KR102060584B1 - Camera Module - Google Patents

Abstract

The camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; A housing unit disposed above the first printed circuit board; A holder module disposed at a distance from an inner bottom surface of the housing unit, the first coil being wound around an outer circumferential surface, and including at least one lens therein; A plate member coupled to the holder module bottom surface; A second printed circuit board installed above the holder module; A plurality of wire springs having one end connected to the plate member and the other end connected to the second printed circuit board; And a buffer part provided at a connection part of the wire spring and the plate member.

Description

Camera Module

The present invention relates to a camera module.

In the case of a camera module mounted in a small electronic product, the camera module may be frequently shocked during use, and the camera module may be minutely shaken due to the shaking of the user during shooting. In view of such a point, the camera module which has the shake prevention means in recent years is disclosed. For example, in Korean Patent Registration No. 10-0741823 (registered on July 16, 2007), a gyro sensor IC or an angular velocity sensor is installed inside a device in which a camera module such as a mobile phone is mounted to correct a hand shake phenomenon. How to do is introduced.

However, if a separate angular velocity detection sensor is provided in this way, a separate detection sensor must be provided to implement a hand shake prevention function, causing an increase in manufacturing cost, and for configuring and installing a hand shake prevention device separately from a camera module. There is a hassle to make room.

(Patent Document 1) KR10-0741823 B1

It is an object of the present invention to provide a camera module having an optical image stabilizer (OIS) function.

Another object of the present invention is to provide a camera module having an improved buffer structure of a wire and a soldered portion so that impact resistance can be improved.

The camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; A housing unit disposed above the first printed circuit board; A holder module disposed at a distance from an inner bottom surface of the housing unit, the first coil being wound around an outer circumferential surface, and including at least one lens therein; A plate member coupled to the holder module bottom surface; A second printed circuit board installed above the holder module; A plurality of wire springs having one end connected to the plate member and the other end connected to the second printed circuit board; And a buffer part provided at a connection part of the wire spring and the plate member.

The buffer unit may be formed to reciprocate around the connection unit.

The buffer part may be formed by a slit formed through the plate member so that the wire spring penetrates around a spring through hole which is connected to the plate member through a connecting material. The slit may be formed by the slit of the plate member. Portions other than the buffer part may be formed by penetrating in an arc shape.

In addition, it may further include a buffer hole which is formed through the space portion between the spring through hole and the buffer portion.

In addition, the connection material may be made of a conductive material such as lead.

The housing unit may include a first housing disposed above the first printed circuit board; A second housing disposed above the first housing and having the second printed circuit board installed thereon; First and second permanent magnets interposed between the first and second housings; And a yoke disposed between the first and second permanent magnets or positioned on inner surfaces of the first and second housings to transfer a magnetic force into the holder module.

The yoke may have a central portion protruding from the holder module.

The second housing and the second printed circuit board may be fixed with double-sided tape.

And a shield can having a through hole at a position corresponding to the connection portion of the second printed circuit board and the wire spring and the lens module, the shield can being installed to surround the housing unit.

The holder module may include an outer blade having a first coil wound around an outer circumferential surface thereof; A bobbin elastically supported by an elastic member on the upper side of the outer blade, arranged to be movable up and down inside the outer blade, and having a second coil wound around its outer circumferential surface, and having at least one lens installed therein; And upper and lower elastic members disposed at upper and lower sides of the bobbin, respectively, to elastically support the bobbin with respect to the outer blade, wherein the center of the first coil has magnetic force invested in the second coil side. The space portion can be formed so that.

The wire spring may be made of a metal material and may be electrically connected to the plate member and the second printed circuit board.

At least six wire springs are provided to supply two polarities for auto focusing control and four polarity powers for driving OIS to the holder module through connection with the plate member and the second printed circuit board. desirable.

The wire springs may have the same length and are arranged in two corner portions of the holder module, and a total of eight wire springs may be provided.

According to the camera module according to the present invention, since the buffer member is provided in the plate member installed below the outer blade, even if a repeated load occurs, it is possible to minimize the breakage of the wire soldering connection due to the impact of the camera module.

In addition, even if soldering is performed more than the standard by mistake during the assembly process, excess solder may be soaked in the buffer hole formed near the soldering portion of the wire, thereby preventing camera module defects.

1 is a schematic plan view of a camera module according to an embodiment of the present invention;
2 is a cross-sectional view taken along line AA of FIG.
3 and 4 are side views of a camera module according to an embodiment of the present invention;
5 and 6 are a plan view showing a pattern of the buffer portion of the plate member according to the first embodiment of the present invention, and
7 and 8 are plan views showing the pattern of the buffer portion of the plate member according to the second embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line AA of FIG. 1, and FIGS. 3 and 4 are side views of a camera module according to an embodiment of the present invention, FIGS. 5 and FIG. 6 is a plan view showing the pattern of the buffer portion of the plate member according to the first embodiment of the present invention, and FIGS. 7 and 8 are plan views showing the pattern of the buffer portion of the plate member according to the second embodiment of the present invention. .

As shown in FIG. 2, which shows a schematic plan view of FIG. 1 and a schematic side view showing an AA cross section of FIG. 1, the camera module according to the present invention includes a first printed circuit board 10 and a housing unit 20. , A holder module 30, a plate member 40, a second printed circuit board 50, a wire spring 60, and a buffer unit 100 provided on the plate member 40.

In the first printed circuit board 10, the image sensor 11 is mounted near the center, and the first printed circuit board 10 is preferably provided as a PCB substrate. Components for operating the image sensor 11 may be disposed on the first printed circuit board 10, or a plurality of terminal units may be provided to supply power and output information of the image sensor 11. .

The housing unit 20 is disposed above the first printed circuit board 10 and forms a skeleton of the camera module. According to a preferred embodiment of the present invention, the housing unit 20, the first housing 21, the second housing 22, the first and second permanent magnets (23) 24 and the yoke 25 It includes.

The first housing 21 is a base and is disposed on an upper surface of the first printed circuit board 10 and is spaced apart from the image sensor 11 by a predetermined distance. If necessary, the first housing 21 may be further provided with a filter member for filtering the image image incident to the image sensor 11.

The second housing 22 is disposed above the first housing 21 to cover the first housing 21. An opening is formed at a corresponding position so that an image can be transferred to the image sensor 11 near the center of the second housing 22. The second printed circuit board 50, which will be described later, is adhesively fixed to the upper side of the second housing 22 by a fixing member such as a double-sided tape or an adhesive, but is not limited thereto. The second printed circuit board 50 may be provided with a separate third housing such as a case or a shield can, and the second printed circuit board 50 may be fixed to the inner surface thereof with the fixing member. If the third housing is provided, the second printed circuit board 50 may be pressed and supported by the third housing without a separate fixing member.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 to inject magnetic force into the holder module 30. The first and second permanent magnets 23 and 24 may be provided in the same size. In addition, the first and second permanent magnets 23, 24 and the yoke 25 may be disposed on the inner side of the first and second housings, if possible, within the design tolerances.

On the other hand, when the sizes of the first and second permanent magnets 23 and 24 become larger, the OIS driving becomes larger even with a small current, and if the first and second permanent magnets 23 and 24 have a constant size, In this case, the OIS driving becomes larger as the current flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 increases. In conclusion, the larger the size of the first and second permanent magnets 23 and 24 is, the better OIS driving is, but it is desirable to design the optimum size within other design allowances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24. In addition, the yoke 25 is provided in a shape protruding near the center so that magnetic forces of the first and second permanent magnets 23 and 24 can be invested into the inner space of the holder module 30. Preferably, the width is provided in the same manner as the first and second permanent magnets (23, 24), the center is projected to a certain size so that the permanent magnet and the yoke is formed to have a substantially "T" shape desirable.

The holder module 30 is disposed to be spaced apart from the bottom surface of the housing unit 20 by a predetermined distance, and includes an outer blade 31 and a bobbin 32. The holder module 30 may pendulum in the front, rear, left, and right directions while being suspended from the wire spring 60.

Spring members 35 and 36 are provided on the upper side and the lower side of the outer blade 31 and are elastically supported by the spring member 35 so as to be able to move upward and downward in the bobbin 32.

As shown in FIG. 1, the outer blade 31 has four first coils 31a to 31d wound around the outer circumferential surface of the four sides, and a central portion of the four sides on which the coils 31a to 31d are wound. It is drilled without a coil. The yoke 25 is disposed at a position corresponding to the drilled space portion, and the yoke 25 may be partially inserted into the space portion.

The plate member 40 may be fixed to the bottom surface of the outer blade 31 by a fixing member 33 such as a double-sided tape or an adhesive. The outer blade 31 may be moved back and forth or left and right as shown in the arrow of FIG. 2 according to the interaction between the magnetic force of the first and second permanent magnets 22 and 23 and the first coils 31a to 31d. Hanging by a plurality of wire springs 60 to move diagonally, spaced apart from the bottom surface of the first housing 21 by a predetermined interval.

In addition, the outer blade 31 may be provided with a plurality of spring through holes 37 so that the wire spring 60 can be connected to the plate member 40.

The bobbin 32 is disposed so that the outer blade 31 is movable up and down inside, at least one lens 34 is provided therein. A second coil 32a is wound around the outer circumferential surface of the bobbin 32, and the second coil 32a is formed by the first coils 31a to 31d of the outer blade 31 through the yoke 25. The bobbin 32 is raised and lowered by interaction with the magnetic force invested through the open space. The larger the yoke 25 size, the better the AF drive, but this also depends on the optimum design value. It is possible to automatically adjust the focus of the image transmitted to the image sensor 11 by the lifting action of the bobbin 32.

The plate member 40 is preferably formed of a conductive metal material, and is disposed on the bottom surface of the outer blade 31 as described above to supply power to the first and second coils 31a and 32a. The wire spring 60 is connected. The connection can be in any way as long as it can be connected by soldering or other conductive material. That is, as shown in FIG. 2, the connecting portion w ′ of the plate member 40 is connected to the first and second coils 31a and 32a, respectively, and through the wire spring 60. The supplied power is transferred to the first and second coils 31a and 32a to form an electromagnetic force.

In this case, in the case of the second coil 32a, it may be directly connected to the plate member 40, and as shown in FIG. 2, first of all, the lower spring 36 is connected to the lower spring 36. It is also possible to connect with the plate member 40.

The second printed circuit board 50 is fixed to the upper side of the second housing 22 by a fixing member such as a double-sided tape and an adhesive member, as described above, and the second printed circuit board 50 is connected to the first printed circuit board 10. Power transmitted through the terminal portion 52 of the printed circuit board 50 is transmitted to the plate member 40 through the wire spring 60. The connection can be in any way as long as it can be connected by soldering or other conductive material.

As shown in FIGS. 3 and 4, the second printed circuit board 50 is provided to cover one side wall surface of the first and second housings 21 and 22. A window 55 is formed on a surface facing the second permanent magnets 23 and 24 and the yoke 25, and may be configured to avoid interference with them.

This is because the first and second permanent magnets 23, 24 and the yoke 25 are generally attached directly to the shield can 70, which will be described later, by means of fixing means such as epoxy.

Meanwhile, the second printed circuit board 50 may be a flexible printed circuit board (FPCB), a printed circuit board (PCB), or an R-FPCB (Rigid FPCB integrated type), but is not limited thereto. Any substrate can be used. In the case of the present invention, the plate member 40 may be formed of a thin metal plate for the formation of the shock absorbing portion 100 for shock absorption at the connection (w ') that the wire spring 60 is soldered to the external impact. .

Both ends of the wire spring 60 are connected to the plate member 40 and the second printed circuit board 50. In this case, one end of the wire spring 60, as shown in Figure 2, is connected to the second printed circuit board 50, the wire spring 60 is connected to the second printed circuit board 50 Power supplied through the terminal portion 52 is supplied to the plate member 40 side, so that the first and second coils 31a and 32a are connected to the first and second permanent magnets 23 and 24. To enable interaction.

Also, as shown in FIG. 2, the other end of the wire spring 60 passes through a spring through hole 37 formed in the outer blade 31, and is provided on the bottom surface of the outer blade 31. It is connected with 40. In this case, the other end of the wire spring 60 is connected to a pad (not shown) formed on the plate member 40 like the second printed circuit board 50, although not shown. At the center of the spring is formed a spring through-hole 41 through which the wire spring 60 passes. The connection can be in any way as long as it can be connected by soldering or other conductive material. According to this configuration, the outer blade 31 may be suspended from the wire spring 60 and spaced apart from the bottom surface of the first housing 21 by a predetermined distance or more. Then, according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24, the outer blade 31 performs a pendulum movement, thereby shaking the outer blade ( It is possible to correct the vibration of the 31 by the interaction of the first coil 31a and the first and second permanent magnets 23 and 24. To this end, the wire spring 60 is preferably provided with a metal material that is elastic and energizable to withstand the impact.

On the other hand, the thinner the thickness of the wire spring 60, the better the image stabilization motility even at a small current, which may vary depending on the optimum design value. Preferably, the wire spring 60 has a thickness of several micrometers to several hundred micrometers, preferably 1 to 100 micrometers.

In addition, it is preferable that at least six wire springs 60 are provided. At least two polarity powers for auto focusing control and four polarity power supplies for image stabilization motion movement are applied to the second printed circuit board 50. It is necessary to supply to the holder module 30 through the connection between the) and the plate member 40.

According to a preferred embodiment of the present invention, as shown in Figures 1 and 2, the same length, two each arranged in the corner portion of the holder module 30, it is good to have a total of eight to provide a balance .

On the other hand, as shown in Figure 2, if further comprises a separate third housing, such as the shield can 70, as described above, the second printed circuit board 50 is the first and second permanent Since the magnets 23 and 24 and the yoke 25 are fixedly bonded to the shield can 70 by epoxy or the like, in order to avoid this coupling portion, a window 55 is formed to form the window 55 and the first and second housings. (21) It covers the side wall surface of 22.

If the shield can 70 is removed, the second printed circuit board 50 may be formed of a PCB or the like, and the first and second permanent magnets 23 and 24 and the yoke may be formed therein. It is also possible to attach and fix 25, and as described above, the second printed circuit board 50 may be formed of a PCB, and the window 55 as described above is provided to the The first and second permanent magnets 23 and 24 and the yoke 25 can be inserted and further configured to be reinforced with a shielding tape or the like.

The shock absorbing part 100 is formed at a connection part w 'through which electrical connection is made by soldering or Ag bonding of the wire spring 60 and the plate member 40, and the impact and repetitive loads applied to the wire spring 60 are applied. To be absorbed.

As shown in FIG. 5, the buffer part 100 is formed near the edge of the plate member 40, and the slit 42 formed around the spring through hole 41 through which the wire spring 60 passes. The plate member 40 may be formed to be connected to the plate member 40, and may be configured to reciprocate in a direction parallel to the acceleration direction of the spring through-hole 41 around the buffer part 100.

At this time, according to the first embodiment of the present invention, the shape of the slit 42 may be configured to have a circular ring shape except for the buffer portion 100, as shown in FIG. . In this case, as illustrated in FIG. 6, the buffer hole 200 may be additionally formed at a position close to the spring through hole 41. When the buffer hole 200 conducts a conductive connection such as soldering to the wire spring 60 penetrated through the spring through hole 41, when the solder flows over the standard, overflow of lead leads to the buffer part. It is provided so as not to flow into the (100) side. That is, if too much lead is accidentally input by a worker, lead may flow to the buffer part 100 side. At this time, if a buffer hole 200 formed through the path is provided, the overflowed lead may be buffered again. Since it is introduced into the hole 200, it is no longer flowed to the buffer portion 100 side. Therefore, since the shock absorbing part 100 can maintain the flexible property of the plate member 40 as it is, even if an impact occurs in the wire spring 60, the shock is equal to the reciprocating movement of the connection part w '. It can be absorbed through morphology.

Meanwhile, according to the second preferred embodiment of the present invention, as shown in FIG. 7, the shape of the buffer part 100 may be configured to be symmetric about the spring through-hole 41. In this case, as shown in FIG. 8, a buffer hole 200 may be formed around the spring through hole 41. The function of the buffer hole 200 is the same.

In addition, the shape of the buffer hole 200 may be configured as an arc (arc), as shown in Figure 6, may be configured as a circular as shown in Figure 8, but is not limited to this, solder Any shape can be used as long as the conductive connecting member can flow in.

However, the buffer hole 200 needs to be formed between the buffer part 100 and the spring through hole 41, and when the buffer hole 200 is formed too large, the buffer hole 200 lowers the strength around the buffer part 100. It is preferable to configure smaller than the area of the spring through-hole (41). According to such a structure, it can prevent that the connection part w 'of the said plate member 40 is damaged by an external shock.

On the other hand, the general assembly sequence after combining the bobbin 32 and the outer blade 31, using a jig, the second housing 22, the plate member 40 and the second printed circuit board 50 and the wire spring ( 60, the bobbin 32 provided with the lens barrel is coupled, and then the first housing 21 is connected and mounted on the first printed circuit board 10. Before connecting the first housing 21, the permanent magnet and the yoke coupling may be made first. This assembly order may be changed as necessary. That is, it may be possible directly in the equipment without jig. In this process, even if the force for inserting and coupling the bobbin 32 provided with the lens barrel acts too largely to impart the connection portion (w '), the buffer portion 100 can absorb this excessive force. That is, when the shock absorbing part 100 is pulled in the direction of gravity due to the load generated in the wire spring 60 near the connection portion (w ') of the wire spring 60 and the plate member 40, or shaken from side to side The generated load absorbs the generated load as strain energy due to the reciprocating movement around the buffer part 100.

Therefore, the connection work may be performed again due to the breakage of the connection part (w ') during the assembling process, or it may be prevented that the parts may not be used, and a more reliable camera module may be produced.

On the other hand, according to a preferred embodiment of the present invention, having a through hole at a position corresponding to the holder module 30 around the connection portion (w) of the second printed circuit board 50 and the wire spring 60, the housing It may further include a shield can 70 is installed to surround the unit (21) (22). In this case, as described above, the second printed circuit board 50 may be attached and fixed to the inner circumferential surface of the shield can 70. On the other hand, the shield can 70 is not necessarily required, it may be omitted depending on the configuration of the housing unit (21) (22).

On the other hand, as shown in Figure 2, in order to fix the shield can 70 to the first housing 21 may be provided with a hook unit 80 on at least one side or at least one side. The location may be within the range allowed by the center or edge design, and the number may be provided in one or a plurality.

The hook unit 80 may include a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81. If necessary, the configuration may be reversed.

The embodiments of the present invention described above and illustrated in the drawings should not be construed as limiting the technical idea of the present invention. The protection scope of the present invention is limited only by the matters described in the claims, and those skilled in the art can change and change the technical idea of the present invention in various forms. Therefore, such improvements and modifications will fall within the protection scope of the present invention, as will be apparent to those skilled in the art.

10; A first printed circuit board 20; Housing unit
21; First housing 22; Second housing
23; First permanent magnet 24; 2nd permanent magnet
25; Yoke 30; Holder module
31; Outer blade 31a; First coil
32; Bobbin 32a; 2nd coil
40; Plate member 50; 2nd printed circuit board
52; Terminal 60; Wire spring
70; Shield can 80; Hook unit
100; Buffer 200; Buffer hole

Claims (20)

Base;
A second printed circuit board comprising a first portion disposed on the base and a second portion extending downward from the first portion;
A holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a plate member disposed on the outer blade;
A second coil disposed on the bobbin;
A permanent magnet for moving the bobbin through interaction with the second coil;
A first coil for moving the holder module through interaction with the permanent magnet;
A wire electrically connecting the second printed circuit board to the holder module; And
A first solder coupling the plate member and the wire,
The plate member includes a coupling portion including a hole through which the wire passes, a body portion coupled to the outer blade, a connection portion extending from a first portion of the coupling portion and connected to the body portion, and a second coupling portion. An image stabilization device comprising an extension portion extending from the portion and the end portion spaced apart from the body portion. The method of claim 1,
The end of the extension is image stabilization device is formed in the free end. The method of claim 1,
The first portion of the coupling portion and the second portion of the coupling portion are spaced apart from each other,
And the connecting portion extends in a first direction and the extending portion extends in a second direction different from the first direction. The method of claim 3,
The first direction is a camera shake correction device in a direction opposite to the second direction. The method of claim 1,
The wire passes through the hole of the engaging portion of the plate member and is connected to the engaging portion of the plate member by the first solder,
The engaging portion of the plate member comprises a curved surface,
And the extension portion of the plate member extends from the curved surface of the coupling portion. The method of claim 1,
At least a portion of the plate member is a camera shake correction device is fixed to the outer blade through an adhesive. The method of claim 1,
And the extension portion of the plate member extends from the coupling portion of the plate member to the opposite side of the hole. The method of claim 1,
A side surface of the coupling part of the plate member includes a curved surface,
And the extension portion of the plate member extends from the side surface of the coupling portion of the plate member to a width smaller than the width of the coupling portion. The method of claim 1,
And the width of the extension portion of the plate member corresponds to the width of at least a portion of the connection portion of the plate member. The method of claim 1,
The outer periphery of the coupling portion of the plate member is formed in a circular shape outside the portion connected to the extension portion and the connecting portion. The method of claim 1,
The plate member is formed of an electrically conductive metal material and is electrically coupled with the wire to supply power to the second coil. The method of claim 1,
And the second coil is directly connected to the plate member. The method of claim 1,
At least a portion of the connecting portion is formed with a shock absorber to absorb shock and repetitive load added to the wire. The method of claim 1,
The camera shake compensation device of the plate member is disposed at a position corresponding to the corner of the outer blade. The method of claim 1,
And a hole formed between the body portion of the plate member and the coupling portion of the plate member. The method of claim 1,
A lower spring connecting the lower part of the bobbin and the lower part of the outer blade;
A shield can including a top plate and a side plate extending from the top plate, and receiving the holder module therein; And
And a second solderer for coupling the first portion and the wire to the second printed circuit board. A first printed circuit board;
An image sensor disposed on the first printed circuit board;
The image stabilizer of any one of claims 1 to 16, disposed on the first printed circuit board; And
And a lens coupled to the bobbin of the image stabilizer. A mobile phone comprising the camera module of claim 17. Base;
A second printed circuit board comprising a first portion disposed on the base and a second portion extending downward from the first portion;
A holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a plate member disposed on the outer blade;
A second coil disposed on the bobbin;
A permanent magnet for moving the bobbin through interaction with the second coil;
A first coil for moving the holder module through interaction with the permanent magnet;
A wire electrically connecting the second printed circuit board to the holder module; And
A first solder coupling the plate member and the wire,
The plate member includes a coupling portion coupled to the wire, a body portion coupled to the outer blade, a connection portion connecting the coupling portion and the body portion, and an extension portion extending from the coupling portion and having a free end formed at an end thereof. Image stabilization device comprising. Base;
A second printed circuit board comprising a first portion disposed on the base and a second portion extending downward from the first portion;
A holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a plate member disposed on the outer blade;
A second coil disposed on the bobbin;
A permanent magnet for moving the bobbin through interaction with the second coil;
A first coil for moving the holder module through interaction with the permanent magnet; And
And a wire for electrically connecting the second printed circuit board and the holder module.

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