KR101870490B1 - 단결정 실리콘을 사용하여 형성된 구조체 - Google Patents

단결정 실리콘을 사용하여 형성된 구조체 Download PDF

Info

Publication number
KR101870490B1
KR101870490B1 KR1020147022311A KR20147022311A KR101870490B1 KR 101870490 B1 KR101870490 B1 KR 101870490B1 KR 1020147022311 A KR1020147022311 A KR 1020147022311A KR 20147022311 A KR20147022311 A KR 20147022311A KR 101870490 B1 KR101870490 B1 KR 101870490B1
Authority
KR
South Korea
Prior art keywords
layer
cavity
delete delete
substrate
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020147022311A
Other languages
English (en)
Korean (ko)
Other versions
KR20140112068A (ko
Inventor
발렌틴 코센코
에드워드 리 맥베인
시프리언 에메카 유조
페즈만 모나게미
세르게이 사바스티오크
Original Assignee
인벤사스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/362,898 external-priority patent/US8757897B2/en
Application filed by 인벤사스 코포레이션 filed Critical 인벤사스 코포레이션
Publication of KR20140112068A publication Critical patent/KR20140112068A/ko
Application granted granted Critical
Publication of KR101870490B1 publication Critical patent/KR101870490B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Micromachines (AREA)
  • Weting (AREA)
  • Optical Integrated Circuits (AREA)
KR1020147022311A 2012-01-10 2013-01-07 단결정 실리콘을 사용하여 형성된 구조체 Active KR101870490B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201261585217P 2012-01-10 2012-01-10
US61/585,217 2012-01-10
US13/362,898 US8757897B2 (en) 2012-01-10 2012-01-31 Optical interposer
US13/362,898 2012-01-31
US13/454,713 US9323010B2 (en) 2012-01-10 2012-04-24 Structures formed using monocrystalline silicon and/or other materials for optical and other applications
US13/454,713 2012-04-24
PCT/US2013/020562 WO2013106285A2 (en) 2012-01-10 2013-01-07 Structures formed using monocrystalline silicon and/or other materials for optical and other applications

Publications (2)

Publication Number Publication Date
KR20140112068A KR20140112068A (ko) 2014-09-22
KR101870490B1 true KR101870490B1 (ko) 2018-06-22

Family

ID=48743988

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020147022311A Active KR101870490B1 (ko) 2012-01-10 2013-01-07 단결정 실리콘을 사용하여 형성된 구조체
KR1020147022313A Active KR101955060B1 (ko) 2012-01-10 2013-01-07 광학 인터포저 및 그 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020147022313A Active KR101955060B1 (ko) 2012-01-10 2013-01-07 광학 인터포저 및 그 제조 방법

Country Status (7)

Country Link
US (1) US9323010B2 (enExample)
EP (2) EP2802915B1 (enExample)
JP (1) JP5970081B2 (enExample)
KR (2) KR101870490B1 (enExample)
CN (2) CN104169768B (enExample)
TW (2) TWI553368B (enExample)
WO (2) WO2013106288A1 (enExample)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8508028B2 (en) * 2010-07-16 2013-08-13 Yu-Lung Huang Chip package and method for forming the same
TW201417250A (zh) * 2012-07-17 2014-05-01 海特根微光學公司 光學模組,特別是光電模組,及其製造方法
US9529162B2 (en) * 2012-10-09 2016-12-27 Corning Optical Communications LLC Optical fiber connectors and methods of forming optical fiber connectors
US9484211B2 (en) 2013-01-24 2016-11-01 Taiwan Semiconductor Manufacturing Company, Ltd. Etchant and etching process
DE102013224607B4 (de) 2013-11-29 2024-06-06 Robert Bosch Gmbh Mikro-elektromechanische Anordnung und Verfahren zum Aufbau einer mikro-elektromechanischen Anordnung
KR101963485B1 (ko) * 2013-12-20 2019-03-28 인텔 코포레이션 테이퍼 도파로 구조체를 갖는 광검출기
CN104752192B (zh) * 2013-12-31 2017-11-14 中芯国际集成电路制造(上海)有限公司 一种在半导体衬底表面制作斜面的方法
US9395491B2 (en) * 2014-02-05 2016-07-19 Aurrion, Inc. Shielding regions for photonic integrated circuits
CN103955129A (zh) * 2014-04-10 2014-07-30 中国电子科技集团公司第三十八研究所 具有双反射镜的微型原子气体腔器件及其制造方法
CN103941577A (zh) * 2014-04-10 2014-07-23 中国电子科技集团公司第三十八研究所 具有双反射镜和凹槽形结构的原子气体腔器件及其制造方法
CN103941576A (zh) * 2014-04-10 2014-07-23 中国电子科技集团公司第三十八研究所 基于mems技术的原子气体腔器件及其制造方法
US9274277B2 (en) 2014-05-15 2016-03-01 Globalfoundries Inc. Waveguide devices with supporting anchors
TWI549259B (zh) * 2014-05-15 2016-09-11 國立清華大學 全集成主被動積體光學於矽基積體電路及其製作方法
CN104465855B (zh) * 2014-11-24 2017-02-22 华天科技(昆山)电子有限公司 晶圆级光互连模块及制作方法
US9498120B2 (en) 2014-12-22 2016-11-22 Carl Zeiss Meditec Ag Method and system for optical coherence elastography of posterior parts of the eye
CN104966670A (zh) * 2015-06-25 2015-10-07 中国工程物理研究院电子工程研究所 一种单晶硅刻蚀方法及刻蚀液
JP6217706B2 (ja) * 2015-07-29 2017-10-25 日亜化学工業株式会社 光学部材の製造方法、半導体レーザ装置の製造方法及び半導体レーザ装置
JP6354704B2 (ja) * 2015-08-25 2018-07-11 日亜化学工業株式会社 光学部材の製造方法、半導体レーザ装置の製造方法及び半導体レーザ装置
CN105321929B (zh) * 2015-08-26 2018-05-08 中国科学院微电子研究所 一种三维光电集成结构及其制作方法
CN105336795B (zh) * 2015-08-26 2017-03-22 中国科学院微电子研究所 一种基于光栅接口的光子芯片封装结构及其制作方法
JP6949829B2 (ja) * 2015-09-03 2021-10-13 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. Icダイ、プローブ、及び超音波システム
US10408926B2 (en) * 2015-09-18 2019-09-10 Qualcomm Incorporated Implementation of the focal plane 2D APD array for hyperion lidar system
US9910232B2 (en) * 2015-10-21 2018-03-06 Luxtera, Inc. Method and system for a chip-on-wafer-on-substrate assembly
WO2017105388A1 (en) * 2015-12-14 2017-06-22 Intel Corporation Substrate integrated waveguide
US10209477B1 (en) * 2017-05-25 2019-02-19 Lockheed Martin Coherent Technologies, Inc. Systems and methods for reconfigurable micro-optic assemblies
US10168495B1 (en) * 2017-06-28 2019-01-01 Kyocera Corporation Optical waveguide and optical circuit board
JP6631609B2 (ja) * 2017-09-26 2020-01-15 日亜化学工業株式会社 半導体レーザ装置の製造方法
US20190237629A1 (en) 2018-01-26 2019-08-01 Lumileds Llc Optically transparent adhesion layer to connect noble metals to oxides
US10930628B2 (en) * 2018-06-27 2021-02-23 Taiwan Semiconductor Manufacturing Company, Ltd. Photonic semiconductor device and method
US11327348B2 (en) * 2018-09-18 2022-05-10 Eagle Technology, Llc Multi-channel laser system including optical assembly with etched optical signal channels and related methods
US11042052B2 (en) 2018-09-18 2021-06-22 Eagle Technology, Llc Multi-channel laser system including an acousto-optic modulator (AOM) with beam polarization switching and related methods
CN111951693B (zh) * 2019-05-17 2022-11-15 浙江宇视科技有限公司 一种阵列器件的定位方法、装置、存储介质及电子设备
US11887985B2 (en) * 2021-03-04 2024-01-30 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and method
US11940659B2 (en) 2021-08-30 2024-03-26 Taiwan Semiconductor Manufacturing Company Limited Optical integrated circuit structure including edge coupling protective features and methods of forming same
US11774689B2 (en) 2021-10-25 2023-10-03 Globalfoundries U.S. Inc. Photonics chips and semiconductor products having angled optical fibers
TWI831270B (zh) * 2022-04-01 2024-02-01 欣興電子股份有限公司 電子裝置
CN115508956B (zh) * 2022-09-22 2024-04-16 希烽光电科技(南京)有限公司 倾斜基板高带宽光引擎
US20250123553A1 (en) * 2023-10-13 2025-04-17 Taiwan Semiconductor Manufacturing Company Limited System and method for patterned layer design and formation
US20250216623A1 (en) * 2024-01-03 2025-07-03 Qualcomm Incorporated Interposer having integrated optical waveguide
US20250244543A1 (en) * 2024-01-26 2025-07-31 Taiwan Semiconductor Manufacturing Company, Ltd. Optical signal redirection structure for photonics device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040067025A1 (en) 2002-05-09 2004-04-08 Akira Haraguchi Optical device
JP2009198803A (ja) 2008-02-21 2009-09-03 Sony Corp 光モジュール及び光導波路

Family Cites Families (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3761782A (en) 1971-05-19 1973-09-25 Signetics Corp Semiconductor structure, assembly and method
US4905523A (en) 1987-04-24 1990-03-06 Wacoh Corporation Force detector and moment detector using resistance element
US5229647A (en) 1991-03-27 1993-07-20 Micron Technology, Inc. High density data storage using stacked wafers
US5357103A (en) * 1991-10-02 1994-10-18 Sumitomo Electric Industries, Inc. Light receiving module with optical fiber coupling
US5502314A (en) * 1993-07-05 1996-03-26 Matsushita Electric Industrial Co., Ltd. Field-emission element having a cathode with a small radius
US5359687A (en) * 1993-08-23 1994-10-25 Alliedsignal Inc. Polymer microstructures which facilitate fiber optic to waveguide coupling
EP0804323B1 (de) 1995-01-18 1998-11-04 Robert Bosch Gmbh Anordnung zur umsetzung von optischen in elektrische signale und verfahren zur herstellung
KR100441810B1 (ko) * 1995-09-29 2004-10-20 모토로라 인코포레이티드 광전달구조물을정렬하기위한전자장치
JPH09320996A (ja) 1996-03-29 1997-12-12 Denso Corp 半導体装置の製造方法
US5808293A (en) * 1996-08-28 1998-09-15 Hewlett-Packard Company Photo detector with an integrated mirror and a method of making the same
US6332719B1 (en) 1997-06-25 2001-12-25 Matsushita Electric Industrial Co., Ltd. Optical transmitter/receiver apparatus, method for fabricating the same and optical semiconductor module
JP4019538B2 (ja) * 1998-03-16 2007-12-12 住友電気工業株式会社 光モジュール用基体及び光モジュール
US6115521A (en) * 1998-05-07 2000-09-05 Trw Inc. Fiber/waveguide-mirror-lens alignment device
US6246026B1 (en) 1998-09-18 2001-06-12 The Whitaker Corporation Process for cutting an optical fiber
DE69907351T2 (de) 1998-09-18 2003-11-06 Sumitomo Electric Industries, Ltd. Photodiodenmodul
US20030034438A1 (en) 1998-11-25 2003-02-20 Sherrer David W. Optoelectronic device-optical fiber connector having micromachined pit for passive alignment of the optoelectronic device
US6625357B2 (en) 1999-03-29 2003-09-23 Tyco Electronics Corporation Method for fabricating fiducials for passive alignment of opto-electronic devices
JP2001021775A (ja) * 1999-07-09 2001-01-26 Sumitomo Electric Ind Ltd 光学装置
US6266472B1 (en) * 1999-09-03 2001-07-24 Corning Incorporated Polymer gripping elements for optical fiber splicing
US20010053260A1 (en) * 2000-03-13 2001-12-20 Toshiyuki Takizawa Optical module and method for producing the same, and optical circuit device
US6737223B2 (en) 2000-08-07 2004-05-18 Shipley Company, L.L.C. Fiber optic chip with lenslet array and method of fabrication
JP3921940B2 (ja) * 2000-12-07 2007-05-30 住友電気工業株式会社 光送受信モジュール
US6863209B2 (en) * 2000-12-15 2005-03-08 Unitivie International Limited Low temperature methods of bonding components
US6439703B1 (en) 2000-12-29 2002-08-27 Eastman Kodak Company CMOS/MEMS integrated ink jet print head with silicon based lateral flow nozzle architecture and method of forming same
US6717254B2 (en) 2001-02-22 2004-04-06 Tru-Si Technologies, Inc. Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture
US6498381B2 (en) 2001-02-22 2002-12-24 Tru-Si Technologies, Inc. Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same
US6787916B2 (en) 2001-09-13 2004-09-07 Tru-Si Technologies, Inc. Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity
JP2003167175A (ja) 2001-12-04 2003-06-13 Matsushita Electric Ind Co Ltd 光実装基板及び光デバイス
JP2003177272A (ja) * 2001-12-12 2003-06-27 Alps Electric Co Ltd 光合分波器とその製造方法及び光合分波モジュール
JP3750649B2 (ja) 2001-12-25 2006-03-01 住友電気工業株式会社 光通信装置
US6928226B2 (en) * 2002-03-14 2005-08-09 Corning Incorporated Fiber and lens grippers, optical devices and methods of manufacture
EP1502135A2 (en) 2002-04-16 2005-02-02 Xloom Photonics Ltd. Electro-optical circuitry having integrated connector and methods for the production thereof
US6730540B2 (en) 2002-04-18 2004-05-04 Tru-Si Technologies, Inc. Clock distribution networks and conductive lines in semiconductor integrated circuits
KR20040081838A (ko) * 2003-03-17 2004-09-23 엘지전자 주식회사 양면형 및 다층형 광 백플레인 기판 및 그 제조방법
US6897148B2 (en) 2003-04-09 2005-05-24 Tru-Si Technologies, Inc. Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby
CN100365775C (zh) 2003-05-23 2008-01-30 罗姆和哈斯电子材料有限责任公司 用于显微机械加工晶体材料的蚀刻方法以及由此方法制备的器件
US6985645B2 (en) * 2003-09-24 2006-01-10 International Business Machines Corporation Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines
US7060601B2 (en) 2003-12-17 2006-06-13 Tru-Si Technologies, Inc. Packaging substrates for integrated circuits and soldering methods
US7049170B2 (en) 2003-12-17 2006-05-23 Tru-Si Technologies, Inc. Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
CN1645172A (zh) 2004-01-22 2005-07-27 松下电器产业株式会社 光传送路基板、光传送路内置基板、及它们的制造方法
US7713053B2 (en) 2005-06-10 2010-05-11 Protochips, Inc. Reusable template for creation of thin films; method of making and using template; and thin films produced from template
US7547637B2 (en) * 2005-06-21 2009-06-16 Intel Corporation Methods for patterning a semiconductor film
JP2008026839A (ja) 2005-08-15 2008-02-07 Rohm & Haas Electronic Materials Llc 結合方法および光学アセンブリ
US20070189659A1 (en) 2006-01-29 2007-08-16 Jeng-Jye Shau Thin Film Optical Patterning Devices
JP2007298770A (ja) * 2006-04-28 2007-11-15 Nec Corp 光導波路デバイス及びその製造方法
US7510928B2 (en) 2006-05-05 2009-03-31 Tru-Si Technologies, Inc. Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques
US7628932B2 (en) * 2006-06-02 2009-12-08 Micron Technology, Inc. Wet etch suitable for creating square cuts in si
US7709341B2 (en) * 2006-06-02 2010-05-04 Micron Technology, Inc. Methods of shaping vertical single crystal silicon walls and resulting structures
DE102006034236B3 (de) * 2006-07-25 2008-05-15 Airbus Deutschland Gmbh Halterung für Lichtwellenleiter
US8304805B2 (en) * 2009-01-09 2012-11-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor diodes fabricated by aspect ratio trapping with coalesced films
US7485965B2 (en) * 2007-05-25 2009-02-03 International Business Machines Corporation Through via in ultra high resistivity wafer and related methods
TWI402549B (zh) * 2008-04-09 2013-07-21 Ind Tech Res Inst 光電互連模組
PL2216670T3 (pl) 2009-02-10 2016-12-30 Wkładka dla zespołu światłowodów i zespół światłowodów wykorzystujący taką wkładkę
US20120099820A1 (en) 2009-03-20 2012-04-26 Rolston David R Two dimensional optical connector
JP5465453B2 (ja) * 2009-03-26 2014-04-09 パナソニック株式会社 光導波路形成用エポキシ樹脂組成物、光導波路形成用硬化性フィルム、光伝送用フレキシブルプリント配線板、及び電子情報機器
CN101852898B (zh) 2009-03-30 2014-03-12 日立电线株式会社 光连接器及使用了光连接器的光纤模块
US8031993B2 (en) 2009-07-28 2011-10-04 Tyco Electronics Corporation Optical fiber interconnect device
US8611716B2 (en) 2009-09-30 2013-12-17 Corning Incorporated Channeled substrates for integrated optical devices employing optical fibers
US8791405B2 (en) * 2009-12-03 2014-07-29 Samsung Electronics Co., Ltd. Optical waveguide and coupler apparatus and method of manufacturing the same
US7949211B1 (en) 2010-02-26 2011-05-24 Corning Incorporated Modular active board subassemblies and printed wiring boards comprising the same
TWI446036B (zh) * 2010-05-24 2014-07-21 Univ Nat Central 光學傳輸模組
TWI414478B (zh) 2010-09-09 2013-11-11 Domintech Co Ltd 可同時量測加速度及壓力之微機電感測器
US20120146101A1 (en) * 2010-12-13 2012-06-14 Chun-Hsien Lin Multi-gate transistor devices and manufacturing method thereof
US8757897B2 (en) * 2012-01-10 2014-06-24 Invensas Corporation Optical interposer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040067025A1 (en) 2002-05-09 2004-04-08 Akira Haraguchi Optical device
JP2009198803A (ja) 2008-02-21 2009-09-03 Sony Corp 光モジュール及び光導波路

Also Published As

Publication number Publication date
JP5970081B2 (ja) 2016-08-17
TW201333562A (zh) 2013-08-16
EP2802915A1 (en) 2014-11-19
CN104364688A (zh) 2015-02-18
EP2802915B1 (en) 2017-04-12
JP2015515113A (ja) 2015-05-21
KR101955060B1 (ko) 2019-03-06
EP2802916A2 (en) 2014-11-19
US9323010B2 (en) 2016-04-26
US20130177274A1 (en) 2013-07-11
WO2013106285A2 (en) 2013-07-18
KR20140112069A (ko) 2014-09-22
TWI539191B (zh) 2016-06-21
EP2802916B1 (en) 2020-03-11
TWI553368B (zh) 2016-10-11
CN104169768A (zh) 2014-11-26
WO2013106285A3 (en) 2013-09-26
TW201333567A (zh) 2013-08-16
KR20140112068A (ko) 2014-09-22
WO2013106288A1 (en) 2013-07-18
CN104364688B (zh) 2016-08-24
CN104169768B (zh) 2016-03-02

Similar Documents

Publication Publication Date Title
US9323010B2 (en) Structures formed using monocrystalline silicon and/or other materials for optical and other applications
US8757897B2 (en) Optical interposer
US10670816B2 (en) Polymer-based 1 x 2 vertical optical splitters on silicon substrate
US9671574B2 (en) Optical integrated circuit comprising light path turning micro-mirror inside the optical waveguide and method of manufacturing the same
CA2843395C (en) Device package and methods for the fabrication and testing thereof
US6828606B2 (en) Substrate with embedded free space optical interconnects
US6944377B2 (en) Optical communication device and laminated optical communication module
KR20140119001A (ko) 유리-실리콘 웨이퍼-적층된 광학-전자 플랫폼
US9651749B1 (en) Interposer with opaque substrate
TW201543092A (zh) 光學組件

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
A302 Request for accelerated examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000