KR102107811B1 - Camera Module - Google Patents

Abstract

The camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; A housing unit disposed on the first printed circuit board; A holder module disposed at a predetermined distance from the inner bottom surface of the housing unit, the first coil wound on the outer circumferential surface, and including at least one lens therein; A second printed circuit board coupled to the bottom surface of the holder module; A third printed circuit board installed on the holder module; A plurality of wire springs connected to the second printed circuit board at one end and connected to the third printed circuit board at the other end; And a buffer part integrally formed with the wire spring at a connection portion between the wire spring and the third printed circuit board.

Description

Camera module

The present invention relates to a camera module.

In the case of a camera module mounted on a small electronic product, the camera module may be frequently shocked during use, and the camera module may be shaken finely according to a user's hand shaking during shooting. In view of this, a camera module having a hand shake preventing means has been recently disclosed.

For example, in Korean Patent Registration No. 10-0741823 (registered on July 16, 2007), a gyro sensor IC or an angular velocity sensor is installed inside a device in which a camera module such as a mobile phone is mounted to correct hand tremor. How to do is introduced.

However, if a separate angular velocity detection sensor is provided in this way, a separate detection sensor must be provided in order to implement a camera shake prevention function, which increases manufacturing cost, and configures and installs a camera shake prevention device separately from the camera module. There is a hassle of preparing a space.

(Patent Document 1) KR10-0741823 B1

An object of the present invention is to provide a camera module having an optical image stabilizer function.

The camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; A housing unit disposed on the first printed circuit board; A holder module disposed at a predetermined distance from the inner bottom surface of the housing unit, the first coil wound on the outer circumferential surface, and including at least one lens therein; A second printed circuit board coupled to the bottom surface of the holder module; A third printed circuit board installed on the holder module; A plurality of wire springs connected to the second printed circuit board at one end and connected to the third printed circuit board at the other end; And a buffer part integrally formed with the wire spring at a connection portion between the wire spring and the third printed circuit board.

The buffer part may be formed by bending the wire spring in a zigzag manner, or may be formed by bending the wire spring in a coil spring shape.

The housing unit may include: a first housing disposed on the first printed circuit board; A second housing disposed on an upper side of the first housing and on which the third printed circuit board is installed; First and second permanent magnets interposed between the first and second housings; It is preferably disposed between the first and second permanent magnets, the yoke for transmitting a magnetic force into the holder module.

The housing unit may include: a first housing disposed on the first printed circuit board; A second housing disposed on an upper side of the first housing and on which the third printed circuit board is installed; First and second permanent magnets located on inner surfaces of the first and second housings; It is preferably disposed between the first and second permanent magnets, the yoke for transmitting a magnetic force into the holder module.

According to a preferred embodiment of the present invention, the third printed circuit board and the wire spring has a through hole in a position corresponding to the connection portion and the lens module, the shield can is installed to surround the housing unit; may further include a have.

The holder module includes: an outer blade on which the first coil is wound on the outer circumferential surface; A bobbin which is elastically supported by an elastic member on an upper side of the outer blade, is disposed to move up and down inside the outer blade, a second coil is wound on its outer circumferential surface, and at least one lens is installed therein; And upper and lower elastic members disposed on the upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade. The center of the first coil may be magnetically invested toward the second coil side. It is preferable that the space portion is formed.

In addition, the yoke is preferably formed protruding near the center toward the holder module.

The holder module includes: an outer blade on which the first coil is wound on the outer circumferential surface; A bobbin which is elastically supported by an elastic member on an upper side of the outer blade, is disposed to move up and down inside the outer blade, a second coil is wound on its outer circumferential surface, and at least one lens is installed therein; And upper and lower elastic members disposed on the upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade.

The second printed circuit board is preferably installed on the bottom surface of the outer blade.

The second printed circuit board is preferably fixed with an adhesive member and a bottom surface of the outer blade.

The wire spring may be made of a metal material, and may be electrically connected to the second and third printed circuit boards.

In addition, at least six wire springs are provided, and two polarities for autofocusing control and four polarities for driving OIS are supplied to the holder module through connection with the second and third printed circuit boards. It is desirable to do.

In addition, it is preferable that the wire springs have the same length and are arranged two at each edge portion of the holder module, so that a total of eight are provided.

At this time, it is preferable that the second coil is electrically connected to the lower spring, and the lower spring is electrically connected to the wire spring on the second printed circuit board.

Further, the second coil may be directly connected to the second printed circuit board so as to be able to conduct electricity.

In addition, a space portion may be formed at the center of the first coil so that magnetic force can be injected toward the second coil.

Since the present invention has a buffer portion in the wire spring so as to absorb the load applied repeatedly, it can be firmly connected to the connection portion of the printed circuit board.

In addition, even if the wire spring receives excessive force during the assembly process of the lens module, it is possible to absorb excessively applied force from the shock absorbing member, thereby improving assembly performance and minimizing component loss due to assembly failure.

1 is a schematic plan view of a camera module according to an embodiment of the present invention,
2 is a cross-sectional view taken along line AA of FIG. 1,
3 is a side view of a camera module according to an embodiment of the present invention,
4 is a side view showing a state in which the shield can of FIG. 3 is removed;
5 is an enlarged view of a portion B of FIG. 2 according to the first embodiment of the present invention, and
6 is an enlarged view of a portion B of FIG. 2 according to the second embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is an AA sectional view of FIG. 1, FIG. 3 is a side view of a camera module according to an embodiment of the present invention, and FIG. 4 is a shield of FIG. 3 A side view showing a state in which the can is removed, FIG. 5 is an enlarged view of a portion B of FIG. 2 according to the first embodiment of the present invention, and FIG. 6 is a view of FIG. 2 according to the second embodiment of the present invention This is an enlarged view of a portion B.

As shown in FIG. 2, which shows a schematic plan view of FIG. 1 and a schematic side view of AA cross-section of FIG. 1, the camera module according to the present invention includes a first printed circuit board 10, a housing unit 20 , A holder module 30, a second printed circuit board 40, a third printed circuit board 50, a wire spring 60 and a buffer part 100.

The first printed circuit board 10 is mounted on the image sensor 11 approximately in the vicinity of the center, and is preferably provided as a PCB substrate. Components for the operation of the image sensor 11 may be disposed on the first printed circuit board 10, or a plurality of terminal units capable of outputting power and outputting the information of the image sensor 11 may be provided. .

The housing unit 20 is disposed above the first printed circuit board 10 and forms a skeleton of a camera module. According to one preferred embodiment of the present invention, the housing unit 20, the first housing 21, the second housing 22, the first and second permanent magnets 23, 24 and yoke 25 It includes.

The first housing 21 is a base and is disposed on an upper side of the first printed circuit board 10 and is provided to be spaced apart from the image sensor 11 by a predetermined distance. If necessary, a filter member capable of filtering the image image incident on the image sensor 11 may be further installed in the first housing 21.

The second housing 22 is disposed above the first housing 21 and is configured to cover the first housing 21. In the vicinity of the center of the second housing 22, an opening is formed at a corresponding position so that an image can be transferred to the image sensor 11 side. On the upper side of the second housing 22, a third printed circuit board 50, which will be described later, is adhesively fixed by a fixing member such as a double-sided tape or an adhesive, but is not limited thereto. It is also possible to provide a separate third housing, such as a case or a shield can, for the third printed circuit board 50 to fix the third printed circuit board 50 with the above-described fixing member on its inner surface. If a third housing is provided, the third printed circuit board 50 may be pressed and supported by the third housing without a separate fixing member.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 to invest magnetic force into the holder module 30. The first and second permanent magnets 23 and 24 are preferably provided with the same size. In addition, the first and second permanent magnets 23, 24 and the yoke 25 may be disposed on the inner surfaces of the first and second housings if possible within the design allowable range.

On the other hand, when the sizes of the first and second permanent magnets 23 and 24 are increased, OIS driving is increased even at a small current, and if the first and second permanent magnets 23 and 24 are constant in size, In the case, as the current flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 increases, the OIS driving increases. In conclusion, the larger the size of the first and second permanent magnets 23 and 24, the better the OIS driving, but it is desirable to design the optimum size within other design allowances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24. In addition, the yoke 25 is provided in a shape protruding near the center so that the magnetic force of the first and second permanent magnets 23 and 24 can be injected into the inner space of the holder module 30. Preferably, the width is provided in the same manner as the first and second permanent magnets 23 and 24, and the center is projected to a certain size so that the permanent magnets and the yokes are formed to have an approximately "T" shape. desirable.

The holder module 30 is disposed at a predetermined distance from the inner bottom surface of the housing unit 20, and is composed of an outer blade 31 and a bobbin 32. The holder module 30 is capable of pendulum movement in the front / rear / left / right and diagonal directions while hanging from the wire spring 60.

The upper and lower sides of the outer blade 31 are provided with spring members 35 and 36, and are elastically supported by the spring member 35, and are connected to enable vertical movement of the bobbin 32.

As illustrated in FIG. 1, the outer blade 31 has a total of four first coils 31a to 31d wound on the outer circumferential surface of the four sides, and the central portion of the four sides where the coils 31a to 31d are wound. It is drilled without a coil. The yoke 25 is disposed at a position corresponding to the perforated space, and the yoke 25 may be partially inserted inside the space.

A second printed circuit board 40 may be fixed to the bottom surface of the outer blade 31 by a fixing member 33 such as double-sided tape or adhesive. The outer blade 31, as shown in the arrow of Figure 2 according to the interaction of the magnetic force of the first and second permanent magnets 22 and 23 and the first coil 31a, diagonally back and forth or diagonally Hanging by a plurality of wire springs 60 so as to be movable, it is arranged spaced a predetermined distance from the bottom surface of the first housing (21).

In addition, a plurality of spring through holes 37 may be provided in the outer blade 31 so that the wire spring 60 penetrates and is connected to the second printed circuit board 40.

In the bobbin 32, the outer blade 31 is disposed to be movable up and down inside, and at least one lens 34 is installed therein. On the outer circumferential surface of the bobbin 32, a second coil 32a is wound, and the second coils 32a have first coils 31a to 31d of the outer blade 31 through the yoke 25. The bobbin 32 is raised and lowered by interaction with the magnetic force invested through the empty space. The larger the yoke 25 size, the better the AF driving, but this may also vary depending on the optimum design value. It is possible to automatically adjust the focus of the image transmitted to the image sensor 11 by the lifting action of the bobbin 32.

The second printed circuit board 40 is disposed on the bottom surface of the outer blade 31 as described above, so that the wire spring 60 is provided to supply power to the first and second coils 31a and 32a. Connected. The connection method may be any method as long as it can be connected by soldering or other conductive materials. That is, the connecting portion (w ') of the second printed circuit board 40 is connected to the first and second coils (31a) (32a), respectively, as shown in Figure 2, the wire spring (60) ) To transmit the power supplied through the first and second coils 31a and 32a to form electromagnetic force.

At this time, in the case of the second coil 32a, it may be directly connected to the second printed circuit board 40, as shown in FIG. 2, first connected to the lower spring 36, and then the lower spring 36 ) May be connected to the second printed circuit board 40.

The third printed circuit board 50 is fixed to the upper side of the second housing 22 by a fixing member such as a double-sided tape or an adhesive member, the third connected to the first printed circuit board 10 The power transmitted through the terminal portion 52 of the printed circuit board 50 is transmitted to the second printed circuit board 40 through a wire spring 60 connected with the second printed circuit board 40. The connection method may be any method as long as it can be connected by soldering or other conductive materials.

The third printed circuit board 50 is provided to cover one side of the first and second housings 21 and 22, as shown in FIGS. 3 and 4, wherein the first and second The windows 55 are formed on the surfaces facing the second permanent magnets 23, 24 and the yoke 25, so that interference with them can be avoided.

This is because the first and second permanent magnets 23, 24 and the yoke 25 are generally attached directly to a shield can 70, which will be described later, with a fixing means such as epoxy, to avoid this.

On the other hand, the second printed circuit board 40 and the third printed circuit board 50 may be a flexible printed circuit board (FPCB), a printed circuit board (PCB) or an R-FPCB (Rigid FPCB integrated type), but this It is not limited, and any substrate can be electrically connected.

Both ends of the wire spring 60 are connected to the second and third printed circuit boards 40 and 50. At this time, one end of the wire spring 60 is connected to a pad 51 formed on the third printed circuit board 50, as shown in FIG. 5, the wire spring in the center of the pad 51 A through hole 53 through which the 60 is penetrated is formed. The connection method may be any method as long as it can be connected by soldering or other conductive materials. Meanwhile, a solder register (SR) is provided around the pad 51 to protect the surface of the third printed circuit board 50, and the pad 51 area can be connected to be energized by opening a solder resistor. have.

In this way, the wire spring 60 connected from the pad 51 supplies power supplied through the terminal 52 to the second printed circuit board 40 side, so that the first and second coils 31a ( 32a) enables interaction with the first and second permanent magnets 23 and 24.

In addition, the other end of the wire spring 60, as shown in Figure 2, passes through a spring through hole 37 formed in the outer blade 31, a second installed on the bottom surface of the outer blade 31 It is connected to the printed circuit board 40. At this time, the other end of the wire spring 60, although not shown, is connected to a pad (not shown) formed on the second printed circuit board 40 like the third printed circuit board 50, the pad In the center (not shown), a through hole (not shown) through which the wire spring 60 passes is formed. The connection method may be any method as long as it can be connected by soldering or other conductive materials. According to such a configuration, the outer blade 31 is suspended from the wire spring 60 and may be spaced apart from the bottom surface of the first housing 21 by a predetermined distance or more. Then, according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24, the outer blade 31 performs a pendulum motion, thereby causing the outer blade to be shaken by hand shaking. It is possible to correct the vibration of 31 by the interaction between the first coil 31a and the first and second permanent magnets 23 and 24. To this end, the wire spring 60 is preferably made of a metal material that has elasticity and can conduct electricity to withstand the impact.

On the other hand, the thinner the wire spring 60 is, the better the image stabilization movement is at a small current, but this may vary depending on the optimum design value. Preferably, the wire spring 60 has a thickness of several μm to hundreds of μm, preferably 1 to 100 μm.

In addition, it is preferable that the wire spring 60 is provided with at least six, at least two polarities for auto focusing control and four polarity power supplies for image stabilization movement image stabilization in the second and third printed circuits. It is necessary to supply the holder module 30 through connection with the substrates 40 and 50.

According to a preferred embodiment of the present invention, as shown in Figures 1 and 2, the same length, the two arranged on each corner portion of the holder module 30, a total of eight is good to balance the balance is provided .

On the other hand, as shown in Figure 2, when further comprising a separate third housing, such as the shield can 70, as described above, the third printed circuit board 50 is the first and second permanent Since the magnets 23, 24 and the yoke 25 are fixedly coupled to the shield can 70 by epoxy or the like, in order to avoid this coupling portion, a window 55 is formed to form the first and second housings. (21) The side wall of 22 is covered.

If, when the shield can 70 is removed, the third printed circuit board 50 is formed of a PCB or the like, and the first and second permanent magnets 23, 24 and yokes ( 25) can be attached and fixed, and the third printed circuit board 50 is composed of a PCB as described above, but a window 55 as described above is provided to provide the window 55 with the agent. The first and second permanent magnets 23, 24 and the yoke 25 may be inserted and additionally reinforced with shielding tape or the like.

It is preferable that the buffer part 100 is integrally formed in a part of the wire spring 60. The buffer part 100 may be formed by bending the wire spring 60 in a zigzag manner, as shown in FIG. 5, or may be formed by bending in a coil spring shape as illustrated in FIG. 6. Do.

At this time, the buffer part 100 may design the shape of the second housing 22 at a position that does not interfere with the second housing 22 of the wire spring 60.

The buffer part 100 has an upper and lower narrow structure, and as shown in FIGS. 5 and 6, it is preferable to be provided in a conical funnel shape that narrows toward the lower side. The support hole 122 is formed through the coaxial with the through hole 53, it is preferable that the diameter of the through hole 53 is provided or larger.

It is preferable that the diameter of the through hole 53 is slightly larger than the diameter of the wire spring 60, and when the wire spring 60 is connected to the pad 51 formed on the third printed circuit board 50, soldering or Other conductive materials such as conductive material may be designed to flow through the through hole 53 to be fixed by being connected to the wire spring 60 on both sides of the upper and lower surfaces of the third printed circuit board 50.

The diameter of the support hole 122 is preferably formed slightly larger than the diameter of the wire spring 60, and may be formed equal to or larger than the diameter of the through hole 53. That is, the wire spring 60 may be designed to prevent interference from contacting the second holder 22 near the support hole 122.

 The shock absorber 100 configured as described above serves to absorb the load applied to the wire spring 60, thereby reducing the load applied to the pad 51 provided on the third printed circuit board 50, It is possible to reduce the load directly applied to the connecting portion (w) holding the wire spring (60).

On the other hand, the general assembly sequence, after combining the bobbin 32 and the outer blade 31, using a jig, the second housing 22, the second and third printed circuit boards 40, 50 and the wire spring ( 60), and after combining the bobbin 32 provided with the lens barrel, the first housing 21 is connected to mount it on the first printed circuit board 10. Before connecting the first housing 21, a permanent magnet and yoke coupling may be made first. This assembly sequence may be changed as necessary. That is, it may be possible right from the machine without a jig. In this process, even if the force of inserting and engaging the bobbin 32 provided with the lens barrel acts too largely to force the connecting portion w, the buffer portion 100 can absorb this excessive force.

That is, the buffer part 100 is as shown in Figures 2, 5 and 6, the wire spring 60 and the wire spring 60 in the vicinity of the connecting portion (w) of the third printed circuit board 50 ) Generates a load, and when it is pulled in the direction of gravity or shakes from side to side, it absorbs the load generated as the deformation energy of the buffer part 100.

Therefore, during the assembly process, it is possible to perform the connection operation again due to the damage of the connecting portion w, or to avoid the hassle that parts cannot be used, and it is possible to produce a more reliable camera module.

On the other hand, according to a preferred embodiment of the present invention, the third printed circuit board 50 and the wire spring 60 has a through hole at a position corresponding to the lens module 30 around the connecting portion (w), the housing It may further include a shield can 70 that is installed to surround the units 21 and 22. In this case, as described above, the third printed circuit board 50 may be fixedly attached to the inner circumferential surface of the shield can 70. Meanwhile, the shield can 70 is not necessarily required, and may be omitted depending on the configuration of the housing units 21 and 22.

Meanwhile, as illustrated in FIG. 2, hook units 80 may be provided on four or at least one surface to fix the shield can 70 to the first housing 21. The position may be within a range permitted by the center or edge design, and the number may be provided in one or more.

The hook unit 80 may be composed of a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81, However, if necessary, it may be configured to the opposite.

The embodiments of the present invention described above and illustrated in the drawings should not be construed as limiting the technical spirit of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and a person having ordinary knowledge in the technical field of the present invention can improve and modify the technical spirit of the present invention in various forms. Therefore, such improvements and modifications will fall within the protection scope of the present invention as long as it is apparent to those skilled in the art.

10; A first printed circuit board 20; Housing unit
21; First housing 22; 2nd housing
23; First permanent magnet 24; 2nd permanent magnet
25; York 30; Holder module
31; Outer blade 31a; 1st coil
32; Bobbin 32a; 2nd coil
40; A second printed circuit board 50; 3rd printed circuit board
51; Pad 52; Terminals
53; Through 60; Wire spring
70; Shield can 100; Buffer
W; Connection 122; Support hole

Claims (20)

Base;
A holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the bobbin and the outer blade;
A second coil disposed on the bobbin;
A permanent magnet that moves the bobbin through interaction with the second coil;
A first coil that moves the holder module through interaction with the permanent magnet;
A third printed circuit board at least partially disposed on the base;
A wire connecting the third printed circuit board and the holder module;
A solder portion connecting the wire to any one or more of the third printed circuit board and the holder module; And
A bent part, a bent part, and a buffer part connected to the wire including any one or more parts of a round-shaped part,
The buffer part is energized with the second coil and connected with the solder part,
The third printed circuit board includes a first portion disposed on the holder module and a second portion extending downward from the first portion,
The first portion of the third printed circuit board includes a pad having a hole,
The wire passes through the hole of the pad,
The pad of the third printed circuit board is a camera shake prevention device disposed on the opposite side of the third printed circuit board is disposed on the opposite side of the surface of the third printed circuit board facing the outer blade. According to claim 1,
The third printed circuit board includes a terminal,
The terminal of the third printed circuit board includes two terminals for focusing and four terminals for image stabilization,
The wire includes a plurality of wires,
The two terminals for focusing are electrically connected to the second coil through two wires of the plurality of wires,
In the current applied to the second coil, current applied from two terminals for the focusing is applied through the buffer,
The holder module includes a first corner portion and a second corner portion disposed opposite the first corner portion based on the optical axis,
Two of the plurality of wires are disposed in the first corner portion, and the other two wires among the plurality of wires are disposed in the second corner portion. According to claim 2,
The terminal of the third printed circuit board is an image stabilization device disposed on the lower end of the second portion of the third printed circuit board. delete According to claim 3,
The solder portion is provided with a first solder portion disposed at one end of the wire to supply external power to the second coil through the third printed circuit board, and a second solder disposed at the other end of the wire to be coupled to the holder module. An anti-shake device including wealth. According to claim 1,
An opening is formed in the center of the base,
The spring member includes an upper spring member coupled with an upper portion of the outer blade, and a lower spring member coupled with a lower portion of the outer blade,
The first coil includes four coils, and the permanent magnet includes four permanent magnets,
The wire is electrically connected to the second coil through the spring member,
The wire is formed of a metal material and an anti-shake device having a thickness of 1 to 100㎛. According to claim 1,
The buffer part is connected to the wire in the long axis direction of the wire,
The shock-absorbing unit is integrally formed with the wire. According to claim 1,
The shock-absorbing unit is disposed closer to the outer blade than the base. According to claim 1,
An anti-shake device further comprising a filter member coupled to the base. The method of claim 5,
The base includes a hook formed to protrude from the base,
The holder module includes a second printed circuit board,
The second solder portion combines the wire with the second printed circuit board,
The wire shake prevention device is electrically connected to the spring member through the second printed circuit board. The method of claim 5,
For each of the plurality of wires, the first solder portion is disposed at one end of the wire to supply external power to the second coil through the third printed circuit board, and the second solder portion is coupled to the holder module so that the wire Anti-shake device disposed on the other end of the. According to claim 3,
At least a portion of the second portion of the third printed circuit board is a camera shake prevention device extending along the outer surface of the base. The method of claim 5,
The first portion of the third printed circuit board is disposed between the first solder portion and the second solder portion,
The image stabilization device is electrically connected to the wire and the spring member through the second solder portion. The method of claim 5,
The plurality of wires includes six wires,
A solder resistor is disposed around the pad,
An image stabilization device in which the wire is soldered in the region of the pad where the solder resistor is opened, and the first solder portion is disposed on the pad. According to claim 1,
The shock absorber is an anti-shake device that movably supports the holder module when an impact is applied to the anti-shake device. According to claim 1,
The shock-absorbing unit is formed to increase or decrease the distance between both ends to absorb the load acting on the anti-shake device. According to claim 1,
The shock absorber is an image stabilization device in which a shape is changed so that the holder module is movable when an impact is applied to the image stabilization device. A first printed circuit board;
An image sensor disposed on the first printed circuit board;
An anti-shake device according to claim 1 disposed on the first printed circuit board; And
A camera module including a lens coupled to the bobbin of the image stabilization device. A mobile phone comprising the camera module of claim 18. delete

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