KR101829613B1 - Deposition apparatus for glass - Google Patents

Abstract

Disclosed is a substrate deposition apparatus which can prevent a quality decrease problem or a yield decrease problem. According to an embodiment of the present invention, the substrate deposition apparatus comprises: a mask frame provided in a chamber in which a deposition process is progressed, and supporting a mask sheet being in contact with a substrate during a bonding process; and a touch plate arranged in an upper area of the mask frame, and aligning the substrate through pressurization so that the substrate is in contact with the mask sheet while maintaining a noncontact state with the mask frame during the bonding process.

Description

[0001] DEPOSITION APPARATUS FOR GLASS [0002]

The present invention relates to a substrate deposition apparatus, and more particularly, to a substrate deposition apparatus capable of improving the accuracy of alignment of a touch plate as compared with the prior art, and thereby causing deterioration in quality or yield due to breakage or shadow of the substrate To the substrate deposition apparatus.

An organic light emitting display (OLED), which is a flat panel display device substrate, is a cemented carbide type display device that realizes a color image by self-emission of an organic substance, and has a simple structure and high optical efficiency. Has attracted attention as a device.

The organic light emitting display OLED includes an anode, a cathode, and organic layers interposed between the anode and the cathode.

Here, the organic layers include at least a light emitting layer and may further include a hole injecting layer, a hole transporting layer, an electron transporting layer, and an electron injecting layer in addition to the light emitting layer.

The organic electroluminescent display device can be divided into a polymer organic electroluminescent device and a low molecular weight organic electroluminescent device depending on an organic film, particularly a material forming the light emitting layer. In order to realize a full color, a light emitting layer must be patterned. As a method of manufacturing a large OLED, a direct patterning method using a fine metal mask (FMM) and a laser induced thermal imaging (LITI) And a method of using a color filter.

When a large-size OLED is manufactured by applying a mask method, a so-called horizontally upward deposition method in which a substrate and a patterned mask are horizontally disposed in a chamber, and then an evaporation material is sprayed toward the mask to deposit a substrate is widely used .

Among the main functions of the deposition process, the method of performing the deposition using the source of the point source and the open mask is uneven in the uniformity of the substance deposited on the substrate.

Therefore, in order to compensate for this, a method of depositing a touch plate, a glass, and a mask frame and rotating the deposition chamber for several to several tens minutes may be considered.

On the other hand, it is important to manage the adhesion structure between the touch plate, the substrate, and the mask frame in a manner that the deposition process proceeds after the adhesion between the touch plate, the substrate and the mask frame. That is, the substrate is usually placed on a mask, and the adhesion is progressed by contacting the substrate while aligning the plate touch plate on the substrate and pressurizing the substrate by its own weight. Therefore, Catching can be an important factor in yield and quality.

If the position of pressing the substrate is varied due to various causes such as generation of burrs and particles, own deformation of the substrate or the mask frame, deterioration of alignment accuracy of the touch plate, etc., If stress is applied, the substrate may be broken, which may lead to a yield reduction problem.

Also, if there is a region where the mask or the touch plate is flattened by an error of tolerance or a gap is generated by the particles, there may be a quality deterioration or a yield reduction due to a shadow phenomenon.

Therefore, it is most important to prevent the above-described problems from occurring when the touch plate, the substrate, and the mask frame are cemented together.

However, as described above, considering the fact that the relatively heavy touch plate is in direct contact with the mask frame to cause vibration, the alignment accuracy of the touch plate is improved. It is necessary to develop a technique for solving the above-mentioned problems.

Korea Patent Office Publication No. 10-2012-0077382

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of aligning a touch plate having a relatively large weight during alignment with a substrate while maintaining a noncontact state on the mask frame, And to provide a substrate deposition apparatus capable of preventing quality deterioration or yield deterioration due to shrinkage of a substrate or shadow due to the substrate.

According to an aspect of the present invention, there is provided a mask frame, which is provided in a chamber in which a deposition process is performed, and supports a mask sheet that is in contact with a substrate during a laminating process. And a touch plate disposed in an upper region of the mask frame for aligning the substrate with the mask sheet while maintaining a noncontact state with the mask frame during the adhesion process, a substrate, and a touch plate.

And a gap sensor coupled to the touch plate and measuring a gap between the touch plate and the mask frame during the adhesion process.

The gap sensor may be arranged in a rectangular shape in a corner area of the touch plate.

The gap sensor can measure a gap between the touch plate and the mask frame in real time during the adhesion process.

And a controller for controlling the aligning operation of the touch plate based on gap information between the touch plate and the mask frame measured in real time by the gap sensor.

The touch plate corresponding to the position of the mask frame may be provided with an upper clamp for clamping an end of the substrate.

The upper clamp may be provided in the clamp mounting groove of the touch plate.

The clamping surface of the upper clamp may be disposed so as to be stepped upward from the touch surface of the touch plate contacting the substrate so that the substrate is not pressed between the mask frame and the touch plate.

A lower clamp may be provided on one side of the mask frame to press the substrate, which is introduced into the chamber during the adhesion process, toward the touch plate.

And a leveler connected to the touch plate and leveling the touch plate even in a vacuum state.

The leveler may be disposed in a corner area of the touch plate.

The touch plate may include a cooling plate contacting the substrate to cool the substrate.

The touch plate may further include an up / down driving plate disposed adjacent to the cooling plate and driven up / down together with the cooling plate.

And a floating unit for floating the up / down driving plate with respect to the cooling plate so that the cooling plate is attached to the substrate by its own weight during the deposition process.

According to the present invention, the relatively large weight of the touch plate is aligned in the non-contact state with the mask frame during the laminating process with the substrate, thereby significantly improving the alignment accuracy of the touch plate Therefore, it is possible to prevent a quality deterioration or a yield deterioration problem from occurring due to a breakage phenomenon or a shadow phenomenon of the substrate.

1 is a schematic structural view of an organic light emitting display device in which an organic film and an inorganic film are alternately deposited in 10 layers.
2 is a structural view of a substrate deposition apparatus according to an embodiment of the present invention.
Figs. 3 to 6 are views showing step by step of the laminating process, respectively.
Fig. 7 is an enlarged view of Fig. 2, showing a laminating process.
Fig. 8 is an enlarged view of Fig. 2 showing the deposition process.
9 is an enlarged view of the gap sensor region.
10 is a control block diagram of a substrate deposition apparatus according to an embodiment of the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

1 is a schematic structural view of an organic light emitting display device in which an organic film and an inorganic film are alternately deposited in 10 layers.

Referring to this figure, an organic light emitting display (OLED) 1 may include a substrate and an organic light emitting element 3 stacked on the substrate.

The substrate may be a substrate provided with glass. The organic light emitting element 3 has a stacked structure of an anode, three organic layers (a hole transporting layer, a light emitting layer, and an electron transporting layer), and a cathode. An organic molecule, when energized (and excited), tries to return to its original state (ground state), and has the property of emitting the energy it receives as light.

In the organic light emitting diode 3, when a voltage is applied, holes (+) injected from the anode and electrons injected from the cathode (-) recombine in the light emitting layer. (Red), G (Green), and B (Blue) light are emitted depending on the organic material on the organic light emitting device 3. In this case, (Full Color) is implemented using the characteristic of emitting a color.

On the other hand, since the organic light emitting element 3 can be easily damaged by gas or moisture in the atmosphere, life thereof may become a problem. To solve this problem, a plurality of organic layers and inorganic layers are alternately stacked The organic light emitting element 3 has been protected from the inflow of gas or moisture.

In Fig. 1, a total of ten organic films and inorganic films are alternately stacked. That is, a first organic film, a first inorganic film, a second organic film, a second inorganic film, a fifth organic film, and a fifth inorganic film are sequentially deposited from the organic light emitting element 3 in layers.

In detail, the first inorganic film completely covers the first organic film, the second organic film partially surrounds the first inorganic film, and the second inorganic film completely covers the second organic film. The following substrate deposition apparatus is required for such deposition.

FIG. 2 is a structural view of a substrate deposition apparatus according to an embodiment of the present invention, and FIGS. 3 to 6 are views showing a step of a lapping process step by step, respectively. FIG. 7 is an enlarged view of FIG. FIG. 8 is an enlarged view of FIG. 2 showing a deposition process, FIG. 9 is an enlarged view of a gap sensor region, and FIG. 10 is a control block diagram of a substrate deposition apparatus according to an embodiment of the present invention.

Referring to these drawings, the substrate deposition apparatus according to the present embodiment includes a chamber 100, a mask frame 130 for supporting a mask sheet 120, which is in contact with a substrate during a laminating process, And a touch plate 140 for aligning the substrate so as to contact the mask sheet 120 while maintaining a noncontact state with respect to the mask frame 130 during a laminating process .

As described above, in the present embodiment, the touch plate 140, which is relatively heavy during the laminating process with the substrate, is aligned while maintaining the noncontact state with the mask frame 130, It is possible to improve the accuracy to a level much higher than that of the prior art, and to prevent the quality deterioration or yield deterioration due to the breakage of the substrate or the shadow phenomenon.

The substrate used in this embodiment may be, for example, a substrate for an organic light emitting display (OLED) as described above.

The chamber 100 is the location where the deposition process for the substrate proceeds. In the case of this embodiment, a horizontal upward deposition method is proposed in which a deposition process is performed on a substrate by an evaporation material that is directed upward after the substrate is horizontally disposed.

However, the scope of the present invention may also be applied to a deposition apparatus to which a vertical type deposition method in which a substrate such as a mask sheet 120 is vertically or obliquely arranged and then is deposited.

The interior of the chamber 100 forms a vacuum atmosphere so that the deposition process for the substrate can proceed reliably.

To this end, a vacuum pump 101a is connected to the lower portion of the chamber 100 as means for maintaining the interior of the chamber 100 in a vacuum atmosphere. The vacuum pump 101a may be a so-called cryopump. The side walls of the chamber 100 may be provided with gates 101b and 101c through which the substrates are introduced.

The source 110 is positioned in the lower region within the chamber 100 as a point source 110 and serves to provide evaporation material toward the upper substrate. In the case of this embodiment, the source 110 injects the evaporation material upwardly in a fixed position. The source 110 may be a linear source.

The substrate deposition apparatus may be mounted on the chamber 100 having such a structure as shown in FIG. At this time, structures such as the substrate, the mask sheet 120, the mask frame 130, and the touch plate 140 are disposed in the chamber 100, and the up / down driving unit 181, which is driving means for driving them, The driving unit 183 may be disposed outside the chamber 100 and connected to the touch plate 140 or the like.

The mask frame 130 is a structure provided in the chamber 100 in which the deposition process is performed as described above. A base plate 124 for supporting the mask frame 130 is provided below the mask frame 130.

This mask frame 130 supports a mask sheet 120, which is in contact with the substrate during the laminating process, as shown in Figs. 3-8. In other words, in the case of the present embodiment, the substrate and the mask sheet 120 are joined together in a contact state as shown in the enlarged view of FIG. 6 due to the action of the touch plate 140, and then the deposition process is performed. Therefore, it is possible to prevent a quality deterioration or a yield reduction problem from occurring due to a shadow phenomenon.

A lower clamp 132 for pressing the substrate, which is introduced into the chamber 100 during the adhesion process, toward the touch plate 140 is provided on one side of the mask frame 130. As shown in FIGS. 3 to 6, the lower clamp 132 is provided with an up / down function.

3 to 6, the touch plate 140 is disposed in an upper region of the mask frame 130, and contacts the substrate 130 while maintaining a noncontact state with the mask frame 130 during the adhesion process, And aligns the substrate so as to be in contact with the mask sheet 120.

As a result, in the case of this embodiment, the mask sheet 120 and the substrate are always in contact with each other as shown in the enlarged view of FIG. 6, and the mask frame 130 and the substrate are free from contact, Thereby preventing the degradation of the substrate or the reduction of the yield due to the shadowing phenomenon of the substrate.

A leveler 180 is connected to the touch plate 140. The leveler 180 enables leveling of the touch plate 140 even under vacuum in the chamber 100. For efficient leveling operations, the leveler 180 may be disposed in a corner area of the touch plate 140, respectively.

In this case, since the leveler 180 is applied in this embodiment, it is necessary to remove the vacuum of the chamber 100 and to perform the leveling operation, Since the leveling operation of the stepping motor 140 is performed, the effect of shortening the time can be provided.

The touch plate 140 corresponding to the position of the mask frame 130 is provided with an upper clamp 142 for clamping an end of the substrate. In this embodiment, the upper clamp 142 may be provided in the clamp mounting groove 141 of the touch plate 140.

At this time, the clamping surface of the upper clamp 142 is disposed in a stepwise manner above the touch surface of the touch plate 140, which is in contact with the substrate, so that the substrate is not pressed between the mask frame 130 and the touch plate 140.

In other words, the height H2 of the clamping surface of the upper clamp 142 is higher than the height H1 of the touch surface of the touch plate 140 as shown in FIG. Therefore, when the end of the substrate is clamped to the upper clamp 142 as shown in FIG. 6, the substrate is not pressed between the mask frame 130 and the touch plate 140, so that the substrate is not broken.

As described above, the mask sheet 120 and the substrate are always in contact with each other during the laminating process as a line operation for the progress of the deposition process, and the mask frame 130 and the substrate are contacted with each other A gap sensor 195 and a controller 190 are further provided in the substrate deposition apparatus according to the embodiment.

The gap sensor 195 is coupled to the touch plate 140 and serves to measure a gap between the touch plate 140 and the mask frame 130 during the adhesion process.

The gap sensor 195 may be disposed in a corner area of the touch plate 140. The gap sensor 195 may be formed in a gap between the touch plate 140 and the mask frame 130 gap) in real time.

The controller 190 controls the alignment operation of the touch plate 140 based on the gap information between the touch plate 140 and the mask frame 130 measured in real time by the gap sensor 195, Leveling operation, and the like. Therefore, the mask sheet 120 and the substrate are always in contact during the laminating process, and the mask frame 130 and the substrate are not in contact with each other, that is, a free structure can be realized. As a result, Can be prevented from being generated.

The controller 190 may include a central processing unit 191 (CPU), a memory 192 (MEMORY), and a support circuit 193 (SUPPORT CIRCUIT).

The central processing unit 191 performs the alignment operation of the touch plate 140 based on the gap information between the touch plate 140 and the mask frame 130 measured in real time by the gap sensor 195 in this embodiment, Leveling operations by the leveler 180, and the like. The computer 110 may be one of a variety of computer 110 processors.

The memory 192 (MEMORY) is connected to the central processing unit 191. The memory 192 may be a local or remote computer-readable recording medium and may be, for example, a random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, At least one readily available memory.

A support circuit 193 (SUPPORT CIRCUIT) is coupled with the central processing unit 191 to support the typical operation of the processor. Such a support circuit 193 may include a cache, a power supply, a clock circuit, an input / output circuit, a subsystem, and the like.

The controller 190 controls the alignment operation of the touch plate 140 based on the gap information between the touch plate 140 and the mask frame 130 measured in real time by the gap sensor 195, 180, and the like, and this series of processes and the like can be stored in the memory 192. Typically, software routines may be stored in memory 192. The software routines may also be stored or executed by other central processing units (not shown).

Although processes according to the present invention are described as being performed by software routines, it is also possible that at least some of the processes of the present invention may be performed by hardware. As such, the processes of the present invention may be implemented in software executed on the computer 110 system, or in hardware such as an integrated circuit, or in a combination of software and hardware.

Meanwhile, the touch plate 140 applied to the present embodiment may be a single structure or may be a single structure or a combination of the cooling plate 150, the up / down driving plate 160, or assembly. In the present embodiment, the latter case will be described.

The cooling plate 150 is a structure disposed on the opposite side of the mask sheet 120 with the substrate interposed therebetween. The cooling plate 150 functions to control (cool) the temperature of the substrate by contacting the substrate during the deposition process for the substrate.

The cooling plate 150 is provided so as to be accessible to or spaced from the mask sheet 120 so that the cooling plate 150 contacts the surface of the substrate during the deposition process.

To this end, the substrate deposition apparatus according to the present embodiment is provided with an up / down driving plate 160 and an up / down driving unit 181.

The up / down driving plate 160 is disposed adjacent to the cooling plate 150, that is, on the upper side of the cooling plate 150, and is driven up / down together with the cooling plate 150. That is, the up / down driving plate 160 is driven up / down by the action of the up / down driving unit 181 so that the cooling plate 150 connected thereto is moved toward or away from the mask sheet 120 .

In this case, in this embodiment, the cooling plate 150 and the up / down driving plate 160 are connected to each other, but they are not completely fixed.

In other words, the up / down driving plate 160 takes a floating state on the cooling plate 150. This is because the cooling plate 150 is lowered to a desired position due to the up / down driving plate 160, and then the cooling plate 150 is pressed against the surface of the substrate by the own load of the cooling plate 150 .

The substrate deposition apparatus according to the present embodiment includes a floating unit 170 for floating the up / down driving plate 160 with respect to the cooling plate 150 so that the cooling plate 150 is attached to the substrate by its own weight during the deposition process, .

9, the floating unit 170 includes a floating block 171 having one end connected to the cooling plate 150 and the other end disposed on the up / down driving plate 160, And a ball plunger 175 coupled to the block 171 and to which the exposed end is supported by the up / down drive plate 160.

The floating block 171 is connected to the cooling plate 150 along the direction in which the up / down driving plate 160 is driven up / down and is fixed to the cooling plate 150 by the ball screw S And a horizontal block 173 which is connected to the vertical block 172 at an upper end of the vertical block 172 in an intersecting manner.

The horizontal block 173 may be disposed on the upper portion of the up / down driving plate 160 while the vertical block 172 is fixed to the cooling plate 150 by the ball screw S, And the ball plunger 175 is coupled to the up / down driving plate 160.

In other words, the cooling plate 150 is not fixed to the up / down driving plate 160 by the bolt type or the welding type, but is mounted on the up / down driving plate 160 via the ball plunger 175 Lt; / RTI > Since the cooling plate 150 and the up / down driving plate 160 are not completely constrained to each other, they are also advantageous for their precise positioning.

The ball plunger 175 may include a plunger body 175a coupled to the floating block 171 and a ball head 175b connected to the plunger body 175a and exposed to the outside of the floating block 171. [

The ball head 175b has a rounded outer surface and a head receiving groove 161 in which the ball head 175b of the ball plunger 175 is accommodated is formed in the up / . Therefore, stable floating support between the cooling plate 150 and the up / down driving plate 160 can be made possible.

2, the up / down driving unit 181 is connected to the up / down driving plate 160 and drives the up / down driving plate 160 up / down .

The up / down driving unit 181 includes an up / down ball screw 181a, an up / down motor 181b for providing a driving force for up / down ball screw 181a to be operated up / down, And a first motion transmission portion 181c for transmitting the rotational motion of the motor 181b to the up / down linear movement of the up / down shaft 181a. The first motion transmission portion 181c may be applied in a belt and pulley structure.

When the up / down motor 181b is operated, the up / down ball screw 181a is rotated in the forward or reverse direction by the first motion transmission portion 181c to move the up / down drive plate 160 up / down .

The periphery of the up / down driving unit 181 is connected to the cooling plate 150 and the mask sheet 120, and rotates and drives the cooling plate 150, the substrate, and the mask sheet 120 during the deposition process.

As mentioned above, in the case of the method of performing the deposition using the point source 110 and the open mask sheet 120 as in the present embodiment, since the uniformity of the substance deposited on the substrate is not uniform, After the cooling plate 150, the substrate and the mask 110 are attached to each other, the deposition process is performed while rotating for several to several tens of minutes. At this time, the rotation driving unit 183 may be operated.

2, the rotation driving unit 183 includes a rotation frame 183a for supporting the cooling plate 150 and the mask sheet 120 together with the up / down driving plate 160, And a second motion transmitting portion 183c for transmitting the rotational motion of the rotating motor 183b by the rotational motion of the rotating frame 183a. Accordingly, when the rotary motor 183b is operated, the rotary frame 183a can be rotated in one direction by the second motion transmission portion 183c, and the deposition process can proceed with the rotation of the substrate.

Hereinafter, the process of depositing on the substrate through the substrate deposition apparatus according to the present embodiment will be described.

First, the process of attaching the substrates will be described with reference to FIG. 3 to FIG.

3, when the substrate enters the chamber 100 as shown in FIG. 3, the lower clamp 132 is operated to attach the substrate to the cooling plate 150 of the touch plate 140, as shown in FIG. Thereafter, as shown in FIGS. 6 and 7, the touch plate 140 is operated downward so that the substrate contacts the mask sheet 120 with its own weight.

The controller 190 controls the alignment of the touch plate 140 based on the gap information between the touch plate 140 and the mask frame 130 measured in real time by the gap sensor 195, The mask sheet 120 and the substrate are in constant contact with each other and the mask frame 130 and the substrate are not in contact with each other, Can be implemented. Therefore, it is possible to prevent a quality deterioration or a yield reduction problem from occurring due to a cracking phenomenon or a shadow phenomenon of the substrate.

When the laminating process is completed, the rotation driving unit 183 is operated. That is, when the rotary motor 183b of the rotary drive unit 183 is operated, the rotary frame 183a can be rotated in one direction by the second motion transmission unit 183c. As a result, The process can proceed.

According to this embodiment having the structure and function as described above, the touch plate 140, which is relatively heavy in the process of attaching the substrate to the substrate, can be aligned while maintaining a noncontact state with respect to the mask frame 130 The accuracy of alignment of the touch plate 140 can be significantly improved compared with the conventional one. As a result, it is possible to prevent a quality deterioration or a yield deterioration problem due to a crack or a shadow of the substrate.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. It is therefore intended that such modifications or alterations be within the scope of the claims appended hereto.

100: chamber 110: source
120: mask sheet 124: base plate
130: mask frame 132: lower clamp
140: touch plate 141: clamp mounting groove
142: upper clamp 150: cooling plate
152: buried groove 152a:
160: up / down driving plate 161: head receiving groove
170: Floating unit 171: Floating block
172: vertical block 173: horizontal block
175: ball plunger 175a: plunger body
175b: ball head 180: leveler
181: up / down driving part 183: rotation driving part
190: controller 195: gap sensor

Claims (14)

A mask frame provided in the chamber in which the deposition process is performed and supporting a mask sheet in contact with the substrate during a laminating process; And
A touch plate disposed in an upper region of the mask frame for aligning the substrate with the mask sheet while maintaining a noncontact state with the mask frame during the adhesion process, plate,
Wherein the touch plate corresponding to the position of the mask frame is provided with an upper clamp for clamping an end portion of the substrate, the touch surface of the touch plate contacting the substrate such that the substrate is not pressed between the mask frame and the touch plate Wherein the clamping surface of the upper clamp is disposed so as to be stepped upward. The method according to claim 1,
And a gap sensor coupled to the touch plate and measuring a gap between the touch plate and the mask frame during the adhesion process. 3. The method of claim 2,
Wherein the gap sensor is disposed in a rectangular shape in a corner area of the touch plate. 3. The method of claim 2,
Wherein the gap sensor measures a gap between the touch plate and the mask frame in real time during the adhesion process. 5. The method of claim 4,
Further comprising a controller for controlling the aligning operation of the touch plate based on gap information between the touch plate and the mask frame measured in real time by the gap sensor. delete The method according to claim 1,
Wherein the upper clamp is provided in a clamp mounting groove of the touch plate. delete The method according to claim 1,
Wherein a lower clamp is provided at one side of the mask frame for pressing a substrate to be introduced into the chamber in the attaching step toward the touch plate. The method according to claim 1,
Further comprising a leveler connected to the touch plate and leveling the touch plate even in a vacuum state. 11. The method of claim 10,
Wherein the leveler is disposed in a corner area of the touch plate. The method according to claim 1,
The touch plate includes:
And a cooling plate contacting the substrate to cool the substrate. 13. The method of claim 12,
The touch plate includes:
Further comprising an up / down driving plate disposed adjacent to the cooling plate and driven up / down together with the cooling plate. 14. The method of claim 13,
Further comprising a floating portion for floating the up / down driving plate with respect to the cooling plate so that the cooling plate is attached to the substrate by its own weight during the deposition process.

Images