving OIS to the holder module through connection with the second and third printed circuit boards. good.

In addition, the wire springs, the same length, are arranged in each of the two corner portions of the holder module, a total of eight can be provided.

According to an embodiment of the present invention, a camera module includes: a first printed circuit board on which an image sensor is mounted; A housing unit disposed above the first printed circuit board; A holder module disposed at a distance from an inner bottom surface of the housing unit, the first coil being wound around an outer circumferential surface, and including at least one lens therein; A second printed circuit board coupled to the bottom surface of the holder module; A third printed circuit board installed above the holder module; A plurality of wire springs having one end connected to the second printed circuit board and the other end connected to the third printed circuit board; And the wire spring and the third printed circuit board are connected to upper and lower surfaces of the three printed circuit boards through a through hole formed in the third printed circuit board.

The present invention has a shock absorbing unit to absorb a load applied repeatedly to the wire spring, the wire spring can be firmly connected to the connection portion of the printed circuit board.

In addition, even if the wire spring receives excessive force during the assembly process of the lens module, it is possible to absorb the force applied excessively in the shock absorbing unit, thereby improving assembly performance and minimizing component loss due to poor assembly.

1 is a schematic plan view of a camera module according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along AA of FIG. 1.
3 is a side view of a camera module according to an embodiment of the present invention.
4 is a perspective view showing a part of the configuration of FIG.
5 is an enlarged view of a portion B of FIG. 2 according to a first embodiment of the present invention.
6 is an enlarged view of a portion B of FIG. 2 according to a second embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, FIG. 3 is a side view of the camera module according to an embodiment of the present invention, and FIG. 4 is a part of FIG. 3. 5 is an enlarged view of part B of FIG. 2 according to the first embodiment of the present invention, and FIG. 6 is B of FIG. 2 according to the second embodiment of the present invention. It is a figure which expands and shows a part.

As shown in FIG. 2, which shows a schematic plan view of FIG. 1 and a schematic side view showing an AA section of FIG. 1, the camera module according to the present invention includes a first printed circuit board 10 and a housing unit 20. , A holder module 30, a second printed circuit board 40, a third printed circuit board 50, a wire spring 60, and a buffer unit 100.

In the first printed circuit board 10, the image sensor 11 is mounted near the center, and the first printed circuit board 10 is preferably provided as a PCB substrate. Components for operating the image sensor 11 may be disposed on the first printed circuit board 10, or a plurality of terminal units may be provided to supply power and output information of the image sensor 11. .

The housing unit 20 is disposed above the first printed circuit board 10 and forms a skeleton of the camera module. According to a preferred embodiment of the present invention, the housing unit 20, the first housing 21, the second housing 22, the first and second permanent magnets (23) 24 and the yoke 25 It includes.

The first housing 21 is a base and is disposed on an upper surface of the first printed circuit board 10 and is spaced apart from the image sensor 11 by a predetermined distance. If necessary, the first housing 21 may be further provided with a filter member for filtering the image image incident to the image sensor 11.

The second housing 22 is disposed above the first housing 21 and configured to cover the first housing 21. An opening is formed at a corresponding position so that an image can be transferred to the image sensor 11 near the center of the second housing 22. The third printed circuit board 50, which will be described later, is adhesively fixed to the upper side of the second housing 22 by a fixing member such as a double-sided tape or an adhesive, but is not limited thereto. The third printed circuit board 50 may be provided with a separate third housing such as a case or a shield can, and the third printed circuit board 50 may be fixed to the inner surface thereof with the fixing member. If the third housing is provided, the third printed circuit board 50 may be pressed and supported by the third housing without a separate fixing member.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 to inject magnetic force into the holder module 30. The first and second permanent magnets 23 and 24 may be provided in the same size. In addition, the first and second permanent magnets 23, 24 and the yoke 25 may be disposed on the inner side of the first and second housings, if possible, within the design tolerances.

On the other hand, when the sizes of the first and second permanent magnets 23 and 24 become larger, the OIS driving becomes larger even with a small current, and if the first and second permanent magnets 23 and 24 have a constant size, In this case, the OIS driving becomes larger as the current flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 increases. In conclusion, the larger the size of the first and second permanent magnets 23 and 24 is, the better OIS driving is, but it is desirable to design the optimum size within other design allowances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24. In addition, the yoke 25 is provided in a shape protruding near the center so that magnetic forces of the first and second permanent magnets 23 and 24 can be invested into the inner space of the holder module 30. Preferably, the width is provided in the same manner as the first and second permanent magnets (23, 24), the center is projected to a certain size so that the permanent magnet and the yoke is formed to have a substantially "T" shape desirable.

The holder module 30 is disposed to be spaced apart from the bottom surface of the housing unit 20 by a predetermined distance, and includes an outer blade 31 and a bobbin 32. The holder module 30 may pendulum in the front, rear, left, and right directions while being suspended from the wire spring 60.

Spring members 35 and 36 are provided on the upper side and the lower side of the outer blade 31 and are elastically supported by the spring member 35 so as to be able to move upward and downward in the bobbin 32.

As shown in FIG. 1, the outer blade 31 has four first coils 31a to 31d wound around the outer circumferential surface of the four sides, and a central portion of the four side at which the coils 31a to 31d are wound. It is drilled without a coil. The yoke 25 is disposed at a position corresponding to the drilled space portion, and the yoke 25 may be partially inserted into the space portion.

The second printed circuit board 40 may be fixed to the bottom of the outer blade 31 by a fixing member 33 such as a double-sided tape or an adhesive. The outer blade 31 may be moved back and forth, left and right or diagonally as shown in the arrow of FIG. 2 according to the interaction between the magnetic force of the first and second permanent magnets 22 and 23 and the first coil 31a. Hanging by a plurality of wire springs 60 to be movable, spaced apart from the bottom surface of the first housing 21 by a predetermined interval.

In addition, a plurality of spring through holes 37 may be provided in the outer blade 31 so that the wire spring 60 may pass through and be connected to the second printed circuit board 40.

The bobbin 32 is disposed so that the outer blade 31 is movable up and down inside, at least one lens 34 is provided therein. A second coil 32a is wound around the outer circumferential surface of the bobbin 32, and the second coil 32a is formed by the first coils 31a to 31d of the outer blade 31 through the yoke 25. The bobbin 32 is raised and lowered by interaction with the magnetic force invested through the open space. The larger the yoke 25 size, the better the AF drive, but this also depends on the optimum design value. It is possible to automatically adjust the focus of the image transmitted to the image sensor 11 by the lifting action of the bobbin 32.

The second printed circuit board 40 is disposed on the bottom surface of the outer blade 31 as described above, so that the wire spring 60 can supply power to the first and second coils 31a and 32a. Connected. The connection can be in any way as long as it can be connected by soldering or other conductive material. That is, as shown in FIG. 2, the connecting portion w ′ of the second printed circuit board 40 is connected to the first and second coils 31a and 32a, respectively, to form the wire spring 60. The power supplied through) is transferred to the first and second coils 31a and 32a to form an electromagnetic force.

In this case, in the case of the second coil 32a, the second coil 32a may be directly connected to the second printed circuit board 40, and as shown in FIG. 2, first, the lower coil 36 is connected to the lower spring 36. ) May be connected to the second printed circuit board 40.

The third printed circuit board 50 is fixed to the upper side of the second housing 22 by a fixing member such as a double-sided tape and an adhesive member, as described above, wherein the third printed circuit board 50 is connected to the first printed circuit board 10. The power transmitted through the terminal portion 52 of the printed circuit board 50 is transmitted to the second printed circuit board 40 through the wire spring 60 connected with the second printed circuit board 40. The connection can be in any way as long as it can be connected by soldering or other conductive material.

As shown in FIGS. 3 and 4, the third printed circuit board 50 is provided to cover one wall surface of the first and second housings 21 and 22. A window 55 is formed on a surface facing the second permanent magnets 23 and 24 and the yoke 25, and may be configured to avoid interference with them.

This is because the first and second permanent magnets 23, 24 and the yoke 25 are generally attached directly to the shield can 70, which will be described later, by means of fixing means such as epoxy.

Meanwhile, the second printed circuit board 40 and the third printed circuit board 50 may be a flexible printed circuit board (FPCB), a printed circuit board (PCB), or an R-FPCB (Rigid FPCB integrated type). The present invention is not limited thereto, and may be any substrate that allows electrical connection.

Both ends of the wire spring 60 are connected to the second and third printed circuit boards 40 and 50. At this time, one end of the wire spring 60, as shown in Figure 5, is connected from the pad 51 formed on the third printed circuit board 50, the wire spring in the center of the pad 51 The through hole 53 through which the 60 passes is formed. The connection can be in any way as long as it can be connected by soldering or other conductive material. Meanwhile, a solder register (SR) is provided around the pad 51 to protect the surface of the third printed circuit board 50, and the pad 51 region may be soldered open to be electrically connected. have.

In this way, the wire spring 60 connected from the pad 51 supplies the power supplied through the terminal portion 52 to the second printed circuit board 40, so that the first and second coils 31a ( 32a) enables interaction with the first and second permanent magnets 23,24.

In addition, as shown in FIG. 2, the other end of the wire spring 60 passes through a spring through hole 37 formed in the outer blade 31 and is provided on the bottom surface of the outer blade 31. It is connected to the printed circuit board 40. In this case, the other end of the wire spring 60 is connected to a pad (not shown) formed on the second printed circuit board 40, like the third printed circuit board 50, although not shown. In the center of the (not shown) is formed a through hole (not shown) through which the wire spring 60 passes. The connection can be in any way as long as it can be connected by soldering or other conductive material. According to this configuration, the outer blade 31 may be suspended from the wire spring 60 and spaced apart from the bottom surface of the first housing 21 by a predetermined distance or more. Then, according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24, the outer blade 31 performs a pendulum movement, thereby shaking the outer blade ( It is possible to correct the vibration of the 31 by the interaction of the first coil 31a and the first and second permanent magnets 23 and 24. To this end, the wire spring 60 is preferably provided with a metal material that is elastic and energizable to withstand the impact.

On the other hand, the thinner the thickness of the wire spring 60, the better the image stabilization motility even at a small current, which may vary depending on the optimum design value. Preferably, the wire spring 60 has a thickness of several micrometers to several hundred micrometers, preferably 1 to 100 micrometers.

In addition, the wire spring 60 is preferably provided with at least six or more, at least two polarities for auto focusing control and four polarity power supplies for image stabilization movement second and third printed circuits It is necessary to supply the holder module 30 through the connection with the substrates 40 and 50.

According to a preferred embodiment of the present invention, as shown in Figures 1 and 2, the same length, two each arranged in the corner portion of the holder module 30, it is good to have a total of eight to provide a balance .

On the other hand, as shown in Figure 2, if further comprises a separate third housing, such as the shield can 70, as described above, the third printed circuit board 50 is the first and second permanent Since the magnets 23 and 24 and the yoke 25 are fixedly bonded to the shield can 70 by epoxy or the like, in order to avoid this coupling portion, a window 55 is formed to form the window 55 and the first and second housings. (21) It covers the side wall surface of 22.

If the shield can 70 is removed, the third printed circuit board 50 may be formed of a PCB or the like, and the first and second permanent magnets 23 and 24 and the yoke may be formed therein. It is also possible to attach and fix 25, and as described above, the third printed circuit board 50 may be made of a PCB, and the window 55 as described above is provided to provide the The first and second permanent magnets 23 and 24 and the yoke 25 can be inserted and further configured to be reinforced with a shielding tape or the like.

The shock absorbing unit 100 surrounds the connection portion w of the connection portion of the wire spring 60 and the third printed circuit board 50 to absorb shock and repetitive loads added to the wire spring 60.

According to a preferred embodiment of the present invention, the buffer unit 100, the injection hole 110, the second wire spring through hole 120.

The injection hole 110 is formed through the vicinity of the through hole 53 in which the wire spring 60 passing through the third printed circuit board 50 is soldered. According to the first embodiment of the present invention, one injection hole 110 may be formed through one, as shown in FIG. 5.

The second wire spring through hole 120 is provided in the second holder 22. The second wire spring through hole 120 includes an upper opening 121 and a support hole 122.

The upper opening 121 has a structure of the upper and lower narrow, as shown in Figure 5 and 6, it is preferably provided in a conical funnel shape that narrows toward the lower side. The support hole 122 is formed through the coaxial with the through-hole 53, preferably corresponding to or larger than the diameter of the through-hole (53).

The diameter of the through hole 53 is preferably formed to be slightly larger than the diameter of the wire spring 60, the soldering or when connected to the pad 51 formed on the wire spring 60 and the third printed circuit board 50 A connecting material 101, such as other conductive material, flows down through the through hole 53 and connects with the wire spring 60 to both upper and lower surfaces of the third printed circuit board 50 as shown in FIGS. 5 and 6. Can be designed to be fixed.

The diameter of the support hole 122 is preferably formed to be slightly larger than the diameter of the wire spring 60, it may be the same as or larger than the diameter of the through hole (53). That is, the wire spring 60 may be designed to prevent interference by contacting the second holder 22 near the support hole 122.

The adhesive material 130 is injected through the injection hole 110 and filled in the inner space of the second wire spring through hole 120 as shown in FIG. 5. In addition, the adhesive material 130 may be added to cover the connection portion w of the third printed circuit board 50. The adhesive material 130 filled in the second wire spring through hole 120 absorbs the impact and the load transmitted to the connection portion w of the wire spring 60 and the third printed circuit board 50, and the wire spring It is possible to prevent the 60 from swinging inside the upper opening 121 of the second wire spring through hole 120. The adhesive material 130 may be an epoxy, but is not limited thereto, and may be any material that can be elastically supported by other adhesives.

According to the second embodiment of the present invention, the buffer unit 100 is configured in the same manner as the first embodiment, the injection hole 110 is provided in two pairs, the center of the through-hole (53) It may be arranged on both sides, or may be arranged symmetrically but the position is not limited thereto.

In this case, as shown in FIG. 6, the adhesive material 130 injected through the pair of injection holes 110 may be formed inside the upper opening 121 of the second wire spring through hole 120 as well as the The connection part w formed on the upper surface of the third printed circuit board 50 may be completely covered.

According to this configuration, it is possible to prevent damage to the connection portion (w) of the third printed circuit board 50, which is exposed on the upper side by an external impact, and to insulate the connection portion (w) It can be obtained additionally.

On the other hand, after assembling the bobbin 32 and the outer blade 31, the general assembly sequence is the second housing 22, the second and third printed circuit board 40, 50 and the wire spring (using a jig) 60, the bobbin 32 provided with the lens barrel is coupled, and then the first housing 21 is connected and mounted on the first printed circuit board 10. Before connecting the first housing 21, the permanent magnet and the yoke coupling may be made first. This assembly order may be changed as necessary. That is, it may be possible directly in the equipment without jig. In this process, even if the force for inserting and combining the bobbin 32 provided with the lens barrel acts too largely to impart the connection portion (w), the shock absorbing unit 100 can absorb this excessive force.

That is, the shock absorbing unit 100 is the wire spring 60 in the vicinity of the connecting portion (w) of the wire spring 60 and the third printed circuit board 50, as shown in Figures 2, 5 and 6 Absorbs the load generated when the load is generated in the direction of gravity or is pulled in the direction of gravity, or shaken from side to side as deformation energy of the buffer unit (100).

Therefore, the connection work can be performed again due to the breakage of the connection part (w) during the assembly process, or the trouble of the parts being unusable can be prevented, and a more reliable camera module can be produced.

On the other hand, according to a preferred embodiment of the present invention, the through hole in the position corresponding to the lens module 30 around the connection portion (w) of the third printed circuit board 50 and the wire spring 60, the housing It may further include a shield can 70 is installed to surround the unit (21) (22). In this case, as described above, the third printed circuit board 50 may be attached and fixed to the inner circumferential surface of the shield can 70. On the other hand, the shield can 70 is not necessarily required, it may be omitted depending on the configuration of the housing unit (21) (22).

On the other hand, as shown in Figure 2, in order to fix the shield can 70 to the first housing 21 may be provided with a hook unit 80 on at least one side or at least one side. The location may be within the range allowed by the center or edge design, and the number may be provided in one or a plurality.

The hook unit 80 may include a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81. If necessary, the configuration may be reversed.

The embodiments of the present invention described above and illustrated in the drawings should not be construed as limiting the technical idea of the present invention. The protection scope of the present invention is limited only by the matters described in the claims, and those skilled in the art can change and change the technical idea of the present invention in various forms. Therefore, such improvements and modifications will fall within the protection scope of the present invention, as will be apparent to those skilled in the art.

10; A first printed circuit board 20; Housing unit
21; First housing 22; Second housing
23; First permanent magnet 24; 2nd permanent magnet
25; Yoke 30; Holder module
31; Outer blade 31a; First coil
32; Bobbin 32a; 2nd coil
40; A second printed circuit board 50; 3rd printed circuit board
51; Pad 52; Terminals
53; Through 60; Wire spring
70; Shield can 80; Hook unit
100; Buffer unit 101; Connecting substance
110; Injection hole 120; 2nd wire spring through
121; Upper opening 122; Support hole
130; Adhesive

Claims (39)

A housing unit comprising a base and a third printed circuit board;
A holder module including an outer blade spaced from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin;
A wire connecting the housing unit and the holder module;
A second coil disposed on an outer circumference of the bobbin;
A magnet for moving the bobbin with respect to the outer blade through interaction with the second coil;
A first coil configured to move the holder module with respect to the housing unit through interaction with the magnet;
Solder coupled with the wire to connect the wire to at least one of the housing unit and the holder module; And
A buffer unit including an adhesive material adhered to the wire,
The spring member includes an upper elastic member disposed above the bobbin and a lower elastic member disposed below the bobbin,
The shock absorbing unit is disposed at a position adjacent to one end of the wire and the image stabilization device disposed closer to the upper elastic member than the lower elastic member. The method of claim 1,
The solder includes a first solder disposed at one end of the wire to couple the wire to the housing unit, and a second solder disposed at the other end of the wire to couple the wire to the holder module;
And the third printed circuit board is disposed between the first solder and the second solder. The method of claim 2,
The first solder is coupled to the third printed circuit board and the wire,
And the adhesive material is in contact with at least a portion of the first solder. The method of claim 3,
The camera shake compensation device is an adhesive material. The method of claim 1,
And the adhesive material is disposed on a portion of the wire to restrict movement of the holder module relative to the housing unit by being coupled to at least one of the housing unit and the holder module. The method of claim 1,
The second coil is a camera shake correction device is connected by the coupling of the spring member and the conductive material. The method of claim 1,
The third printed circuit board includes at least six terminals, the six terminals include two terminals for focusing and four terminals for image stabilization,
The wire comprises at least six wires,
And two terminals for focusing are electrically connected to the second coil through two of the six wires. The method of claim 1,
The holder module includes first to fourth corner portions,
The wire is disposed in the first to fourth corner portion of the holder module,
The wire comprises at least six wires,
Two of the six wires are disposed in the first corner portion, and the other two wires of the six wires are disposed in the third corner portion opposite to the first corner portion. The method of claim 2,
The third printed circuit board may include a first portion disposed on an upper portion of the base, a second portion extending downward from the first portion, a pad disposed on the first portion, and a hole formed in the pad. Including,
And the wire penetrates the hole and is coupled to the pad. The method of claim 9,
The adhesive material is a camera shake correction device that completely surrounds the outer surface of the solder. The method of claim 9,
And a solder resistor disposed around the pad to form a surface of the third printed circuit board. The method of claim 1,
The adhesive material is a camera shake correction device for connecting the wire and the housing unit. The method of claim 1,
The adhesive material is an insulating material,
The wire is formed of a metal material and has a camera shake correction device having a thickness of 1 to 100㎛. The method of claim 2,
The holder module further includes a second printed circuit board,
The second solder combines the wire and the second printed circuit board,
And the wire is electrically connected to the spring member through the second printed circuit board. The method of claim 2,
An image stabilization device in which a current is applied to the second coil through the first solder and the second solder. The method of claim 1,
And the wire provides a current to the second coil through the spring member. The method of claim 11,
And an area in which the solder resistor is not disposed in a region corresponding to the first solder of the third printed circuit board. The method of claim 2,
And at least a portion of the first solder and the adhesive material are disposed opposite to each other with respect to the third printed circuit board. The method of claim 2,
At least one of the first solder and the second solder is an image stabilization device surrounding the end of the wire. The method of claim 2,
And the adhesive material limits the movement of the holder module with respect to the housing unit when an impact occurs in at least one of the first solder and the second solder. The method of claim 2,
And the adhesive material mitigates the impact when an impact occurs in one of the first solder and the second solder. The method of claim 2,
And the adhesive material mitigates vibration of at least one of the wire and the holder module when an impact occurs in one of the first solder and the second solder. The method of claim 1,
And the shock absorbing unit is disposed closer to the one end of the wire than the lower elastic member. Image stabilization device of claim 1;
A lens coupled to the bobbin of the image stabilizer;
A first printed circuit board disposed below the base of the image stabilizer; And
An image sensor disposed on the first printed circuit board,
The holder module is arranged to move relative to the image sensor,
The buffer unit is a camera module disposed closer to the lens than the image sensor. A housing unit comprising a base;
A holder module including an outer blade spaced from the base, a bobbin disposed in the outer blade, and a spring member disposed on the outer blade to support movement of the bobbin;
A second coil disposed on an outer circumference of the bobbin;
A magnet for moving the bobbin with respect to the outer blade through interaction with the second coil;
A first coil configured to move the holder module with respect to the housing unit through interaction with the magnet;
A third printed circuit board disposed in the housing unit;
A wire electrically connecting the third printed circuit board to the holder module;
A first solder coupled to the wire to connect the wire to the third printed circuit board; And
A buffer unit adhered to the wire and including an adhesive material,
The wire comprises a plurality of wires,
Two wires of the plurality of wires are electrically connected to the second coil,
The third printed circuit board may include a first portion disposed above the base, a second portion extending downward from the first portion, a pad disposed on the first portion, and a center portion of the pad. Including a hall,
The wire penetrates the hole and is coupled by the pad and the first solder,
The spring member includes an upper elastic member disposed above the bobbin and a lower elastic member disposed below the bobbin,
And the shock absorbing unit is disposed at a position adjacent to one end of the wire and is disposed closer to the one end of the wire than the lower elastic member. The method of claim 25,
The shock absorbing unit is a hand shake correction device disposed closer to the upper elastic member than the lower elastic member. The method of claim 25,
The second portion of the third printed circuit board includes a terminal,
The terminals include at least six terminals, the six terminals include two terminals for focusing and four terminals for image stabilization,
The wire comprises at least six wires,
And two terminals for focusing are electrically connected to the second coil through two of the six wires. The method of claim 27,
The holder module includes first to fourth corner portions,
The wire is disposed in the first to fourth corner portion of the holder module,
Two wires of the six wires are disposed in the first corner portion, the other two wires of the six wires are disposed in the third corner portion opposite to the first corner portion,
The adhesive material is a camera shake correction device that completely surrounds the outer surface of the first solder. The method of claim 25,
A second solder disposed to couple the wire to the holder module;
The first solder is disposed at one end of the wire, the second solder is a camera shake correction device is disposed at the other end of the wire. The method of claim 29,
And the adhesive material is in contact with at least one of the first solder and the second solder. The method of claim 29,
And the wire and the spring member are electrically connected to each other through the second solder. The method of claim 31, wherein
The holder module includes a second printed circuit board,
The second solder couples the wire to the second printed circuit board,
And the wire is electrically connected to the spring member through the second printed circuit board. The method of claim 25,
The adhesive material is a camera shake correction device for connecting the wire and the housing unit. The method of claim 29,
And the adhesive material mitigates vibration and impact of at least one of the wire and the holder module when an impact occurs in one of the first solder and the second solder. The method of claim 25,
The image stabilization device comprises an epoxy. A housing unit comprising a base;
A holder module including an outer blade spaced from the base, a bobbin disposed in the outer blade, and a spring member disposed on the outer blade to support movement of the bobbin;
A lens coupled to the bobbin;
A second coil disposed on an outer circumference of the bobbin;
A magnet for moving the bobbin with respect to the outer blade through interaction with the second coil;
A first coil configured to move the holder module with respect to the housing unit through interaction with the magnet;
A wire supporting the movement of the holder module and electrically connected to the second coil;
A third printed circuit board disposed on the housing unit;
A first printed circuit board disposed under the housing unit;
Solder disposed on one side and the other side of the wire;
A buffer unit bonded to the wire and including an adhesive material; And
An image sensor coupled to the first printed circuit board,
The wire comprises a plurality of wires,
The third printed circuit board includes two terminals for focusing,
The two terminals for focusing are electrically connected to the second coil through two wires of the plurality of wires,
The shock absorbing unit is disposed at a position adjacent to one end of the wire and is disposed closer to the lens than the image sensor. The method of claim 36,
The spring member includes an upper elastic member disposed above the bobbin and a lower elastic member disposed below the bobbin,
The buffer unit is a camera module disposed closer to the upper elastic member than the lens. The method of claim 37,
The buffer unit is a camera module disposed closer to the upper elastic member than the lower elastic member. The method of claim 38,
The wire is a camera module for electrically connecting the third printed circuit board and the holder module.

Images