KR101877360B1 - 포토레지스트 및 그의 사용방법 - Google Patents

포토레지스트 및 그의 사용방법 Download PDF

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Publication number
KR101877360B1
KR101877360B1 KR1020100128671A KR20100128671A KR101877360B1 KR 101877360 B1 KR101877360 B1 KR 101877360B1 KR 1020100128671 A KR1020100128671 A KR 1020100128671A KR 20100128671 A KR20100128671 A KR 20100128671A KR 101877360 B1 KR101877360 B1 KR 101877360B1
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South Korea
Prior art keywords
photoresist composition
photoresist
substrate
relief image
phenolic
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Korean (ko)
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KR20110068936A (ko
Inventor
게르하르트 포레르스
Original Assignee
롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/266—Bombardment with radiation with high-energy radiation producing ion implantation using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/60—Impurity distributions or concentrations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020100128671A 2009-12-15 2010-12-15 포토레지스트 및 그의 사용방법 Active KR101877360B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28675609P 2009-12-15 2009-12-15
US61/286,756 2009-12-15

Publications (2)

Publication Number Publication Date
KR20110068936A KR20110068936A (ko) 2011-06-22
KR101877360B1 true KR101877360B1 (ko) 2018-07-11

Family

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Family Applications (1)

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KR1020100128671A Active KR101877360B1 (ko) 2009-12-15 2010-12-15 포토레지스트 및 그의 사용방법

Country Status (6)

Country Link
US (2) US8815754B2 (enExample)
EP (1) EP2336827B1 (enExample)
JP (2) JP5753681B2 (enExample)
KR (1) KR101877360B1 (enExample)
CN (1) CN102201333B (enExample)
TW (1) TWI468865B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5776580B2 (ja) * 2011-02-25 2015-09-09 信越化学工業株式会社 ポジ型レジスト材料及びこれを用いたパターン形成方法
EP2799928B1 (en) * 2011-12-26 2019-05-22 Toray Industries, Inc. Photosensitive resin composition and process for producing semiconductor element
KR20160070801A (ko) * 2013-12-26 2016-06-20 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 감광성 수지 적층체
US10365322B2 (en) 2016-04-19 2019-07-30 Analog Devices Global Wear-out monitor device
US10677822B2 (en) 2016-09-27 2020-06-09 Analog Devices Global Unlimited Company Electrical overstress detection device
US11112436B2 (en) 2018-03-26 2021-09-07 Analog Devices International Unlimited Company Spark gap structures for detection and protection against electrical overstress events
CN109164685B (zh) * 2018-09-26 2022-06-28 珠海雅天科技有限公司 一种euv光刻胶及其制备方法与应用

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KR20060048326A (ko) * 2004-06-11 2006-05-18 샤프 가부시키가이샤 컬러 필터 기판, 컬러 필터 기판의 제조 방법 및 컬러 필터기판을 포함하는 표시 장치
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JP2007072183A (ja) * 2005-09-07 2007-03-22 Tokyo Ohka Kogyo Co Ltd ポジ型レジスト組成物およびレジストパターン形成方法

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US4810613A (en) 1987-05-22 1989-03-07 Hoechst Celanese Corporation Blocked monomer and polymers therefrom for use as photoresists
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH032294B2 (enExample) * 1984-01-30 1991-01-14 Intaanashonaru Bijinesu Mashiinzu Corp
KR19980080093A (ko) * 1997-03-11 1998-11-25 가네코 히사시 화학증폭계 레지스트
US20030022435A1 (en) * 2001-03-19 2003-01-30 Wei-Wen Chen Method for forming multiple gate oxide layer with the plasma oxygen doping
WO2004092831A2 (en) * 2003-04-09 2004-10-28 Rohm And Haas, Electronic Materials, L.L.C. Photoresists and methods for use thereof
KR20060048326A (ko) * 2004-06-11 2006-05-18 샤프 가부시키가이샤 컬러 필터 기판, 컬러 필터 기판의 제조 방법 및 컬러 필터기판을 포함하는 표시 장치
JP2006189713A (ja) * 2005-01-07 2006-07-20 Fuji Photo Film Co Ltd イオン注入工程用ポジ型レジスト組成物及びそれを用いたイオン注入方法
JP2007072183A (ja) * 2005-09-07 2007-03-22 Tokyo Ohka Kogyo Co Ltd ポジ型レジスト組成物およびレジストパターン形成方法

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Publication number Publication date
US8815754B2 (en) 2014-08-26
US9502254B2 (en) 2016-11-22
EP2336827A1 (en) 2011-06-22
EP2336827B1 (en) 2015-09-16
CN102201333A (zh) 2011-09-28
US20110254140A1 (en) 2011-10-20
JP6121464B2 (ja) 2017-04-26
JP2015135983A (ja) 2015-07-27
KR20110068936A (ko) 2011-06-22
TWI468865B (zh) 2015-01-11
CN102201333B (zh) 2014-04-30
JP5753681B2 (ja) 2015-07-22
US20140361415A1 (en) 2014-12-11
TW201140246A (en) 2011-11-16
JP2011227448A (ja) 2011-11-10

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