KR101843982B1 - 전자부품 용기 및 그의 제조방법 - Google Patents

전자부품 용기 및 그의 제조방법 Download PDF

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Publication number
KR101843982B1
KR101843982B1 KR1020170023538A KR20170023538A KR101843982B1 KR 101843982 B1 KR101843982 B1 KR 101843982B1 KR 1020170023538 A KR1020170023538 A KR 1020170023538A KR 20170023538 A KR20170023538 A KR 20170023538A KR 101843982 B1 KR101843982 B1 KR 101843982B1
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KR
South Korea
Prior art keywords
base layer
conductive
conductive layer
solvent
layers
Prior art date
Application number
KR1020170023538A
Other languages
English (en)
Korean (ko)
Inventor
윤세원
Original Assignee
윤세원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윤세원 filed Critical 윤세원
Priority to KR1020170023538A priority Critical patent/KR101843982B1/ko
Priority to CN201710948326.0A priority patent/CN108461431B/zh
Priority to JP2018003186A priority patent/JP2018135154A/ja
Application granted granted Critical
Publication of KR101843982B1 publication Critical patent/KR101843982B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)
KR1020170023538A 2017-02-22 2017-02-22 전자부품 용기 및 그의 제조방법 KR101843982B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020170023538A KR101843982B1 (ko) 2017-02-22 2017-02-22 전자부품 용기 및 그의 제조방법
CN201710948326.0A CN108461431B (zh) 2017-02-22 2017-10-12 电子元件容器及其制造方法
JP2018003186A JP2018135154A (ja) 2017-02-22 2018-01-12 電子部品の容器及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170023538A KR101843982B1 (ko) 2017-02-22 2017-02-22 전자부품 용기 및 그의 제조방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020180003817A Division KR101910471B1 (ko) 2018-01-11 2018-01-11 전자부품 용기

Publications (1)

Publication Number Publication Date
KR101843982B1 true KR101843982B1 (ko) 2018-03-30

Family

ID=61900194

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170023538A KR101843982B1 (ko) 2017-02-22 2017-02-22 전자부품 용기 및 그의 제조방법

Country Status (3)

Country Link
JP (1) JP2018135154A (zh)
KR (1) KR101843982B1 (zh)
CN (1) CN108461431B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021075315A (ja) * 2019-11-12 2021-05-20 株式会社村田製作所 ベーステープおよび電子部品連

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100196633B1 (ko) 1995-04-18 1999-06-15 이사오 우치가사키 정전기 보호장치 및 그의 제조방법
JP5638182B2 (ja) * 2007-11-27 2014-12-10 株式会社レグルス 電子部品の収納容器

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5566501U (zh) * 1978-11-01 1980-05-08
JP3684700B2 (ja) * 1996-08-27 2005-08-17 凸版印刷株式会社 テープキャリア及びその製造方法
JP3440718B2 (ja) * 1996-11-01 2003-08-25 松下電器産業株式会社 キャリアテープの製造方法
JP4359990B2 (ja) * 2000-02-16 2009-11-11 凸版印刷株式会社 フィルムキャリアの製造方法
JP4618622B2 (ja) * 2000-08-25 2011-01-26 株式会社アサヒコーポレーション トレ−ニングシュ−ズ
KR20040062966A (ko) * 2001-11-27 2004-07-09 엔테그리스, 아이엔씨. 정전기 소산 필름을 갖는 반도체 구성요소 취급 장치
CN201260267Y (zh) * 2008-01-14 2009-06-17 东莞市问鼎静电科技有限公司 超洁净防静电和导电托盘
JP2010158795A (ja) * 2009-01-06 2010-07-22 Regulus Co Ltd 電子部品の収納容器および帯電防止樹脂シート
JP3150663U (ja) * 2009-03-09 2009-05-28 八重美 池尻 猫背を矯正する室内ではく履物
US9078484B2 (en) * 2010-03-19 2015-07-14 Universitaet Duisburg-Essen Sole for a shoe and shoe
CN103158307A (zh) * 2011-12-09 2013-06-19 苏州丸爱半导体包装有限公司 超耐磨损导电性塑料片材及其制造方法
JP5993016B2 (ja) * 2012-07-04 2016-09-14 トビアス・シューマッハＳＣＨＵＭＡＣＨＥＲ， Ｔｏｂｉａｓ 歩行修正または歩行保存のための靴底
CN202873169U (zh) * 2012-11-01 2013-04-10 纳诺电子化学（苏州）有限公司 一种用于周转托盘的片材
CN104386373A (zh) * 2014-09-17 2015-03-04 恩斯盟防静电材料(苏州)有限公司 电池周转用托盘制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100196633B1 (ko) 1995-04-18 1999-06-15 이사오 우치가사키 정전기 보호장치 및 그의 제조방법
JP5638182B2 (ja) * 2007-11-27 2014-12-10 株式会社レグルス 電子部品の収納容器

Also Published As

Publication number Publication date
CN108461431B (zh) 2022-05-10
JP2018135154A (ja) 2018-08-30
CN108461431A (zh) 2018-08-28

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