JP6234438B2 - 回折効果を用いた光学モデルの測定スペクトルへの適合 - Google Patents

回折効果を用いた光学モデルの測定スペクトルへの適合 Download PDF

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JP6234438B2
JP6234438B2 JP2015508993A JP2015508993A JP6234438B2 JP 6234438 B2 JP6234438 B2 JP 6234438B2 JP 2015508993 A JP2015508993 A JP 2015508993A JP 2015508993 A JP2015508993 A JP 2015508993A JP 6234438 B2 JP6234438 B2 JP 6234438B2
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spectrum
output spectrum
substrate
polishing
parameters
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JP2015520508A (ja
JP2015520508A5 (enExample
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ジェフリー ドゥルー デーヴィッド，
ジェフリー ドゥルー デーヴィッド，
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Applied Materials Inc
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Applied Materials Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2015508993A 2012-04-25 2013-04-05 回折効果を用いた光学モデルの測定スペクトルへの適合 Active JP6234438B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/456,035 US9011202B2 (en) 2012-04-25 2012-04-25 Fitting of optical model with diffraction effects to measured spectrum
US13/456,035 2012-04-25
PCT/US2013/035510 WO2013162855A1 (en) 2012-04-25 2013-04-05 Fitting of optical model with diffraction effects to measured spectrum

Publications (3)

Publication Number Publication Date
JP2015520508A JP2015520508A (ja) 2015-07-16
JP2015520508A5 JP2015520508A5 (enExample) 2016-06-02
JP6234438B2 true JP6234438B2 (ja) 2017-11-22

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JP2015508993A Active JP6234438B2 (ja) 2012-04-25 2013-04-05 回折効果を用いた光学モデルの測定スペクトルへの適合

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US (1) US9011202B2 (enExample)
JP (1) JP6234438B2 (enExample)
KR (1) KR101917344B1 (enExample)
TW (1) TWI546154B (enExample)
WO (1) WO2013162855A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11260497B2 (en) 2018-05-11 2022-03-01 Toshiba Memory Corporation Polishing apparatus and polishing pad

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US9011202B2 (en) * 2012-04-25 2015-04-21 Applied Materials, Inc. Fitting of optical model with diffraction effects to measured spectrum
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
US20140242880A1 (en) * 2013-02-26 2014-08-28 Applied Materials, Inc. Optical model with polarization direction effects for comparison to measured spectrum
US20140242881A1 (en) * 2013-02-27 2014-08-28 Applied Materials, Inc. Feed forward parameter values for use in theoretically generating spectra
JP5958627B1 (ja) * 2015-09-08 2016-08-02 株式会社豊田中央研究所 摺動装置
KR102808528B1 (ko) 2018-09-24 2025-05-16 어플라이드 머티어리얼스, 인코포레이티드 Cmp 프로세스 제어 알고리즘에 대한 입력으로서의 기계 시각
JP2020181959A (ja) 2019-04-26 2020-11-05 東京エレクトロン株式会社 学習方法、管理装置および管理プログラム
EP4301548A4 (en) * 2021-03-03 2025-01-29 Applied Materials, Inc. IN-SITU MONITORING FOR MARKING TRAINING SPECTRA FOR A MACHINE LEARNING SYSTEM FOR SPECTROGRAPHIC MONITORING
US20250256371A1 (en) * 2024-02-13 2025-08-14 Applied Materials, Inc. Endpoint control for inconsistent underlayer

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11260497B2 (en) 2018-05-11 2022-03-01 Toshiba Memory Corporation Polishing apparatus and polishing pad

Also Published As

Publication number Publication date
TWI546154B (zh) 2016-08-21
KR101917344B1 (ko) 2018-11-09
US20130288570A1 (en) 2013-10-31
JP2015520508A (ja) 2015-07-16
KR20150005652A (ko) 2015-01-14
WO2013162855A1 (en) 2013-10-31
US9011202B2 (en) 2015-04-21
TW201343323A (zh) 2013-11-01

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