KR101898757B1 - 열전도성 습기 경화형 수지 조성물 - Google Patents

열전도성 습기 경화형 수지 조성물 Download PDF

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Publication number
KR101898757B1
KR101898757B1 KR1020147007477A KR20147007477A KR101898757B1 KR 101898757 B1 KR101898757 B1 KR 101898757B1 KR 1020147007477 A KR1020147007477 A KR 1020147007477A KR 20147007477 A KR20147007477 A KR 20147007477A KR 101898757 B1 KR101898757 B1 KR 101898757B1
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KR
South Korea
Prior art keywords
component
thermally conductive
group
moisture
curable resin
Prior art date
Application number
KR1020147007477A
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English (en)
Korean (ko)
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KR20140063722A (ko
Inventor
다카시 마츠키
마모루 아다치
야스오 마에다
츠네토시 후지사와
시게카즈 모토키
미요카 이데
Original Assignee
쓰리본드 화인 케미칼 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20140063722A publication Critical patent/KR20140063722A/ko
Application granted granted Critical
Publication of KR101898757B1 publication Critical patent/KR101898757B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
KR1020147007477A 2011-09-21 2012-09-14 열전도성 습기 경화형 수지 조성물 KR101898757B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011205534 2011-09-21
JPJP-P-2011-205534 2011-09-21
PCT/JP2012/073736 WO2013042638A1 (fr) 2011-09-21 2012-09-14 Composition de résine thermoconductrice, durcissable par l'humidité

Publications (2)

Publication Number Publication Date
KR20140063722A KR20140063722A (ko) 2014-05-27
KR101898757B1 true KR101898757B1 (ko) 2018-09-13

Family

ID=47914405

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147007477A KR101898757B1 (ko) 2011-09-21 2012-09-14 열전도성 습기 경화형 수지 조성물

Country Status (4)

Country Link
JP (1) JPWO2013042638A1 (fr)
KR (1) KR101898757B1 (fr)
CN (1) CN103998528B (fr)
WO (1) WO2013042638A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3810714A1 (fr) * 2018-06-25 2021-04-28 Sika Technology Ag Compositions durcissables sans catalyseur et à base de polymères à fonction silane
CN109135247A (zh) * 2018-07-17 2019-01-04 平湖阿莱德实业有限公司 高导热填隙界面材料及其制备方法
WO2020165288A1 (fr) * 2019-02-13 2020-08-20 Sika Technology Ag Composition durcissable thermoconductrice
CN114127156A (zh) * 2019-02-28 2022-03-01 钟化美洲控股公司 可湿固化粘合剂组合物
JP7256944B2 (ja) * 2019-08-08 2023-04-13 株式会社スリーボンド 湿気硬化型樹脂組成物および硬化物
WO2022197726A1 (fr) * 2021-03-15 2022-09-22 Henkel Ag & Co. Kgaa Matériaux thermoconducteurs durcissables à température ambiante à un composant
FR3136238A1 (fr) * 2022-06-03 2023-12-08 Bostik Sa Composition bicomposante thermoconductrice de polymère silylé

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004224985A (ja) * 2003-01-24 2004-08-12 Kanegafuchi Chem Ind Co Ltd 硬化性組成物
WO2005073276A1 (fr) * 2004-01-30 2005-08-11 Kaneka Corporation Procédé de production d’un polymère d’oxyalkylène contenant un groupe silicium hydrolysable et composition de durcissement de celui-ci
CN101166773A (zh) 2005-04-29 2008-04-23 Sika技术股份公司 具有提高的延展性的湿气固化性组合物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04335086A (ja) 1991-05-10 1992-11-24 Three Bond Co Ltd 熱伝導性充填剤組成物
JP2002363429A (ja) 2001-06-07 2002-12-18 Three Bond Co Ltd 熱伝導性組成物
JP2008088318A (ja) * 2006-10-03 2008-04-17 Momentive Performance Materials Japan Kk 熱伝導性シリコーン組成物及びそれを用いた半導体装置
JP2010506034A (ja) * 2006-10-10 2010-02-25 ダウ・コーニング・コーポレイション オルガノシロキサン組成物用の増量剤
JP5300232B2 (ja) * 2007-09-12 2013-09-25 三井・デュポンポリケミカル株式会社 放熱性樹脂組成物
JP4656339B2 (ja) * 2008-02-14 2011-03-23 信越化学工業株式会社 縮合反応硬化型シリコーンゴム組成物
GB0806820D0 (en) * 2008-04-16 2008-05-14 Dow Corning Polymeric compositions
JP2011256214A (ja) 2008-10-08 2011-12-22 Denki Kagaku Kogyo Kk 熱伝導性湿気硬化型樹脂組成物
JP2011032344A (ja) * 2009-07-31 2011-02-17 Kaneka Corp 半導体パッケージ用硬化性樹脂組成物
JP5828835B2 (ja) * 2010-04-08 2015-12-09 デンカ株式会社 熱伝導性湿気硬化型樹脂組成物
JP2011225695A (ja) * 2010-04-19 2011-11-10 Three Bond Co Ltd 難燃性湿気硬化型樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004224985A (ja) * 2003-01-24 2004-08-12 Kanegafuchi Chem Ind Co Ltd 硬化性組成物
WO2005073276A1 (fr) * 2004-01-30 2005-08-11 Kaneka Corporation Procédé de production d’un polymère d’oxyalkylène contenant un groupe silicium hydrolysable et composition de durcissement de celui-ci
CN101166773A (zh) 2005-04-29 2008-04-23 Sika技术股份公司 具有提高的延展性的湿气固化性组合物

Also Published As

Publication number Publication date
CN103998528A (zh) 2014-08-20
JPWO2013042638A1 (ja) 2015-03-26
WO2013042638A1 (fr) 2013-03-28
CN103998528B (zh) 2017-06-23
KR20140063722A (ko) 2014-05-27

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