JP6157085B2 - 硬化性シリコーン組成物、その硬化物、および光半導体装置 - Google Patents

硬化性シリコーン組成物、その硬化物、および光半導体装置 Download PDF

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JP6157085B2
JP6157085B2 JP2012235184A JP2012235184A JP6157085B2 JP 6157085 B2 JP6157085 B2 JP 6157085B2 JP 2012235184 A JP2012235184 A JP 2012235184A JP 2012235184 A JP2012235184 A JP 2012235184A JP 6157085 B2 JP6157085 B2 JP 6157085B2
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group
carbon atoms
formula
curable silicone
sio
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JP2012235184A
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Japanese (ja)
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JP2014084418A5 (enExample
JP2014084418A (ja
Inventor
小林　昭彦
昭彦 小林
岡　裕
裕 岡
通孝 須藤
通孝 須藤
智浩 飯村
智浩 飯村
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Priority to JP2012235184A priority Critical patent/JP6157085B2/ja
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to KR1020157013087A priority patent/KR101875382B1/ko
Priority to CN201380055100.8A priority patent/CN104755569B/zh
Priority to US14/438,102 priority patent/US9683084B2/en
Priority to TW102138282A priority patent/TWI621665B/zh
Priority to EP13792109.4A priority patent/EP2912129B1/en
Priority to PCT/JP2013/079333 priority patent/WO2014065433A1/en
Publication of JP2014084418A publication Critical patent/JP2014084418A/ja
Publication of JP2014084418A5 publication Critical patent/JP2014084418A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
JP2012235184A 2012-10-24 2012-10-24 硬化性シリコーン組成物、その硬化物、および光半導体装置 Active JP6157085B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012235184A JP6157085B2 (ja) 2012-10-24 2012-10-24 硬化性シリコーン組成物、その硬化物、および光半導体装置
CN201380055100.8A CN104755569B (zh) 2012-10-24 2013-10-23 可固化有机硅组合物、其固化产物及光学半导体器件
US14/438,102 US9683084B2 (en) 2012-10-24 2013-10-23 Curable silicone composition, cured product thereof, and optical semiconductor device
TW102138282A TWI621665B (zh) 2012-10-24 2013-10-23 可硬化性聚矽氧組合物、其硬化產品、及光半導體裝置
KR1020157013087A KR101875382B1 (ko) 2012-10-24 2013-10-23 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치
EP13792109.4A EP2912129B1 (en) 2012-10-24 2013-10-23 Curable silicone composition, cured product thereof, and optical semiconductor device
PCT/JP2013/079333 WO2014065433A1 (en) 2012-10-24 2013-10-23 Curable silicone composition, cured product thereof, and optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012235184A JP6157085B2 (ja) 2012-10-24 2012-10-24 硬化性シリコーン組成物、その硬化物、および光半導体装置

Publications (3)

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JP2014084418A JP2014084418A (ja) 2014-05-12
JP2014084418A5 JP2014084418A5 (enExample) 2015-11-26
JP6157085B2 true JP6157085B2 (ja) 2017-07-05

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JP2012235184A Active JP6157085B2 (ja) 2012-10-24 2012-10-24 硬化性シリコーン組成物、その硬化物、および光半導体装置

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Country Link
US (1) US9683084B2 (enExample)
EP (1) EP2912129B1 (enExample)
JP (1) JP6157085B2 (enExample)
KR (1) KR101875382B1 (enExample)
CN (1) CN104755569B (enExample)
TW (1) TWI621665B (enExample)
WO (1) WO2014065433A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6084808B2 (ja) 2012-10-24 2017-02-22 東レ・ダウコーニング株式会社 オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6081774B2 (ja) 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
CN109716544B (zh) * 2016-09-30 2021-11-09 日产化学株式会社 Led用密封材料组合物
WO2018236127A1 (en) * 2017-06-19 2018-12-27 Dow Silicones Corporation LIQUID SILICONE COMPOSITION FOR TRANSFER OR INJECTION MOLDING OF OPTICAL PARTS, OPTICAL PARTS MADE THEREFROM, AND CORRESPONDING PROCESS
KR102471220B1 (ko) * 2018-08-17 2022-11-25 와커 헤미 아게 가교성 오르가노실록산 조성물
KR102106968B1 (ko) 2018-11-05 2020-05-06 구경식 의자 겸용 다기능 운동기구
JP2022178085A (ja) * 2021-05-19 2022-12-02 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止剤、及び光半導体装置
JP7900338B2 (ja) * 2023-09-12 2026-08-04 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物、その硬化物、及び光半導体装置

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JPH1180362A (ja) * 1997-08-29 1999-03-26 Toray Dow Corning Silicone Co Ltd シルフェニレンシルアルキレンポリマーの製造方法
JP4360595B2 (ja) 2002-10-18 2009-11-11 ペルノックス株式会社 光電変換装置
JP2004361692A (ja) 2003-04-07 2004-12-24 Dow Corning Asia Ltd 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法
JP2005162859A (ja) 2003-12-02 2005-06-23 Dow Corning Toray Silicone Co Ltd 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材
JP4801320B2 (ja) 2003-12-19 2011-10-26 東レ・ダウコーニング株式会社 付加反応硬化型オルガノポリシロキサン樹脂組成物
KR100899830B1 (ko) * 2004-08-04 2009-05-27 와커 헤미 아게 수지로 봉지된 발광 다이오드 및 발광 다이오드의 봉지법
US8071697B2 (en) 2005-05-26 2011-12-06 Dow Corning Corporation Silicone encapsulant composition for molding small shapes
JP5392805B2 (ja) 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
KR20080104279A (ko) 2006-02-24 2008-12-02 다우 코닝 코포레이션 실리콘으로 캡슐화된 발광 장치 및 실리콘 제조용의 경화성실리콘 조성물
RU2401846C2 (ru) 2006-04-25 2010-10-20 Учреждение Российской академии наук Институт синтетических полимерных материалов им. Н.С. Ениколопова РАН (ИСПМ РАН) Функциональные полиорганосилоксаны и композиция, способная к отверждению на их основе
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JP5283346B2 (ja) 2007-04-10 2013-09-04 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5972512B2 (ja) * 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
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JP5170471B2 (ja) * 2010-09-02 2013-03-27 信越化学工業株式会社 低ガス透過性シリコーン樹脂組成物及び光半導体装置
JP5524017B2 (ja) * 2010-10-08 2014-06-18 信越化学工業株式会社 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置
WO2013077705A1 (ko) 2011-11-25 2013-05-30 주식회사 엘지화학 오가노폴리실록산
JP6084808B2 (ja) 2012-10-24 2017-02-22 東レ・ダウコーニング株式会社 オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6081774B2 (ja) * 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置

Also Published As

Publication number Publication date
US9683084B2 (en) 2017-06-20
WO2014065433A1 (en) 2014-05-01
US20150284514A1 (en) 2015-10-08
KR101875382B1 (ko) 2018-07-06
EP2912129A1 (en) 2015-09-02
JP2014084418A (ja) 2014-05-12
EP2912129B1 (en) 2018-10-03
CN104755569A (zh) 2015-07-01
TW201422723A (zh) 2014-06-16
TWI621665B (zh) 2018-04-21
CN104755569B (zh) 2017-12-22
KR20150080521A (ko) 2015-07-09

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