JP2015520508A5 - - Google Patents

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Publication number
JP2015520508A5
JP2015520508A5 JP2015508993A JP2015508993A JP2015520508A5 JP 2015520508 A5 JP2015520508 A5 JP 2015520508A5 JP 2015508993 A JP2015508993 A JP 2015508993A JP 2015508993 A JP2015508993 A JP 2015508993A JP 2015520508 A5 JP2015520508 A5 JP 2015520508A5
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JP
Japan
Prior art keywords
output spectrum
spectrum
array
measured
endpoint
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JP2015508993A
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English (en)
Japanese (ja)
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JP6234438B2 (ja
JP2015520508A (ja
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Priority claimed from US13/456,035 external-priority patent/US9011202B2/en
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Publication of JP2015520508A5 publication Critical patent/JP2015520508A5/ja
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JP2015508993A 2012-04-25 2013-04-05 回折効果を用いた光学モデルの測定スペクトルへの適合 Active JP6234438B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/456,035 US9011202B2 (en) 2012-04-25 2012-04-25 Fitting of optical model with diffraction effects to measured spectrum
US13/456,035 2012-04-25
PCT/US2013/035510 WO2013162855A1 (en) 2012-04-25 2013-04-05 Fitting of optical model with diffraction effects to measured spectrum

Publications (3)

Publication Number Publication Date
JP2015520508A JP2015520508A (ja) 2015-07-16
JP2015520508A5 true JP2015520508A5 (enExample) 2016-06-02
JP6234438B2 JP6234438B2 (ja) 2017-11-22

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ID=49477711

Family Applications (1)

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JP2015508993A Active JP6234438B2 (ja) 2012-04-25 2013-04-05 回折効果を用いた光学モデルの測定スペクトルへの適合

Country Status (5)

Country Link
US (1) US9011202B2 (enExample)
JP (1) JP6234438B2 (enExample)
KR (1) KR101917344B1 (enExample)
TW (1) TWI546154B (enExample)
WO (1) WO2013162855A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101892914B1 (ko) * 2012-03-08 2018-08-29 어플라이드 머티어리얼스, 인코포레이티드 측정된 스펙트럼에 대한 광학 모델의 피팅
US9011202B2 (en) * 2012-04-25 2015-04-21 Applied Materials, Inc. Fitting of optical model with diffraction effects to measured spectrum
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
US20140242880A1 (en) * 2013-02-26 2014-08-28 Applied Materials, Inc. Optical model with polarization direction effects for comparison to measured spectrum
US20140242881A1 (en) * 2013-02-27 2014-08-28 Applied Materials, Inc. Feed forward parameter values for use in theoretically generating spectra
JP5958627B1 (ja) * 2015-09-08 2016-08-02 株式会社豊田中央研究所 摺動装置
JP7197999B2 (ja) 2018-05-11 2022-12-28 キオクシア株式会社 研磨装置および研磨パッド
KR102808528B1 (ko) 2018-09-24 2025-05-16 어플라이드 머티어리얼스, 인코포레이티드 Cmp 프로세스 제어 알고리즘에 대한 입력으로서의 기계 시각
JP2020181959A (ja) 2019-04-26 2020-11-05 東京エレクトロン株式会社 学習方法、管理装置および管理プログラム
EP4301548A4 (en) * 2021-03-03 2025-01-29 Applied Materials, Inc. IN-SITU MONITORING FOR MARKING TRAINING SPECTRA FOR A MACHINE LEARNING SYSTEM FOR SPECTROGRAPHIC MONITORING
US20250256371A1 (en) * 2024-02-13 2025-08-14 Applied Materials, Inc. Endpoint control for inconsistent underlayer

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5658183A (en) * 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5653622A (en) * 1995-07-25 1997-08-05 Vlsi Technology, Inc. Chemical mechanical polishing system and method for optimization and control of film removal uniformity
JP3109577B2 (ja) * 1997-03-27 2000-11-20 日本電気株式会社 半導体ウェハ研磨終点検出装置
US6489624B1 (en) 1997-07-18 2002-12-03 Nikon Corporation Apparatus and methods for detecting thickness of a patterned layer
JPH1148134A (ja) * 1997-08-11 1999-02-23 Nikon Corp 研磨終点検出方法、研磨終点検出装置及びこれを有する研磨装置
US6271047B1 (en) 1998-05-21 2001-08-07 Nikon Corporation Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
US6361646B1 (en) 1998-06-08 2002-03-26 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6276987B1 (en) * 1998-08-04 2001-08-21 International Business Machines Corporation Chemical mechanical polishing endpoint process control
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
AU2001279126A1 (en) 2000-07-31 2002-02-13 Silicon Valley Group Inc In-situ method and apparatus for end point detection in chemical mechanical polishing
JP3844973B2 (ja) * 2001-03-16 2006-11-15 大日本スクリーン製造株式会社 基板の研磨終点検出
JP3932836B2 (ja) * 2001-07-27 2007-06-20 株式会社日立製作所 薄膜の膜厚計測方法及びその装置並びにそれを用いたデバイスの製造方法
US6947135B2 (en) * 2002-07-01 2005-09-20 Therma-Wave, Inc. Reduced multicubic database interpolation method for optical measurement of diffractive microstructures
JP4542324B2 (ja) * 2002-10-17 2010-09-15 株式会社荏原製作所 研磨状態監視装置及びポリッシング装置
JP4464642B2 (ja) * 2003-09-10 2010-05-19 株式会社荏原製作所 研磨状態監視装置、研磨状態監視方法、研磨装置及び研磨方法
US7394554B2 (en) 2003-09-15 2008-07-01 Timbre Technologies, Inc. Selecting a hypothetical profile to use in optical metrology
US7264535B2 (en) * 2004-04-23 2007-09-04 Hitachi Global Storage Technologies Netherlands, B.V. Run-to-run control of backside pressure for CMP radial uniformity optimization based on center-to-edge model
US7144297B2 (en) * 2005-05-03 2006-12-05 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus to enable accurate wafer prediction
US7495781B2 (en) 2006-07-10 2009-02-24 Tokyo Electron Limited Optimizing selected variables of an optical metrology model
US7522295B2 (en) 2006-11-07 2009-04-21 Tokyo Electron Limited Consecutive measurement of structures formed on a semiconductor wafer using a polarized reflectometer
EP2088123A1 (en) * 2006-11-10 2009-08-12 Sumitomo Electric Industries, Ltd. Si-O CONTAINING HYDROGENATED CARBON FILM, OPTICAL DEVICE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE Si-O CONTAINING HYDROGENATED FILM AND THE OPTICAL DEVICE
JP5254668B2 (ja) * 2008-06-03 2013-08-07 株式会社荏原製作所 研磨終点検出方法
US20100120331A1 (en) * 2008-11-07 2010-05-13 Applied Materials, Inc. Endpoint control of multiple-wafer chemical mechanical polishing
US8751033B2 (en) 2008-11-14 2014-06-10 Applied Materials, Inc. Adaptive tracking spectrum features for endpoint detection
JP5728239B2 (ja) 2010-03-02 2015-06-03 株式会社荏原製作所 研磨監視方法、研磨方法、研磨監視装置、および研磨装置
WO2011139575A2 (en) * 2010-05-05 2011-11-10 Applied Materials, Inc. Endpoint method using peak location of modified spectra
US8190285B2 (en) * 2010-05-17 2012-05-29 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing
NL2006700A (en) * 2010-06-04 2011-12-06 Asml Netherlands Bv Method and apparatus for measuring a structure on a substrate, computer program products for implementing such methods & apparatus.
JP2014500613A (ja) 2010-10-15 2014-01-09 アプライド マテリアルズ インコーポレイテッド 光学監視のためのスペクトルライブラリの構築
US20120278028A1 (en) 2011-04-28 2012-11-01 Jeffrey Drue David Generating model based spectra library for polishing
US9011202B2 (en) * 2012-04-25 2015-04-21 Applied Materials, Inc. Fitting of optical model with diffraction effects to measured spectrum

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