KR102273181B1 - Camera Module - Google Patents

Abstract

The camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; a housing unit disposed above the first printed circuit board; a holder module disposed to be spaced apart from an inner bottom surface of the housing unit by a predetermined distance, a first coil wound around an outer circumferential surface, and at least one lens installed therein; a second printed circuit board coupled to the bottom surface of the holder module; a third printed circuit board disposed above the holder module to form a ceiling surface; One end is connected to the second printed circuit board, and the other end is connected to the third printed circuit board, so that the second and third printed circuit boards are energized while supporting the holder module in a pendulum motion. a plurality of wire springs; It characterized in that it comprises a; buffer portion integrally formed in a portion of the wire spring.

Description

Camera Module

The present invention relates to a camera module.

In the case of a camera module mounted on a small electronic product, the camera module may frequently be impacted during use, and the camera module may be slightly shaken depending on a user's hand shake while shooting. In view of this point, recently, a camera module having a hand shake preventing means has been disclosed.

As an example, in Korea Patent Registration No. 10-0741823 (registered on July 16, 2007), a gyro sensor IC or an angular velocity sensor is installed inside a device on which a camera module such as a mobile phone is mounted in order to correct hand shake. How to do it is introduced.

However, when a separate angular velocity detection sensor is provided in this way, it is necessary to provide a separate detection sensor to implement the hand shake prevention function, which causes an increase in manufacturing cost, and it is necessary to configure and install the hand shake prevention device separately from the camera module. There is a hassle of having to prepare a space.

(Patent Document 1) KR10-0741823 B1

An object of the present invention is to provide a camera module having an optical image stabilizer function.

The camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; a housing unit disposed above the first printed circuit board; a holder module disposed to be spaced apart from an inner bottom surface of the housing unit by a predetermined distance, a first coil wound around an outer circumferential surface, and including at least one lens therein; a second printed circuit board positioned on the bottom surface of the holder module; a third printed circuit board disposed above the holder module to form a ceiling surface; A plurality of ends connected to the second printed circuit board and the other end connected to the third printed circuit board to energize the second and third printed circuit boards while movably supporting the holder module four wire springs; It is characterized in that it includes.

According to a preferred embodiment of the present invention, further comprising a buffer portion in a portion of the wire spring, it is preferable that the buffer portion is integrally formed with the wire spring.

In this case, the buffer part may be formed near the connection part of the wire spring and the third printed circuit board, and the connection part between the wire spring and the third printed circuit board, and the wire spring and the second printed circuit board near the connection part. All of them may be formed, or may be formed near the connection portion between the wire spring and the second printed circuit board.

The housing unit may include a first housing disposed above the first printed circuit board; a second housing disposed above the first housing and having the third printed circuit board installed thereon; first and second permanent magnets interposed between the first and second housings; It is preferable to include; a yoke disposed between the first and second permanent magnets to transmit a magnetic force to the inside of the holder module and protruding near the center toward the holder module.

The housing unit may include a first housing disposed above the first printed circuit board; a second housing disposed above the first housing and having the third printed circuit board installed thereon; first and second permanent magnets positioned on inner surfaces of the first and second housings; It is preferable to include; a yoke disposed between the first and second permanent magnets to transmit a magnetic force to the inside of the holder module and protruding near the center toward the holder module.

According to a preferred embodiment of the present invention, a shield can having a through hole at a position corresponding to the connection portion between the third printed circuit board and the wire spring and the lens module, and installed to surround the housing unit; further comprising good.

The holder module may include an outer blade on which a first coil is wound on an outer circumferential surface; a bobbin elastically supported by an elastic member on the upper side of the outer blade, arranged to be movable up and down inside the outer blade, a second coil is wound on an outer peripheral surface thereof, and at least one lens is installed therein; and upper and lower elastic members respectively disposed on the upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade, wherein the center of the first coil has a magnetic force applied toward the second coil. It is preferable that the space portion is formed so that the

In this case, the second printed circuit board is preferably installed on the bottom surface of the outer blade, and the second printed circuit board may be fixed to the bottom surface of the outer blade by an adhesive member.

In addition, the second coil may be electrically connected to the lower spring, and the lower spring may be electrically connected to the wire spring in the second printed circuit board.

The wire spring is provided with at least six, and supplies two polarity power for auto-focusing control and four polarity power for hand-shake correction to the holder module through connection with the second and third printed circuit boards. it is preferable

In addition, it is preferable that the wire springs are provided with the same length, and two are arranged at the corners of the holder module, and a total of eight are preferably provided.

In addition, the second coil may be directly connected to the second printed circuit board to be energized.

Since the present invention has a buffer part in the wire spring to absorb the load repeatedly applied, it can be firmly connected to the connection part of the printed circuit board.

In addition, even if the wire spring receives an excessive force during the assembly process of the lens module, it is possible to absorb the excessively applied force from the buffer member, thereby improving assembling property and minimizing loss of parts due to assembly defects.

1 is a schematic plan view of a camera module according to an embodiment of the present invention;
2 is a cross-sectional view taken along line AA of FIG. 1 according to a first embodiment of the present invention;
3 is a side view of a camera module according to an embodiment of the present invention;
4 is a side view showing a state in which the shield can of FIG. 3 is removed;
5 is an enlarged view of part B of FIG. 2;
6 is a cross-sectional view taken along line AA of FIG. 1 according to a second embodiment of the present invention, and,
7 is a cross-sectional view taken along line AA of FIG. 1 according to a third embodiment of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1 according to a first embodiment of the present invention, and FIG. 3 is an enlarged view of part B of FIG. , FIG. 4 is a cross-sectional view taken along line AA of FIG. 1 according to a second exemplary embodiment of the present invention, and FIG. 5 is a cross-sectional view taken along line AA of FIG. 1 according to a third exemplary embodiment of the present invention.

As shown in Fig. 2 showing a schematic plan view of Fig. 1 and a schematic side view showing a cross section AA of Fig. 1, the camera module according to the present invention is a first printed circuit board (10), a housing unit (20) , a holder module 30 , a second printed circuit board 40 , a third printed circuit board 50 , a wire spring 60 and a buffer unit 100 .

The image sensor 11 is mounted on the first printed circuit board 10 in the vicinity of the center, and it is preferable that the first printed circuit board 10 is provided as a PCB board. Components for operation of the image sensor 11 may be disposed on the first printed circuit board 10 , or a plurality of terminal units capable of supplying power and outputting information of the image sensor 11 may be provided. .

The housing unit 20 is disposed on the upper side of the first printed circuit board 10 and forms a skeleton of the camera module. According to a preferred embodiment of the present invention, the housing unit 20 includes a first housing 21 , a second housing 22 , first and second permanent magnets 23 , 24 and a yoke 25 . includes

The first housing 21 as a base is disposed on the upper surface of the first printed circuit board 10 and is provided to be spaced apart from the image sensor 11 by a predetermined distance. A filter member capable of filtering an image incident to the image sensor 11 may be further installed in the first housing 21 , if necessary.

The second housing 22 is disposed above the first housing 21 to cover the first housing 21 . An opening is formed at a position corresponding to the image to be transmitted to the image sensor 11 in the vicinity of the center of the second housing 22 . A third printed circuit board 50, which will be described later, is adhesively fixed to the upper surface of the second housing 22 by a fixing member such as a double-sided tape or an adhesive, but is not limited thereto. It is also possible to provide a separate third housing such as a case or a shield can for the third printed circuit board 50 , and fix the third printed circuit board 50 to the inner surface thereof with the above-described fixing member. If the third housing is provided, the third printed circuit board 50 may be supported by pressing the third housing without a separate fixing member.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 to invest magnetic force into the holder module 30 . It is preferable that the first and second permanent magnets 23 and 24 have the same size. In addition, the first and second permanent magnets 23 and 24 and the yoke 25 may be disposed on the inner surfaces of the first and second housings if possible within the design tolerance range.

On the other hand, when the sizes of the first and second permanent magnets 23 and 24 are increased, the OIS operation is increased even with a small current, and if the first and second permanent magnets 23 and 24 are configured to have a constant size, In this case, as the current flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 increases, the OIS driving increases. In conclusion, the larger the size of the first and second permanent magnets 23 and 24, the better the OIS drive, but it is desirable to design the optimal size within other design tolerances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24 . In addition, the yoke 25 is provided in a protruding shape near the center so that the magnetic force of the first and second permanent magnets 23 and 24 can be invested into the inner space of the holder module 30 . Preferably, the width is provided the same as the first and second permanent magnets 23 and 24, and the center protrudes to a certain size so that the permanent magnet and the yoke are formed to have an approximately “T” shape. desirable.

The holder module 30 is spaced apart from the inner bottom surface of the housing unit 20 by a predetermined distance, and includes an outer blade 31 and a bobbin 32 . The holder module 30 may perform pendulum motion in forward/backward/left/right and diagonal directions while being suspended from the wire spring 60 .

Spring members 35 and 36 are provided on the upper and lower sides of the outer blade 31 , and are elastically supported by the spring member 35 , and are connected to enable vertical movement of the bobbin 32 .

As shown in FIG. 1 , the outer blade 31 has a total of four first coils 31a to 31d wound on the outer peripheral surface of the four sides, and the four side central portions on which the coils 31a to 31d are wound. It is drilled without a coil. The yoke 25 is disposed at a position corresponding to the open space, so that the yoke 25 may be partially inserted into the space.

A second printed circuit board 40 may be fixed to a lower surface of the outer blade 31 by a fixing member 33 such as a double-sided tape or an adhesive. The outer blade 31 moves forward, backward, left, right, or diagonally as shown in the arrow of FIG. 2 according to the interaction between the magnetic force of the first and second permanent magnets 22 and 23 and the first coil 31a. It is suspended by a plurality of wire springs 60 so as to be movable, and is spaced apart from the bottom surface of the first housing 21 by a predetermined distance.

In addition, a plurality of spring through-holes 37 may be provided in the outer blade 31 so that the wire spring 60 may pass through and be connected to the second printed circuit board 40 .

In the bobbin 32 , the outer blade 31 is vertically movable inside, and at least one lens 34 is installed therein. A second coil 32a is wound around the outer circumferential surface of the bobbin 32 , and the second coil 32a is connected to the first coils 31a to 31d of the outer blade 31 through the yoke 25 . An operation of raising and lowering the bobbin 32 is performed by interaction with the magnetic force invested through the empty space. As the size of the yoke 25 increases, the AF driving improves, but this may also vary depending on an optimal design value. It is possible to automatically adjust the focus of the image transmitted to the image sensor 11 by the lifting action of the bobbin 32 as described above.

The second printed circuit board 40 is disposed on the bottom surface of the outer blade 31 as described above, and a wire spring 60 is provided to supply power to the first and second coils 31a and 32a. Connected. The connection method can be any method as long as it can be connected by soldering or other conductive material. That is, the connection portion w' of the second printed circuit board 40 is connected to the first and second coils 31a and 32a, respectively, as shown in FIG. 2, and the wire spring 60 ) by transferring the power supplied through the first and second coils 31a and 32a to form an electromagnetic force.

At this time, in the case of the second coil 32a, it may be directly connected to the second printed circuit board 40, and as shown in FIG. 2, firstly connected to the lower spring 36, and then the lower spring 36 ) may be connected to the second printed circuit board 40 .

The third printed circuit board 50 is fixed to the upper side of the second housing 22 by a fixing member such as a double-sided tape or an adhesive member as described above. Power transmitted through the terminal part 52 of the printed circuit board 50 is transmitted to the second printed circuit board 40 through the wire spring 60 connected to the second printed circuit board 40 . The connection method can be any method as long as it can be connected by soldering or other conductive material.

As shown in FIGS. 3 and 4, the third printed circuit board 50 is provided to cover one side wall of the first and second housings 21 and 22. In this case, the first and A window 55 is formed on the surface facing the second permanent magnets 23 and 24 and the yoke 25 , and may be configured to avoid interference with them. As shown in FIG. 2 , the third printed circuit board 50 includes a first part 56 disposed on the base 21 , and a plurality of terminals 52 extending downward from the first part 56 . It may include a second part 57 including the.

This is a configuration for avoiding this, since the first and second permanent magnets 23 and 24 and the yoke 25 are generally directly attached to the shield can 70 to be described later with a fixing means such as epoxy.

On the other hand, the second printed circuit board 40 and the third printed circuit board 50 may be a flexible printed circuit board (FPCB), a printed circuit board (PCB) or R-FPCB (Rigid FPCB integrated type), but this It is not limited, and any substrate may be used as long as it is electrically connected.

Both ends of the wire spring 60 are connected to the second and third printed circuit boards 40 and 50 . At this time, one end of the wire spring 60 is connected to the pad 51 formed on the third printed circuit board 50 as shown in FIG. 5 , and the wire spring is located at the center of the pad 51 . A through hole 53 through which (60) passes is formed. The connection method can be any method as long as it can be connected by soldering or other conductive material. On the other hand, a solder resistor (SR) is provided around the pad 51 to protect the surface of the third printed circuit board 50, and the pad 51 area can be connected to be energized by opening the solder resistor. have.

In this way, the wire spring 60 connected from the pad 51 supplies the power supplied through the terminal part 52 to the second printed circuit board 40 side, and the first and second coils 31a ( 32a) to enable interaction with the first and second permanent magnets 23 and 24.

In addition, as shown in FIG. 2 , the other end of the wire spring 60 passes through a spring through hole 37 formed in the outer blade 31 , and is installed on the bottom surface of the outer blade 31 . It is connected to the printed circuit board 40 . At this time, the other end of the wire spring 60 is connected to a pad (not shown) formed on the second printed circuit board 40 like the third printed circuit board 50, although not shown. A through hole (not shown) through which the wire spring 60 passes is formed in the center (not shown). The connection method can be any method as long as it can be connected by soldering or other conductive material. According to this configuration, the outer blade 31 may be suspended from the wire spring 60 and spaced apart from the bottom surface of the first housing 21 by a predetermined distance or more. Then, according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24, the outer blade 31 performs a pendulum motion, It is possible to correct the vibration of the 31 ) by the interaction of the first coil 31a with the first and second permanent magnets 23 and 24 . To this end, it is preferable that the wire spring 60 is made of a metal material that has elasticity to withstand impact and can conduct electricity.

On the other hand, the thinner the wire spring 60, the better the hand shake correction movement even with a small current, but this may vary depending on the optimal design value. Preferably, the thickness of the wire spring 60 is several μm to several hundred μm, preferably 1 to 100 μm.

In addition, the wire spring 60, it is preferable that at least six are provided, at least two polarities for auto-focusing control and four polarity power sources for hand-shake correction movement hand-shake correction are supplied to the second and third printed circuits. It is necessary to supply the holder module 30 through the connection with the substrates 40 and 50 .

According to a preferred embodiment of the present invention, as shown in FIGS. 1 and 2 , two of the same length and two each are arranged at the corners of the holder module 30, it is good to provide a total of eight for balancing . The holder module 30 may include first to fourth corner portions 30a, 30b, 30c, and 30d as shown in FIG. 1 . The wire 60 may be disposed at the first to fourth corner portions 30a, 30b, 30c, and 30d of the holder module 30 . The plurality of wires 60 may include six wires. Two wires among the six wires may be disposed in the first corner part 30a, and the other two wires among the six wires may be disposed in the third corner part 30c. The first corner part 30a of the holder module 30 and the third corner part 30c of the holder module 30 may be disposed opposite to each other with respect to the optical axis.

On the other hand, as shown in FIGS. 2, 6 and 7, when a separate third housing such as a shield can 70 is further included, as described above, the third printed circuit board 50 is Since the first and second permanent magnets 23 and 24 and the yoke 25 are fixedly coupled to the shield can 70 with epoxy or the like, a window 55 is formed to avoid this coupling portion. The sidewall surfaces of the first and second housings 21 and 22 are covered.

If the shield can 70 is deleted, the third printed circuit board 50 is formed of a PCB or the like, and the first and second permanent magnets 23 and 24 and the yoke ( 25) can be attached and fixed, and as described above, the third printed circuit board 50 is made of a PCB, and a window 55 as described above is provided, and the second printed circuit board 50 is placed on the window 55. The first and second permanent magnets 23 and 24 and the yoke 25 may be inserted and configured by reinforcing the external shielding tape or the like.

It is preferable that the buffer unit 100 is integrally formed in a portion of the wire spring 60 . According to a first preferred embodiment of the present invention, the buffer unit 100 is, as shown in FIGS. 2 and 5, the connection part w of the wire spring 60 and the third printed circuit board 50 and , is preferably formed near the connection portion (w') of the wire spring 60 and the second printed circuit board (40).

At this time, the buffer part 100 is preferably formed to have the first and second bent parts 110 and 120 at a position that does not interfere with the second housing 22 of the wire spring 60. , is not limited thereto, and is bent twice or more as necessary to absorb the load applied to the wire spring 60 at the bent point.

That is, as shown in FIG. 3 , the first and second bent parts 110 and 120 become the center of moment of the bent wire spring 60 according to the load applied to the wire spring 60 , Deformation in the direction in which the bent wire spring 60 becomes a straight line is possible. Accordingly, since the deformation around each of the first and second bent portions 110 and 120 serves to absorb the load applied to the wire spring 60, the third printed circuit board 50 By reducing the load applied to the pad 51 provided in the, it is possible to reduce the load directly applied to the connection portion (w) fixing the wire spring (60).

According to a second preferred embodiment of the present invention, the buffer part 100 is formed only near the connection part w of the wire spring 60 and the third printed circuit board 50, as shown in FIG. 6 . could be That is, since the connection part w of the wire spring 60 and the third printed circuit board 50 is a location where the concentrated load of the wire spring 60 hanging from the holder module 30 is applied, the outer blade ( 31) A relatively large force is applied compared to the connection portion w ′ connected to the second printed circuit board 40 installed on the bottom surface. Therefore, the buffer part 100 may be provided only at a position close to the connection part w of the wire spring 60 and the third printed circuit board 50 .

In addition, according to a third preferred embodiment of the present invention, the buffer part 100 is, as shown in FIG. 7 , the connection part w' between the wire spring 60 and the second printed circuit board 40 . It can also be formed only in nearby areas. Of course, as described in the second embodiment, the location where the load is intensively applied is the connection part w between the wire spring 60 and the third printed circuit board 50, but the wire spring on the extension line of the load Even if it is installed in the vicinity of the connection part (w') of the second printed circuit board (60) and the second printed circuit board (40), since the load absorption occurs in this part as in the first and second embodiments, as a result, the wire spring ( 60) and the load applied to the connection part w of the third printed circuit board 50 can be reduced.

On the other hand, in a general assembly sequence, after combining the bobbin 32 and the outer blade 31, using a jig, the second housing 22, the second and third printed circuit boards 40 and 50 and the wire spring ( 60), and after coupling the bobbin 32 provided with the lens barrel, the first housing 21 is connected, and this is mounted on the first printed circuit board 10 . Before connecting the first housing 21, the permanent magnet and the yoke may be coupled first. This assembly sequence may be changed as needed. That is, it may be possible directly from the equipment without a jig. In this process, even if the force for inserting and coupling the bobbin 32 provided with the lens barrel is excessively large and exerts stress on the connecting parts w and w', the buffer unit 100 can absorb this excessive force. .

That is, as shown in FIGS. 2 and 3 , the buffer part 100 is loaded with the wire spring 60 near the connection part w between the wire spring 60 and the third printed circuit board 50 . When this occurs and is pulled in the direction of gravity or shakes left and right, the load generated by the shock absorber 100 is absorbed as deformation energy.

Accordingly, it is possible to prevent the inconvenience of reconnecting or unusable parts due to damage to the connecting parts w and w' during the assembly process, and it is possible to produce a more reliable camera module.

Meanwhile, according to a preferred embodiment of the present invention, the third printed circuit board 50 and the wire spring 60 have a through hole at a position corresponding to the lens module 30 around the connection part w, and the housing It may further include a shield can 70 installed to surround the units 21 and 22 . In this case, as described above, the third printed circuit board 50 may be attached and fixed to the inner circumferential surface of the shield can 70 . Meanwhile, the shield can 70 is not necessarily required, and may be omitted depending on the configuration of the housing units 21 and 22 .

On the other hand, as shown in FIGS. 2, 6 and 7, the hook unit 80 is provided on four or at least one surface in order to fix the shield can 70 to the first housing 21. can The positions may be within a range allowed by the center or edge design, and the number may be one or plural.

The hook unit 80 may include a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81. , and vice versa, if necessary.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical spirit of the present invention. The protection scope of the present invention is limited only by the matters described in the claims, and those skilled in the art can improve and change the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the protection scope of the present invention as long as it is apparent to those of ordinary skill in the art.

10; a first printed circuit board 20; housing unit
21; first housing 22; second housing
23; a first permanent magnet 24; 2nd permanent magnet
25; yoke 30; holder module
31; outer blade 31a; first coil
32; bobbin 32a; 2nd coil
33; fixing member 34; lens
35, 36; upper and lower elastic members 37; spring bore
40; a second printed circuit board 50; 3rd printed circuit board
60; wire spring 70; shield can
80; hook unit 100; buffer
w; a connection part w' of the third printed circuit board; Connection of the second printed circuit board

Claims (20)

Base;
a holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member coupled to the outer blade;
a second coil disposed on the bobbin;
a magnet configured to interact with the second coil to move the bobbin;
a first coil configured to interact with the magnet to move the holder module;
a wire supporting the holder module and electrically connected to the second coil through the spring member; and
OIS driving device including a buffer portion connected to the wire to absorb the load applied to the holder module and including a bent portion bent at least twice. According to claim 1,
The bent part includes a first bent part and a second bent part,
The first bent portion is formed by a first portion extending in a first direction, and a second portion extending from the first portion in a second direction different from the first direction,
The second bent portion is formed by the second portion and a third portion extending from the second portion in a third direction different from the second direction. 3. The method of claim 2,
An obtuse angle is formed by the first portion and the second portion of the first bent portion. 3. The method of claim 2,
The third direction is an OIS driving device parallel to the first direction. According to claim 1,
The buffer unit is an OIS driving device electrically connected to the second coil. According to claim 1,
The holder module includes first to fourth corner parts,
The wire is disposed in the first to fourth corner portions of the holder module,
The wire comprises 6 wires,
Two wires of the six wires are disposed in the first corner portion and the other two wires of the six wires are disposed in the third corner portion,
The first corner part of the holder module and the third corner part of the holder module are disposed opposite to each other with respect to an optical axis. According to claim 1,
a third printed circuit board including a first portion disposed on the base and a second portion extending downwardly from the first portion;
The wire is an OIS driving device coupled to the first portion of the third printed circuit board. 8. The method of claim 7,
The wire includes 6 wires having the same height,
The buffer includes six buffers,
The six buffer parts are OIS driving devices that are respectively connected to the six wires. 9. The method of claim 8,
The third printed circuit board includes a plurality of terminals,
The plurality of terminals of the third printed circuit board include two terminals for focusing and four terminals for image stabilization,
The second coil is electrically connected to the two terminals for focusing through the spring member and two wires among the six wires. 8. The method of claim 7,
a first solder disposed on one end of the wire to couple the wire to the holder module; and
a second solder disposed on the other end of the wire to apply a current to the second coil;
The wire and the spring member are electrically connected through the first solder,
The first portion of the third printed circuit board is disposed between the first solder and the second solder. 11. The method of claim 10,
The second solder connects the wire to the first portion of the third printed circuit board,
The third printed circuit board includes a pad formed in the first portion of the third printed circuit board and including a hole,
The pad includes a first surface facing the holder module, and a second surface opposite to the first surface,
and the wire passes through the hole of the pad and is coupled to the second surface of the pad. According to claim 1,
The spring member includes an upper spring member coupled to an upper portion of the outer blade, and a lower spring member coupled to a lower portion of the outer blade,
The buffer is disposed closer to the outer blade than the base,
The OIS driving device is disposed closer to the upper spring member than the buffer portion is the lower spring member. According to claim 1,
a shield can coupled to the base;
The magnet comprises four magnets,
The first coil is an OIS driving device including four first coils. a first printed circuit board;
an image sensor disposed on the first printed circuit board;
The OIS driving device of claim 1 disposed on the first printed circuit board; and
A camera module including a lens coupled to the bobbin of the OIS driving device. A mobile phone comprising the camera module of claim 14 . Base;
a holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member coupled to the outer blade;
a second coil disposed on the bobbin;
a magnet configured to interact with the second coil to move the bobbin;
a first coil configured to interact with the magnet to move the holder module;
a wire supporting the holder module and electrically connected to the second coil through the spring member; and
It includes a buffer connected to the wire,
The buffer part includes a first bent part and a second bent part,
The first bent portion is formed by a first portion extending in a first direction, and a second portion extending from the first portion in a second direction different from the first direction,
The second bent portion is formed by the second portion and a third portion extending from the second portion in a third direction different from the second direction. 17. The method of claim 16,
An obtuse angle is formed by the first portion and the second portion of the first bent portion. 17. The method of claim 16,
The third direction is an OIS driving device parallel to the first direction. 17. The method of claim 16,
The buffer unit is an OIS driving device electrically connected to the second coil. 17. The method of claim 16,
The wire includes 6 wires having the same height,
The buffer includes six buffers,
The six buffer parts are OIS driving devices that are respectively connected to the six wires.

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