KR101840240B1 - 마이크로 전자 패키지 - Google Patents

마이크로 전자 패키지 Download PDF

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Publication number
KR101840240B1
KR101840240B1 KR1020147012161A KR20147012161A KR101840240B1 KR 101840240 B1 KR101840240 B1 KR 101840240B1 KR 1020147012161 A KR1020147012161 A KR 1020147012161A KR 20147012161 A KR20147012161 A KR 20147012161A KR 101840240 B1 KR101840240 B1 KR 101840240B1
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South Korea
Prior art keywords
semiconductor chip
microelectronic
package
terminal
substrate
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KR1020147012161A
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English (en)
Korean (ko)
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KR20140084131A (ko
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리차드 드윗 크리스프
와엘 조니
벨가셈 하바
프랭크 람브레히트
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인벤사스 코포레이션
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Priority claimed from US13/439,286 external-priority patent/US8525327B2/en
Application filed by 인벤사스 코포레이션 filed Critical 인벤사스 코포레이션
Publication of KR20140084131A publication Critical patent/KR20140084131A/ko
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Publication of KR101840240B1 publication Critical patent/KR101840240B1/ko

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    • G11—INFORMATION STORAGE
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    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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    • H01L2924/30—Technical effects
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    • H01L2924/3011—Impedance

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
KR1020147012161A 2011-10-03 2012-09-27 마이크로 전자 패키지 KR101840240B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US201161542488P 2011-10-03 2011-10-03
US201161542553P 2011-10-03 2011-10-03
US61/542,553 2011-10-03
US61/542,488 2011-10-03
US201261600361P 2012-02-17 2012-02-17
US61/600,361 2012-02-17
US13/439,286 US8525327B2 (en) 2011-10-03 2012-04-04 Stub minimization for assemblies without wirebonds to package substrate
US13/439,286 2012-04-04
PCT/US2012/057554 WO2013052345A1 (fr) 2011-10-03 2012-09-27 Réduction au minimum des stubs pour montages sans connexion des fils au substrat du boîtier

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KR20140084131A KR20140084131A (ko) 2014-07-04
KR101840240B1 true KR101840240B1 (ko) 2018-05-04

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CN112687614A (zh) 2019-10-17 2021-04-20 美光科技公司 包含多个装置堆叠的微电子装置组合件和封装体以及相关方法
US11456284B2 (en) 2019-10-17 2022-09-27 Micron Technology, Inc. Microelectronic device assemblies and packages and related methods

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JP2015502652A (ja) 2015-01-22
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KR101901218B1 (ko) 2018-11-08
WO2013052345A1 (fr) 2013-04-11
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JP5895059B2 (ja) 2016-03-30
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JP5881833B2 (ja) 2016-03-09
KR20140084131A (ko) 2014-07-04
TWI491016B (zh) 2015-07-01
WO2013052347A1 (fr) 2013-04-11
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WO2013052398A2 (fr) 2013-04-11
EP2764541A1 (fr) 2014-08-13

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