KR101834572B1 - 질화물 반도체 레이저 소자 및 그 제조 방법 - Google Patents
질화물 반도체 레이저 소자 및 그 제조 방법 Download PDFInfo
- Publication number
- KR101834572B1 KR101834572B1 KR1020110078290A KR20110078290A KR101834572B1 KR 101834572 B1 KR101834572 B1 KR 101834572B1 KR 1020110078290 A KR1020110078290 A KR 1020110078290A KR 20110078290 A KR20110078290 A KR 20110078290A KR 101834572 B1 KR101834572 B1 KR 101834572B1
- Authority
- KR
- South Korea
- Prior art keywords
- film
- nitride semiconductor
- region
- resonator
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0281—Coatings made of semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/176—Specific passivation layers on surfaces other than the emission facet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0282—Passivation layers or treatments
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010177270A JP5707772B2 (ja) | 2010-08-06 | 2010-08-06 | 窒化物半導体レーザ素子及びその製造方法 |
| JPJP-P-2010-177270 | 2010-08-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120024411A KR20120024411A (ko) | 2012-03-14 |
| KR101834572B1 true KR101834572B1 (ko) | 2018-03-05 |
Family
ID=44653996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020110078290A Active KR101834572B1 (ko) | 2010-08-06 | 2011-08-05 | 질화물 반도체 레이저 소자 및 그 제조 방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8654808B2 (https=) |
| EP (1) | EP2416460B1 (https=) |
| JP (1) | JP5707772B2 (https=) |
| KR (1) | KR101834572B1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8867582B2 (en) | 2012-04-04 | 2014-10-21 | Osram Opto Semiconductors Gmbh | Laser diode assembly |
| DE102012102305B4 (de) * | 2012-03-19 | 2025-07-31 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Laserdiodenvorrichtung |
| US8737445B2 (en) | 2012-04-04 | 2014-05-27 | Osram Opto Semiconductors Gmbh | Laser diode assembly |
| DE102012103160A1 (de) | 2012-04-12 | 2013-10-17 | Osram Opto Semiconductors Gmbh | Laserdiodenvorrichtung |
| US9008138B2 (en) | 2012-04-12 | 2015-04-14 | Osram Opto Semiconductors Gmbh | Laser diode device |
| JP6090111B2 (ja) * | 2013-05-29 | 2017-03-08 | 豊田合成株式会社 | 半導体装置およびその製造方法 |
| JP2017050318A (ja) | 2015-08-31 | 2017-03-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP6385633B1 (ja) * | 2018-04-02 | 2018-09-05 | 三菱電機株式会社 | 半導体光素子、半導体光集積素子、および半導体光素子の製造方法 |
| WO2022158557A1 (ja) * | 2021-01-22 | 2022-07-28 | 京セラ株式会社 | 発光素子、半導体レーザ素子並びにその製造方法および製造装置 |
| JP2024019797A (ja) * | 2022-08-01 | 2024-02-14 | 株式会社日本製鋼所 | 半導体レーザおよびその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003209318A (ja) | 2001-11-12 | 2003-07-25 | Sharp Corp | 半導体レーザ素子および半導体レーザ素子の製造方法 |
| JP2008218523A (ja) * | 2007-02-28 | 2008-09-18 | Nichia Chem Ind Ltd | 窒化物半導体レーザ素子及びその製造方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60043536D1 (de) * | 1999-03-04 | 2010-01-28 | Nichia Corp | Nitridhalbleiterlaserelement |
| ATE487255T1 (de) * | 2001-05-31 | 2010-11-15 | Nichia Corp | Halbleiterlaserelement |
| WO2002103866A1 (en) * | 2001-06-15 | 2002-12-27 | Nichia Corporation | Semiconductor laser element, and its manufacturing method |
| US7339255B2 (en) * | 2004-08-24 | 2008-03-04 | Kabushiki Kaisha Toshiba | Semiconductor device having bidirectionally inclined toward <1-100> and <11-20> relative to {0001} crystal planes |
| CN1805230B (zh) | 2004-12-20 | 2011-06-01 | 夏普株式会社 | 氮化物半导体发光元件及其制造方法 |
| JP4451371B2 (ja) | 2004-12-20 | 2010-04-14 | シャープ株式会社 | 窒化物半導体レーザ素子 |
| JP4946243B2 (ja) | 2005-07-29 | 2012-06-06 | 日亜化学工業株式会社 | 半導体レーザ素子、及びそれを用いた光ピックアップ装置、光学式情報再生装置 |
| CN100449888C (zh) | 2005-07-29 | 2009-01-07 | 日亚化学工业株式会社 | 半导体激光元件 |
| US7646798B2 (en) * | 2006-12-28 | 2010-01-12 | Nichia Corporation | Nitride semiconductor laser element |
| US7773650B2 (en) * | 2006-12-28 | 2010-08-10 | Nichia Corporation | Nitride semiconductor laser element |
| US7668218B2 (en) | 2007-02-20 | 2010-02-23 | Nichia Corporation | Nitride semiconductor laser element |
| JP2008227002A (ja) | 2007-03-09 | 2008-09-25 | Nichia Chem Ind Ltd | 窒化物半導体レーザ素子 |
| US7701995B2 (en) * | 2007-07-06 | 2010-04-20 | Nichia Corporation | Nitride semiconductor laser element |
| JP2009152276A (ja) | 2007-12-19 | 2009-07-09 | Mitsubishi Electric Corp | 窒化物半導体レーザの製造方法 |
| JP5305948B2 (ja) | 2009-01-27 | 2013-10-02 | 芝浦メカトロニクス株式会社 | 基板処理装置 |
| KR101698629B1 (ko) * | 2009-07-31 | 2017-01-20 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 레이저 다이오드 |
-
2010
- 2010-08-06 JP JP2010177270A patent/JP5707772B2/ja active Active
-
2011
- 2011-07-29 US US13/194,046 patent/US8654808B2/en active Active
- 2011-08-04 EP EP11176617.6A patent/EP2416460B1/en active Active
- 2011-08-05 KR KR1020110078290A patent/KR101834572B1/ko active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003209318A (ja) | 2001-11-12 | 2003-07-25 | Sharp Corp | 半導体レーザ素子および半導体レーザ素子の製造方法 |
| JP2008218523A (ja) * | 2007-02-28 | 2008-09-18 | Nichia Chem Ind Ltd | 窒化物半導体レーザ素子及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120024411A (ko) | 2012-03-14 |
| JP2012038897A (ja) | 2012-02-23 |
| JP5707772B2 (ja) | 2015-04-30 |
| US20120033698A1 (en) | 2012-02-09 |
| EP2416460A3 (en) | 2014-08-27 |
| EP2416460A2 (en) | 2012-02-08 |
| EP2416460B1 (en) | 2019-04-03 |
| US8654808B2 (en) | 2014-02-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101834572B1 (ko) | 질화물 반도체 레이저 소자 및 그 제조 방법 | |
| US7408199B2 (en) | Nitride semiconductor laser device and nitride semiconductor device | |
| KR101199114B1 (ko) | 반도체 레이저 소자 | |
| JP5285835B2 (ja) | 半導体素子およびその製造方法 | |
| EP2048752B1 (en) | Semiconductor laser device | |
| EP2287982B1 (en) | Nitride semiconductor laser device and method of manufacturing the nitride semiconductor laser device | |
| US7668218B2 (en) | Nitride semiconductor laser element | |
| KR20090004743A (ko) | 질화물 반도체 레이저 소자 | |
| US20080298411A1 (en) | Nitride-based semiconductor laser device and method of manufacturing the same | |
| JP2010258363A (ja) | 窒化物半導体レーザ素子 | |
| US20160352077A1 (en) | Semiconductor laser device | |
| JP2008205171A (ja) | 窒化物半導体レーザ素子 | |
| US7787510B2 (en) | Nitride semiconductor laser chip, nitride semiconductor laser device, and manufacturing method of nitride semiconductor laser chip | |
| JP2024170279A (ja) | 垂直共振器面発光レーザ素子 | |
| JP4131293B2 (ja) | 窒化物半導体レーザ素子及び窒化物半導体素子 | |
| JP2008218523A (ja) | 窒化物半導体レーザ素子及びその製造方法 | |
| JP5707929B2 (ja) | 窒化物半導体レーザ素子 | |
| EP4195427B1 (en) | Nitride semiconductor laser element | |
| JP2009164459A (ja) | 窒化物半導体レーザ素子及びその製造方法 | |
| JP3804494B2 (ja) | 窒化物半導体レーザ素子 | |
| JP2006186025A (ja) | 窒化物半導体レーザ素子 | |
| JP2023084658A (ja) | 窒化物半導体レーザ素子 | |
| JP2012069970A (ja) | 半導体素子 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| FPAY | Annual fee payment |
Payment date: 20210128 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20220120 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| U11 | Full renewal or maintenance fee paid |
Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE) Year of fee payment: 9 |