KR101862053B1 - 스테이지 장치, 리소그래피 장치, 물품의 제조방법, 및 결정방법 - Google Patents

스테이지 장치, 리소그래피 장치, 물품의 제조방법, 및 결정방법 Download PDF

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KR101862053B1
KR101862053B1 KR1020150083121A KR20150083121A KR101862053B1 KR 101862053 B1 KR101862053 B1 KR 101862053B1 KR 1020150083121 A KR1020150083121 A KR 1020150083121A KR 20150083121 A KR20150083121 A KR 20150083121A KR 101862053 B1 KR101862053 B1 KR 101862053B1
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South Korea
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stage
signal
vibration
information
thrust
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Korean (ko)
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KR20150144705A (ko
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사토시 마루야마
미츠오 히라타
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캐논 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Control Of Position Or Direction (AREA)
  • Control Of Linear Motors (AREA)
KR1020150083121A 2014-06-17 2015-06-12 스테이지 장치, 리소그래피 장치, 물품의 제조방법, 및 결정방법 Active KR101862053B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014124684A JP6438219B2 (ja) 2014-06-17 2014-06-17 ステージ装置、リソグラフィ装置、物品の製造方法、および決定方法
JPJP-P-2014-124684 2014-06-17

Publications (2)

Publication Number Publication Date
KR20150144705A KR20150144705A (ko) 2015-12-28
KR101862053B1 true KR101862053B1 (ko) 2018-05-29

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ID=54836067

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KR1020150083121A Active KR101862053B1 (ko) 2014-06-17 2015-06-12 스테이지 장치, 리소그래피 장치, 물품의 제조방법, 및 결정방법

Country Status (4)

Country Link
US (1) US9720334B2 (enExample)
JP (1) JP6438219B2 (enExample)
KR (1) KR101862053B1 (enExample)
CN (1) CN105319863B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021064308A (ja) * 2019-10-17 2021-04-22 株式会社Ｓｕｂａｒｕ 最適制御システム
US11422460B2 (en) * 2019-12-12 2022-08-23 Canon Kabushiki Kaisha Alignment control in nanoimprint lithography using feedback and feedforward control
US11604408B2 (en) * 2021-02-24 2023-03-14 Canon Kabushiki Kaisha Adaptive feedforward and feedback control for controlled viscosity alignment and field-to-field related friction variation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060170888A1 (en) * 2005-01-31 2006-08-03 Canon Kabushiki Kaisha Moving control apparatus and moving control method
US20090014932A1 (en) 2005-02-18 2009-01-15 Yokogawa Electric Corporation Xy stage
JP2009141283A (ja) 2007-12-10 2009-06-25 Nikon Corp ステージ装置、露光装置、およびステージ装置の制御方法

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JPH06202736A (ja) * 1992-12-28 1994-07-22 Yaskawa Electric Corp トルクリップル補償機能付制御装置
EP0632568B1 (en) * 1993-06-24 1998-08-26 Canon Kabushiki Kaisha Controller for a multiphase motor
JPH07299778A (ja) * 1994-05-10 1995-11-14 Daikin Ind Ltd ロボット制御装置
JP2001075611A (ja) * 1999-09-02 2001-03-23 Kawasaki Steel Corp セットアップモデルの自動構築方法及び装置
JP2001175332A (ja) 1999-12-22 2001-06-29 Nikon Corp ステージの駆動方法、ステージ装置及び露光装置
JP2001297960A (ja) * 2000-04-11 2001-10-26 Nikon Corp ステージ装置および露光装置
JP2002198285A (ja) * 2000-12-25 2002-07-12 Nikon Corp ステージ装置およびその制振方法並びに露光装置
JP2003088159A (ja) 2001-09-05 2003-03-20 Yaskawa Electric Corp トルクリップル補正方法および装置
JP4473088B2 (ja) * 2004-10-07 2010-06-02 オークマ株式会社 リニアモータ
CN1658075A (zh) 2005-03-25 2005-08-24 上海微电子装备有限公司 一种曝光装置
JP2007142093A (ja) * 2005-11-17 2007-06-07 Hitachi High-Technologies Corp ステージ装置、電子線照射装置及び露光装置
JP5007924B2 (ja) * 2006-09-25 2012-08-22 株式会社安川電機 電動機制御装置とその振動抑制方法
KR20100072015A (ko) 2007-09-07 2010-06-29 내셔널 유니버서티 코포레이션 요코하마 내셔널 유니버서티 구동 제어 방법, 구동 제어 장치, 스테이지 제어 방법, 스테이지 제어 장치, 노광 방법, 노광 장치 및 계측 장치
JP2010207038A (ja) * 2009-03-05 2010-09-16 Yokogawa Electric Corp 推力リップル解析方法及び補正方法
JP5540667B2 (ja) * 2009-11-26 2014-07-02 シンフォニアテクノロジー株式会社 制振装置及びこれを備えた車両
US8488106B2 (en) * 2009-12-28 2013-07-16 Nikon Corporation Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method
KR20110108756A (ko) 2010-03-29 2011-10-06 윤경원 다모드 시스템에서 잔류진동 제거 방법
JP6066592B2 (ja) 2012-06-12 2017-01-25 キヤノン株式会社 露光装置及びデバイス製造方法
US9331624B2 (en) * 2013-02-25 2016-05-03 National Taiwan University Thrust ripple mapping system in a precision stage and method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060170888A1 (en) * 2005-01-31 2006-08-03 Canon Kabushiki Kaisha Moving control apparatus and moving control method
US20090014932A1 (en) 2005-02-18 2009-01-15 Yokogawa Electric Corporation Xy stage
JP2009141283A (ja) 2007-12-10 2009-06-25 Nikon Corp ステージ装置、露光装置、およびステージ装置の制御方法

Also Published As

Publication number Publication date
KR20150144705A (ko) 2015-12-28
JP6438219B2 (ja) 2018-12-12
CN105319863B (zh) 2018-05-29
JP2016004440A (ja) 2016-01-12
US9720334B2 (en) 2017-08-01
CN105319863A (zh) 2016-02-10
US20150362846A1 (en) 2015-12-17

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