KR101875382B1 - 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치 - Google Patents

경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치 Download PDF

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KR101875382B1
KR101875382B1 KR1020157013087A KR20157013087A KR101875382B1 KR 101875382 B1 KR101875382 B1 KR 101875382B1 KR 1020157013087 A KR1020157013087 A KR 1020157013087A KR 20157013087 A KR20157013087 A KR 20157013087A KR 101875382 B1 KR101875382 B1 KR 101875382B1
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carbon atoms
curable silicone
sio
organopolysiloxane
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KR20150080521A (ko
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아키히코 고바야시
유타카 오카
미치타카 스토
도모히로 이이무라
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다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H01L23/296—
    • H01L33/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H01L2224/32245—
    • H01L2224/48091—
    • H01L2224/48247—
    • H01L2224/73265—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
KR1020157013087A 2012-10-24 2013-10-23 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치 Active KR101875382B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-235184 2012-10-24
JP2012235184A JP6157085B2 (ja) 2012-10-24 2012-10-24 硬化性シリコーン組成物、その硬化物、および光半導体装置
PCT/JP2013/079333 WO2014065433A1 (en) 2012-10-24 2013-10-23 Curable silicone composition, cured product thereof, and optical semiconductor device

Publications (2)

Publication Number Publication Date
KR20150080521A KR20150080521A (ko) 2015-07-09
KR101875382B1 true KR101875382B1 (ko) 2018-07-06

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US (1) US9683084B2 (enExample)
EP (1) EP2912129B1 (enExample)
JP (1) JP6157085B2 (enExample)
KR (1) KR101875382B1 (enExample)
CN (1) CN104755569B (enExample)
TW (1) TWI621665B (enExample)
WO (1) WO2014065433A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102106968B1 (ko) 2018-11-05 2020-05-06 구경식 의자 겸용 다기능 운동기구

Families Citing this family (7)

* Cited by examiner, † Cited by third party
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JP6084808B2 (ja) 2012-10-24 2017-02-22 東レ・ダウコーニング株式会社 オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6081774B2 (ja) 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
CN109716544B (zh) * 2016-09-30 2021-11-09 日产化学株式会社 Led用密封材料组合物
WO2018236127A1 (en) * 2017-06-19 2018-12-27 Dow Silicones Corporation LIQUID SILICONE COMPOSITION FOR TRANSFER OR INJECTION MOLDING OF OPTICAL PARTS, OPTICAL PARTS MADE THEREFROM, AND CORRESPONDING PROCESS
KR102471220B1 (ko) * 2018-08-17 2022-11-25 와커 헤미 아게 가교성 오르가노실록산 조성물
JP2022178085A (ja) * 2021-05-19 2022-12-02 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止剤、及び光半導体装置
JP7900338B2 (ja) * 2023-09-12 2026-08-04 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物、その硬化物、及び光半導体装置

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JPH1180362A (ja) * 1997-08-29 1999-03-26 Toray Dow Corning Silicone Co Ltd シルフェニレンシルアルキレンポリマーの製造方法
KR20070032320A (ko) * 2004-08-04 2007-03-21 와커 헤미 아게 수지로 봉지된 발광 다이오드 및 발광 다이오드의 봉지법
KR20120024479A (ko) * 2010-09-02 2012-03-14 신에쓰 가가꾸 고교 가부시끼가이샤 저가스투과성 실리콘 수지 조성물 및 광 반도체 장치
JP2012082300A (ja) * 2010-10-08 2012-04-26 Shin-Etsu Chemical Co Ltd 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置

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JP4360595B2 (ja) 2002-10-18 2009-11-11 ペルノックス株式会社 光電変換装置
JP2004361692A (ja) 2003-04-07 2004-12-24 Dow Corning Asia Ltd 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法
JP2005162859A (ja) 2003-12-02 2005-06-23 Dow Corning Toray Silicone Co Ltd 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材
JP4801320B2 (ja) 2003-12-19 2011-10-26 東レ・ダウコーニング株式会社 付加反応硬化型オルガノポリシロキサン樹脂組成物
US8071697B2 (en) 2005-05-26 2011-12-06 Dow Corning Corporation Silicone encapsulant composition for molding small shapes
JP5392805B2 (ja) 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
KR20080104279A (ko) 2006-02-24 2008-12-02 다우 코닝 코포레이션 실리콘으로 캡슐화된 발광 장치 및 실리콘 제조용의 경화성실리콘 조성물
RU2401846C2 (ru) 2006-04-25 2010-10-20 Учреждение Российской академии наук Институт синтетических полимерных материалов им. Н.С. Ениколопова РАН (ИСПМ РАН) Функциональные полиорганосилоксаны и композиция, способная к отверждению на их основе
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JP5520528B2 (ja) 2008-07-10 2014-06-11 東レ・ダウコーニング株式会社 ガスバリアー性硬化オルガノポリシロキサン樹脂フィルム及びその製造方法
WO2010050625A1 (en) 2008-10-31 2010-05-06 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
WO2013077705A1 (ko) 2011-11-25 2013-05-30 주식회사 엘지화학 오가노폴리실록산
JP6084808B2 (ja) 2012-10-24 2017-02-22 東レ・ダウコーニング株式会社 オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6081774B2 (ja) * 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1180362A (ja) * 1997-08-29 1999-03-26 Toray Dow Corning Silicone Co Ltd シルフェニレンシルアルキレンポリマーの製造方法
KR20070032320A (ko) * 2004-08-04 2007-03-21 와커 헤미 아게 수지로 봉지된 발광 다이오드 및 발광 다이오드의 봉지법
KR20120024479A (ko) * 2010-09-02 2012-03-14 신에쓰 가가꾸 고교 가부시끼가이샤 저가스투과성 실리콘 수지 조성물 및 광 반도체 장치
JP2012082300A (ja) * 2010-10-08 2012-04-26 Shin-Etsu Chemical Co Ltd 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102106968B1 (ko) 2018-11-05 2020-05-06 구경식 의자 겸용 다기능 운동기구

Also Published As

Publication number Publication date
JP6157085B2 (ja) 2017-07-05
US9683084B2 (en) 2017-06-20
WO2014065433A1 (en) 2014-05-01
US20150284514A1 (en) 2015-10-08
EP2912129A1 (en) 2015-09-02
JP2014084418A (ja) 2014-05-12
EP2912129B1 (en) 2018-10-03
CN104755569A (zh) 2015-07-01
TW201422723A (zh) 2014-06-16
TWI621665B (zh) 2018-04-21
CN104755569B (zh) 2017-12-22
KR20150080521A (ko) 2015-07-09

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