KR101896930B1 - 경화성 실리콘 조성물, 이의 경화 생성물, 및 광반도체 디바이스 - Google Patents

경화성 실리콘 조성물, 이의 경화 생성물, 및 광반도체 디바이스 Download PDF

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KR101896930B1
KR101896930B1 KR1020147009272A KR20147009272A KR101896930B1 KR 101896930 B1 KR101896930 B1 KR 101896930B1 KR 1020147009272 A KR1020147009272 A KR 1020147009272A KR 20147009272 A KR20147009272 A KR 20147009272A KR 101896930 B1 KR101896930 B1 KR 101896930B1
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parts
mass
cured product
curable silicone
silicone composition
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KR20140063778A (ko
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가즈오 히라이
마코토 요시타케
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다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8067—Reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
KR1020147009272A 2011-09-16 2012-09-13 경화성 실리콘 조성물, 이의 경화 생성물, 및 광반도체 디바이스 Active KR101896930B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2011-203542 2011-09-16
JP2011203542 2011-09-16
JP2012021278A JP5912600B2 (ja) 2011-09-16 2012-02-02 硬化性シリコーン組成物、その硬化物、および光半導体装置
JPJP-P-2012-021278 2012-02-02
PCT/JP2012/074138 WO2013039265A1 (en) 2011-09-16 2012-09-13 Curable silicone composition, cured product thereof, and optical semiconductor device

Publications (2)

Publication Number Publication Date
KR20140063778A KR20140063778A (ko) 2014-05-27
KR101896930B1 true KR101896930B1 (ko) 2018-09-12

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US (1) US9045667B2 (enExample)
EP (1) EP2756027B1 (enExample)
JP (1) JP5912600B2 (enExample)
KR (1) KR101896930B1 (enExample)
CN (1) CN103797049B (enExample)
TW (1) TWI570185B (enExample)
WO (1) WO2013039265A1 (enExample)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5640476B2 (ja) * 2010-06-08 2014-12-17 信越化学工業株式会社 光半導体素子封止用樹脂組成物及び発光装置
JP5992666B2 (ja) * 2011-06-16 2016-09-14 東レ・ダウコーニング株式会社 架橋性シリコーン組成物及びその架橋物
JP2013139547A (ja) * 2011-12-05 2013-07-18 Jsr Corp 硬化性組成物、硬化物および光半導体装置
JP5814175B2 (ja) * 2012-04-16 2015-11-17 信越化学工業株式会社 Ｌｅｄのリフレクター用熱硬化性シリコーン樹脂組成物並びにこれを用いたｌｅｄ用リフレクター及び光半導体装置
JP2014065900A (ja) * 2012-09-07 2014-04-17 Dow Corning Toray Co Ltd 硬化性シリコーン組成物およびその硬化物
CN104211965A (zh) * 2013-06-03 2014-12-17 北京化工大学 一种可用于led封装的网状甲基苯基乙烯基聚硅氧烷的制备方法
WO2014200112A1 (ja) * 2013-06-14 2014-12-18 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
JP6302902B2 (ja) * 2013-06-14 2018-03-28 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
KR102370815B1 (ko) * 2014-06-20 2022-03-08 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 핫 멜트성 실리콘 및 경화성 핫 멜트 조성물
JP6590445B2 (ja) * 2014-09-10 2019-10-16 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6245136B2 (ja) * 2014-10-20 2017-12-13 信越化学工業株式会社 光半導体素子封止用シリコーン樹脂組成物及び光半導体装置
EP3498779A4 (en) 2016-08-08 2020-01-15 Dow Toray Co., Ltd. HARDENABLE PARTICULAR SILICONE COMPOSITION, SEMICONDUCTOR ELEMENT WITH HARDENABLE PARTICLE SHAPED SILICONE COMPOSITION AND MOLDING PROCESS FOR SEMICONDUCTOR ELEMENT WITH HARDENABLE PARTICLE SHAPED SILICONE COMPOSITION
JP6930815B2 (ja) 2016-08-08 2021-09-01 ダウ・東レ株式会社 硬化性粒状シリコーン組成物、それからなる光反射材、およびその製造方法
US11028266B2 (en) 2016-08-12 2021-06-08 Wacker Chemie Ag Curable organopolysiloxane composition, encapsulant and semiconductor device
JP2018165348A (ja) * 2017-03-29 2018-10-25 信越化学工業株式会社 高耐熱性付加硬化型シリコーン樹脂組成物
WO2018236127A1 (en) 2017-06-19 2018-12-27 Dow Silicones Corporation LIQUID SILICONE COMPOSITION FOR TRANSFER OR INJECTION MOLDING OF OPTICAL PARTS, OPTICAL PARTS MADE THEREFROM, AND CORRESPONDING PROCESS
WO2018235491A1 (ja) 2017-06-19 2018-12-27 東レ・ダウコーニング株式会社 硬化性粒状シリコーン組成物、それからなる半導体用部材、およびその成型方法
CN107312339A (zh) * 2017-06-28 2017-11-03 广州惠利电子材料有限公司 白光led封装用硅胶及其制备方法和应用
CN111936582B (zh) * 2018-08-17 2022-06-17 瓦克化学股份公司 可交联的有机硅氧烷组合物
JP7419251B2 (ja) 2018-10-30 2024-01-22 ダウ・東レ株式会社 硬化反応性シリコーン組成物及びその硬化物並びにそれらの用途
CN113396042A (zh) 2018-12-27 2021-09-14 陶氏东丽株式会社 具有热熔性的固化性有机硅片材的制造方法
JP7513365B2 (ja) 2018-12-27 2024-07-09 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
KR102912731B1 (ko) 2018-12-27 2026-01-16 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법
EP3954739A4 (en) 2019-03-29 2022-12-28 Dow Toray Co., Ltd. CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF AND METHOD OF MAKING THEREOF
JP7509756B2 (ja) 2019-03-29 2024-07-02 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
CN113614174B (zh) 2019-03-29 2023-04-04 陶氏东丽株式会社 固化性有机硅组合物、其固化物及其制造方法
EP3950845B1 (en) 2019-03-29 2026-04-01 Dow Toray Co., Ltd. Curable silicone composition, cured product of same and method for producing same
US20220243015A1 (en) * 2019-05-17 2022-08-04 Wacker Chemie Ag Silicone composition that can be cross-linked to form a silicone resin composite material
CA3084396A1 (en) * 2019-06-21 2020-12-21 Crayola Llc Two part silicone moldable eraser
US11746235B2 (en) 2019-06-21 2023-09-05 Crayola Llc Two part silicone moldable eraser
JP7838778B2 (ja) * 2019-07-30 2026-04-01 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物、光半導体装置、および光半導体装置の製造方法
JP7475135B2 (ja) * 2019-12-25 2024-04-26 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性白色シリコーン組成物、光半導体装置用反射材、および光半導体装置
JP7876965B2 (ja) 2019-12-27 2026-06-22 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
JP7820893B2 (ja) 2020-03-30 2026-02-26 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
KR102469375B1 (ko) * 2020-04-06 2022-11-21 삼성에스디아이 주식회사 실리콘계 점착성 보호 필름 및 이를 포함하는 광학 부재
US12258503B2 (en) * 2020-09-22 2025-03-25 Dow Silicones Corporation Curable silicone-(meth)acrylate composition and methods for its preparation and use
JP7851688B2 (ja) * 2021-04-06 2026-04-27 信越化学工業株式会社 シリコーン組成物およびその硬化物
TW202334318A (zh) * 2022-02-24 2023-09-01 美商陶氏有機矽公司 可固化聚矽氧組成物
WO2023164018A1 (en) * 2022-02-24 2023-08-31 Dow Silicones Corporation Curable silicone composition and cured product thereof

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438094A (en) * 1993-07-06 1995-08-01 Shin-Etsu Chemical Co., Ltd. Adhesive silicone compositions
JP3687738B2 (ja) * 2001-01-16 2005-08-24 信越化学工業株式会社 硬化性組成物
CA2483510A1 (en) * 2002-04-26 2003-11-06 Kaneka Corporation Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product
JP4557136B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
US20070219312A1 (en) * 2006-03-17 2007-09-20 Jennifer Lynn David Silicone adhesive composition and method for preparing the same
JP5202822B2 (ja) * 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4514058B2 (ja) * 2006-08-30 2010-07-28 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5420166B2 (ja) * 2006-12-28 2014-02-19 東レ・ダウコーニング株式会社 無溶剤型剥離性硬化皮膜形成性オルガノポリシロキサン組成物および剥離性硬化皮膜を有するシート状基材
JP4519869B2 (ja) * 2007-03-05 2010-08-04 株式会社東芝 半導体装置
JP5283346B2 (ja) * 2007-04-10 2013-09-04 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP2009021394A (ja) 2007-07-12 2009-01-29 Nitto Denko Corp 光半導体素子収納用実装パッケージ用樹脂組成物およびそれを用いて得られる光半導体発光装置
US8017246B2 (en) * 2007-11-08 2011-09-13 Philips Lumileds Lighting Company, Llc Silicone resin for protecting a light transmitting surface of an optoelectronic device
JP2009120437A (ja) * 2007-11-14 2009-06-04 Niigata Univ シロキサンをグラフト化したシリカ及び高透明シリコーン組成物並びに該組成物で封止した発光半導体装置
JP5233325B2 (ja) * 2008-02-29 2013-07-10 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP2009256400A (ja) * 2008-04-11 2009-11-05 Shin Etsu Chem Co Ltd 半導体素子用シリコーン接着剤
JP5507059B2 (ja) * 2008-05-27 2014-05-28 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電子装置
JP5475296B2 (ja) * 2009-02-02 2014-04-16 東レ・ダウコーニング株式会社 高透明のシリコーン硬化物を与える硬化性シリコーン組成物
JP2010285571A (ja) * 2009-06-15 2010-12-24 Shin-Etsu Chemical Co Ltd ダイボンディング用シリコーン樹脂組成物
JP2011074355A (ja) * 2009-09-07 2011-04-14 Nitto Denko Corp 光半導体装置用樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置
JP2011140550A (ja) 2010-01-06 2011-07-21 Shin-Etsu Chemical Co Ltd 光学素子ケース成形用付加硬化型シリコーン樹脂組成物及び光半導体装置
JP2011203542A (ja) 2010-03-26 2011-10-13 Yamaha Corp 集積回路
JP5635317B2 (ja) 2010-07-12 2014-12-03 株式会社小島製作所 横主管用掃除口構造とその敷設方法

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JP2013076050A (ja) 2013-04-25
CN103797049A (zh) 2014-05-14
TW201315773A (zh) 2013-04-16
EP2756027A1 (en) 2014-07-23
KR20140063778A (ko) 2014-05-27
WO2013039265A1 (en) 2013-03-21
EP2756027B1 (en) 2015-07-01
US9045667B2 (en) 2015-06-02
TWI570185B (zh) 2017-02-11
JP5912600B2 (ja) 2016-04-27
CN103797049B (zh) 2015-11-25
US20140377570A1 (en) 2014-12-25

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