KR20220035353A - Camera Module - Google Patents

Abstract

A camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; a housing unit disposed above the first printed circuit board; a holder module disposed at a predetermined distance from the inner bottom of the housing unit, a first coil wound on an outer circumferential surface, and at least one lens installed therein; a second printed circuit board coupled to the bottom of the holder module; a third printed circuit board installed on the upper side of the holder module; a plurality of wire springs, one end of which is connected to the second printed circuit board and the other end of which are connected to the third printed circuit board; and a buffer unit provided at a connection portion between the wire spring and the third printed circuit board and surrounding the connection portion between the wire spring and the third printed circuit board.

Description

Camera Module {Camera Module}

The present invention relates to a camera module.

In the case of camera modules mounted on small electronic products, the camera module may frequently receive impacts during use, and the camera module may be slightly shaken due to the user's hand shaking during filming. Taking this into consideration, recently, a camera module having a means for preventing hand shake has been disclosed.

For example, in Korean Patent No. 10-0741823 (registered on July 16, 2007), a gyro sensor IC or angular velocity sensor is installed inside a device where a camera module, such as a mobile phone, is mounted to correct hand tremor. A method is introduced.

However, when providing a separate angular velocity detection sensor like this, a separate detection sensor must be provided to implement the hand shake prevention function, which causes an increase in manufacturing cost, and it is necessary to configure and install the hand shake prevention device separately from the camera module. There is the hassle of having to prepare space.

(Patent Document 1) KR10-0741823 B1

The purpose of the present invention is to provide a camera module with an optical image stabilization function.

A camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; a housing unit disposed above the first printed circuit board; a holder module disposed at a predetermined distance from the inner bottom of the housing unit, having a first coil wound on an outer circumferential surface, and including at least one lens therein; a second printed circuit board coupled to the bottom of the holder module; A third printed circuit board installed on the upper side of the holder module; a plurality of wire springs, one end of which is connected to the second printed circuit board and the other end of which are connected to the third printed circuit board; and a buffer unit provided at a connection portion between the wire spring and the third printed circuit board and surrounding the connection portion between the wire spring and the third printed circuit board.

The buffer unit includes at least one injection hole formed through the third printed circuit board around the through hole to which the wire spring is connected; It is preferable to include a second wire spring through hole formed in the housing unit in an upper-lower narrow shape so as to be coaxial with the through-hole of the third printed circuit board, and communicating with the injection hole through the upper opening.

In addition, the camera module according to a preferred embodiment of the present invention may further include an adhesive material injected into the second wire spring through hole through the injection hole.

In addition, the wire spring and the third printed circuit board are connected through the through hole. In this case, it is preferable that both the upper and lower surfaces of the third printed circuit board are connected through the through hole with a connecting material, and the connecting material is a conductive material such as lead. It is desirable to prepare it with a material.

In addition, the buffer unit includes a pair of injection holes formed through the third printed circuit board on both sides of the first wire spring through hole to which the wire spring is soldered; a second wire spring aperture formed through the housing unit in an upper-to-lower narrow shape so as to be coaxial with the first wire spring aperture of the third printed circuit board, and communicating with the injection hole through an upper opening; It is desirable to include.

In addition, the camera unit according to a preferred embodiment of the present invention further includes an adhesive material injected into the second wire spring through hole through the injection hole, wherein the adhesive material is injected into the second wire spring through hole and the second wire spring through hole. It is desirable to cover the entire connection formed on the upper side of the third printed circuit board. At this time, the adhesive material is preferably prepared as epoxy.

The second wire spring through hole includes an upper opening provided in the housing unit in the shape of a funnel with upper and lower ends; and a wire spring support hole provided coaxially with the through hole.

The diameter of the second wire spring through hole may be equal to or larger than the diameter of the through hole.

The housing unit includes: a first housing disposed above the first printed circuit board; a second housing disposed above the first housing and on which the third printed circuit board is installed; first and second permanent magnets disposed between the first and second housings; It is preferable to include a yoke disposed between the first and second permanent magnets or located on an inner surface of the first and second housings to transmit magnetic force into the holder module.

The yoke preferably has a central portion that protrudes toward the holder module.

The second housing and the third printed circuit board are preferably fixed with double-sided tape.

In addition, the camera module according to a preferred embodiment of the present invention includes a shield can having a through hole at a position corresponding to the connection portion of the third printed circuit board and the wire spring and the lens module, and installed to surround the housing unit; It is desirable to further include.

The holder module includes an outer blade on which a first coil is wound on an outer peripheral surface; A bobbin is elastically supported by an elastic member on the upper side of the outer blade and is movable up and down inside the outer blade, a second coil is wound around the outer circumferential surface, and at least one lens is installed inside the bobbin; And upper and lower elastic members disposed on the upper and lower sides of the bobbin, respectively, to elastically support the bobbin with respect to the outer blade; wherein the center of the first coil is capable of investing magnetic force toward the second coil. A space may be formed so that

The wire spring is preferably made of a metal material and is electrically connected to the second and third printed circuit boards.

At least six wire springs are provided to supply power of two polarities for auto-focusing control and four polarities for OIS driving to the holder module through connection to the second and third printed circuit boards. good night.

In addition, the wire springs may be of the same length, two each at the corners of the holder module, for a total of eight wire springs.

A camera module according to a preferred and optimal embodiment of the present invention includes a first printed circuit board on which an image sensor is mounted; a housing unit disposed above the first printed circuit board; a holder module disposed at a predetermined distance from the inner bottom of the housing unit, having a first coil wound on an outer circumferential surface, and including at least one lens therein; a second printed circuit board coupled to the bottom of the holder module; A third printed circuit board installed on the upper side of the holder module; a plurality of wire springs, one end of which is connected to the second printed circuit board and the other end of which are connected to the third printed circuit board; And the connection between the wire spring and the third printed circuit board is characterized in that both the upper and lower surfaces of the three printed circuit boards are connected with a connecting material through a hole formed through the third printed circuit board.

Since the present invention has a buffering unit to absorb the load repeatedly applied to the wire spring, the wire spring can be firmly connected to the connection portion of the printed circuit board.

In addition, even if the wire spring receives excessive force during the assembly process of the lens module, it can absorb the excessive force applied by the buffer unit, thereby improving assembly efficiency and minimizing component loss due to poor assembly.

1 is a schematic plan view of a camera module according to an embodiment of the present invention.
Figure 2 is a cross-sectional view taken along line AA of Figure 1.
Figure 3 is a side view of a camera module according to an embodiment of the present invention.
Figure 4 is a perspective view showing a portion of the configuration of Figure 3.
Figure 5 is an enlarged view of portion B of Figure 2 according to the first embodiment of the present invention.
Figure 6 is an enlarged view of part B of Figure 2 according to the second embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is a cross-sectional view A-A of FIG. 1, FIG. 3 is a side view of a camera module according to an embodiment of the present invention, and FIG. 4 is a portion of FIG. 3. A perspective view showing the configuration, FIG. 5 is an enlarged view of portion B of FIG. 2 according to the first embodiment of the present invention, and FIG. 6 is a view showing portion B of FIG. 2 according to the second embodiment of the present invention. This is a drawing showing an enlarged portion.

As shown in FIG. 2, which shows a schematic plan view of FIG. 1 and a schematic side view showing the cross section A-A of FIG. 1, the camera module according to the present invention includes a first printed circuit board 10 and a housing unit 20. , a holder module 30, a second printed circuit board 40, a third printed circuit board 50, a wire spring 60, and a buffer unit 100.

The image sensor 11 is mounted approximately near the center of the first printed circuit board 10, and is preferably provided as a PCB board. Components for operating the image sensor 11 may be disposed on the first printed circuit board 10, or a plurality of terminals capable of supplying power and outputting information about the image sensor 11 may be provided. .

The housing unit 20 is disposed on the upper side of the first printed circuit board 10 and forms the framework of the camera module. According to a preferred embodiment of the present invention, the housing unit 20 includes a first housing 21, a second housing 22, first and second permanent magnets 23 and 24, and a yoke 25. Includes.

The first housing 21 is a base, which is disposed on the upper side of the first printed circuit board 10 and is spaced a certain distance away from the image sensor 11. If necessary, a filter member capable of filtering the image incident on the image sensor 11 may be further installed in the first housing 21 .

The second housing 22 is disposed above the first housing 21 and covers the first housing 21 . An opening is formed approximately in the center of the second housing 22 at a corresponding position so that an image can be transmitted to the image sensor 11. On the upper side of the second housing 22, a third printed circuit board 50, which will be described later, is adhesively fixed by a fixing member such as double-sided tape or adhesive, but this is not limited, and depending on the product design, It is also possible to provide a separate third housing, such as a case or shield can, for the third printed circuit board 50 and fix the third printed circuit board 50 to the inner surface of the third housing using the above-described fixing member. If a third housing is provided, the third printed circuit board 50 may be pressed and supported by the third housing without a separate fixing member.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 and apply magnetic force to the holder module 30. The first and second permanent magnets 23 and 24 are preferably provided with the same size. Additionally, the first and second permanent magnets 23, 24 and the yoke 25 may be disposed on the inner surfaces of the first and second housings if possible within the design tolerance range.

On the other hand, as the size of the first and second permanent magnets 23 and 24 increases, OIS driving increases even with a small current, and if the first and second permanent magnets 23 and 24 are configured to have a constant size, In this case, as the current flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 increases, the OIS drive increases. In conclusion, the larger the size of the first and second permanent magnets 23 and 24, the better the OIS operation, but it is desirable to design the optimal size within other design tolerances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24. In addition, the yoke 25 is provided in a protruding shape near the center so that the magnetic force of the first and second permanent magnets 23 and 24 can be invested into the internal space of the holder module 30. Preferably, the width is provided to be the same as that of the first and second permanent magnets 23 and 24, and the center protrudes to a certain size, so that the permanent magnet and the yoke are formed to have an approximately "T" shape. desirable.

The holder module 30 is disposed at a certain distance from the inner bottom surface of the housing unit 20 and is composed of an outer blade 31 and a bobbin 32. The holder module 30 can make a pendulum movement in the forward/left/right and diagonal directions while hanging on the wire spring 60.

Spring members 35 and 36 are provided on the upper and lower sides of the outer blade 31, are elastically supported by the spring members 35, and are connected to enable vertical movement of the bobbin 32.

As shown in FIG. 1, the outer blade 31 has a total of four first coils (31a to 31d) wound on the outer peripheral surface of the four sides, and the central portion of the four sides where the coils (31a to 31d) are wound. It is open without a coil. The yoke 25 is disposed at a position corresponding to the open space, so that the yoke 25 is partially inserted inside this space.

The second printed circuit board 40 may be fixed to the bottom of the outer blade 31 with a fixing member 33 such as double-sided tape or adhesive. The outer blade 31 moves forward and backward left and right or diagonally as shown by the arrow in FIG. 2 according to the interaction between the magnetic force of the first and second permanent magnets 22 and 23 and the first coil 31a. It is suspended by a plurality of wire springs 60 so as to be movable, and is spaced apart from the bottom surface of the first housing 21 at a predetermined distance.

In addition, the outer blade 31 may be provided with a plurality of spring holes 37 through which the wire spring 60 can pass and be connected to the second printed circuit board 40.

The bobbin 32 is arranged to be movable up and down inside the outer blade 31, and at least one lens 34 is installed therein. A second coil 32a is wound on the outer peripheral surface of the bobbin 32, and the second coil 32a is connected to the first coils 31a to 31d of the outer blade 31 through the yoke 25. The bobbin 32 is raised and lowered by interaction with the magnetic force applied through the empty space. As the size of the yoke (25) increases, AF operation improves, but this may also vary depending on the optimal design value. It is possible to automatically adjust the focus of the image transmitted to the image sensor 11 by the lifting action of the bobbin 32.

The second printed circuit board 40 is disposed on the bottom surface of the outer blade 31 as described above, and has a wire spring 60 to supply power to the first and second coils 31a and 32a. connected. Any connection method is possible as long as it can be connected by soldering or other conductive materials. That is, the connection portion (w') of the second printed circuit board 40 is connected to the first and second coils 31a and 32a, respectively, as shown in FIG. 2, and the wire spring 60 ) is transmitted to the first and second coils 31a and 32a to generate electromagnetic force.

At this time, in the case of the second coil 32a, it may be directly connected to the second printed circuit board 40, and as shown in FIG. 2, it is first connected to the lower spring 36 and then connected to the lower spring 36. ) is also possible to connect with the second printed circuit board 40.

The third printed circuit board 50 is fixed to the upper side of the second housing 22 with a fixing member such as double-sided tape or an adhesive member as described above. The third printed circuit board 50 connected to the first printed circuit board 10 Power transmitted through the terminal portion 52 of the printed circuit board 50 is transmitted to the second printed circuit board 40 through a wire spring 60 connected to the second printed circuit board 40. Any connection method is possible as long as it can be connected by soldering or other conductive materials.

As shown in FIGS. 3 and 4, the third printed circuit board 50 is provided to cover one wall of the first and second housings 21 and 22. In this case, the first and A window 55 is formed on the surface facing the second permanent magnets 23, 24 and the yoke 25, so that interference with them can be avoided.

This is a configuration to avoid this because the first and second permanent magnets 23, 24 and the yoke 25 are generally directly attached to the shield can 70, which will be described later, using a fixing means such as epoxy.

Meanwhile, the second printed circuit board 40 and the third printed circuit board 50 can be a flexible printed circuit board (FPCB), printed circuit board (PCB), or R-FPCB (Rigid FPCB integrated type). It is not limited, and any board that allows for electrical connection is possible.

Both ends of the wire spring 60 are connected to the second and third printed circuit boards 40 and 50. At this time, one end of the wire spring 60 is connected to the pad 51 formed on the third printed circuit board 50, as shown in FIG. 5, and the wire spring is located in the center of the pad 51. A through hole 53 through which 60 passes is formed. Any connection method is possible as long as it can be connected by soldering or other conductive materials. Meanwhile, a solder register (SR) is provided around the pad 51 to protect the surface of the third printed circuit board 50, and the area of the pad 51 can be connected to allow electricity to pass by opening the solder resist. there is.

In this way, the wire spring 60 connected to the pad 51 supplies the power supplied through the terminal portion 52 to the second printed circuit board 40, thereby forming the first and second coils 31a ( 32a) is capable of interacting with the first and second permanent magnets 23 and 24.

In addition, the other end of the wire spring 60 passes through the spring hole 37 formed in the outer blade 31, as shown in FIG. 2, and is installed on the bottom surface of the outer blade 31. It is connected to the printed circuit board (40). At this time, the other end of the wire spring 60, although not shown, is connected to a pad (not shown) formed on the second printed circuit board 40 like the third printed circuit board 50. The pad A through hole (not shown) through which the wire spring 60 passes is formed in the center (not shown). Any connection method is possible as long as it can be connected by soldering or other conductive material. According to this configuration, the outer blade 31 is suspended from the wire spring 60 and can be spaced apart from the bottom surface of the first housing 21 by a certain distance or more. Then, according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24, the outer blade 31 performs a pendulum movement, causing the outer blade ( It is possible to correct the vibration of 31) by the interaction of the first coil 31a and the first and second permanent magnets 23 and 24. For this purpose, the wire spring 60 is preferably made of a metal material that has elasticity and can conduct electricity to withstand impact.

On the other hand, the thinner the thickness of the wire spring 60, the better the camera shake correction movement even with a small current, but this may vary depending on the optimal design value. Preferably, the thickness of the wire spring 60 ranges from several ㎛ to hundreds of ㎛, preferably from 1 to 100 ㎛.

In addition, it is preferable that at least six wire springs 60 are provided, and at least two polarities for auto focusing control and four polarities for hand shake correction and motion shake correction are provided to the second and third printed circuits. It is necessary to supply it to the holder module 30 through connection with the substrate 40 and 50.

According to a preferred embodiment of the present invention, as shown in FIGS. 1 and 2, it is better to provide a total of 8 holders of the same length, 2 at each corner of the holder module 30, to ensure balance. .

Meanwhile, as shown in FIG. 2, when a separate third housing such as a shield can 70 is further included, as described above, the third printed circuit board 50 is connected to the first and second permanent housings. Since the magnets 23, 24 and the yoke 25 are fixedly coupled to the shield can 70 with epoxy or the like, to avoid this coupling portion, a window 55 is formed to separate the first and second housings. (21) Covers the side walls of (22).

If the shield can 70 is removed, the third printed circuit board 50 is formed of a PCB, and the first and second permanent magnets 23 and 24 and the yoke ( 25) can also be attached and fixed. As described above, the third printed circuit board 50 is composed of a PCB, but a window 55 as described above is provided, and the third printed circuit board 50 is provided in this window 55. The first and second permanent magnets 23, 24 and the yoke 25 can be inserted, and it is also possible to reinforce the outside with shielding tape, etc.

The shock absorbing unit 100 surrounds the connection portion (w) of the connection portion between the wire spring 60 and the third printed circuit board 50 to absorb shock and repeated loads applied to the wire spring 60.

According to a preferred embodiment of the present invention, the shock absorbing unit 100 includes an injection hole 110 and a second wire spring through hole 120.

The injection hole 110 is formed near the through hole 53 where the wire spring 60 passing through the third printed circuit board 50 is soldered. According to the first embodiment of the present invention, one injection hole 110 may be formed through, as shown in FIG. 5 .

The second wire spring through hole 120 is provided in the second holder 22. The second wire spring through hole 120 includes an upper opening 121 and a support hole 122.

The upper opening 121 has an upper-lower narrow structure, and is preferably provided in the shape of a conical funnel that narrows toward the bottom, as shown in FIGS. 5 and 6. The support hole 122 is formed coaxially with the through hole 53, and is preferably provided to correspond to or be larger than the diameter of the through hole 53.

The diameter of the through hole 53 is preferably formed to be slightly larger than the diameter of the wire spring 60, and when the wire spring 60 is connected to the pad 51 formed on the third printed circuit board 50, soldering or A connecting material 101, such as another conductive material, flows down through the hole 53 and connects to the wire spring 60 on both upper and lower surfaces of the third printed circuit board 50, as shown in FIGS. 5 and 6. It can be designed to be fixed.

The diameter of the support hole 122 is preferably slightly larger than the diameter of the wire spring 60, and may be the same as or larger than the diameter of the through hole 53. That is, the wire spring 60 can be designed to prevent interference by contacting the second holder 22 near the support hole 122.

The adhesive material 130 is injected through the injection hole 110 and filled in the inner space of the second wire spring through hole 120, as shown in FIG. 5. It is also possible to add the adhesive material 130 to cover the connection portion (w) of the third printed circuit board (50). The adhesive material 130 filled in the second wire spring hole 120 absorbs the shock and load transmitted to the connection portion (w) of the wire spring 60 and the third printed circuit board 50, and the wire spring (60) can be prevented from shaking inside the upper opening 121 of the second wire spring through hole 120. The adhesive material 130 may be epoxy, but is not limited thereto, and may be any other material that can be adhered and elastically supported.

According to the second embodiment of the present invention, the shock absorbing unit 100 is configured in the same way as the first embodiment, but the injection holes 110 are provided in a pair, with the through hole 53 as the center. It may be placed on both sides, or may be placed symmetrically, but the location is not limited to this.

In this case, the adhesive material 130 injected through the pair of injection holes 110 is not only inside the upper opening 121 of the second wire spring through hole 120, but also inside the upper opening 121 of the second wire spring through hole 120, as shown in FIG. It can completely cover the connection portion (w) formed on the upper side of the third printed circuit board 50.

According to this configuration, it is possible to prevent the connection portion (w) of the third printed circuit board 50 exposed at the top from being damaged by external impact, and even has the effect of insulating the connection portion (w). You can get it additionally.

Meanwhile, the general assembly sequence is to combine the bobbin 32 and the outer blade 31, then use a jig to assemble the second housing 22, the second and third printed circuit boards 40 and 50, and the wire spring ( 60) is connected, the bobbin 32 provided with the lens barrel is connected, and then the first housing 21 is connected and mounted on the first printed circuit board 10. Before connecting the first housing 21, the permanent magnet and yoke may be combined first. This assembly sequence may be changed as needed. In other words, it may be possible right on the equipment without a jig. In this process, even if the force for inserting and coupling the bobbin 32 on which the lens barrel is provided is excessively large and puts a strain on the connection portion w, the buffer unit 100 can absorb this excessive force.

That is, as shown in FIGS. 2, 5, and 6, the buffer unit 100 connects the wire spring 60 near the connection portion (w) between the wire spring 60 and the third printed circuit board 50. ), the load generated when it is pulled in the direction of gravity or shakes left and right is absorbed as the strain energy of the buffer unit 100.

Therefore, it is possible to prevent the inconvenience of having to reconnect or parts becoming unusable due to damage to the connection part (w) during the assembly process, and it is possible to produce a more reliable camera module.

Meanwhile, according to a preferred embodiment of the present invention, there is a through hole at a position corresponding to the lens module 30 around the connection portion (w) of the third printed circuit board 50 and the wire spring 60, and the housing It may further include a shield can 70 installed to surround the units 21 and 22. In this case, as described above, the third printed circuit board 50 may be attached and fixed to the inner peripheral surface of the shield can 70. Meanwhile, the shield can 70 is not necessarily necessary, and may be omitted depending on the configuration of the housing units 21 and 22.

Meanwhile, as shown in FIG. 2, hook units 80 may be provided on four sides or at least one side to fix the shield can 70 to the first housing 21. The location can be within the range allowed by the center or edge design, and the number can be one or multiple.

The hook unit 80 may be composed of a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81. , it may be configured in the opposite direction as needed.

The maximum width of the buffer unit 100 in a direction perpendicular to the optical axis (see L1 in FIG. 6) may be longer than the maximum width (see L2 in FIG. 6) of the connection portion (w) in the corresponding direction.

One of the first to third printed circuit boards 10, 40, and 50 may be referred to as a 'first board', the other may be referred to as a 'second board', and the remaining one may be referred to as a 'third board'. Alternatively, each of the first to third printed circuit boards 10, 40, and 50 may be referred to as a 'substrate'. The wire spring 60 may include a wire. The buffer unit 100 may be referred to as a 'buffer unit'.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters stated in the claims, and those skilled in the art can improve and change the technical idea of the present invention into various forms. Therefore, such improvements and changes will fall within the scope of protection of the present invention as long as they are obvious to those skilled in the art.

10; First printed circuit board 20; housing unit
21; first housing 22; second housing
23; first permanent magnet 24; 2nd permanent magnet
25; York 30; holder module
31; Outer blade 31a; first coil
32; Bobbin 32a; second coil
40; second printed circuit board 50; 3rd printed circuit board
51; pad 52; Terminals
53; Tonggong 60; wire spring
70; shield can 80; Hook unit
100; Buffer unit 101; connecting substance
110; injection hole 120; 2nd wire spring through hole
121; upper opening 122; support hall
130; adhesive material

Claims (20)

Base;
a holder module including an outer blade spaced apart from the base, a bobbin disposed within the outer blade, and a spring member connecting the bobbin and the outer blade;
a first coil disposed on the bobbin;
a magnet interacting with the first coil;
a second coil interacting with the magnet;
A wire coupled to the holder module;
a first connection portion that secures the first end of the wire; and
A buffer portion disposed on a portion of the wire and including an adhesive material,
In a direction perpendicular to the wire, a maximum width of the buffer portion is greater than a maximum width of the first connection portion. According to paragraph 1,
At least a portion of the buffer portion is disposed between the first connection portion and the outer blade. According to paragraph 1,
The spring member includes an upper spring coupled to the upper part of the bobbin and a lower spring coupled to the lower part of the bobbin,
A hand shake correction device wherein the buffer unit is disposed closer to the upper spring than the lower spring. According to paragraph 1,
A first substrate disposed on the base and including terminals,
The first substrate includes a first part disposed on the base and a second part bent and extended from the first part,
The wire connects the holder module and the first portion of the first substrate. According to clause 4,
The first portion of the first substrate includes a first surface facing the holder module and a second surface disposed opposite to the first surface,
The wire is coupled to the second surface of the first portion of the first substrate. According to clause 4,
The first substrate includes a pad disposed in the first portion and a hole disposed in a central area of the pad,
An image stabilization device in which the wire passes through the hole and is connected to the pad by solder. According to clause 6,
An image stabilization device in which a solder resist is disposed around the pad to form the surface of the first substrate. According to paragraph 3,
It includes a second connection part that secures the second end of the wire,
The second connection portion is disposed closer to the lower spring than to the upper spring. According to clause 8,
The first connection portion includes a first solder,
The second connection part includes a second solder. According to clause 9,
At least a portion of the buffer portion is disposed between the first solder and the second solder. According to paragraph 1,
The holder module includes first to fourth corner portions,
The wire is disposed in each of the first to fourth corner portions of the holder module. According to clause 11,
The wire includes six wires spaced apart from each other,
Two of the six wires are disposed in the first corner, and the other two wires among the six wires are disposed in the third corner,
An image stabilization device in which the first corner portion and the third corner portion are disposed on opposite sides of each other based on an optical axis. According to paragraph 1,
The first coil is electrically connected to the wire. According to clause 12,
The two wires disposed in the first corner are electrically connected to the first coil. According to paragraph 1,
The buffer unit is configured to absorb shock or load applied to the wire. Base;
a holder module including an outer blade spaced apart from the base, a bobbin disposed within the outer blade, and a spring member connecting the bobbin and the outer blade;
a first coil disposed on the bobbin;
a magnet interacting with the first coil;
a second coil interacting with the magnet;
A wire coupled to the holder module;
a first solder fixing the first end of the wire; and
A buffer portion disposed on a portion of the wire and containing an adhesive material,
The first solder is a hand shake correction device disposed within the buffer. According to clause 16,
In a direction perpendicular to the wire, the maximum width of the buffer portion is greater than the maximum width of the first solder. printed circuit board;
an image sensor disposed on the printed circuit board;
The camera shake correction device according to any one of claims 1 to 17 disposed on the printed circuit board; and
A camera module including a lens coupled to the bobbin of the image stabilization device. A mobile phone including the camera module of claim 18. Base;
a holder module including an outer blade spaced apart from the base, a bobbin disposed within the outer blade, and a spring member connecting the bobbin and the outer blade;
a first coil disposed on the bobbin;
a magnet interacting with the first coil; and
An image stabilization device comprising a second coil interacting with the magnet.