KR101944920B1 - Camera Module - Google Patents

Abstract

A camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; A housing unit disposed on the first printed circuit board; A holder module disposed at a distance from the bottom surface of the housing unit, the holder module including a first coil wound around an outer circumferential surface thereof and including at least one lens therein; A second printed circuit board coupled to the bottom surface of the holder module; A third printed circuit board mounted on the holder module; A plurality of wire springs, one end of which is connected to the second printed circuit board and the other end of which is connected to the third printed circuit board; And a buffer member interposed between the holder module and the third printed circuit board.

Description

Camera module {Camera Module}

The present invention relates to a camera module.

In the case of a camera module mounted on a small electronic product, the camera module may be frequently hit during use, and the camera module may be shaken finely due to hand shake or the like during shooting. Taking these points into consideration, a camera module having an anti-shake device has recently been disclosed.

For example, Korean Patent Registration No. 10-0741823 (registered Jul. 14, 2007) discloses a gyro sensor IC or an angular velocity sensor installed inside a device in which a camera module such as a mobile phone is mounted for correction of a hand- Is introduced.

However, when a separate angular velocity detection sensor is provided as described above, a separate detection sensor must be provided in order to realize the anti-shake function, thereby increasing the manufacturing cost. In addition, in order to construct and install the anti- There is a hassle to provide space.

Korean Patent No. 10-0741823 (July 16, 2007)

An object of the present invention is to provide a camera module having an optical image stabilizer function.

A camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; A housing unit disposed on the first printed circuit board; A holder module disposed at a distance from the bottom surface of the housing unit, the holder module including a first coil wound around an outer circumferential surface thereof and including at least one lens therein; A second printed circuit board coupled to the bottom surface of the holder module; A third printed circuit board mounted on the holder module; A plurality of wire springs, one end of which is connected to the second printed circuit board and the other end of which is connected to the third printed circuit board; And a buffer member interposed between the holder module and the third printed circuit board.

According to a preferred embodiment of the present invention, the cushioning member is disposed on the entire face of the upper end of the housing unit facing the third printed circuit board.

In addition, the buffer member is preferably formed of microcellular polyurethane, which is an impact-resistant member.

The third printed circuit board preferably includes a pad having a through hole through which the wire spring passes, at the center.

At this time, it is preferable that the buffer member is disposed at a certain distance from the end of the through hole.

The buffer member may be disposed at a predetermined distance from the end of the pad, or may be disposed between the end of the through hole and the end of the pad.

The housing unit may include: a first housing disposed on the first printed circuit board; A second housing disposed above the first housing and having the third printed circuit board mounted on an upper side thereof; First and second permanent magnets interposed between the first and second housings; And a yoke disposed between the first and second permanent magnets or positioned on a side surface of the first and second housings to transmit magnetic force into the holder module.

Preferably, the yoke protrudes from the center of the yoke toward the holder module.

According to a preferred embodiment of the present invention, there is further provided a shield can, which has a through hole at a position corresponding to the connection portion of the third printed circuit board and the wire spring and the lens module, and which is installed to surround the housing unit have.

The holder module includes: an outer blade having a first coil wound on an outer circumferential surface thereof; A bobbin which is supported by an elastic member on an upper side of the outer blade and is arranged to be movable up and down inside the outer blade, a second coil is wound on an outer circumference of the outer blade, and at least one lens is installed therein; And upper and lower elastic members disposed on the upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade.

The wire spring may be made of a metal material and may be connected to the second and third printed circuit boards in a conductive manner.

In addition, at least six wire springs are provided to supply two polarities for autofocusing control and four polarity power sources for OIS driving to the holder module through connection with the second and third printed circuit boards .

It is preferable that the wire springs have the same length, and two wire springs are arranged at the corner portions of the holder module so that a total of eight wire springs are provided.

A space may be formed in the center of the first coil so that a magnetic force can be applied to the second coil.

Preferably, the second coil is electrically connected to the lower spring, and the lower spring is electrically connected to the wire spring on the second printed circuit board.

Alternatively, the second coil may be directly connected to the second printed circuit board.

The present invention can be tightly connected to the connection part of the printed circuit board since the buffer part is provided on the wire spring so as to absorb the load applied repeatedly.

Further, even if the wire spring receives an excessive force during the assembly process of the lens module, the excessive force can be absorbed by the cushioning member, so that not only the assembling property but also the component loss due to the assembly failure can be minimized.

1 is a schematic plan view of a camera module according to an embodiment of the present invention,
FIG. 2 is a cross-sectional view taken along line AA of FIG. 1,
3 is a side view of a camera module according to an embodiment of the present invention,
FIG. 4 is a side view showing a state in which the shield can of FIG. 3 is removed,
5 is an enlarged view of a portion B in Fig. 2 according to the first embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention; Fig. 2 is a sectional view taken along the line AA of Fig. 1; Fig. 3 is a side view of a camera module according to an embodiment of the present invention; Fig. 5 is an enlarged view of a portion B in Fig. 2. Fig.

2, the camera module according to the present invention includes a first printed circuit board 10, a housing unit 20, and a second printed circuit board 10, A holder module 30, a second printed circuit board 40, a third printed circuit board 50, a wire spring 60, and a buffer member 100.

The first printed circuit board 10 is mounted on the image sensor 11 in the vicinity of the center thereof and is preferably provided as a PCB substrate. The first printed circuit board 10 may be provided with a plurality of terminal portions for arranging components for operating the image sensor 11 or for supplying power and outputting information of the image sensor 11 .

The housing unit 20 is disposed on the first printed circuit board 10 to form a skeleton of the camera module. According to a preferred embodiment of the present invention, the housing unit 20 includes a first housing 21, a second housing 22, first and second permanent magnets 23 and 24, and a yoke 25, .

The first housing 21 is disposed on an upper surface of the first printed circuit board 10 as a base and spaced apart from the image sensor 11 by a predetermined distance. The first housing 21 may further include a filter member for filtering an image incident on the image sensor 11 if necessary.

The second housing 22 is disposed on the upper side of the first housing 21 to cover the first housing 21. An opening is formed in the vicinity of the center of the second housing 22 at a position corresponding to the image sensor 11. The third printed circuit board 50 to be described later is adhered and fixed to the upper surface of the second housing 22 by a fixing member such as a double-sided tape or an adhesive. However, the present invention is not limited thereto, The third printed circuit board 50 may be provided with a separate third housing such as a case or shield can and the third printed circuit board 50 may be fixed to the inner side of the third printed circuit board 50 with the fixing member. If the third housing is provided, the third printed circuit board 50 may be pushed and supported by the third housing without a separate fixing member.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 so that a magnetic force is applied to the holder module 30. It is preferable that the first and second permanent magnets 23 and 24 have the same size. Also, the first and second permanent magnets 23 and 24 and the yoke 25 may be disposed on the inner side surfaces of the first and second housings, if possible, within the design tolerance range.

On the other hand, if the size of the first and second permanent magnets 23 and 24 increases, the OIS drive becomes large even if the current is small. If the first and second permanent magnets 23 and 24 are constant in size , The OIS drive becomes larger as the currents flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 are increased. As a result, the larger the size of the first and second permanent magnets 23 and 24, the better the OIS drive, but it is desirable to design the optimal size within other design tolerances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24. The yoke 25 is provided in a shape protruding near the center so that the magnetic force of the first and second permanent magnets 23 and 24 can be invested into the inner space of the holder module 30. Preferably, the width is provided in the same manner as the first and second permanent magnets 23 and 24, and the center is protruded by a predetermined size so that the permanent magnet and the yoke are formed to have a substantially "T" desirable.

The holder module 30 is spaced apart from the inner bottom surface of the housing unit 20 by a predetermined distance. The holder module 30 includes an outer blade 31 and a bobbin 32. The holder module 30 can perform pendulum movement in the forward / backward / left / right and diagonal directions while being suspended from the wire spring 60.

Spring members 35 and 36 are provided on the upper and lower sides of the outer blade 31 so as to be elastically supported by the spring member 35 so that the bobbin 32 can move upward and downward.

As shown in FIG. 1, the outer blade 31 has a total of four first coils 31a to 31d wound on the outer circumferential surface of four sides, and the four side central portions around which the coils 31a to 31d are wound There is no coil. The yoke 25 may be disposed at a position corresponding to the opened space and the yoke 25 may be partially inserted into the space.

The second printed circuit board 40 may be fixed to the bottom surface of the outer blade 31 with a fixing member 33 such as double-sided tape or adhesive. The outer blade 31 is rotated in the longitudinal, left and / or diagonal directions as shown by arrows in FIG. 2 in accordance with the interaction between the magnetic forces of the first and second permanent magnets 22 and 23 and the first coil 31a And is spaced apart from the bottom surface of the first housing 21 by a predetermined distance.

A plurality of spring through holes 37 may be formed in the outer blade 31 so that the wire spring 60 penetrates the outer blade 31 and is connected to the second printed circuit board 40.

The bobbin (32) is arranged such that the outer blade (31) is vertically movable inside and at least one lens (34) is installed therein. A second coil 32a is wound on the outer circumferential surface of the bobbin 32. The second coil 32a is connected to the first coils 31a to 31d of the outer blade 31 through the yoke 25, And moves up and down the bobbin 32 by interaction with the magnetic force that is invested through the open space. The larger the size of the yoke 25, the better the AF drive, but this also depends on the optimum design value. The focus of the image transmitted to the image sensor 11 can be automatically adjusted by the bobbin 32 moving up and down.

The second printed circuit board 40 is disposed on the bottom surface of the outer blade 31 as described above so that the wire spring 60 can be connected to the first and second coils 31a and 32a . The connection can be done in any way as long as it can be connected by soldering or other conductive material. That is, the connection portion w 'of the second printed circuit board 40 is connected to the first and second coils 31a and 32a, respectively, as shown in FIG. 2, To the first and second coils 31a and 32a so as to form an electromagnetic force.

In this case, the second coil 32a may be directly connected to the second printed circuit board 40 and connected to the lower spring 36 first, as shown in FIG. 2. Then, the lower spring 36 May be connected to the second printed circuit board (40).

The third printed circuit board 50 is fixed to the upper portion of the second housing 22 by a fixing member such as a double sided tape or an adhesive member as described above. The power transmitted through the terminal portion 52 of the printed circuit board 50 is transferred to the second printed circuit board 40 through the wire spring 60 connected with the second printed circuit board 40. The connection can be done in any way as long as it can be connected by soldering or other conductive material.

As shown in FIGS. 3 and 4, the third printed circuit board 50 is provided to cover one side wall of the first and second housings 21 and 22, A window 55 may be formed on the surface facing the second permanent magnets 23 and 24 and the yoke 25 so that interference with them can be avoided.

This is because the first and second permanent magnets 23 and 24 and the yoke 25 are directly attached to the shield can 70 to be described later by fixing means such as epoxy.

The second printed circuit board 40 and the third printed circuit board 50 may be a flexible printed circuit board (FPCB), a printed circuit board (PCB), or an R-FPCB (rigid FPCB integrated type) But the present invention is not limited thereto, and any substrate can be used as long as it is electrically connected.

Both ends of the wire spring 60 are connected to the second and third printed circuit boards 40 and 50. At this time, one end of the wire spring 60 is connected to the pad 51 formed on the third printed circuit board 50 as shown in FIG. 5, and at the center of the pad 51, A through hole 53 through which the electrode 60 penetrates is formed. The connection can be done in any way as long as it can be connected by soldering or other conductive material. A solder resistor (SR) is provided around the pad 51 to protect the surface of the third printed circuit board 50. The area of the pad 51 can be connected to the solder resistor have.

The wire spring 60 connected to the pad 51 supplies the power supplied through the terminal unit 52 to the second printed circuit board 40 so that the first and second coils 31a 32a are allowed to interact with the first and second permanent magnets 23, 24.

2, the other end of the wire spring 60 passes through a spring through hole 37 formed in the outer blade 31, and a second end of the wire spring 60, which is provided on the bottom surface of the outer blade 31, And is connected to the printed circuit board 40. The other end of the wire spring 60 is connected to a pad (not shown) formed on the second printed circuit board 40 like the third printed circuit board 50, (Not shown) through which the wire springs 60 are inserted is formed at the center of the base plate (not shown). The connection can be done in any way as long as it can be connected by soldering or other conductive material. According to this configuration, the outer blade 31 may be suspended from the wire spring 60, and may be spaced apart from the bottom surface of the first housing 21 by a certain distance. The outer blade 31 performs the pendulum motion according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24 so that the outer blade 31 can be corrected by the interaction of the first coil 31a and the first and second permanent magnets 23, 24. For this purpose, it is preferable that the wire spring 60 is made of a metal material which is elastic and able to withstand an impact, and is made conductive.

On the other hand, the thinner the thickness of the wire spring 60, the better the mobility for correcting the shaking motion even with a small current, which may vary depending on the optimum design value. Preferably, the thickness of the wire spring 60 is several 탆 to several hundred 탆, preferably 1 to 100 탆.

In addition, it is preferable that at least six wire springs (60) are provided, and at least two polarities for auto focus control and four polarity power sources for correction of camera shake correction movement are provided to the second and third printed circuits It is necessary to supply the holder module 30 through the connection with the substrate 40 (50).

According to a preferred embodiment of the present invention, as shown in FIG. 1 and FIG. 2, it is preferable that a total of 8 pieces are provided at the corner portions of the holder module 30 with the same length, .

2, the third printed circuit board 50 may include a third housing, such as the shield can 70, as described above. In this case, The magnets 23 and 24 and the yoke 25 are fixedly coupled to the shield can 70 by epoxy or the like so that a window 55 is formed in order to avoid this coupling portion, (21) (22).

If the shield can 70 is omitted, the third printed circuit board 50 is formed of PCB or the like, and the first and second permanent magnets 23 and 24 and the yoke The third printed circuit board 50 is formed of a PCB as described above. The above-described window 55 may be provided, and the window 55 may be provided with the above- 1 and the second permanent magnets 23 and 24 and the yoke 25 may be inserted into the yoke 25 and the yoke 25 may be further reinforced by a shielding tape or the like.

The buffer member 100 is interposed between the second housing 22 and the third printed circuit board 50 and is connected to the third printed circuit board 50 for connection between the wire spring 60 and the third printed circuit board 50. [ Absorbs a force generated in the pad 51 or the wire spring 60 provided on the printed circuit board 50 and disperses and absorbs a load acting on the connection portion w.

The diameter of the through hole 53 may be slightly larger than the diameter of the wire spring 60. When the wire spring 60 is connected to the pad 51 formed on the third printed circuit board 50, And other conductive material may flow through the through hole 53 and be connected to the wire spring 60 on both sides of the upper and lower surfaces of the third printed circuit board 50 to be fixed.

The diameter of the support hole 122 may be larger than the diameter of the wire spring 60 and may be larger than the diameter of the through hole 53 so that the wire spring 60 is located near the support hole 122 So that interference does not occur.

According to a preferred embodiment of the present invention, the buffer member 100 is preferably disposed on the entire face of the upper end of the second housing 22 facing the third printed circuit board 50, However, it may be installed only around the connection portion w.

The buffer member 100 may be formed of a microcellular polyurethane foam, which is an impact-resistant member. As an example of such a microcellular polyurethane foam, PORON may be used, but it is not limited thereto, and any material that can be elastically deformed by an external force can be used.

The buffer member 100 may be spaced apart from the ends of the pads 51 and the through holes 53 to prevent the third printed circuit board 50 from being torn. 5, the buffer member 100 is disposed between the end of the through hole 53 and the end of the pad 51, and the third printed circuit board 50 and the second housing 22 And it is possible to reduce a load directly applied to the connecting portion w fixing the wire spring 60. [

The cushioning member 100 is connected to the third printed circuit board 50 and the second housing 22 (not shown) at a position spaced from the end of the support hole 122 or the end of the support hole 122 The cushioning member 100 can be placed in a buffer function.

The general assembly procedure is to combine the bobbin 32 and the outer blade 31 and then connect the second housing 22, the second and third printed circuit boards 40 and 50 and the wire springs And the first housing 21 is connected to the first printed circuit board 10 after the bobbin 32 having the lens barrel is coupled. Before connecting the first housing 21, the permanent magnet and yoke coupling may be performed first. This assembly sequence may be changed as needed. That is, it may be possible directly from the equipment without a jig. In this process, even if the force for inserting and connecting the bobbin 32 provided with the lens barrel is excessively large, the buffer member 100 can absorb such an excessive force even if the coupling portion w is overloaded.

2 and 5, since the buffer member 100 is disposed so as to be in surface contact with the pad 51, a load is generated in the wire spring 60 and pulled in the gravity direction, A force generated when the pad 51 is shaken to the right and left is primarily applied to the pad 51 and a force applied to the pad 51 is transmitted to the buffer member 100 again to elastically deform it, Absorbed by the strain energy of the member (100).

Therefore, it is possible to perform the connection operation again due to breakage of the connection portion (w) during the assembling process or to prevent the inconvenience that the parts can not be used.

According to a preferred embodiment of the present invention, a through hole is provided at a position corresponding to the lens module 30 around the connection portion w of the third printed circuit board 50 and the wire spring 60, And a shield can 70 installed to enclose the units 21 and 22. In this case, as described above, the third printed circuit board 50 may be fixedly attached to the inner circumferential surface of the shield can 70. Meanwhile, the shield can 70 is not necessarily required, and may be omitted depending on the configuration of the housing units 21 and 22.

2, the hook unit 80 may be provided on four sides or at least one side of the shield can 70 in order to fix the shield can 70 to the first housing 21. As shown in FIG. The position may be within a range allowed by the center or edge design, and the number may be one or more.

The hook unit 80 may include a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81 , And may be configured as the opposite if necessary.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

10; A first printed circuit board 20; The housing unit
21; A first housing 22; The second housing
23; A first permanent magnet 24; The second permanent magnet
25; Yoke 30; Holder module
31; Outer blades 31a to 31d; The first coil
32; Bobbin 32a; The second coil
40; A second printed circuit board 50; The third printed circuit board
51; Pad 52; Terminals
53; Hole 60; Wire spring
70; Shield can 100; The buffer member
w; A connection 122; Support hole

Claims (17)

Base;
A third printed circuit board including a first portion disposed on the base, a second portion extending downwardly from the first portion, and a terminal disposed on a lower end of the second portion;
A holder module including an outer blade, a bobbin disposed in the outer blade, and a spring member connecting the bobbin and the outer blade, the holder module being disposed on the base;
A first coil disposed in the bobbin;
A permanent magnet for moving the bobbin through interaction with the first coil;
A second coil for moving the holder module through interaction with the permanent magnet; And
And a wire connecting the holder module to the first portion of the third printed circuit board,
Wherein the third printed circuit board further comprises a pad formed in the first portion and including a hole,
The wire passing through the hole of the pad,
Wherein a first surface of the pad is coupled to the wire by soldering and a cushioning member having elasticity is disposed on a second surface disposed on the opposite side of the first surface of the pad.
The method according to claim 1,
And a housing unit including a first housing which is the base and a second housing which is disposed on the first housing and covers the holder module,
Wherein the buffer member is disposed between the housing unit and the first portion of the third printed circuit board.
The method according to claim 1,
Wherein the buffer member is formed of microcellular polyurethane which is an impact-resistant member.
The method according to claim 1,
A solder resistor is disposed around the pad to form a surface of the third printed circuit board,
Wherein the wire is coupled by soldering to an area of the pad where the solder resist is open.
The method according to claim 1,
Wherein the buffer member is spaced apart from the hole of the pad.
The method according to claim 1,
Wherein the buffer member includes a hole through which the wire passes,
Wherein the diameter of the hole of the buffer member is larger than the diameter of the hole of the pad.
The method according to claim 6,
Wherein the diameter of the hole of the buffer member is smaller than the diameter of the pad.
3. The method of claim 2,
The housing unit
First and second permanent magnets disposed between the first and second housings; And
And a yoke disposed between the first and second permanent magnets.
9. The method of claim 8,
And the yoke includes a portion protruding toward the holder module.
3. The method of claim 2,
And a shield can disposed to surround the housing unit.
The method according to claim 1,
Wherein the spring member includes upper and lower springs disposed on the upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade.
The method according to claim 1,
Wherein the wire is made of a metal material and is electrically connected to the third printed circuit board.
The method according to claim 1,
Wherein at least six wires are provided to supply two polarities for autofocusing control and four polarity powers for OIS driving to the holder module through connection with the third printed circuit board.
14. The method of claim 13,
Wherein the wires are arranged at two corners of the holder module with the same length so that a total of eight wires are provided.
The method according to claim 1,
The method according to claim 1,
A first printed circuit board disposed below the base;
An image sensor disposed on the first printed circuit board; And
Further comprising a lens coupled to the bobbin,
And the terminal of the third printed circuit board is coupled to the first printed circuit board by soldering.
12. The method of claim 11,
And the first coil is electrically connected to the lower spring.
A mobile phone comprising a camera module according to claim 1.

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