KR101882163B1 - 금속판으로부터 레지스트 막을 제거하는 방법 및 에칭된 금속판의 제조 방법 - Google Patents
금속판으로부터 레지스트 막을 제거하는 방법 및 에칭된 금속판의 제조 방법 Download PDFInfo
- Publication number
- KR101882163B1 KR101882163B1 KR1020187005980A KR20187005980A KR101882163B1 KR 101882163 B1 KR101882163 B1 KR 101882163B1 KR 1020187005980 A KR1020187005980 A KR 1020187005980A KR 20187005980 A KR20187005980 A KR 20187005980A KR 101882163 B1 KR101882163 B1 KR 101882163B1
- Authority
- KR
- South Korea
- Prior art keywords
- metal plate
- resist film
- resist
- film
- metal
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015173829A JP6109896B2 (ja) | 2015-09-03 | 2015-09-03 | 金属板からレジスト膜を除去する方法およびエッチングされた金属板の製造方法 |
JPJP-P-2015-173829 | 2015-09-03 | ||
PCT/JP2016/002856 WO2017037970A1 (ja) | 2015-09-03 | 2016-06-13 | 金属板からレジスト膜を除去する方法およびエッチングされた金属板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180026800A KR20180026800A (ko) | 2018-03-13 |
KR101882163B1 true KR101882163B1 (ko) | 2018-07-25 |
Family
ID=58186843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020187005980A KR101882163B1 (ko) | 2015-09-03 | 2016-06-13 | 금속판으로부터 레지스트 막을 제거하는 방법 및 에칭된 금속판의 제조 방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10156789B2 (ko) |
EP (1) | EP3346338B1 (ko) |
JP (1) | JP6109896B2 (ko) |
KR (1) | KR101882163B1 (ko) |
CN (1) | CN107924145A (ko) |
WO (1) | WO2017037970A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102028458B1 (ko) * | 2017-12-12 | 2019-10-04 | 한국제이씨씨(주) | 관통박 제조방법 |
JP6774589B1 (ja) * | 2019-01-28 | 2020-10-28 | 三菱製紙株式会社 | 樹脂組成物のエッチング液及びエッチング方法 |
Family Cites Families (27)
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JPS4914681B1 (ko) * | 1969-10-13 | 1974-04-09 | ||
US4623611A (en) | 1985-01-16 | 1986-11-18 | General Electric Company | Photolithographic stripping method for removing contrast enhancement layer |
JPS62227153A (ja) * | 1986-03-28 | 1987-10-06 | Oji Paper Co Ltd | Ps版用画像消去液 |
JPH04361265A (ja) * | 1991-06-07 | 1992-12-14 | Kansai Paint Co Ltd | 剥離液 |
JP2649621B2 (ja) | 1991-10-04 | 1997-09-03 | 東亞合成株式会社 | 裏止め材用紫外線硬化型樹脂組成物及びシャドウマスクの製造方法 |
US5268260A (en) * | 1991-10-22 | 1993-12-07 | International Business Machines Corporation | Photoresist develop and strip solvent compositions and method for their use |
US5454985A (en) | 1992-11-06 | 1995-10-03 | Gage Products Company | Paint stripping composition |
JP3299371B2 (ja) | 1993-07-14 | 2002-07-08 | 三菱レイヨン株式会社 | 硬化性被覆材組成物 |
JPH09265180A (ja) | 1996-03-27 | 1997-10-07 | Mitsubishi Rayon Co Ltd | 金属加工用感光性樹脂組成物積層体 |
JP4202516B2 (ja) * | 1999-03-18 | 2008-12-24 | 花王株式会社 | 剥離剤組成物 |
JP4830224B2 (ja) | 2000-07-14 | 2011-12-07 | Dic株式会社 | 紫外線硬化型レジスト用グラビアインキ組成物 |
KR100429455B1 (ko) * | 2001-06-11 | 2004-05-04 | 동우 화인켐 주식회사 | 포토레지스트의 에지 비드를 제거하는 세정용액 및 이를이용한 세정방법 |
KR100483372B1 (ko) * | 2001-11-02 | 2005-04-15 | 주식회사 아담스테크놀로지 | 포토레지스트용 수계 박리액 |
US20040050406A1 (en) * | 2002-07-17 | 2004-03-18 | Akshey Sehgal | Compositions and method for removing photoresist and/or resist residue at pressures ranging from ambient to supercritical |
JP5152816B2 (ja) * | 2006-02-24 | 2013-02-27 | 化研テック株式会社 | 被洗浄物の洗浄方法 |
CN101373340B (zh) * | 2007-08-23 | 2013-07-10 | 安集微电子(上海)有限公司 | 一种光刻胶清洗剂 |
KR101286777B1 (ko) * | 2007-10-17 | 2013-07-17 | 헨켈 코포레이션 | 박리액 조성물, 그것을 이용한 수지층의 박리 방법 |
KR100945157B1 (ko) * | 2008-01-04 | 2010-03-08 | 주식회사 켐트로닉스 | 티에프티 엘씨디용 칼라 레지스트 박리액 조성물 |
JP5518311B2 (ja) | 2008-08-26 | 2014-06-11 | 日新製鋼株式会社 | エッチングレジスト用インクジェットインキ組成物 |
CN101978001B (zh) * | 2008-03-27 | 2013-08-28 | 日新制钢株式会社 | 抗蚀用喷墨油墨组合物 |
JP5255307B2 (ja) | 2008-03-27 | 2013-08-07 | 日新製鋼株式会社 | エッチングレジスト用インクジェットインキ組成物 |
JP5633115B2 (ja) | 2008-04-09 | 2014-12-03 | Jnc株式会社 | インクジェット用インクおよびインクから得られた硬化膜 |
CN101907835B (zh) * | 2009-06-08 | 2013-08-28 | 安集微电子科技(上海)有限公司 | 一种光刻胶的清洗剂组合物 |
JP5659873B2 (ja) * | 2010-12-16 | 2015-01-28 | 富士通株式会社 | レジストパターン改善化材料、レジストパターンの形成方法、及び半導体装置の製造方法 |
US20140100151A1 (en) * | 2012-10-08 | 2014-04-10 | Air Products And Chemicals Inc. | Stripping and Cleaning Compositions for Removal of Thick Film Resist |
JP2014157339A (ja) * | 2013-02-18 | 2014-08-28 | Lion Corp | レジスト剥離剤組成物 |
US20150219996A1 (en) * | 2014-02-06 | 2015-08-06 | Dynaloy, Llc | Composition for removing substances from substrates |
-
2015
- 2015-09-03 JP JP2015173829A patent/JP6109896B2/ja active Active
-
2016
- 2016-06-13 EP EP16841018.1A patent/EP3346338B1/en active Active
- 2016-06-13 KR KR1020187005980A patent/KR101882163B1/ko active IP Right Grant
- 2016-06-13 US US15/757,408 patent/US10156789B2/en active Active
- 2016-06-13 CN CN201680049520.9A patent/CN107924145A/zh active Pending
- 2016-06-13 WO PCT/JP2016/002856 patent/WO2017037970A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN107924145A (zh) | 2018-04-17 |
KR20180026800A (ko) | 2018-03-13 |
JP2017049473A (ja) | 2017-03-09 |
EP3346338A1 (en) | 2018-07-11 |
JP6109896B2 (ja) | 2017-04-05 |
WO2017037970A1 (ja) | 2017-03-09 |
EP3346338B1 (en) | 2020-05-06 |
EP3346338A4 (en) | 2019-01-23 |
US10156789B2 (en) | 2018-12-18 |
US20180253009A1 (en) | 2018-09-06 |
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A201 | Request for examination | ||
A302 | Request for accelerated examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |