KR101917344B1 - 측정된 스펙트럼에 대해 회절 효과들을 갖는 광학적 모델의 피팅 - Google Patents

측정된 스펙트럼에 대해 회절 효과들을 갖는 광학적 모델의 피팅 Download PDF

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KR101917344B1
KR101917344B1 KR1020147032927A KR20147032927A KR101917344B1 KR 101917344 B1 KR101917344 B1 KR 101917344B1 KR 1020147032927 A KR1020147032927 A KR 1020147032927A KR 20147032927 A KR20147032927 A KR 20147032927A KR 101917344 B1 KR101917344 B1 KR 101917344B1
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controlling
output spectrum
spectrum
polishing
polishing operation
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KR20150005652A (ko
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제프리 드류 데이비드
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어플라이드 머티어리얼스, 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020147032927A 2012-04-25 2013-04-05 측정된 스펙트럼에 대해 회절 효과들을 갖는 광학적 모델의 피팅 Active KR101917344B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/456,035 US9011202B2 (en) 2012-04-25 2012-04-25 Fitting of optical model with diffraction effects to measured spectrum
US13/456,035 2012-04-25
PCT/US2013/035510 WO2013162855A1 (en) 2012-04-25 2013-04-05 Fitting of optical model with diffraction effects to measured spectrum

Publications (2)

Publication Number Publication Date
KR20150005652A KR20150005652A (ko) 2015-01-14
KR101917344B1 true KR101917344B1 (ko) 2018-11-09

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KR1020147032927A Active KR101917344B1 (ko) 2012-04-25 2013-04-05 측정된 스펙트럼에 대해 회절 효과들을 갖는 광학적 모델의 피팅

Country Status (5)

Country Link
US (1) US9011202B2 (enExample)
JP (1) JP6234438B2 (enExample)
KR (1) KR101917344B1 (enExample)
TW (1) TWI546154B (enExample)
WO (1) WO2013162855A1 (enExample)

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KR101892914B1 (ko) * 2012-03-08 2018-08-29 어플라이드 머티어리얼스, 인코포레이티드 측정된 스펙트럼에 대한 광학 모델의 피팅
US9011202B2 (en) * 2012-04-25 2015-04-21 Applied Materials, Inc. Fitting of optical model with diffraction effects to measured spectrum
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
US20140242880A1 (en) * 2013-02-26 2014-08-28 Applied Materials, Inc. Optical model with polarization direction effects for comparison to measured spectrum
US20140242881A1 (en) * 2013-02-27 2014-08-28 Applied Materials, Inc. Feed forward parameter values for use in theoretically generating spectra
JP5958627B1 (ja) * 2015-09-08 2016-08-02 株式会社豊田中央研究所 摺動装置
JP7197999B2 (ja) 2018-05-11 2022-12-28 キオクシア株式会社 研磨装置および研磨パッド
KR102808528B1 (ko) 2018-09-24 2025-05-16 어플라이드 머티어리얼스, 인코포레이티드 Cmp 프로세스 제어 알고리즘에 대한 입력으로서의 기계 시각
JP2020181959A (ja) 2019-04-26 2020-11-05 東京エレクトロン株式会社 学習方法、管理装置および管理プログラム
EP4301548A4 (en) * 2021-03-03 2025-01-29 Applied Materials, Inc. IN-SITU MONITORING FOR MARKING TRAINING SPECTRA FOR A MACHINE LEARNING SYSTEM FOR SPECTROGRAPHIC MONITORING
US20250256371A1 (en) * 2024-02-13 2025-08-14 Applied Materials, Inc. Endpoint control for inconsistent underlayer

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JP2005142535A (ja) 2003-09-15 2005-06-02 Timbre Technologies Inc 光学的測定に使用する仮想プロファイルの選択方法、システム及び仮想プロファイルを選択するコンピュータ実行可能なコードを有する記録媒体
JP2008118145A (ja) 2006-11-07 2008-05-22 Tokyo Electron Ltd 偏光反射率計を用いた半導体ウエハ上に形成された構造の連続測定
JP2011205070A (ja) 2010-03-02 2011-10-13 Ebara Corp 研磨監視方法、研磨方法、研磨監視装置、および研磨装置
WO2011146208A2 (en) * 2010-05-17 2011-11-24 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing
WO2011151121A1 (en) * 2010-06-04 2011-12-08 Asml Netherlands B.V. Measurement of a structure on a substrate

Also Published As

Publication number Publication date
TWI546154B (zh) 2016-08-21
JP6234438B2 (ja) 2017-11-22
US20130288570A1 (en) 2013-10-31
JP2015520508A (ja) 2015-07-16
KR20150005652A (ko) 2015-01-14
WO2013162855A1 (en) 2013-10-31
US9011202B2 (en) 2015-04-21
TW201343323A (zh) 2013-11-01

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