KR101872708B1 - 다단계 이온 주입을 이용하여 패턴화된 포토레지스트를 변경하기 하기 위한 방법 및 시스템 - Google Patents

다단계 이온 주입을 이용하여 패턴화된 포토레지스트를 변경하기 하기 위한 방법 및 시스템 Download PDF

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KR101872708B1
KR101872708B1 KR1020137010472A KR20137010472A KR101872708B1 KR 101872708 B1 KR101872708 B1 KR 101872708B1 KR 1020137010472 A KR1020137010472 A KR 1020137010472A KR 20137010472 A KR20137010472 A KR 20137010472A KR 101872708 B1 KR101872708 B1 KR 101872708B1
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tilt angle
substrate
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exposure
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KR20130138786A (ko
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루도빅 고데
패트릭 엠. 마틴
죠셉 씨. 올슨
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베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26586—Bombardment with radiation with high-energy radiation producing ion implantation characterised by the angle between the ion beam and the crystal planes or the main crystal surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/266—Bombardment with radiation with high-energy radiation producing ion implantation using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31793—Problems associated with lithography
    • H01J2237/31796—Problems associated with lithography affecting resists

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Micromachines (AREA)
KR1020137010472A 2010-10-01 2011-09-28 다단계 이온 주입을 이용하여 패턴화된 포토레지스트를 변경하기 하기 위한 방법 및 시스템 Active KR101872708B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/896,046 US8133804B1 (en) 2010-10-01 2010-10-01 Method and system for modifying patterned photoresist using multi-step ion implantation
US12/896,046 2010-10-01
PCT/US2011/053666 WO2012044677A1 (en) 2010-10-01 2011-09-28 Method and system for modifying patterned photoresist using multi-step ion implantion

Publications (2)

Publication Number Publication Date
KR20130138786A KR20130138786A (ko) 2013-12-19
KR101872708B1 true KR101872708B1 (ko) 2018-06-29

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Country Status (6)

Country Link
US (1) US8133804B1 (enExample)
JP (1) JP5858496B2 (enExample)
KR (1) KR101872708B1 (enExample)
CN (1) CN103155090B (enExample)
TW (1) TWI520181B (enExample)
WO (1) WO2012044677A1 (enExample)

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US8974683B2 (en) * 2011-09-09 2015-03-10 Varian Semiconductor Equipment Associates, Inc. Method and system for modifying resist openings using multiple angled ions
WO2014002336A1 (ja) * 2012-06-29 2014-01-03 キヤノンアネルバ株式会社 イオンビーム処理方法およびイオンビーム処理装置
CN104345568A (zh) * 2013-08-07 2015-02-11 中芯国际集成电路制造(上海)有限公司 减小光刻胶图形线宽粗糙度的方法
US20160064239A1 (en) * 2014-08-28 2016-03-03 Taiwan Semiconductor Manufacturing Company, Ltd. Method for Integrated Circuit Patterning
US9512517B2 (en) 2015-01-23 2016-12-06 Varian Semiconductor Equipment Associates, Inc. Multiple exposure treatment for processing a patterning feature
CN106298929B (zh) * 2015-06-12 2019-11-01 中芯国际集成电路制造(上海)有限公司 鳍式场效应管的形成方法
KR20170016107A (ko) * 2015-08-03 2017-02-13 삼성전자주식회사 반도체 장치 제조 방법
CN105632981A (zh) * 2016-03-19 2016-06-01 复旦大学 一种利用热处理减小微电子器件表面粗糙度的仪器
CN105789044A (zh) * 2016-03-19 2016-07-20 复旦大学 一种利用热处理减小微电子器件表面粗糙度的方法
US10658184B2 (en) 2016-12-15 2020-05-19 Taiwan Semiconductor Manufacturing Co., Ltd. Pattern fidelity enhancement with directional patterning technology
US10310379B2 (en) * 2017-01-13 2019-06-04 Varian Semiconductor Equipment Associates, Inc. Multiple patterning approach using ion implantation
US10147584B2 (en) * 2017-03-20 2018-12-04 Varian Semiconductor Equipment Associates, Inc. Apparatus and techniques for decelerated ion beam with no energy contamination
KR102491093B1 (ko) 2017-08-21 2023-01-20 삼성전자주식회사 패턴 형성 방법
US10522349B2 (en) 2017-11-30 2019-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-reflective coating by ion implantation for lithography patterning
US10818473B2 (en) * 2018-08-14 2020-10-27 Taiwan Semiconductor Manufacturing Co., Ltd. Implanter calibration
KR102687231B1 (ko) * 2020-03-30 2024-07-22 주식회사 히타치하이테크 하전 입자선 장치 및 조도 지표 산출 방법
US11635695B2 (en) * 2020-06-15 2023-04-25 Taiwan Semiconductor Manufacturing Co., Ltd. Method for reducing line-end space in integrated circuit patterning
CN111755326A (zh) * 2020-06-29 2020-10-09 西安微电子技术研究所 一种解决7度角注入工艺中硅衬底起皮缺陷的方法
US12354873B2 (en) * 2020-09-30 2025-07-08 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for multiple step directional patterning
US11854818B2 (en) * 2021-05-04 2023-12-26 Applied Materials, Inc. Angled etch for surface smoothing
US20220399272A1 (en) * 2021-06-14 2022-12-15 Taiwan Semiconductor Manufacturing Co., Ltd. System and method to reduce layout dimensions using non-perpendicular process scheme
US12198931B2 (en) * 2022-04-14 2025-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Ion implantation method for reducing roughness of patterned resist lines
US20240194540A1 (en) * 2022-12-08 2024-06-13 Applied Materials, Inc. Two step implant to improve line edge roughness and line width roughness

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JP2000235969A (ja) 1999-02-15 2000-08-29 Sony Corp 半導体装置の製造方法
KR100272159B1 (ko) * 1993-11-24 2000-11-15 윤종용 대칭적 이온 주입 방법
JP2005038952A (ja) * 2003-07-17 2005-02-10 Fujitsu Ltd スリミング製造方法およびスリミングシステム
US20100096566A1 (en) 2008-10-20 2010-04-22 Robert Bristol Reducing Line Edge Roughness by Particle Beam Exposure

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JP4060659B2 (ja) * 2002-07-24 2008-03-12 株式会社東芝 パターン形成方法、及び基板処理装置
US20040087153A1 (en) * 2002-10-31 2004-05-06 Yan Du Method of etching a silicon-containing dielectric material
JP3963846B2 (ja) * 2003-01-30 2007-08-22 東京エレクトロン株式会社 熱的処理方法および熱的処理装置
CN100440450C (zh) * 2003-09-30 2008-12-03 日本航空电子工业株式会社 固体表面平坦化方法及其装置
US7291563B2 (en) * 2005-08-18 2007-11-06 Micron Technology, Inc. Method of etching a substrate; method of forming a feature on a substrate; and method of depositing a layer comprising silicon, carbon, and fluorine onto a semiconductor substrate
WO2008054013A1 (fr) * 2006-10-30 2008-05-08 Japan Aviation Electronics Industry Limited Procédé de façonnage d'une surface solide faisant intervenir un faisceau ionique à agrégats gazeux

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
KR100272159B1 (ko) * 1993-11-24 2000-11-15 윤종용 대칭적 이온 주입 방법
JP2000235969A (ja) 1999-02-15 2000-08-29 Sony Corp 半導体装置の製造方法
JP2005038952A (ja) * 2003-07-17 2005-02-10 Fujitsu Ltd スリミング製造方法およびスリミングシステム
US20100096566A1 (en) 2008-10-20 2010-04-22 Robert Bristol Reducing Line Edge Roughness by Particle Beam Exposure

Also Published As

Publication number Publication date
TW201222640A (en) 2012-06-01
JP5858496B2 (ja) 2016-02-10
CN103155090A (zh) 2013-06-12
JP2013541845A (ja) 2013-11-14
US20120083136A1 (en) 2012-04-05
CN103155090B (zh) 2016-02-24
US8133804B1 (en) 2012-03-13
KR20130138786A (ko) 2013-12-19
WO2012044677A1 (en) 2012-04-05
TWI520181B (zh) 2016-02-01

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