KR20130138975A - Camera module - Google Patents

Abstract

A camera module according to the present invention comprises a first printed circuit board in which an image sensor is mounted; a housing unit which is arranged in the upper side of the first printed circuit board; a holder module which is arranged to be spaced from the internal bottom surface of the housing unit in a certain distance and comprises a first coil that winds the peripheral surface thereof and at least one lens formed therein; a plate member which is combined with the bottom surface of the holder module; a second printed circuit substrate which is installed in the upper side of the holder module; a plurality of wire springs in which one end thereof is connected to the plate member, and the other end thereof is connected to the second printed circuit board; and a buffer which is arranged in the connection part of the wire spring and the plate member.

Description

Camera module {Camera Module}

The present invention relates to a camera module.

In the case of a camera module mounted in a small electronic product, the camera module may be frequently shocked during use, and the camera module may be minutely shaken due to the shaking of the user during shooting. In view of such a point, the camera module which has the shake prevention means in recent years is disclosed. For example, in Korean Patent Registration No. 10-0741823 (registered on July 16, 2007), a gyro sensor IC or an angular velocity sensor is installed inside a device in which a camera module such as a mobile phone is mounted to correct a hand shake phenomenon. How to do is introduced.

However, if a separate angular velocity detection sensor is provided in this way, a separate detection sensor must be provided to implement a hand shake prevention function, causing an increase in manufacturing cost, and for configuring and installing a hand shake prevention device separately from a camera module. There is a hassle to make room.

Korean Patent No. 10-0741823 (July 16, 2007)

An object of the present invention is to provide a camera module having an OIS (Optical Image Stabilizer) function.

Another object of the present invention is to provide a camera module having an improved buffer structure of a wire and a soldering part so that impact resistance can be improved.

A camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; A housing unit disposed on the first printed circuit board; A holder module disposed at a distance from the bottom surface of the housing unit, the holder module including a first coil wound around an outer circumferential surface thereof and including at least one lens therein; A plate member coupled to a bottom surface of the holder module; A second printed circuit board mounted on the holder module; A plurality of wire springs having one end connected to the plate member and the other end connected to the second printed circuit board; And a buffer part provided at a connection part of the wire spring and the plate member.

The buffer unit may be formed to reciprocate around the connection unit.

The buffer part may be formed by a slit formed through the plate member so that the wire spring penetrates around a spring through hole which is connected to the plate member through a connecting material. Portions other than the buffer part may be formed by penetrating in an arc shape.

In addition, it may further include a buffer hole which is formed through the space portion between the spring through hole and the buffer portion.

In addition, the connection material may be made of a conductive material such as lead.

The housing unit may include a first housing disposed above the first printed circuit board; A second housing disposed above the first housing and having the second printed circuit board mounted on an upper side thereof; First and second permanent magnets interposed between the first and second housings; And a yoke disposed between the first and second permanent magnets or positioned on inner surfaces of the first and second housings to transfer a magnetic force into the holder module.

The yoke may have a central portion protruding from the holder module.

The second housing and the second printed circuit board may be fixed with a double-sided tape.

And a shield can having a through hole at a position corresponding to the connection portion of the second printed circuit board and the wire spring and the lens module, and to surround the housing unit.

The holder module may include an outer blade having a first coil wound around an outer circumferential surface thereof; A bobbin elastically supported by an elastic member on the upper side of the outer blade, arranged to be movable up and down inside the outer blade, and having a second coil wound around its outer circumferential surface, and having at least one lens installed therein; And upper and lower elastic members disposed at upper and lower sides of the bobbin, respectively, to elastically support the bobbin with respect to the outer blade, wherein the center of the first coil has magnetic force invested in the second coil side. The space portion can be formed so that.

The wire spring may be made of a metal material and may be electrically connected to the plate member and the second printed circuit board.

At least six wire springs are provided to supply two polarities for auto focusing control and four polarity powers for driving OIS to the holder module through connection with the plate member and the second printed circuit board. desirable.

The wire springs may have the same length and are arranged in two corner portions of the holder module, and a total of eight wire springs may be provided.

According to the camera module according to the present invention, since the buffer member is provided in the plate member installed below the outer blade, even if a repeated load occurs, it is possible to minimize the breakage of the wire soldering connection due to the impact of the camera module.

In addition, even if soldering is performed more than the standard by mistake during the assembly process, excess solder may be soaked in the buffer hole formed near the soldering portion of the wire, thereby preventing camera module defects.

1 is a schematic plan view of a camera module according to an embodiment of the present invention,
FIG. 2 is a cross-sectional view taken along line AA of FIG. 1,
3 and 4 are side views of a camera module according to an embodiment of the present invention;
5 and 6 are a plan view showing a pattern of the buffer portion of the plate member according to the first embodiment of the present invention, and
7 and 8 are plan views showing the pattern of the buffer portion of the plate member according to the second embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line AA of FIG. 1, and FIGS. 3 and 4 are side views of a camera module according to an embodiment of the present invention, FIGS. 5 and FIG. 6 is a plan view showing the pattern of the buffer portion of the plate member according to the first embodiment of the present invention, and FIGS. 7 and 8 are plan views showing the pattern of the buffer portion of the plate member according to the second embodiment of the present invention. .

As shown in FIG. 2, which shows a schematic plan view of FIG. 1 and a schematic side view showing an AA cross section of FIG. 1, the camera module according to the present invention includes a first printed circuit board 10 and a housing unit 20. , A holder module 30, a plate member 40, a second printed circuit board 50, a wire spring 60, and a buffer unit 100 provided on the plate member 40.

The first printed circuit board 10 is mounted on the image sensor 11 in the vicinity of the center thereof and is preferably provided as a PCB substrate. The first printed circuit board 10 may be provided with a plurality of terminal portions for arranging components for operating the image sensor 11 or for supplying power and outputting information of the image sensor 11 .

The housing unit 20 is disposed on the first printed circuit board 10 to form a skeleton of the camera module. According to a preferred embodiment of the present invention, the housing unit 20 includes a first housing 21, a second housing 22, first and second permanent magnets 23 and 24, and a yoke 25, .

The first housing 21 is disposed on an upper surface of the first printed circuit board 10 as a base and spaced apart from the image sensor 11 by a predetermined distance. The first housing 21 may further include a filter member for filtering an image incident on the image sensor 11 if necessary.

The second housing 22 is disposed on the upper side of the first housing 21 to cover the first housing 21. An opening is formed in the vicinity of the center of the second housing 22 at a position corresponding to the image sensor 11. The second printed circuit board 50 to be described later is adhered and fixed to the upper surface of the second housing 22 by a fixing member such as a double-sided tape or an adhesive. However, the second printed circuit board 50 is not limited thereto, It is also possible to provide the second printed circuit board 50 with a separate third housing such as a case or shield can and fix the second printed circuit board 50 on the inner side with the fixing member. If the third housing is provided, the second printed circuit board 50 may be pressed and supported by the third housing without a separate fixing member.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 so that a magnetic force is applied to the holder module 30. The first and second permanent magnets 23 and 24 may have the same size. Also, the first and second permanent magnets 23 and 24 and the yoke 25 may be disposed on the inner side surfaces of the first and second housings, if possible, within the design tolerance range.

On the other hand, when the sizes of the first and second permanent magnets 23 and 24 become larger, the OIS driving becomes larger even with a small current, and if the first and second permanent magnets 23 and 24 have a constant size, In this case, the OIS driving becomes larger as the current flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 increases. In conclusion, the larger the size of the first and second permanent magnets 23 and 24 is, the better OIS driving is, but it is desirable to design the optimum size within other design allowances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24. The yoke 25 is provided in a shape protruding near the center so that the magnetic force of the first and second permanent magnets 23 and 24 can be invested into the inner space of the holder module 30. Preferably, the width is provided in the same manner as the first and second permanent magnets 23 and 24, and the center is protruded by a predetermined size so that the permanent magnet and the yoke are formed to have a substantially "T" desirable.

The holder module 30 is spaced apart from the inner bottom surface of the housing unit 20 by a predetermined distance. The holder module 30 includes an outer blade 31 and a bobbin 32. The holder module 30 can perform pendulum movement in the forward / backward / left / right and diagonal directions while being suspended from the wire spring 60.

Spring members 35 and 36 are provided on the upper side and the lower side of the outer blade 31 and are elastically supported by the spring member 35 so as to be able to move upward and downward in the bobbin 32.

As shown in FIG. 1, the outer blade 31 has a total of four first coils 31a to 31d wound on the outer circumferential surface of four sides, and the four side central portions around which the coils 31a to 31d are wound There is no coil. The yoke 25 may be disposed at a position corresponding to the opened space and the yoke 25 may be partially inserted into the space.

The plate member 40 may be fixed to the bottom surface of the outer blade 31 with a fixing member 33 such as double-sided tape or adhesive. The outer blade 31 is rotated in the front, rear, left, and right directions as shown by arrows in FIG. 2 in accordance with the interaction between the magnetic forces of the first and second permanent magnets 22 and 23 and the first coils 31a to 31d. And is spaced apart from the bottom surface of the first housing 21 by a predetermined distance.

A plurality of spring through holes 37 may be formed in the outer blade 31 so that the wire spring 60 penetrates the outer blade 31 and is connected to the plate member 40.

The bobbin (32) is arranged such that the outer blade (31) is vertically movable inside and at least one lens (34) is installed therein. A second coil 32a is wound on the outer circumferential surface of the bobbin 32. The second coil 32a is connected to the first coils 31a to 31d of the outer blade 31 through the yoke 25, And moves up and down the bobbin 32 by interaction with the magnetic force that is invested through the open space. The larger the size of the yoke 25, the better the AF drive, but this also depends on the optimum design value. The focus of the image transmitted to the image sensor 11 can be automatically adjusted by the bobbin 32 moving up and down.

The plate member 40 is preferably made of a metal material that can be energized and is disposed on the bottom surface of the outer blade 31 as described above so as to supply power to the first and second coils 31a and 32a The wire spring 60 is connected. The connection can be done in any way as long as it can be connected by soldering or other conductive material. That is, the connection portion w 'of the plate member 40 is connected to the first and second coils 31a and 32a, respectively, as shown in FIG. 2, And transmits the supplied power to the first and second coils 31a and 32a so as to form an electromagnetic force.

In this case, the second coil 32a may be directly connected to the plate member 40. As shown in FIG. 2, after the lower spring 36 is connected to the lower spring 36, It is also possible to connect with the plate member 40.

The second printed circuit board 50 is fixed to the upper side of the second housing 22 by a fixing member such as a double-sided tape and an adhesive member, as described above, and the second printed circuit board 50 is connected to the first printed circuit board 10. Power transmitted through the terminal portion 52 of the printed circuit board 50 is transmitted to the plate member 40 through the wire spring 60. The connection can be done in any way as long as it can be connected by soldering or other conductive material.

As shown in FIGS. 3 and 4, the second printed circuit board 50 is provided to cover one side wall of the first and second housings 21 and 22, A window 55 may be formed on the surface facing the second permanent magnets 23 and 24 and the yoke 25 so that interference with them can be avoided.

This is because the first and second permanent magnets 23 and 24 and the yoke 25 are directly attached to the shield can 70 to be described later by fixing means such as epoxy.

The second printed circuit board 50 may be a flexible printed circuit board (FPCB), a printed circuit board (PCB), or an R-FPCB (rigid FPCB integrated type), but is not limited thereto and may be electrically connected Any substrate can be used. In the case of the present invention, the plate member 40 may be formed of a thin metal plate for the formation of the shock absorbing portion 100 for shock absorption at the connection (w ') that the wire spring 60 is soldered to the external impact. .

Both ends of the wire spring 60 are connected to the plate member 40 and the second printed circuit board 50. At this time, one end of the wire spring 60 is connected to the second printed circuit board 50 as shown in FIG. 2, and the wire spring 60 connected to the second printed circuit board 50 The first and second coils 31a and 32a are connected to the first and second permanent magnets 23 and 24 and the second and third coils 31a and 32b, .

2, the other end of the wire spring 60 passes through a spring through hole 37 formed in the outer blade 31, and is inserted into a plate member (not shown) provided on the bottom surface of the outer blade 31, (40). In this case, the other end of the wire spring 60 is connected to a pad (not shown) formed on the plate member 40 like the second printed circuit board 50, although not shown. At the center of the spring is formed a spring through-hole 41 through which the wire spring 60 passes. The connection can be done in any way as long as it can be connected by soldering or other conductive material. According to this configuration, the outer blade 31 may be suspended from the wire spring 60, and may be spaced apart from the bottom surface of the first housing 21 by a certain distance. The outer blade 31 performs the pendulum motion according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24 so that the outer blade 31 can be corrected by the interaction of the first coil 31a and the first and second permanent magnets 23, 24. For this purpose, it is preferable that the wire spring 60 is made of a metal material which is elastic and able to withstand an impact, and is made conductive.

On the other hand, the thinner the thickness of the wire spring 60, the better the mobility for correcting the shaking motion even with a small current, which may vary depending on the optimum design value. Preferably, the thickness of the wire spring 60 is several 탆 to several hundred 탆, preferably 1 to 100 탆.

In addition, it is preferable that at least six wire springs 60 are provided. At least two polarity powers for auto focusing control and four polarity power supplies for image stabilization motion movement are applied to the second printed circuit board 50. It is necessary to supply to the holder module 30 through the connection between the) and the plate member 40.

According to a preferred embodiment of the present invention, as shown in FIG. 1 and FIG. 2, it is preferable that a total of 8 pieces are provided at the corner portions of the holder module 30 with the same length, .

2, the second printed circuit board 50 may include a third housing such as the shield can 70, as described above, The magnets 23 and 24 and the yoke 25 are fixedly coupled to the shield can 70 by epoxy or the like so that a window 55 is formed in order to avoid this coupling portion, (21) (22).

If the shield can 70 is removed, the second printed circuit board 50 is formed of PCB or the like, and the first and second permanent magnets 23 and 24 and the yoke The second printed circuit board 50 may be formed of a PCB and the window 55 may be provided as described above so that the window 55 may be provided with the second printed circuit board 50, 1 and the second permanent magnets 23 and 24 and the yoke 25 may be inserted into the yoke 25 and the yoke 25 may be further reinforced by a shielding tape or the like.

The shock absorbing part 100 is formed at a connection part w 'through which electrical connection is made by soldering or Ag bonding of the wire spring 60 and the plate member 40, and the impact and repetitive loads applied to the wire spring 60 are applied. To be absorbed.

As shown in FIG. 5, the buffer part 100 is formed near the edge of the plate member 40, and the slit 42 formed around the spring through hole 41 through which the wire spring 60 passes. The plate member 40 may be formed to be connected to the plate member 40, and may be configured to reciprocate in a direction parallel to the acceleration direction of the spring through-hole 41 around the buffer part 100.

At this time, according to the first embodiment of the present invention, the shape of the slit 42 may be configured to have a circular ring shape except for the buffer portion 100, as shown in FIG. . In this case, as illustrated in FIG. 6, the buffer hole 200 may be additionally formed at a position close to the spring through hole 41. When the buffer hole 200 conducts a conductive connection such as soldering to the wire spring 60 penetrated through the spring through hole 41, when the solder flows over the standard, overflow of lead leads to the buffer part. It is provided so as not to flow into the (100) side. That is, if too much lead is accidentally input by a worker, lead may flow to the buffer part 100 side. At this time, if a buffer hole 200 formed through the path is provided, the overflowed lead may be buffered again. Since it is introduced into the hole 200, it is no longer flowed to the buffer portion 100 side. Therefore, since the shock absorbing part 100 can maintain the flexible property of the plate member 40 as it is, even if an impact occurs in the wire spring 60, the shock is equal to the reciprocating movement of the connection part w '. It can be absorbed through morphology.

Meanwhile, according to the second preferred embodiment of the present invention, as shown in FIG. 7, the shape of the buffer part 100 may be configured to be symmetric about the spring through-hole 41. In this case, as shown in FIG. 8, a buffer hole 200 may be formed around the spring through hole 41. The function of the buffer hole 200 is the same.

In addition, the shape of the buffer hole 200 may be configured as an arc (arc), as shown in Figure 6, may be configured as a circular as shown in Figure 8, but is not limited to this, solder Any shape can be used as long as the conductive connecting member can flow in.

However, the buffer hole 200 needs to be formed between the buffer part 100 and the spring through hole 41, and when the buffer hole 200 is formed too large, the buffer hole 200 lowers the strength around the buffer part 100. It is preferable to configure smaller than the area of the spring through-hole (41). According to such a structure, it can prevent that the connection part w 'of the said plate member 40 is damaged by an external shock.

On the other hand, the general assembly sequence after combining the bobbin 32 and the outer blade 31, using a jig, the second housing 22, the plate member 40 and the second printed circuit board 50 and the wire spring ( 60, the bobbin 32 provided with the lens barrel is coupled, and then the first housing 21 is connected and mounted on the first printed circuit board 10. Before connecting the first housing 21, the permanent magnet and the yoke coupling may be made first. This assembly order may be changed as necessary. That is, it may be possible directly in the equipment without jig. In this process, even if the force for inserting and coupling the bobbin 32 provided with the lens barrel acts too largely to impart the connection portion (w '), the buffer portion 100 can absorb this excessive force. That is, when the shock absorbing part 100 is pulled in the direction of gravity due to the load generated in the wire spring 60 near the connection portion (w ') of the wire spring 60 and the plate member 40, or shaken from side to side The generated load absorbs the generated load as strain energy due to the reciprocating movement around the buffer part 100.

Therefore, the connection work may be performed again due to the breakage of the connection part (w ') during the assembling process, or it may be prevented that the parts may not be used, and a more reliable camera module may be produced.

On the other hand, according to a preferred embodiment of the present invention, having a through hole at a position corresponding to the holder module 30 around the connection portion (w) of the second printed circuit board 50 and the wire spring 60, the housing It may further include a shield can 70 is installed to surround the unit (21) (22). In this case, as described above, the second printed circuit board 50 may be fixedly attached to the inner circumferential surface of the shield can 70. Meanwhile, the shield can 70 is not necessarily required, and may be omitted depending on the configuration of the housing units 21 and 22.

2, the hook unit 80 may be provided on four sides or at least one side of the shield can 70 in order to fix the shield can 70 to the first housing 21. As shown in FIG. The position may be within a range allowed by the center or edge design, and the number may be one or more.

The hook unit 80 may include a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81 , And may be configured as the opposite if necessary.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

10; A first printed circuit board 20; The housing unit
21; A first housing 22; The second housing
23; A first permanent magnet 24; The second permanent magnet
25; Yoke 30; Holder module
31; An outer blade 31a; The first coil
32; Bobbin 32a; The second coil
40; Plate member 50; The second printed circuit board
52; Terminal 60; Wire spring
70; Shield can 80; Hook unit
100; Buffer 200; Buffer hole

Claims (14)

A first printed circuit board on which an image sensor is mounted;
A housing unit disposed on the first printed circuit board;
A holder module disposed at a distance from the bottom surface of the housing unit, the holder module including a first coil wound around an outer circumferential surface thereof and including at least one lens therein;
A plate member coupled to a bottom surface of the holder module;
A second printed circuit board mounted on the holder module;
A plurality of wire springs having one end connected to the plate member and the other end connected to the second printed circuit board; And
And a buffer part provided at a connection part of the wire spring and the plate member.
The method of claim 1, wherein the buffer portion,
Camera module is formed to be reciprocating around the connecting portion.
The method of claim 1, wherein the buffer portion,
The camera module is formed by a slit formed through the plate member and the wire spring is formed around the through-hole through which the wire spring is connected to the plate member.
The method of claim 3, wherein the slit,
A camera module configured to penetrate a portion of the plate member except for the buffer part in an arc shape.
The method of claim 3, wherein
And a buffer hole formed through the space portion between the spring through hole and the buffer part.
The method of claim 3, wherein
The connecting material is a camera module which is a conductive material such as lead.
The connector according to claim 1, wherein the housing unit comprises:
A first housing disposed above the first printed circuit board;
A second housing disposed above the first housing and having the second printed circuit board mounted on an upper side thereof;
First and second permanent magnets interposed between the first and second housings;
And a yoke disposed between the first and second permanent magnets or positioned on a side surface of the first and second housings to transmit magnetic force into the holder module.
8. The motor according to claim 7,
And a central portion facing the holder module is protruded.
The method of claim 7, wherein
Wherein the second housing and the second printed circuit board are fixed to each other with a double-sided tape.
The method of claim 7, wherein
And a shield can having a through hole at a position corresponding to a connection portion of the second printed circuit board and the wire spring and the lens module, and to surround the housing unit.
The optical module according to claim 1,
An outer blade having a first coil wound around an outer circumferential surface thereof;
A bobbin elastically supported by an elastic member on the upper side of the outer blade, arranged to be movable up and down inside the outer blade, and having a second coil wound around its outer circumferential surface, and having at least one lens installed therein; And
And upper and lower elastic members disposed on upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade,
Wherein a center portion of the first coil is formed with a space portion so that a magnetic force can be invested in the second coil.
The wire springs according to claim 1,
The camera module is made of a metal material and is electrically connected to the plate member and the second printed circuit board.
The wire springs according to claim 1,
At least six or more camera modules are provided to supply two polarities for auto focusing control and four polarities for driving OIS to the holder module through connection with the plate member and the second printed circuit board.
The wire springs according to claim 12,
Two camera module modules are provided in the corner module of the holder module with the same length.

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