KR20200043348A - Camera Module - Google Patents

Abstract

According to the present invention, provided is a camera module, which comprises: a first printed circuit board on which an image sensor is mounted; a housing unit disposed on an upper side of the first printed circuit board; a holder module disposed at a predetermined distance from an inner bottom surface of the housing unit, having a first coil wound on an outer circumferential surface, and having at least one lens installed therein; a second printed circuit board coupled to a bottom surface of the holder module; a third printed circuit board disposed on an upper side the holder module to form a ceiling surface; a plurality of wire springs having one end connected with the second printed circuit board and the other end connected with the third printed circuit board, while the second and third printed circuit boards are electrically connected to support the pendulum movement of the holder module; and a buffer unit integrally formed in a portion of the wire spring.

Description

Camera module

The present invention relates to a camera module.

In the case of a camera module mounted on a small electronic product, the camera module may be frequently shocked during use, and the camera module may be shaken finely according to a user's hand shaking during shooting. In view of this, a camera module having a hand shake preventing means has been recently disclosed.

For example, in Korean Patent Registration No. 10-0741823 (registered on July 16, 2007), a gyro sensor IC or an angular velocity sensor is installed inside a device in which a camera module such as a mobile phone is mounted to correct hand tremor. How to do is introduced.

However, if a separate angular velocity detection sensor is provided in this way, a separate detection sensor must be provided in order to implement a camera shake prevention function, which increases manufacturing cost, and configures and installs a camera shake prevention device separately from the camera module. There is a hassle of preparing a space.

(Patent Document 1) KR10-0741823 B1

An object of the present invention is to provide a camera module having an optical image stabilizer function.

The camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; A housing unit disposed on the first printed circuit board; A holder module disposed at a predetermined distance from the inner bottom surface of the housing unit, the first coil wound on the outer circumferential surface, and including at least one lens therein; A second printed circuit board located on the bottom surface of the holder module; A third printed circuit board disposed on the holder module to form a ceiling surface; One end is connected to the second printed circuit board, the other end is connected to the third printed circuit board, while connecting the second and third printed circuit boards to be energized, a plurality of movably supporting the holder module Wire springs; It characterized in that it comprises a.

According to an exemplary embodiment of the present invention, the buffer part is further included in a portion of the wire spring, and the buffer part is preferably formed integrally with the wire spring.

In this case, the buffer part may be formed near the connection part of the wire spring and the third printed circuit board, and the connection part of the wire spring and the third printed circuit board, and near the connection part of the wire spring and the second printed circuit board. All may be formed, or may be formed near the connection portion of the wire spring and the second printed circuit board.

The housing unit may include: a first housing disposed on the first printed circuit board; A second housing disposed on an upper side of the first housing and on which the third printed circuit board is installed; First and second permanent magnets interposed between the first and second housings; It is preferably disposed between the first and second permanent magnets, and transmits a magnetic force into the holder module, and a yoke protruding near the center toward the holder module.

The housing unit may include: a first housing disposed on the first printed circuit board; A second housing disposed on an upper side of the first housing and on which the third printed circuit board is installed; First and second permanent magnets located on inner surfaces of the first and second housings; It is preferably disposed between the first and second permanent magnets, and transmits a magnetic force into the holder module, and a yoke protruding near the center toward the holder module.

According to a preferred embodiment of the present invention, the third printed circuit board and the wire spring has a through hole at a position corresponding to the connection portion and the lens module, the shield can is installed to surround the housing unit; good.

The holder module includes: an outer blade on which the first coil is wound on the outer circumferential surface; A bobbin which is elastically supported by an elastic member on an upper side of the outer blade, is disposed to move up and down inside the outer blade, a second coil is wound on its outer circumferential surface, and at least one lens is installed therein; And upper and lower elastic members disposed on the upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade. The center of the first coil may be magnetically invested toward the second coil side. It is preferable that the space portion is formed.

At this time, the second printed circuit board is preferably installed on the bottom surface of the outer blade, the second printed circuit board may be fixed to the bottom surface of the outer blade with an adhesive member.

Further, the second coil may be electrically connected to the lower spring, and the lower spring may be electrically connected to the wire spring on the second printed circuit board.

The wire spring is provided with at least six, and supplies two polarities for autofocusing control and four polarities for image stabilization movement to the holder module through connection with the second and third printed circuit boards. It is preferred.

In addition, it is preferable that the wire springs are provided with the same length, and it is preferable that a total of eight is provided by being arranged two at each corner portion of the holder module.

In addition, the second coil is preferably connected to the second printed circuit board so that it can be directly energized.

Since the present invention has a buffer portion in the wire spring so as to absorb the load applied repeatedly, it can be firmly connected to the connection portion of the printed circuit board.

In addition, even if the wire spring receives excessive force during the assembly process of the lens module, it is possible to absorb excessively applied force from the shock absorbing member, thereby improving assembly performance and minimizing component loss due to assembly failure.

1 is a schematic plan view of a camera module according to an embodiment of the present invention,
2 is a cross-sectional view taken along line AA of FIG. 1 according to the first embodiment of the present invention;
3 is a side view of a camera module according to an embodiment of the present invention,
4 is a side view showing a state in which the shield can of FIG. 3 is removed;
5 is an enlarged view of a portion B of FIG. 2,
6 is a cross-sectional view taken along line AA of FIG. 1 according to a second embodiment of the present invention, and
7 is an AA cross-sectional view of FIG. 1 according to a third embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is an AA sectional view of FIG. 1 according to a first embodiment of the present invention, and FIG. 3 is an enlarged view of a portion B of FIG. 2 , FIG. 4 is an AA sectional view of FIG. 1 according to a second embodiment of the present invention, and FIG. 5 is an AA sectional view of FIG. 1 according to a third embodiment of the present invention.

As shown in FIG. 2, which shows a schematic plan view of FIG. 1 and a schematic side view of AA cross-section of FIG. 1, the camera module according to the present invention includes a first printed circuit board 10, a housing unit 20 , A holder module 30, a second printed circuit board 40, a third printed circuit board 50, a wire spring 60 and a buffer part 100.

The first printed circuit board 10 is mounted on the image sensor 11 approximately in the vicinity of the center, and is preferably provided as a PCB substrate. Components for the operation of the image sensor 11 may be disposed on the first printed circuit board 10, or a plurality of terminal units capable of outputting power and outputting information of the image sensor 11 may be provided. .

The housing unit 20 is disposed above the first printed circuit board 10 and forms a skeleton of a camera module. According to one preferred embodiment of the present invention, the housing unit 20, the first housing 21, the second housing 22, the first and second permanent magnets 23, 24 and yoke 25 It includes.

The first housing 21 is a base and is disposed on an upper side of the first printed circuit board 10 and is provided to be spaced apart from the image sensor 11 by a predetermined distance. If necessary, a filter member capable of filtering the image image incident on the image sensor 11 may be further installed in the first housing 21.

The second housing 22 is disposed above the first housing 21 and is configured to cover the first housing 21. In the vicinity of the center of the second housing 22, an opening is formed at a corresponding position so that an image can be transferred to the image sensor 11 side. On the upper side of the second housing 22, a third printed circuit board 50, which will be described later, is adhesively fixed by a fixing member such as a double-sided tape or an adhesive, but is not limited thereto. It is also possible to provide a separate third housing, such as a case or a shield can, for the third printed circuit board 50 to fix the third printed circuit board 50 with the above-described fixing member on its inner surface. If a third housing is provided, the third printed circuit board 50 may be pressed and supported by the third housing without a separate fixing member.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 to invest magnetic force into the holder module 30. The first and second permanent magnets 23 and 24 are preferably provided with the same size. In addition, the first and second permanent magnets 23, 24 and the yoke 25 may be disposed on the inner surfaces of the first and second housings if possible within the design allowable range.

On the other hand, when the sizes of the first and second permanent magnets 23 and 24 are increased, OIS driving is increased even at a small current, and if the first and second permanent magnets 23 and 24 are constant in size, In the case, as the current flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 increases, the OIS driving increases. In conclusion, the larger the size of the first and second permanent magnets 23 and 24, the better the OIS driving, but it is desirable to design the optimum size within other design allowances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24. In addition, the yoke 25 is provided in a shape protruding near the center so that the magnetic force of the first and second permanent magnets 23 and 24 can be injected into the inner space of the holder module 30. Preferably, the width is provided in the same manner as the first and second permanent magnets 23 and 24, and the center is projected to a certain size so that the permanent magnets and the yokes are formed to have an approximately "T" shape. desirable.

The holder module 30 is disposed at a predetermined distance from the inner bottom surface of the housing unit 20, and is composed of an outer blade 31 and a bobbin 32. The holder module 30 is capable of pendulum movement in the front / rear / left / right and diagonal directions while hanging from the wire spring 60.

The upper and lower sides of the outer blade 31 are provided with spring members 35 and 36, and are elastically supported by the spring member 35, and are connected to enable vertical movement of the bobbin 32.

As illustrated in FIG. 1, the outer blade 31 has a total of four first coils 31a to 31d wound on the outer circumferential surface of the four sides, and the central portion of the four sides where the coils 31a to 31d are wound. It is drilled without a coil. The yoke 25 is disposed at a position corresponding to the perforated space, and the yoke 25 may be partially inserted inside the space.

A second printed circuit board 40 may be fixed to the bottom surface of the outer blade 31 by a fixing member 33 such as double-sided tape or adhesive. The outer blade 31, as shown in the arrow of Figure 2 according to the interaction of the magnetic force of the first and second permanent magnets 22 and 23 and the first coil 31a, diagonally back and forth or diagonally Hanging by a plurality of wire springs 60 so as to be movable, it is arranged spaced a predetermined distance from the bottom surface of the first housing (21).

In addition, a plurality of spring through holes 37 may be provided in the outer blade 31 so that the wire spring 60 penetrates and is connected to the second printed circuit board 40.

In the bobbin 32, the outer blade 31 is disposed to be movable up and down inside, and at least one lens 34 is installed therein. On the outer circumferential surface of the bobbin 32, a second coil 32a is wound, and the second coils 32a have first coils 31a to 31d of the outer blade 31 through the yoke 25. The bobbin 32 is raised and lowered by interaction with the magnetic force invested through the empty space. The larger the yoke 25 size, the better the AF driving, but this may also vary depending on the optimum design value. It is possible to automatically adjust the focus of the image transmitted to the image sensor 11 by the lifting action of the bobbin 32.

The second printed circuit board 40 is disposed on the bottom surface of the outer blade 31 as described above, so that the wire spring 60 is provided to supply power to the first and second coils 31a and 32a. Connected. The connection method may be any method as long as it can be connected by soldering or other conductive materials. That is, the connecting portion (w ') of the second printed circuit board 40 is connected to the first and second coils (31a) (32a), respectively, as shown in Figure 2, the wire spring (60) ) To transmit the power supplied through the first and second coils 31a and 32a to form electromagnetic force.

At this time, in the case of the second coil 32a, it may be directly connected to the second printed circuit board 40, as shown in FIG. 2, first connected to the lower spring 36, and then the lower spring 36 ) May be connected to the second printed circuit board 40.

The third printed circuit board 50 is fixed to the upper side of the second housing 22 by a fixing member such as a double-sided tape or an adhesive member, the third connected to the first printed circuit board 10 The power transmitted through the terminal portion 52 of the printed circuit board 50 is transmitted to the second printed circuit board 40 through a wire spring 60 connected with the second printed circuit board 40. The connection method may be any method as long as it can be connected by soldering or other conductive materials.

The third printed circuit board 50 is provided to cover one side of the first and second housings 21 and 22, as shown in FIGS. 3 and 4, wherein the first and second The windows 55 are formed on the surfaces facing the second permanent magnets 23, 24 and the yoke 25, so that interference with them can be avoided. The third printed circuit board 50 includes a first portion 56 disposed above the base 21 and a plurality of terminals 52 extending downward from the first portion 56 as shown in FIG. 2. It may include a second portion 57 to include.

This is because the first and second permanent magnets 23, 24 and the yoke 25 are generally attached directly to a shield can 70, which will be described later, with a fixing means such as epoxy, to avoid this.

On the other hand, the second printed circuit board 40 and the third printed circuit board 50 may be a flexible printed circuit board (FPCB), a printed circuit board (PCB) or an R-FPCB (Rigid FPCB integrated type), but this It is not limited, and any substrate can be electrically connected.

Both ends of the wire spring 60 are connected to the second and third printed circuit boards 40 and 50. At this time, one end of the wire spring 60 is connected to a pad 51 formed on the third printed circuit board 50, as shown in FIG. 5, the wire spring in the center of the pad 51 A through hole 53 through which the 60 is penetrated is formed. The connection method may be any method as long as it can be connected by soldering or other conductive materials. Meanwhile, a solder register (SR) is provided around the pad 51 to protect the surface of the third printed circuit board 50, and the pad 51 area can be connected to be energized by opening a solder resistor. have.

In this way, the wire spring 60 connected from the pad 51 supplies power supplied through the terminal 52 to the second printed circuit board 40 side, so that the first and second coils 31a ( 32a) enables interaction with the first and second permanent magnets 23 and 24.

In addition, the other end of the wire spring 60, as shown in Figure 2, passes through a spring through hole 37 formed in the outer blade 31, a second installed on the bottom surface of the outer blade 31 It is connected to the printed circuit board 40. At this time, the other end of the wire spring 60, although not shown, is connected to a pad (not shown) formed on the second printed circuit board 40 like the third printed circuit board 50, the pad In the center (not shown), a through hole (not shown) through which the wire spring 60 passes is formed. The connection method may be any method as long as it can be connected by soldering or other conductive materials. According to this configuration, the outer blade 31 is suspended from the wire spring 60, and may be spaced apart from the bottom surface of the first housing 21 by a predetermined distance or more. Then, according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24, the outer blade 31 performs a pendulum motion, thereby causing the outer blade to be shaken by hand shaking. It is possible to correct the vibration of 31 by the interaction between the first coil 31a and the first and second permanent magnets 23 and 24. To this end, the wire spring 60 is preferably made of a metal material that has elasticity and can conduct electricity to withstand the impact.

On the other hand, the thinner the wire spring 60 is, the better the image stabilization movement is at a small current, but this may vary depending on the optimum design value. Preferably, the wire spring 60 has a thickness of several μm to hundreds of μm, preferably 1 to 100 μm.

In addition, it is preferable that the wire spring 60 is provided with at least six, at least two polarities for auto focusing control and four polarity power supplies for image stabilization movement image stabilization in the second and third printed circuits. It is necessary to supply the holder module 30 through connection with the substrates 40 and 50.

According to an exemplary embodiment of the present invention, as shown in FIGS. 1 and 2, it is good to balance the same length, two each being disposed at the corner portion of the holder module 30, eight in total. . The holder module 30 may include first to fourth corner portions 30a, 30b, 30c, and 30d as shown in FIG. 1. The wire 60 may be disposed in the first to fourth corner portions 30a, 30b, 30c, and 30d of the holder module 30. The plurality of wires 60 may include six wires. Two of the six wires may be disposed in the first corner portion 30a, and the other two wires of the six wires may be disposed in the third corner portion 30c. The first corner portion 30a of the holder module 30 and the third corner portion 30c of the holder module 30 may be disposed on opposite sides of the optical axis.

On the other hand, as shown in Figures 2, 6 and 7, further comprising a separate third housing, such as shield can 70, as described above, the third printed circuit board 50 is the Since the first and second permanent magnets 23, 24 and the yoke 25 are fixedly bonded to the shield can 70 by epoxy or the like, to avoid this bonding portion, a window 55 is formed to The sidewall surfaces of the first and second housings 21 and 22 are covered.

If, when the shield can 70 is removed, the third printed circuit board 50 is formed of a PCB or the like, and the first and second permanent magnets 23, 24 and yokes ( 25) can be attached and fixed, and the third printed circuit board 50 is composed of a PCB as described above. The first and second permanent magnets 23, 24 and the yoke 25 may be inserted and additionally reinforced with shielding tape or the like.

It is preferable that the buffer part 100 is integrally formed in a part of the wire spring 60. According to a first preferred embodiment of the present invention, the buffer part 100 is as shown in Figures 2 and 5, the wire spring 60 and the connecting portion (w) of the third printed circuit board 50 and , It is preferably formed near the connecting portion (w ') of the wire spring 60 and the second printed circuit board 40.

At this time, the buffer portion 100 is preferably formed to have the first and second bent portion 110, 120 in a position that does not interfere with the second housing 22 of the wire spring 60 , It is not limited to this, and bent twice or more as necessary, so that the load applied to the wire spring 60 can be absorbed at the bent point.

That is, as shown in FIG. 3, the first and second bent portions 110 and 120 become a moment center of the bent wire spring 60 according to a load applied to the wire spring 60, The bending wire spring 60 can be deformed in a straight line. Accordingly, since the deformation around the first and second bent portions 110 and 120 serves to absorb the load added to the wire spring 60, the third printed circuit board 50 By reducing the load applied to the pad 51 provided in the, it is possible to reduce the load applied directly to the connecting portion (w) fixing the wire spring 60.

According to a second preferred embodiment of the present invention, the buffer part 100 is formed only near the connection part w of the wire spring 60 and the third printed circuit board 50, as shown in FIG. It may be. That is, since the connecting portion w of the wire spring 60 and the third printed circuit board 50 is a location where a concentrated load of the wire spring 60 hanging from the holder module 30 is applied, the outer blade ( 31) It takes a relatively large force compared to the connecting portion w 'connected to the second printed circuit board 40 installed on the bottom surface. Accordingly, the buffer part 100 may be provided only at a position close to the connection part w of the wire spring 60 and the third printed circuit board 50.

In addition, according to a third preferred embodiment of the present invention, the buffer portion 100, as shown in Figure 7, the connecting portion (w ') of the wire spring 60 and the second printed circuit board 40 It can be formed only in the vicinity. Of course, as described in the second embodiment, the intensively loaded position is the connecting portion w of the wire spring 60 and the third printed circuit board 50, but the wire spring on the extension line of the load Even if installed near the connecting portion w 'of the 60 and the second printed circuit board 40, since the load absorption occurs in this part as in the first and second embodiments described above, as a result, the wire spring ( 60) and the load applied to the connecting portion w of the third printed circuit board 50 can be reduced.

On the other hand, the general assembly sequence, after combining the bobbin 32 and the outer blade 31, using a jig, the second housing 22, the second and third printed circuit boards 40, 50 and the wire spring ( 60), and after combining the bobbin 32 provided with the lens barrel, the first housing 21 is connected to mount it on the first printed circuit board 10. Before connecting the first housing 21, a permanent magnet and yoke coupling may be made first. This assembly sequence may be changed as necessary. That is, it may be possible right from the machine without a jig. In this process, even if the force of inserting and engaging the bobbin 32 provided with the lens barrel acts too largely to force the connection parts w and w ', the buffer part 100 can absorb this excessive force. .

That is, the buffer portion 100, as shown in Figures 2 and 3, the wire spring 60 and the load on the wire spring 60 in the vicinity of the connecting portion (w) of the third printed circuit board 50 When this occurs and is pulled in the direction of gravity or shakes from side to side, the load generated is absorbed as the deformation energy of the buffer part 100.

Therefore, during the assembly process, it is possible to perform the connection operation again due to the damage of the connecting parts (w, w '), or to prevent the hassle that parts cannot be used, and it is possible to produce a more reliable camera module.

On the other hand, according to a preferred embodiment of the present invention, the third printed circuit board 50 and the wire spring 60 has a through hole at a position corresponding to the lens module 30 around the connecting portion (w), the housing It may further include a shield can 70 that is installed to surround the units 21 and 22. In this case, as described above, the third printed circuit board 50 may be fixedly attached to the inner circumferential surface of the shield can 70. Meanwhile, the shield can 70 is not necessarily required, and may be omitted depending on the configuration of the housing units 21 and 22.

On the other hand, as shown in Figures 2, 6 and 7, to secure the shield can 70 to the first housing 21, four or at least one or more hook units 80 to be provided on the You can. The position may be within a range permitted by the center or edge design, and the number may be provided in one or more.

The hook unit 80 may be composed of a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81, However, if necessary, it may be configured to the opposite.

The embodiments of the present invention described above and illustrated in the drawings should not be construed as limiting the technical spirit of the present invention. The scope of protection of the present invention is limited only by the items described in the claims, and a person having ordinary knowledge in the technical field of the present invention can improve and modify the technical spirit of the present invention in various forms. Therefore, such improvements and modifications will fall within the protection scope of the present invention as long as it is apparent to those skilled in the art.

10; A first printed circuit board 20; Housing unit
21; First housing 22; 2nd housing
23; First permanent magnet 24; 2nd permanent magnet
25; York 30; Holder module
31; Outer blade 31a; 1st coil
32; Bobbin 32a; 2nd coil
33; Fixing member 34; lens
35, 36; Upper and lower elastic members 37; Spring through
40; A second printed circuit board 50; 3rd printed circuit board
60; Wire spring 70; Shield can
80; Hook unit 100; Buffer
w; A connecting portion w 'of the third printed circuit board; Connection part of the second printed circuit board

Claims (20)

Base;
A holder module including an outer blade spaced from the base, a bobbin disposed in the outer blade, and a spring member coupled to the outer blade;
A second coil disposed on the bobbin;
A magnet configured to interact with the second coil to move the bobbin;
A first coil adapted to move the holder module by interacting with the magnet;
A wire supporting the holder module and electrically connected to the second coil through the spring member; And
OIS driving device including a buffer portion connected to the wire to absorb the load applied to the holder module and including a bent portion bent at least twice. According to claim 1,
The bent portion includes a first bent portion and a second bent portion,
The first bent portion is formed by a first portion extending in a first direction and a second portion extending from the first portion in a second direction different from the first direction,
The second bending part is formed by the second portion and a third portion extending from the second portion in a third direction different from the second direction. According to claim 2,
An OIS driving device in which an obtuse angle is formed by the first portion and the second portion of the first bent portion. According to claim 2,
The third direction is OIS driving device parallel to the first direction. According to claim 1,
The shock absorber is an OIS driving device electrically connected to the second coil. According to claim 1,
The holder module includes first to fourth corner portions,
The wire is disposed in the first to fourth corner portions of the holder module,
The wire includes six wires,
Two of the six wires are disposed in the first corner portion, and the other two wires of the six wires are disposed in the third corner portion,
The first corner portion of the holder module and the third corner portion of the holder module are OIS driving devices disposed opposite to each other based on the optical axis. According to claim 1,
A third printed circuit board including a first portion disposed on the base and a second portion extending downward from the first portion,
The wire is an OIS driving device coupled to the first portion of the third printed circuit board. The method of claim 7,
The wire includes six wires having the same height,
The buffer part includes six buffer parts,
The six buffer units are OIS driving devices connected to the six wires, respectively. The method of claim 8,
The third printed circuit board includes a plurality of terminals,
The plurality of terminals of the third printed circuit board include two terminals for focusing and four terminals for image stabilization,
The second coil is an OIS driving device electrically connected to the two terminals for focusing through the spring member and two of the six wires. The method of claim 7,
A first solder disposed at one end of the wire to couple the wire to the holder module; And
And a second solder disposed at the other end of the wire to apply current to the second coil,
The wire and the spring member are electrically connected through the first solder,
The first portion of the third printed circuit board is an OIS driving device disposed between the first solder and the second solder. The method of claim 10,
The second solder connects the wire to the first portion of the third printed circuit board,
The third printed circuit board includes a pad formed on the first portion of the third printed circuit board and including a hole,
The pad includes a first surface facing the holder module, and a second surface opposite the first surface,
The wire passes through the hole of the pad and the OIS driving device is coupled to the second surface of the pad. According to claim 1,
The spring member includes an upper spring member coupled to an upper portion of the outer blade, and a lower spring member coupled to a lower portion of the outer blade,
The buffer portion is disposed closer to the outer blade than the base,
The shock absorber is an OIS driving device disposed closer to the upper spring member than the lower spring member. According to claim 1,
It includes a shield can coupled to the base,
The magnet includes four magnets,
The first coil is an OIS driving device including four first coils. A first printed circuit board;
An image sensor disposed on the first printed circuit board;
The OIS driving device of claim 1 disposed on the first printed circuit board; And
A camera module including a lens coupled to the bobbin of the OIS driving device. A mobile phone comprising the camera module of claim 14. Base;
A holder module including an outer blade spaced from the base, a bobbin disposed in the outer blade, and a spring member coupled to the outer blade;
A second coil disposed on the bobbin;
A magnet configured to interact with the second coil to move the bobbin;
A first coil adapted to move the holder module by interacting with the magnet;
A wire supporting the holder module and electrically connected to the second coil through the spring member; And
It includes a buffer connected to the wire,
The buffer portion includes a first bent portion and a second bent portion,
The first bent portion is formed by a first portion extending in a first direction and a second portion extending from the first portion in a second direction different from the first direction,
The second bending part is formed by the second portion and a third portion extending from the second portion in a third direction different from the second direction. The method of claim 16,
An OIS driving device in which an obtuse angle is formed by the first portion and the second portion of the first bent portion. The method of claim 16,
The third direction is OIS driving device parallel to the first direction. The method of claim 16,
The shock absorber is an OIS driving device electrically connected to the second coil. Base;
A holder module including an outer blade spaced from the base, a bobbin disposed in the outer blade, and a spring member coupled to the outer blade;
A second coil disposed on the bobbin;
A magnet configured to interact with the second coil to move the bobbin;
A first coil adapted to move the holder module by interacting with the magnet;
OIS driving device including a wire for supporting the holder module.

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